Circuit board and circuit module

Abstract

The utility model provides a circuit substrate and a circuit module. The circuit board includes: a board main body having an upper main surface and a lower main surface; the signal conductor layer is arranged on the substrate main body; a branch conductor layer provided on the substrate main body and electrically connected to the signal conductor layer; the signal electrode is positioned on the lower main surface; and a branch electrode located on the upper main surface or the lower main surface, the signal electrode being electrically connected to the signal conductor layer, the branch electrode being electrically connected to the branch conductor layer, and the branch electrode being electrically connected to the branch conductor layer when the circuit substrate is connected to one or more other circuit substrates. A conductive bonding material is bonded to the branch electrodes of the one or more other circuit substrates, thereby connecting to a ground potential.

Description

Technical Field

[0001] The present utility model relates to a circuit board and a circuit module including the circuit board and one or more other circuit boards. Background Art

[0002] As a conventional invention related to a circuit module, for example, a transmission line device described in Patent Document 1 is known. The transmission line device includes a first multilayer substrate and a second multilayer substrate. The first multilayer substrate and the second multilayer substrate are fixed by solder.

[0003] Prior Art Documents

[0004] Patent Documents

[0005] Patent Document 1: International Publication No. 2019 / 131286 Summary of the Utility Model

[0006] Problems to be Solved by the Utility Model

[0007] However, in the field of the transmission line device described in Patent Document 1, there is a requirement to suppress the characteristic impedance generated at the connection portion between the first multilayer substrate and the second multilayer substrate from deviating from a desired characteristic impedance (for example, 50 Ω).

[0008] Therefore, an object of the present utility model is to provide a circuit module and a circuit board capable of suppressing the characteristic impedance generated at the connection portion between the first circuit board and the second circuit board from deviating from a desired characteristic impedance.

[0009] Technical Solution for Solving the Problem

[0010] A circuit board according to one aspect of the present utility model includes:

[0011] a substrate body having an upper main surface and a lower main surface;

[0012] a signal conductor layer provided on the substrate body;

[0013] a branch conductor layer provided on the substrate body and electrically connected to the signal conductor layer;

[0014] a signal electrode located on the lower main surface; and

[0015] a branch electrode located on the upper main surface or the lower main surface,

[0016] the signal electrode is electrically connected to the signal conductor layer,

[0017] The branch electrode is electrically connected to the branch conductor layer, and when the circuit board is connected to one or more other circuit boards, it is joined to the branch electrodes of the one or more other circuit boards by a conductive joining material, thereby connecting to the ground potential.

[0018] One aspect of the present utility model relates to a circuit module including:

[0019] A first circuit board; and

[0020] One or more other circuit boards,

[0021] The one or more other circuit boards have a portion that overlaps with the first circuit board when viewed in the vertical direction.

[0022] The first circuit board includes:

[0023] A first substrate body having a first upper main surface and a first lower main surface;

[0024] A first signal conductor layer provided on the first substrate body;

[0025] A first branch conductor layer provided on the first substrate body and electrically connected to the first signal conductor layer;

[0026] A first signal electrode located on the first lower main surface; and

[0027] A first branch electrode located on the first upper main surface or the first lower main surface,

[0028] The one or more other circuit boards include:

[0029] One or more substrate bodies having an upper main surface and a lower main surface;

[0030] A second signal conductor layer provided on any one of the one or more substrate bodies;

[0031] A second ground conductor layer provided on any one of the one or more substrate bodies;

[0032] A second signal electrode located on the upper main surface of the substrate body among the one or more substrate bodies on which the second signal conductor layer is provided; and

[0033] A second branch electrode located on the upper main surface or the lower main surface of the substrate body among the one or more substrate bodies on which the second ground conductor layer is provided,

[0034] The first signal electrode is electrically connected to the first signal conductor layer,

[0035] The first branch electrode is electrically connected to the first branch conductor layer,

[0036] The second signal electrode is electrically connected to the second signal conductor layer and is bonded to the first signal electrode through a conductive bonding material.

[0037] The second branch electrode is electrically connected to the second ground conductor layer and is bonded to the first branch electrode through a conductive bonding material.

[0038] A circuit module according to one aspect of the present invention includes:

[0039] A first circuit board; and

[0040] One or more other circuit boards,

[0041] wherein the one or more other circuit boards have a portion that overlaps with the first circuit board when viewed in the vertical direction.

