Wafer positioning jig

Abstract

The utility model provides a wafer positioning jig, which belongs to the technical field of semiconductor packaging and comprises a bottom platform and a circular ring matched with the bottom platform in size, and the bottom platform is provided with a wafer positioning block groove, a jig positioning hole and a wafer direction block groove. A plurality of positioning pieces corresponding to the wafer positioning block grooves, the jig positioning holes and the wafer direction block grooves are arranged at the circumferential position of the circular ring; the positioning piece comprises a wafer positioning block and a jig positioning block; during working, the wafer positioning block is inserted into the wafer positioning block groove and is used for positioning the position of a wafer, so that the wafer is placed in the middle; the jig positioning pins are inserted into the jig positioning holes to realize fixation; the wafer direction block is embedded into the wafer direction block groove, and the wafer direction block is used for fixing the direction of the wafer; according to the invention, through cooperative work of the designed supporting block clearance groove, the wafer positioning block groove, the plurality of jig positioning holes and the wafer direction block groove, a wafer can be quickly positioned, and the precision is ensured.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor packaging, and particularly to a wafer positioning jig. Background Art

[0002] When the existing dispensing equipment operates on 12-inch wafer products, it is necessary to manually place the wafer on three support blocks around the metal platform, and then lower the support blocks so that the wafer is adsorbed on the bottom metal platform. The position deviation of the wafer on the support blocks is relatively large, and there is no angle positioning device. The position of each manual placement is different, and the position and angle of the wafer need to be manually adjusted for each wafer to make it consistent with the position set by the program. It takes a lot of time, and the chip is easily contaminated during the manual adjustment process, affecting the product quality. Summary of the Invention

[0003] Object of the Invention: The object of the present invention is to provide a wafer positioning jig for the deficiency that the existing technology needs to manually adjust the position and angle of the wafer, which takes too much time. Through the cooperative work of the designed support block clearance groove, wafer positioning block groove, several jig positioning holes and wafer direction block groove, the wafer can be quickly positioned to ensure the accuracy.

[0004] Technical Solution: The wafer positioning jig of the present invention includes a bottom platform and a ring adapted to the size of the bottom platform. The bottom platform is provided with a wafer positioning block groove, a jig positioning hole and a wafer direction block groove. A plurality of positioning members corresponding to the wafer positioning block groove, the jig positioning hole and the wafer direction block groove are provided at the circumferential position of the ring;

[0005] The positioning members include a wafer positioning block and a jig positioning block, and a cylindrical jig positioning pin at the center position of the bottom of the jig positioning block; during operation, the wafer positioning block is embedded in the wafer positioning block groove, and the wafer positioning pin makes the wafer centered through the action of the spring, and the jig positioning pin is inserted into the jig positioning hole to achieve fixation;

[0006] The ring is also provided with a support block clearance groove, and the support block clearance groove is a through hole. The size of the support block clearance groove corresponds to the size of the support block on the bottom platform to clear the support block. The wafer positioning block is used to fix the wafer; the jig positioning block is used to fix the jig; the wafer direction block is used to fix the wafer direction.

[0007] Further, there are 3 wafer positioning block grooves, namely a first wafer positioning block groove, a second wafer positioning block groove and a third wafer positioning block groove provided at the 40°, 160°, and 280° positions of the circumferential direction of the bottom platform respectively.

[0008] Furthermore, the wafer positioning blocks include three, namely the first wafer positioning block, the second wafer positioning block and the third wafer positioning block, which are arranged at 40°, 160° and 280° positions on the circumference of the ring; the first wafer positioning block, the second wafer positioning block and the third wafer positioning block are respectively embedded in the first wafer positioning block groove, the second wafer positioning block groove and the third wafer positioning block groove.

[0009] Furthermore, the wafer positioning pins include positioning pins, springs and stop screws in sequence. During operation, the three positioning pins are pushed forward by the springs to center the wafer.

[0010] Furthermore, the jig positioning holes include three, namely a first jig positioning hole, a second jig positioning hole and a third jig positioning hole, which are respectively arranged at 80°, 200° and 320° positions on the circumference of the bottom platform.

[0011] Furthermore, the jig positioning blocks include three, namely the first jig positioning block, the second jig positioning block and the third jig positioning block, which are arranged at 80°, 200° and 320° positions on the circumference of the ring; the first jig positioning block, the second jig positioning block and the third jig positioning block are fixed to the first jig positioning hole, the second jig positioning hole and the third jig positioning hole respectively through jig positioning pins.

