Wafer mechanical arm and wafer processing equipment
By setting up multiple robot arm groups on the wafer robot arm, each of which has a wafer gripper, the problem of wafer waiting to be grasped in the prior art is solved, and the wafer gripping efficiency is improved.
Patent Information
- Application Number
- CN202422223923.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-10
- Publication Date
- 2025-07-29
- Estimated Expiration
- 2034-09-10
AI Technical Summary
The existing semiconductor wafer robot arm only has one wafer gripper installed, causing the wafer to wait for the grabbing process, reducing the working efficiency.
A wafer robot arm is designed, including at least two robot arm groups, each robot arm group is rotatably connected to the first connecting arm, and each robot arm group has a wafer gripper, allowing different wafers to be grasped simultaneously and reducing waiting time.
By increasing the number of robotic arm groups, multiple wafers are captured simultaneously, improving the working efficiency of wafer grabbing and saving waiting time.
Smart Images
Figure CN223167459U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of semiconductor equipment, and in particular to a wafer robotic arm and wafer processing equipment. Background Art
[0002] A wafer is the silicon chip used in the manufacture of silicon semiconductor integrated circuits. Due to its round shape, it is therefore called a wafer. Semiconductor wafer processing generally involves two steps: wafer transfer and processing. The wafer transfer step is used to transfer the wafer between wafer processing equipment areas such as the wafer buffer and process chambers. The processing step is used to perform wafer processing within the process chambers, completing the semiconductor wafer manufacturing process.
[0003] Conventional semiconductor wafer handling requires a robotic arm to drive a wafer gripper to complete wafer handling and placement. However, the wafer gripper of existing robotic arms is fixed to the robotic arm, and the robotic arm is only equipped with one wafer gripper. This results in a wafer waiting time during wafer handling, which in turn reduces operational efficiency. Utility Model Content
[0004] The purpose of the utility model is to provide a wafer robot arm, which can improve the working efficiency of wafer grabbing.
[0005] The embodiment of the present utility model is achieved as follows:
[0006] In one aspect, the present invention provides a wafer robot arm comprising a first connecting arm and at least two robot arm groups, each of which is rotatably connected to the first connecting arm. Each of the two robot arm groups comprises a second connecting arm and a wafer gripper, the second connecting arm being rotatably connected to the first connecting arm, and the wafer gripper being rotatably connected to the second connecting arm. The wafer gripper is used to grasp wafers to be transferred. This wafer robot arm can improve wafer gripping efficiency.
[0007] Optionally, the two robotic arm groups are located on the same side of the first connecting arm, and the two robotic arm groups are spaced apart on the first connecting arm.
[0008] Optionally, the two robotic arm groups are rotatably connected to opposite ends of the first connecting arm.
[0009] Optionally, the wafer robot arm further includes a third connecting arm, which is rotatably connected to the first connecting arm, and the third connecting arm is located on a side of the first connecting arm away from the robot arm group.
[0010] Optionally, the two robotic arm groups are located on different sides of the first connecting arm.
[0011] Optionally, the rotation centers of the two robot arm groups and the first connecting arm do not overlap on the first connecting arm.
[0012] Optionally, the wafer gripper includes a body and two gripping portions provided at opposite ends of the body. The body is rotatably connected to the second connecting arm, and the gripping portions are used for gripping the wafer to be transferred.
[0013] Optionally, the two gripping portions have the same dimension in a first direction, and the first direction is perpendicular to the direction of the rotation axis of the wafer gripper.
[0014] Optionally, the two gripping portions have different dimensions in a first direction, and the first direction is perpendicular to the direction of the rotation axis of the wafer gripper.
[0015] In another aspect of the present utility model, there is provided a wafer processing apparatus, which includes the above-mentioned wafer robot arm.