[0042] The first circuit board includes:

[0043] A first substrate body having a first upper main surface and a first lower main surface;

[0044] A first signal conductor layer provided on the first substrate body;

[0045] A first branch conductor layer provided on the first substrate body and electrically connected to the first signal conductor layer;

[0046] A first signal electrode located on the first lower main surface; and

[0047] A first branch electrode located on the first upper main surface or the first lower main surface,

[0048] The one or more other circuit boards include:

[0049] One or more substrate bodies having an upper main surface and a lower main surface;

[0050] A second radiation conductor layer that transmits or receives electromagnetic waves and is provided on any one of the one or more substrate bodies;

[0051] A second ground conductor layer provided on any one of the one or more substrate bodies;

[0052] A second signal electrode located on the upper main surface of the substrate body among the one or more substrate bodies on which the second radiation conductor layer is provided; and

[0053] A second branch electrode located on the upper main surface or the lower main surface of the substrate body among the one or more substrate bodies on which the second ground conductor layer is provided,

[0054] The first signal electrode is electrically connected to the first signal conductor layer.

[0055] The first branch electrode is electrically connected to the first branch conductor layer.

[0056] The second signal electrode is electrically connected to the second radiation conductor layer and is bonded to the first signal electrode via a conductive bonding material.

[0057] The second branch electrode is electrically connected to the second ground conductor layer and is bonded to the first branch electrode via a conductive bonding material.

[0058] Utility model effect

[0059] According to the circuit module of the present invention, it is possible to suppress the characteristic impedance generated at the connection portion between the first circuit board and the second circuit board from deviating from a desired characteristic impedance. BRIEF DESCRIPTION OF THE DRAWINGS

[0060] Figure 1 is a cross-sectional view of the circuit module 1 .

[0061] Figure 2 This is a rear view of the circuit module 1 when in use.

[0062] Figure 3 This is a rear view of the circuit module 1 when in use.

[0063] Figure 4 5 is a cross-sectional view of the circuit board 510 .

[0064] Figure 5 It is a plan view of the first signal conductor layer 18 , the first branch conductor layer 19 , the first signal electrode 32 , the first branch electrode 34 , and the third ground electrode 36 a of the circuit module 1 a .

[0065] Figure 6 It is a plan view of the first signal conductor layer 18 , the first branch conductor layer 19 , the first signal electrode 32 , the first branch electrode 34 , and the third ground electrode 36 a of the circuit module 1 b .

[0066] Figure 7 1 is a plan view of the first signal conductor layer 18 , the first branch conductor layer 19 , the first signal electrode 32 , the first branch electrode 34 , the third ground electrode 36 a , and the fourth ground electrode 36 b of the circuit module 1 c .

[0067] Figure 8 It is a plan view of the first signal conductor layer 18 , the first branch conductor layer 19 , the first signal electrode 32 , the first branch electrode 34 , the third ground electrode 36 a , and the fourth ground electrode 36 b of the circuit module 1 d .

[0068] Figure 9 It is a top view of the first signal conductor layer 18, the first branch conductor layer 19, the open stub conductor layer 70a, the first signal electrode 32, and the first branch electrode 34 of the circuit module 1e.

[0069] Figure 10 It is a top view of the first signal conductor layer 18, the first branch conductor layer 19, the open stub conductor layers 70a and 70b, the first signal electrode 32, and the first branch electrode 34 of the circuit module 1f.

[0070] Figure 11 It is a top view of the first signal conductor layer 18, the first branch conductor layer 19, the second branch conductor layer 72a, the first signal electrode 32, the first branch electrode 34, and the third branch electrode 38a of the circuit module 1g.

[0071] Figure 12 It is Figure 11 a cross-sectional view taken along A - A of

[0072] Figure 13 It is a top view of the first signal conductor layer 18, the first branch conductor layer 19, the second branch conductor layers 72a and 72b, the first signal electrode 32, the first branch electrode 34, and the third branch electrodes 38a and 38b of the circuit module 1h.

[0073] Figure 14 It is a top view of the first signal conductor layer 18, the first branch conductor layer 19, the first signal electrode 32, and the first branch electrode 34 of the circuit module 1i.

[0074] Figure 15 It is a cross-sectional view of the circuit module 1j.

[0075] Figure 16 It is a cross-sectional view of the circuit module 1k.

[0076] Figure 17 It is a cross-sectional view of the circuit module 1l.

[0077] Figure 18 It is a cross-sectional view of the circuit module 1m.