[0012] Furthermore, the jig positioning pin is a cylindrical pin. When working, the jig positioning pin is inserted into the jig positioning hole of the bottom platform to achieve fixation.

[0013] Furthermore, the support block air avoidance grooves include three, namely a first support block air avoidance groove, a second support block air avoidance groove and a third support block air avoidance groove which are respectively arranged at the positions of 0°, 120° and 240° of the circular ring.

[0014] Furthermore, the wafer direction block groove is set at a 180° position on the bottom platform.

[0015] Furthermore, the wafer orientation block includes an internally threaded hole, centrally located inside the ring, that penetrates the wafer orientation block and the ring body. A wafer orientation pin is threaded into the internally threaded hole. During operation, the wafer orientation block fits into the wafer orientation block groove, and the wafer orientation pin pushes forward against the wafer notch to secure the wafer in place.

[0016] Beneficial effects: Compared with the prior art, the advantages of the present invention are:

[0017] (1) Since the equipment platform in the prior art has a support block, which plays a role in preliminary positioning and cannot be removed, the present invention is designed with a support block avoidance groove to avoid the support block and prevent the jig from colliding with the support block;

[0018] (2) The present invention is designed with a wafer positioning block groove and a wafer positioning block, which can position the wafer. At the same time, it is convenient for fixing and disassembling;

[0019] (3) The present invention is designed with a fixture positioning hole, a fixture positioning block and a fixture positioning pin, which can position the ring body. At the same time, it is convenient for fixing and disassembling;

[0020] (4) The present invention is designed with a wafer direction block groove and a wafer direction block, which can position the wafer direction. Description of the Drawings

[0021] Figure 1 is a schematic structural view of the bottom platform in the present invention;

[0022] Figure 2 is a schematic structural view of the ring in the present invention;

[0023] Figure 3 is a schematic structural view of the wafer positioning pin in the present invention;

[0024] Figure 4 is a schematic structural view of the wafer direction pin in the present invention.

[0025] Figure 5 is a schematic structural view of the fixture positioning pin in the present invention Detailed Embodiments

[0026] The technical solution of the present invention will be described in detail below with reference to the drawings, but the protection scope of the present invention is not limited to the described embodiments.

[0027] Embodiment 1

[0028] As Figure 1 and Figure 2 shown, a wafer positioning fixture includes a bottom platform and a ring adapted to the size of the bottom platform. The outer diameter of the ring is 330 mm, the inner diameter is 311 mm, and the overall thickness of the ring is 8 mm.

[0029] The bottom platform is provided with a wafer positioning block groove 2, a fixture positioning hole 3, and a wafer orientation block groove 4; the wafer positioning block groove 2 includes three, namely a first wafer positioning block groove 2-1, a second wafer positioning block groove 2-2, and a third wafer positioning block groove 2-3, which are respectively arranged at the 40°, 160°, and 280° positions in the circumferential direction of the bottom platform. The fixture positioning hole 3 includes three, namely a first fixture positioning hole 3-1, a second fixture positioning hole 3-2, and a third fixture positioning hole 3-3, which are respectively arranged at the 80°, 200°, and 320° positions in the circumferential direction of the bottom platform. The wafer orientation block groove 4 is arranged at the 180° position of the bottom platform. During operation, the wafer square block 9 is embedded in the wafer orientation block groove 4; the wafer orientation block 9 includes an internal threaded hole that penetrates the wafer orientation block 9 and the circular ring body at the inner center position, and a wafer orientation pin 10 is screwed into the internal threaded hole. The wafer orientation pin 10 is used to fix the wafer orientation.