[0016] The beneficial effects of the present utility model include:
[0017] The wafer robot arm provided in the present application includes a first connecting arm and at least two robot arm groups. The two robot arm groups are respectively rotatably connected to the first connecting arm; the at least two robot arm groups respectively include a second connecting arm and a wafer gripper. The second connecting arm is rotatably connected to the first connecting arm, and the wafer gripper is rotatably connected to the second connecting arm. The wafer gripper is used for gripping the wafer to be transferred. By providing at least two robot arm groups and respectively rotatably connecting each robot arm group to the first connecting arm, in this way, each robot arm group can rotate relative to the first connecting arm, so that the wafer grippers of each robot arm group can grip the wafer to be transferred as needed. Furthermore, when the wafer gripper of one robot arm group grips the wafer to be transferred, another robot arm group can also grip other wafers to be transferred at the same time. Therefore, the present application can save the waiting time of the wafers, thereby improving the working efficiency of wafer gripping. Description of the Drawings
[0018] In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the drawings required to be used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of the present utility model, and therefore should not be regarded as limiting the scope. For those of ordinary skill in the art, other related drawings can be obtained based on these drawings without creative efforts.
[0019] Figure 1 It is a schematic structural diagram of the wafer robot arm provided by the embodiment of the present utility model;
[0020] Figure 2 It is a schematic structural diagram of the wafer gripper provided by the embodiment of the present utility model.
[0021] Icon: 10 - First connecting arm; 20 - Robot arm group; 21 - Second connecting arm; 22 - Wafer gripper; 221 - Body; 222 - Gripping part; 30 - Third connecting arm. Detailed implementation mode
[0022] To make the objectives, technical solutions and advantages of the embodiments of the present utility model clearer, the technical solutions in the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are some but not all of the embodiments of the present utility model. Generally, the components of the embodiments of the present utility model described and illustrated in the accompanying drawings here can be arranged and designed in various different configurations.
[0023] Therefore, the following detailed description of the embodiments of the present utility model provided in the accompanying drawings is not intended to limit the scope of the present utility model claimed, but merely represents selected embodiments of the present utility model. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present utility model without creative efforts fall within the scope of protection of the present utility model.
[0024] It should be noted that: similar reference numerals and letters denote similar items in the following drawings. Therefore, once an item is defined in one drawing, it does not need to be further defined and explained in subsequent drawings.
[0025] In the description of the present utility model, it should be noted that the orientation or positional relationship indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. is based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship in which the utility model product is usually placed during use. It is only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the present utility model. In addition, the terms "first", "second", "third", etc. are only used for descriptive distinction and cannot be understood as indicating or implying relative importance.
[0026] In addition, terms such as "horizontal" and "vertical" do not mean that the components are required to be absolutely horizontal or hanging, but can be slightly inclined. For example, "horizontal" only means that its direction is more horizontal relative to "vertical", and does not mean that the structure must be completely horizontal, but can be slightly inclined.
[0027] In the description of the present utility model, it should also be noted that unless otherwise clearly specified and defined, the terms "set", "installed", "connected", and "coupled" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood according to specific circumstances.
[0028] Please refer to Figure 1 and Figure 2 , this embodiment provides a wafer manipulator, which includes a first connecting arm 10 and at least two manipulator groups 20. The at least two manipulator groups 20 are respectively rotatably connected to the first connecting arm 10; the two manipulator groups 20 respectively include a second connecting arm 21 and a wafer gripper 22. The second connecting arm 21 is rotatably connected to the first connecting arm 10, and the wafer gripper 22 is rotatably connected to the second connecting arm 21. The wafer gripper 22 is used to grip the wafer to be transferred. This wafer manipulator can improve the working efficiency of wafer gripping.
[0029] It should be noted that the wafer manipulator of the present application includes a first connecting arm 10 and a manipulator group 20, wherein the manipulator group 20 is rotatably connected to the first connecting arm 10. In this embodiment, the manipulator group 20 includes at least two and is respectively rotatably connected to the first connecting arm 10. In this way, each manipulator group 20 can rotate relative to the first connecting arm 10 respectively to grip different wafers to be transferred, thereby saving waiting time (the existing wafer manipulator needs to wait until the current wafer to be transferred is transferred before it can grip other wafers to be transferred, resulting in wafer waiting time), and improving the working efficiency of wafer gripping.
[0030] Among them, the above-mentioned first connecting arm 10 is rotatably connected to the manipulator group 20. In this way, the first connecting arm 10 can be driven to rotate, thereby driving the manipulator group 20 to move synchronously in position; the manipulator group 20 can also be driven to rotate relative to the first connecting arm 10, thereby realizing the position switching of the manipulator group 20 on the first connecting arm 10.