[0078] Figure 19 It is a cross-sectional view of the circuit module 1n.

[0079] Figure 20 It is a cross-sectional view of the circuit module 1o.

[0080] Figure 21 It is a cross-sectional view of the circuit module 1p.

[0081] Figure 22 It is a cross-sectional view of the circuit module 1q.

[0082] Figure 23 is a cross-sectional view of the circuit module 1r.

[0083] Figure 24 It is a cross-sectional view of the circuit module 1s.

[0084] Figure 25 2 is a cross-sectional view of the circuit module 1t. DETAILED DESCRIPTION

[0085] (Implementation Method)

[0086] [Structure of Circuit Module 1]

[0087] Hereinafter, the structure of the circuit module 1 according to the embodiment of the present invention will be described with reference to the drawings. Figure 1 is a cross-sectional view of the circuit module 1 .

[0088] In this specification, directions are defined as follows. The direction in which the first circuit substrate 10 and the second circuit substrate 110 are arranged is the vertical direction. Furthermore, the direction in which the first signal conductor layer 18 extends is the horizontal direction. The horizontal direction is orthogonal to the vertical direction. The front-back direction is orthogonal to the vertical direction and the horizontal direction. Furthermore, the vertical direction, front-back direction, and horizontal direction in this specification may not be consistent with the vertical direction, front-back direction, and horizontal direction in actual use of the circuit module 1. Furthermore, the front and rear directions may be reversed, the left and right directions may be reversed, and the top and bottom directions may be reversed.

[0089] First, refer to Figure 1 The structure of the circuit module 1 will be described. The circuit module 1 is used in electronic devices such as smartphones. The circuit module 1 includes a first circuit board 10, a second circuit board 110, and conductive bonding materials 200a to 200c.

[0090] First, the structure of the first circuit board 10 will be described. The first circuit board 10 includes a first substrate body 12, a first signal conductor layer 18, a first branch conductor layer 19, a third ground conductor layer 20a, a first ground conductor layer 20b, a top surface signal electrode 30, a first signal electrode 32, a first branch electrode 34, a first ground electrode 36, and interlayer connection conductors v1 to v3.

[0091] The first substrate body 12 has a plate shape. The first substrate body 12 has a first upper main surface S1 and a first lower main surface S2. The first substrate body 12 has a structure in which a plurality of first dielectric layers 16a to 16c, a protective layer 17a, and a first protective layer 17b are stacked in the vertical direction. The first dielectric layers 16a to 16c are arranged in order from top to bottom. The first dielectric layers 16a to 16c are flexible dielectric sheets. The material of the first dielectric layers 16a to 16c is resin. In the present embodiment, the material of the first dielectric layers 16a to 16c is a thermoplastic resin. The thermoplastic resin is, for example, a liquid crystal polymer, PTFE (polytetrafluoroethylene), etc. In addition, the material of the first dielectric layers 16a to 16c may also be polyimide. Regarding the first dielectric layers 16a to 16c, the adjacent first dielectric layers are fused to each other in the vertical direction. Such a first substrate body 12 has flexibility. The protective layer 17a and the first protective layer 17b will be described later.

[0092] The first signal conductor layer 18 is provided on the first substrate body 12. In the present embodiment, the first signal conductor layer 18 is located on the lower main surface of the first dielectric layer 16b. The first signal conductor layer 18 has a line shape extending in the left-right direction. A high-frequency signal is transmitted through the first signal conductor layer 18.

[0093] The first branch conductor layer 19 is provided on the first substrate body 12. In the present embodiment, the first branch conductor layer 19 is located on the lower main surface of the first dielectric layer 16b. The first branch conductor layer 19 is electrically connected to the first signal conductor layer 18. More specifically, the first branch conductor layer 19 has a line shape. The first branch conductor layer 19 extends rightward from the right end of the first signal conductor layer 18. In this specification, the starting point of the first branch conductor layer 19 is the portion branched from the main path of the high-frequency signal. The main path of the high-frequency signal is the path from the first signal conductor layer 18 to the first signal electrode 32 via the interlayer connection conductor v2. Moreover, the starting point of the first branch conductor layer 19 is the portion branched from the first signal conductor layer 18. In the present embodiment, when observed in the vertical direction, the starting point of the first branch conductor layer 19 is the center of the interlayer connection conductor v2. On the other hand, the end point of the first branch conductor layer 19 is the center of the interlayer connection conductor v3.