[0030] Positioning members corresponding to the wafer positioning block groove 2, the fixture positioning hole 3, and the wafer orientation block groove 4 are arranged at the circumferential position of the circular ring, including a wafer positioning block 5 and a fixture positioning block 7. The wafer positioning block 5 includes three, namely a first wafer positioning block 5-1, a second wafer positioning block 5-2, and a third wafer positioning block 5-3, which are respectively arranged at the 40°, 160°, and 280° positions in the circumferential direction of the circular ring; the first wafer positioning block 5-1, the second wafer positioning block 5-2, and the third wafer positioning block 5-3 are respectively embedded in the first wafer positioning block groove 2-1, the second wafer positioning block groove 2-2, and the third wafer positioning block groove 2-3. The fixture positioning block 7 includes three, namely a first fixture positioning block 7-1, a second fixture positioning block 7-2, and a third fixture positioning block 7-3, which are respectively arranged at the 80°, 200°, and 320° positions in the circumferential direction of the circular ring; the first fixture positioning block 7-1, the second fixture positioning block 7-2, and the third fixture positioning block 7-3 are respectively fixed to the first fixture positioning hole 3-1, the second fixture positioning hole 3-2, and the third fixture positioning hole 3-3 through a fixture positioning pin 8. The fixture positioning pin 8 is a cylindrical plug. During operation, the fixture positioning pin 8 is inserted into the fixture positioning hole of the bottom platform for fixation.

[0031] The circular ring is also provided with a support block clearance groove 1, including three, namely a first support block clearance groove 1-1, a second support block clearance groove 1-2, and a third support block clearance groove 1-3, which are respectively arranged at the 0°, 120°, and 240° positions of the circular ring. The support block clearance groove is a through hole, and the size of the support block clearance groove corresponds to the size of the support block on the bottom platform to clear the support block.

[0032] In this embodiment, the size of the groove of the wafer positioning block is 9 * 5.3 mm, the depth is 2.5 mm, the size of the wafer positioning block is 8X5.3 mm, and the thickness is 5 mm; it is used to fix the wafer positioning pin, and its upper surface is flush with the fixture body. The middle part of the wafer positioning block 5 has a wafer positioning through hole for accommodating the wafer positioning pin 6. The diameter of the wafer positioning through hole is 2.1 mm, which is used to accommodate the wafer positioning pin. The inner diameter of the through hole near the head of the wafer positioning block is 1.6 - 1.9 mm to prevent the whole wafer positioning pin from slipping out. The through hole is near the outer circle of the fixture, and a thread is provided inside for placing a stop screw; during positioning, the wafer positioning pin 6 is inserted into the wafer positioning through hole for fixation; the wafer positioning pin 6 successively includes a positioning pin 6-1, a spring 6-2, and a stop screw 6-3, and the head of the positioning pin is an arc surface structure.

[0033] The size of the fixture positioning hole is a diameter of 2.1 mm and a depth of 2.5 mm; the center of the positioning hole is 1.5 mm away from the outer edge of the bottom platform, which is used to accommodate the fixture positioning pin. The size of the fixture positioning block is 8 mm in length * 4 mm in width, and the thickness is 3 mm; the fixture positioning block 7 is used to fix the fixture; there is a fixture positioning pin 8 at the center of the bottom of the fixture positioning block. During positioning, the fixture positioning pin 8 is inserted into the fixture positioning hole for fixation; the size of the fixture positioning pin is a diameter of 2 mm and a length of 2 mm.

[0034] The size of the wafer orientation block is 8 mm in length * 4 mm in width, and the thickness is 5 mm; the wafer orientation pin 10 is a screw with a diameter of 3 mm, and the head of the screw is an arc surface with a radius of 1 mm, which is slightly smaller than the diameter of the notch of the wafer.

[0035] Working method:

[0036] 1. The wafer orientation block, with the orientation facing down (180°), insert the three fixture positioning pins under the three fixture positioning blocks into the positioning holes of the bottom metal platform to complete the fixture positioning;

[0037] 2. Place the wafer on the support block, with the notch facing down (180°), consistent with the wafer orientation block;

[0038] 3. The support block descends, and the wafer is embedded between the three wafer positioning pins of the fixture. Under the action of the spring behind the positioning pins, the wafer will complete centering positioning

[0039] 4. Turn the screw of the wafer orientation pin to slowly embed it into the notch of the wafer. During this process, only manually fine-tune the angle of the wafer to make the two fully embed;

[0040] 5. Complete the positioning and turn on the equipment vacuum;

[0041] 6. Reverse-turn the screw of the wafer orientation pin to make it withdraw from the notch of the wafer;

[0042] 7. Remove the fixture and start normal operation.

[0043] As described above, although the present invention has been shown and described with reference to specific preferred embodiments, it should not be construed as a limitation on the present invention itself. Various changes in form and detail may be made thereto without departing from the spirit and scope of the invention as defined by the appended claims.