[0031] By setting at least two manipulator groups 20 in the present application, in this way, each manipulator group 20 can be used to grip the wafer to be transferred, which can improve the gripping efficiency of the wafer to be transferred and the working efficiency of the wafer manipulator. It should be noted that Figure 1 the case where the manipulator group 20 includes two groups is taken as an example for illustration. Of course, in other embodiments, three manipulator groups 20 or more than three manipulator groups 20 can also be set. The present application does not limit this, and those skilled in the art can determine it according to needs.
[0032] Each robotic arm assembly 20 includes a second connecting arm 21 and a wafer gripper 22, wherein the second connecting arm 21 is rotatably connected to the first connecting arm 10, and the wafer gripper 22 is rotatably connected to the second connecting arm 21. Optionally, the wafer gripper 22 can be located on a side of the second connecting arm 21 facing away from the first connecting arm 10.
[0033] The above-mentioned wafer gripper 22 is used to grab the wafer to be transferred. The way in which the wafer gripper 22 grabs the wafer to be transferred is not limited in this application. It can be grabbed by clamping or by vacuum adsorption. The specific method can be determined according to actual needs and is not limited in this application.
[0034] In summary, the wafer robot provided by the present application includes a first connecting arm 10 and at least two robot arm groups 20, the two robot arm groups 20 are respectively rotatably connected to the first connecting arm 10; the at least two robot arm groups 20 respectively include a second connecting arm 21 and a wafer gripper 22, the second connecting arm 21 is rotatably connected to the first connecting arm 10, and the wafer gripper 22 is rotatably connected to the second connecting arm 21, and the wafer gripper 22 is used to grab the wafer to be transferred. The present application sets at least two robot arm groups 20, and each robot arm group 20 is rotatably connected to the first connecting arm 10, so that each robot arm group 20 can rotate relative to the first connecting arm 10, so that the wafer gripper 22 of each robot arm group 20 can grab the wafer to be transferred as needed, and then when the wafer gripper 22 of one robot arm group 20 grabs the wafer to be transferred, the other robot arm group 20 can also grab other wafers to be transferred at the same time. Therefore, the present application can save the waiting time of the wafer, thereby improving the working efficiency of wafer grabbing.
[0035] In order to avoid mutual interference between the two robotic arm groups 20 and thereby increase the range of motion of each robotic arm group 20, optionally, in this embodiment, the two robotic arm groups 20 are located on the same side of the first connecting arm 10, and the two robotic arm groups 20 are spaced apart on the first connecting arm 10. The spacing between the two robotic arm groups 20 can be determined based on the motion trajectory requirements of the two robotic arm groups 20, and is not limited in this application.
[0036] Optionally, the two robotic arm groups 20 are rotatably connected to opposite ends of the first connecting arm 10. In this way, the distance between the two robotic arm groups 20 can be further increased, thereby further expanding the range of motion of each robotic arm group 20.
[0037] Furthermore, in this embodiment, the wafer robot can optionally further include a third connecting arm 30, which is rotatably connected to the first connecting arm 10 and is located on a side of the first connecting arm 10 facing away from the robot arm group 20. In this way, the first connecting arm 10 can rotate relative to the third connecting arm 30, thereby driving each robot arm group 20 to move.
[0038] It should be noted that, in addition to being on the same side of the first connecting arm 10, in other embodiments, optionally, the two robotic arm groups 20 can also be on different sides of the first connecting arm 10. In this way, the movement trajectories of the robotic arm groups 20 on opposite sides of the first connecting arm 10 will not interfere with each other, and the robotic arm groups 20 have a higher degree of freedom of movement.
[0039] In addition, when the two robotic arm groups 20 are on different sides of the first connecting arm 10, optionally, the two robotic arm groups 20 can be respectively non-overlapping with the rotation center of the first connecting arm 10 on the first connecting arm 10. In this way, the forces on the two robotic arm groups 20 on the first connecting arm 10 are relatively balanced.