[0094] The third ground conductor layer 20a is provided on the first substrate body 12. In the present embodiment, the third ground conductor layer 20a is located on the upper main surface of the first dielectric layer 16a. Thus, the third ground conductor layer 20a is located at a position higher than the first signal conductor layer 18. When observed in the vertical direction, the third ground conductor layer 20a overlaps with the first signal conductor layer 18 and the first branch conductor layer 19. Further, when observed in the vertical direction, the third ground conductor layer 20a overlaps with the first signal electrode 32, the first branch electrode 34, and the first ground electrode 36 to be described later.

[0095] The first ground conductor layer 20b is provided on the first substrate body 12. In the present embodiment, the first ground conductor layer 20b is located on the lower main surface of the first dielectric layer 16c. Thus, the first ground conductor layer 20b is located at a position lower than the first signal conductor layer 18. When observed in the vertical direction, the first ground conductor layer 20b overlaps with the first signal conductor layer 18 and the first branch conductor layer 19. In addition, the first ground conductor layer 20b is electrically connected to the third ground conductor layer 20a via an interlayer connection conductor (not shown). The first signal conductor layer 18, the third ground conductor layer 20a, and the first ground conductor layer 20b as described above have a stripline structure.

[0096] The upper surface signal electrode 30 is located on the first upper main surface S1. In the present embodiment, the upper surface signal electrode 30 is located on the upper main surface of the first dielectric layer 16a. The upper surface signal electrode 30 is electrically connected to the first signal conductor layer 18. Specifically, when observed in the vertical direction, the upper surface signal electrode 30 overlaps with the left end portion of the first signal conductor layer 18. The interlayer connection conductor v1 penetrates the first dielectric layers 16a and 16b in the vertical direction. The interlayer connection conductor v1 electrically connects the upper surface signal electrode 30 and the left end portion of the first signal conductor layer 18. Thus, high-frequency signals are input and output via the upper surface signal electrode 30.

[0097] The first signal electrode 32 is located on the first lower main surface S2. In the present embodiment, the first signal electrode 32 is located on the lower main surface of the first dielectric layer 16c. The first signal electrode 32 is electrically connected to the first signal conductor layer 18. Specifically, when observed in the vertical direction, the first signal electrode 32 overlaps with the right end portion of the first signal conductor layer 18. The interlayer connection conductor v2 penetrates the first dielectric layer 16c in the vertical direction. The interlayer connection conductor v2 electrically connects the first signal electrode 32 and the right end portion of the first signal conductor layer 18. Thus, high-frequency signals are input and output via the first signal electrode 32.

[0098] The first branch electrode 34 is located on the first lower main surface S2. In the present embodiment, the first branch electrode 34 is located on the lower main surface of the first dielectric layer 16c. The first branch electrode 34 is electrically connected to the first branch conductor layer 19. Specifically, when observed in the vertical direction, the first branch electrode 34 overlaps with the right end portion of the first branch conductor layer 19. The interlayer connection conductor v3 penetrates the first dielectric layer 16c in the vertical direction. The interlayer connection conductor v3 electrically connects the first branch electrode 34 and the right end portion of the first branch conductor layer 19. Additionally, in a state where the first circuit board 10 and the second circuit board 110 are not connected, the first branch electrode 34 is not electrically connected to any ground conductor layer.

[0099] The first ground electrode 36 is located on the first lower main surface S2. In the present embodiment, the first ground electrode 36 is located on the lower main surface of the first dielectric layer 16c. The first ground electrode 36 is electrically connected to the first ground conductor layer 20b. In the present embodiment, the first ground electrode 36 and the first ground conductor layer 20b together form a conductor layer.

[0100] The first signal conductor layer 18, the first branch conductor layer 19, the third ground conductor layer 20a, the first ground conductor layer 20b, the upper surface signal electrode 30, the first signal electrode 32, the first branch electrode 34, and the first ground electrode 36 as described above are formed by adhering a metal foil to the upper main surface or the lower main surface of the first dielectric layers 16a to 16c and patterning the metal foil through a photolithography process. The metal foil is, for example, a copper foil.

[0101] In addition, the interlayer connection conductors v1 to v3 are formed by filling a conductive paste into through holes that penetrate the first dielectric layers 16a to 16c in the vertical direction and curing the conductive paste by heating. However, the interlayer connection conductors v1 to v3 can also be formed by plating the through holes.