Claims

1. A wafer positioning fixture, characterized in that: It includes a bottom platform and a ring adapted to the size of the bottom platform. On the bottom platform, there are a wafer positioning block groove (2), a fixture positioning hole (3), and a wafer orientation block groove (4). On the circumferential position of the ring, there are several positioning parts corresponding to the wafer positioning block groove (2), the fixture positioning hole (3), and the wafer orientation block groove (4). The positioning parts include a wafer positioning block (5) and a fixture positioning block (7). At the center of the bottom of the fixture positioning block (7), there is a fixture positioning pin (8). During operation, the wafer positioning block (5) is inserted into the wafer positioning block groove (2), and the fixture positioning pin (8) is inserted into the fixture positioning hole (3) to achieve fixation. On the ring, there is also a support block clearance groove (1). The support block clearance groove (1) is a through hole, and the size of the support block clearance groove corresponds to the size of the support block on the bottom platform to clear the support block. The wafer positioning block is used to fix the wafer. In the fixture positioning hole (3), there is a corresponding fixture positioning pin (8), and the fixture positioning pin (8) is used to fix the fixture. In the wafer orientation block groove (4), there is a corresponding wafer orientation block (9), and the wafer orientation block (9) is used to fix the wafer orientation.

2. The wafer positioning fixture according to claim 1, characterized in that: The wafer positioning block groove (2) includes three, namely the first wafer positioning block groove (2-1), the second wafer positioning block groove (2-2), and the third wafer positioning block groove (2-3) located at the 40°, 160°, and 280° positions on the circumference of the bottom platform respectively.

3. A wafer positioning fixture according to claim 2, wherein: The wafer positioning block (5) includes three, namely the first wafer positioning block (5-1), the second wafer positioning block (5-2), and the third wafer positioning block (5-3) located at the 40°, 160°, and 280° positions on the circumference of the ring respectively. The first wafer positioning block (5-1), the second wafer positioning block (5-2), and the third wafer positioning block (5-3) are respectively embedded into the first wafer positioning block groove (2-1), the second wafer positioning block groove (2-2), and the third wafer positioning block groove (2-3).

4. The wafer positioning fixture according to claim 3, wherein: It also includes a wafer positioning pin (6). The wafer positioning pin (6) successively includes a positioning pin (6-1), a spring (6-2), and a stop screw (6-3).

5. A wafer positioning jig according to claim 1, characterized in that: The fixture positioning hole (3) includes three, namely the first fixture positioning hole (3-1), the second fixture positioning hole (3-2), and the third fixture positioning hole (3-3) located at the 80°, 200°, and 320° positions on the circumference of the bottom platform respectively.

6. The wafer positioning fixture according to claim 5, characterized in that: The fixture positioning block (7) includes three, namely the first fixture positioning block (7-1), the second fixture positioning block (7-2), and the third fixture positioning block (7-3) located at the 80°, 200°, and 320° positions on the circumference of the ring respectively. The first fixture positioning block (7-1), the second fixture positioning block (7-2), and the third fixture positioning block (7-3) are fixed by inserting the fixture positioning pin (8) into the first fixture positioning hole (3-1), the second fixture positioning hole (3-2), and the third fixture positioning hole (3-3) respectively.

7. The wafer positioning fixture according to claim 6, characterized in that: The fixture positioning pin (8) is a cylindrical pin. During operation, the fixture positioning pin (8) is inserted into the fixture positioning hole on the bottom platform to achieve fixation.

8. A wafer positioning fixture according to claim 1, wherein: There are 3 support block clearance grooves (1), namely a first support block clearance groove (1-1), a second support block clearance groove (1-2), and a third support block clearance groove (1-3) provided at the 0°, 120°, and 240° positions of the ring respectively.

9. The wafer positioning fixture according to claim 1, wherein: The wafer orientation block groove (4) is provided at the 180° position of the bottom platform.

10. A wafer positioning fixture according to claim 9, characterized in that: During operation, the wafer orientation block (9) is embedded in the wafer orientation block groove (4); the wafer orientation block (9) includes an internal threaded hole provided at the inner center position and passing through the wafer orientation block (9) and the ring body, and a wafer orientation pin (10) is screwed into the internal threaded hole, and the wafer orientation pin (10) is used to fix the wafer orientation.

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