[0040] Please refer to Figure 2 , optionally, the wafer gripper 22 includes a body 221 and two gripping parts 222 provided at opposite ends of the body 221. The body 221 is rotatably connected to the second connecting arm 21, and the gripping parts 222 are used to grip the wafer to be transferred.
[0041] Among them, the above-mentioned body 221 can be rotatably connected to the second connecting arm 21 through a rotating shaft, and the gripping parts 222 are connected to the body 221 and are used to grip the wafer to be transferred.
[0042] In this embodiment, the specific structure of the gripping part 222 is not limited in this application, as long as it can grip the wafer to be transferred, and it can be implemented by any feasible method such as clamping or adsorption. For example, when the gripping part 222 grips the wafer to be transferred by means of vacuum adsorption, vacuum adsorption holes (not shown in the figure) can be provided on the gripping part 222.
[0043] Furthermore, optionally, the two gripping parts 222 have the same size in the first direction, and the first direction is perpendicular to the direction of the rotation axis of the wafer gripper 22. In this way, the two gripping parts 222 have the same specification size in the first direction and can grip wafers to be transferred of the same specification size.
[0044] Of course, in other embodiments, the two gripping parts 222 can also have different sizes in the first direction, and the first direction is perpendicular to the direction of the rotation axis of the wafer gripper 22. In this way, the two gripping parts 222 can be respectively used to grip wafers to be transferred of different specification sizes. Thus, the wafer robotic arm can be applicable to wafers to be transferred of more size specifications, and the application range is wider.
[0045] On the other hand, the present utility model provides a wafer processing device, which includes the above-mentioned wafer robot. Among them, the specific structure and beneficial effects of the wafer robot have been elaborated and described in detail above, so they will not be repeated herein. In addition to the wafer robot, the wafer processing device of the present application may further include other process equipment, and the wafer robot and other process equipment can be used in cooperation to perform process processing on the wafer.
[0046] The above are only optional embodiments of the present utility model and are not intended to limit the present utility model. For those skilled in the art, the present utility model can have various changes and modifications. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present utility model shall be included within the protection scope of the present utility model.
[0047] In addition, it should be noted that the various specific technical features described in the above specific embodiments can be combined in any appropriate manner without conflict. To avoid unnecessary repetition, the present utility model will not separately describe various possible combination methods.
Claims
1. A wafer robot, characterized in that, It includes a first connecting arm and at least two robotic arm groups, and at least two of the robotic arm groups are respectively rotatably connected to the first connecting arm; the two robotic arm groups respectively include a second connecting arm and a wafer gripper, the second connecting arm is rotatably connected to the first connecting arm, and the wafer gripper is rotatably connected to the second connecting arm, and the wafer gripper is used to grab the wafer to be transferred.
2. The wafer robot according to claim 1, wherein The two robotic arm groups are located on the same side of the first connecting arm, and the two robotic arm groups are spaced apart on the first connecting arm.
3. The wafer robot according to claim 2, wherein The two mechanical arm groups are rotatably connected to the opposite ends of the first connecting arm respectively.
4. The wafer robot according to claim 2, wherein, The wafer robot arm further includes a third connecting arm, which is rotatably connected to the first connecting arm and is located on a side of the first connecting arm away from the robot arm group.
5. The wafer robot according to claim 1, wherein, The two robotic arm groups are located on different sides of the first connecting arm.
6. The wafer robot according to claim 4, wherein The rotation centers of the two mechanical arm groups and the first connecting arm do not overlap on the first connecting arm.
7. The wafer robot according to any one of claims 1 to 6, characterized in that The wafer gripper includes a main body and two gripping parts provided at opposite ends of the main body. The main body is rotatably connected to the second connecting arm, and the gripping parts are used to grip the wafer to be transferred.
8. The wafer robot according to claim 7, wherein The two gripping portions have the same size in a first direction, and the first direction is perpendicular to the rotation axis of the wafer gripper.
9. The wafer robot according to claim 7, wherein, The two gripping portions have different sizes in a first direction, and the first direction is perpendicular to the rotation axis of the wafer gripper.
10. A wafer processing device, characterized in that, A wafer robot arm comprising any one of claims 1 to 9.