[0102] The protective layer 17a is laminated on the uppermost layer in the first substrate body 12. The protective layer 17a covers the third ground conductor layer 20a. However, the upper surface signal electrode 30 is exposed to the outside of the first substrate body 12 through an opening provided in the protective layer 17a.

[0103] The first protective layer 17b is laminated on the lowermost layer in the first substrate body 12. The first protective layer 17b covers the first ground conductor layer 20b. However, the first signal electrode 32, the first branch electrode 34, and the first ground electrode 36 are exposed to the outside of the first substrate body 12 through openings provided in the first protective layer 17b. The protective layer 17a and the first protective layer 17b as described above are dielectric layers. The protective layer 17a and the first protective layer 17b can be formed by printing or by adhering a resin sheet.

[0104] Next, the structure of the second circuit board 110 will be described. The second circuit board 110 is located at a position lower than the first circuit board 10 and has a portion that overlaps the first circuit board 10 when viewed in the vertical direction. The second circuit board 110 includes a second substrate body 112, a second signal conductor layer 118, a second ground conductor layer 120a, a ground conductor layer 120b, a lower surface signal electrode 130, a second signal electrode 132, a second branch electrode 134, a second ground electrode 136, and interlayer connection conductors v11 and v12.

[0105] The second substrate body 112 has a plate shape. The second substrate body 112 has a second upper main surface S11 and a second lower main surface S12. The second substrate body 112 has a structure in which a plurality of second dielectric layers 116a to 116c, a second protective layer 117a, and a protective layer 117b are stacked in the vertical direction. The second dielectric layers 116a to 116c are arranged in order from top to bottom. The second dielectric layers 116a to 116c are flexible dielectric sheets. The material of the second dielectric layers 116a to 116c is resin. In the present embodiment, the material of the second dielectric layers 116a to 116c is a thermoplastic resin. The thermoplastic resin is, for example, a liquid crystal polymer, PTFE (polytetrafluoroethylene), or the like. In addition, the material of the second dielectric layers 116a to 116c may also be polyimide. Regarding the second dielectric layers 116a to 116c, the adjacent second dielectric layers in the vertical direction are fused to each other. Such a second substrate body 112 has flexibility. The second protective layer 117a and the protective layer 117b will be described later.

[0106] The second signal conductor layer 118 is provided on the second substrate body 112. In the present embodiment, the second signal conductor layer 118 is located on the upper main surface of the second dielectric layer 116b. The second signal conductor layer 118 has a linear shape extending in the left-right direction. A high-frequency signal is transmitted through the second signal conductor layer 118.

[0107] The second ground conductor layer 120a is provided on the second substrate body 112. In the present embodiment, the second ground conductor layer 120a is located on the upper main surface of the second dielectric layer 116a. Thus, the second ground conductor layer 120a is located at a position higher than the second signal conductor layer 118. When observed in the vertical direction, the second ground conductor layer 120a overlaps with the second signal conductor layer 118.

[0108] The ground conductor layer 120b is provided on the second substrate body 112. In the present embodiment, the ground conductor layer 120b is located on the lower main surface of the second dielectric layer 116c. Thus, the ground conductor layer 120b is located at a position lower than the second signal conductor layer 118. When observed in the vertical direction, the ground conductor layer 120b overlaps with the second signal conductor layer 118. In addition, the ground conductor layer 120b is electrically connected to the second ground conductor layer 120a via an interlayer connection conductor (not shown). The second signal conductor layer 118, the second ground conductor layer 120a, and the ground conductor layer 120b as described above have a stripline structure.

[0109] The lower surface signal electrode 130 is located on the second lower main surface S12. In the present embodiment, the lower surface signal electrode 130 is located on the lower main surface of the second dielectric layer 116c. The lower surface signal electrode 130 is electrically connected to the second signal conductor layer 118. When observed in the vertical direction, the lower surface signal electrode 130 overlaps with the left end portion of the second signal conductor layer 118. The interlayer connection conductor v11 penetrates through the second dielectric layers 116b and 116c in the vertical direction. The interlayer connection conductor v11 electrically connects the lower surface signal electrode 130 and the left end portion of the second signal conductor layer 118. Thus, high-frequency signals are input and output via the lower surface signal electrode 130.

[0110] The second signal electrode 132 is located on the second upper main surface S11. In the present embodiment, the second signal electrode 132 is located on the upper main surface of the second dielectric layer 116a. The second signal electrode 132 is electrically connected to the second signal conductor layer 118. Specifically, when observed in the vertical direction, the second signal electrode 132 overlaps with the right end portion of the second signal conductor layer 118. The interlayer connection conductor v12 penetrates through the second dielectric layer 116a in the vertical direction. The interlayer connection conductor v12 electrically connects the second signal electrode 132 and the right end portion of the second signal conductor layer 118. Thus, high-frequency signals are input and output via the second signal electrode 132.

[0111] The second branch electrode 134 is located on the second upper main surface S11. In the present embodiment, the second branch electrode 134 is located on the upper main surface of the second dielectric layer 116a. The second branch electrode 134 is electrically connected to the second ground conductor layer 120a.

[0112] The second ground electrode 136 is located on the second upper main surface S11. In the present embodiment, the second ground electrode 136 is located on the upper main surface of the second dielectric layer 116a. The second ground electrode 136 is electrically connected to the second ground conductor layer 120a. In the present embodiment, the second ground electrode 136, the second ground conductor layer 120a, and the second branch electrode 134 together form a conductor layer.

[0113] The second signal conductor layer 118, the second ground conductor layer 120a, the ground conductor layer 120b, the lower surface signal electrode 130, the second signal electrode 132, the second branch electrode 134, and the second ground electrode 136 as described above are formed by adhering metal foils on the upper main surfaces or lower main surfaces of the second dielectric layers 116a to 116c and patterning the metal foils through a photolithography process. The metal foil is, for example, a copper foil.

[0114] The interlayer connection conductors v11 and v12 are formed by filling conductive paste into through-holes that vertically penetrate the second dielectric layers 116a to 116c and curing the conductive paste by heating. However, the interlayer connection conductors v11 and v12 can also be formed by plating the through-holes.

[0115] The second protective layer 117a is stacked on top of the second substrate body 112. The second protective layer 117a covers the second ground conductor layer 120a. However, the second signal electrode 132, the second branch electrode 134, and the second ground electrode 136 are exposed outside the second substrate body 112 through openings provided in the second protective layer 117a.

[0116] Protective layer 117b is laminated at the bottom of second substrate body 112. Protective layer 117b covers ground conductor layer 120b. However, lower surface signal electrode 130 is exposed outside second substrate body 112 through an opening provided in protective layer 117b. Second protective layers 117a and 117b are dielectric layers. They can be formed by printing or by adhering a resin sheet.

[0117] The second circuit substrate 110, as described above, is connected to the first circuit substrate 10. More specifically, the second signal electrode 132 is bonded to the first signal electrode 32 via the conductive bonding material 200a. This electrically connects the second signal conductor layer 118 to the first signal conductor layer 18. Furthermore, the second branch electrode 134 is bonded to the first branch electrode 34 via the conductive bonding material 200b. The second branch electrode 134 is electrically connected to the second ground conductor layer 120a. Therefore, when the first circuit substrate 10 and the second circuit substrate 110 are connected, the first branch electrode 34 is bonded to the second branch electrode 134 of the second circuit substrate 110 via the conductive bonding material 200b, thereby being connected to the ground potential. Furthermore, the second ground electrode 136 is bonded to the first ground electrode 36 via the conductive bonding material 200c. This electrically connects the second ground conductor layer 120a to the first ground conductor layer 20b. The conductive bonding materials 200a, 200b, and 200c are, for example, solder, but may also be, for example, a conductive adhesive in which metal powder is dispersed in a resin.

[0118] However, the second circuit board 110 is fixed to the first circuit board 10 only by the conductive adhesive containing the conductive bonding materials 200a and 200b. Therefore, the portion of the second circuit board 110 other than the conductive adhesive is not fixed to the first circuit board 10. In other words, the second protective layer 117a is not fixed to the first protective layer 17b.

[0119] Next, the usage method of circuit module 1 will be described. Figure 2 And Figure 3 is the rear view of circuit module 1 during use.

[0120] As Figure 2 shown, a connector 50 is mounted on the signal electrode 30 on the upper surface of the first circuit board 10. A connector 150 is mounted on the signal electrode 130 on the lower surface of the second circuit board 110. In addition, when using circuit module 1, the first substrate body 12 of the first circuit board 10 bends. The following will be described in detail.

[0121] As Figure 1 And Figure 2 shown, the first substrate body 12 has a first section A1, a second section A2, and a third section A3. The first section A1, the second section A2, and the third section A3 are arranged in sequence from right to left. The first signal electrode 32, the first branch electrode 34, and the first ground electrode 36 are located in the first section A1. The connector 50 is located in the third section A3.

[0122] Define the up-down direction in the first section A1 as the Z-axis direction. The positive direction of the Z-axis is the upward direction in the first section A1. The negative direction of the Z-axis is the downward direction in the first section A1. At this time, the second section A2 bends in the Z-axis direction relative to the first section A1. In the present embodiment, the second section A2 bends in the positive direction of the Z-axis relative to the first section A1. In addition, the first section A1 and the third section A3 do not bend. However, the first section A1 and the third section A3 may also bend. In this case, the radius of curvature of the first section A1 and the radius of curvature of the third section A3 are larger than the radius of curvature of the second section A2.

[0123] In addition, when using circuit module 1, the second substrate body 112 of the second circuit board 110 may also bend. The following will be described in detail.

[0124] As Figure 1 And Figure 3 shown, the second substrate body 112 has a fourth section A4, a fifth section A5, and a sixth section A6. The fourth section A4, the fifth section A5, and the sixth section A6 are arranged in sequence from right to left. The second signal electrode 132, the second branch electrode 134, and the second ground electrode 136 are located in the fourth section A4. The connector 150 is located in the sixth section A6.

[0125] The up-down direction in the fourth section A4 is defined as the Z-axis direction. The positive direction of the Z-axis is the upward direction in the fourth section A4. The negative direction of the Z-axis is the downward direction in the fourth section A4. At this time, the fifth section A5 is bent in the Z-axis direction relative to the fourth section A4. In this embodiment, the fifth section A5 is bent in the negative direction of the Z-axis relative to the fourth section A4. In addition, the fourth section A4 and the sixth section A6 are not bent. However, the fourth section A4 and the sixth section A6 may also be bent. In this case, the curvature radius of the fourth section A4 and the curvature radius of the sixth section A6 are larger than the curvature radius of the fifth section A5.

[0126] [Effect]

[0127] (a) According to circuit module 1, the characteristic impedance generated at the connection portion between first circuit board 10 and second circuit board 110 can be suppressed from deviating from a desired characteristic impedance. More specifically, the connection portion between first circuit board 10 and second circuit board 110 includes first signal electrode 32, second signal electrode 132, interlayer connection conductors v2 and v12, and conductive bonding material 200a. Therefore, the structure of the connection portion between first circuit board 10 and second circuit board 110 differs significantly from the structures of first signal conductor layer 18 and second signal conductor layer 118. Consequently, the characteristic impedance generated at the connection portion between first circuit board 10 and second circuit board 110 is likely to differ from the characteristic impedance generated at first signal conductor layer 18 and second signal conductor layer 118.

[0128] Therefore, in circuit module 1, a short-circuit stub is provided on first circuit substrate 10. The short-circuit stub matches the characteristic impedance generated at the connection between first circuit substrate 10 and second circuit substrate 110 with the characteristic impedance generated in first signal conductor layer 18 and the characteristic impedance generated in second signal conductor layer 118. More specifically, first branch conductor layer 19 is electrically connected to first signal conductor layer 18. Furthermore, first branch conductor layer 19 is electrically connected to second ground conductor layer 120a, which is connected to ground potential, via first branch electrode 34, second branch electrode 134, and conductive bonding material 200a. Thus, first branch conductor layer 19 functions as a short-circuit stub. As a result, first branch conductor layer 19 matches the characteristic impedance generated at the connection between first circuit substrate 10 and second circuit substrate 110 with the characteristic impedance generated in first signal conductor layer 18 and the characteristic impedance generated in second signal conductor layer 118. As described above, according to the circuit module 1 , it is possible to suppress the characteristic impedance generated at the connection portion between the first circuit board 10 and the second circuit board 110 from deviating from a desired characteristic impedance.

[0129] The length of the short-circuit stub is designed so that the characteristic impedance generated at the connection between the first circuit board 10 and the second circuit board 110 matches the characteristic impedance generated in the first signal conductor layer 18 and the characteristic impedance generated in the second signal conductor layer 118. The length of the short-circuit stub is, for example, less than the wavelength of the high-frequency signal.

[0130] (b) According to the circuit module 1, it becomes easy to detect a short circuit in the first circuit board 10. Hereinafter, a circuit board 510 according to a comparative example will be described as an example. Figure 4 5 is a cross-sectional view of the circuit board 510 .

[0131] Circuit board 510 includes a signal conductor layer 518, a branch conductor layer 519, ground conductor layers 520a and 520b, a signal electrode 532, a ground electrode 536, and interlayer connection conductors v111 to v113. Signal conductor layer 518 and ground conductor layers 520a and 520b have a stripline structure. Interlayer connection conductor v111 electrically connects the right end of signal conductor layer 518 to signal electrode 532.

[0132] The branch conductor layer 519 extends rightward from the right end of the signal conductor layer 518. The interlayer connecting conductor v112 electrically connects the right end of the branch conductor layer 519 to the ground conductor layer 520b. The interlayer connecting conductor v113 electrically connects the ground conductor layer 520b to the ground electrode 536. As described above, the circuit board 510 does not include branch electrodes. Therefore, the branch conductor layer 519 is electrically connected to the ground conductor layer 520b within the circuit board 510.

[0133] In such a circuit substrate 510 , it is difficult to detect a short circuit between the signal conductor layer 518 and the ground conductor layer 520 b .

[0134] Therefore, in circuit module 1, the first branch electrode 34 is electrically connected to the first branch conductor layer 19. The first branch electrode 34 does not contact the first ground conductor layer 20b. Consequently, when the first circuit board 10 and the second circuit board 110 are not connected, the first branch electrode 34 is not electrically connected to either ground conductor layer. Therefore, it is possible to detect a short circuit between the first signal conductor layer 18 and the first ground conductor layer 20b, and a short circuit between the first signal conductor layer 18 and the third ground conductor layer 20a, even when the first circuit board 10 and the second circuit board 110 are not connected. As described above, circuit module 1 facilitates detection of a short circuit in the first circuit board 10.

[0135] (c) In circuit module 1, the first signal conductor layer 18, the third ground conductor layer 20a, and the first ground conductor layer 20b have a stripline structure. Thereby, it becomes easy to make the characteristic impedance generated in the first signal conductor layer 18 approach the desired characteristic impedance (for example, 50 Ω).

[0136] (d) In circuit module 1, it is possible to suppress the deviation of the characteristic impedance generated at the connection portion between the first circuit board 10 and the second circuit board 110 from the desired characteristic impedance. More specifically, the first signal electrode 32 and the first branch electrode 34 are exposed to the outside of the first substrate body 12 through the openings provided in the first protective layer 17b. The second signal electrode 132 and the second branch electrode 134 are exposed to the outside of the second substrate body 112 through the openings provided in the second protective layer 117a. Thereby, the shape of the conductive bonding material 200a is determined by the shapes of the two openings, the thickness of the first protective layer 17b in the vertical direction, and the thickness of the second protective layer 117a in the vertical direction. Therefore, the deviation of the shape of the conductive bonding material 200a can be suppressed, and the deviation of the characteristic impedance generated in the conductive bonding material 200a can be suppressed. Based on the above, in circuit module 1, it is possible to suppress the deviation of the characteristic impedance generated at the connection portion between the first circuit board 10 and the second circuit board 110 from the desired characteristic impedance.

[0137] (e) In circuit module 1, it is possible to suppress the deviation of the characteristic impedance generated in the first signal conductor layer 18. More specifically, the first circuit board 10 has a second section A2 that is bent in the Z-axis direction with respect to the first section A1. In this way, in order to enable the second section A2 to be bent, it is necessary to reduce the thickness of the first substrate body 12 in the vertical direction. However, if the thickness of the first substrate body 12 in the vertical direction becomes smaller, the distance between the first signal conductor layer 18 and the third ground conductor layer 20a and the distance between the first signal conductor layer 18 and the first ground conductor layer 20b become smaller. As a result, the characteristic impedance generated in the first signal conductor layer 18 becomes liable to deviate from the desired characteristic impedance. Therefore, in the first circuit board 10, a short-circuit stub is provided. Thereby, it is possible to match the characteristic impedance generated in the first signal conductor layer 18 with the desired characteristic impedance.

[0138] (First Modified Example)

[0139] Hereinafter, the circuit module 1a according to the first modified example will be described with reference to the drawings. Figure 5 It is a top view of the first signal conductor layer 18, the first branch conductor layer 19, the first signal electrode 32, the first branch electrode 34, and the third ground electrode 36a of the circuit module 1a.

[0140] The first circuit board 10a of the circuit module 1a may also include one or more first ground electrodes 36. The one or more first ground electrodes 36 include the third ground electrode 36a. Additionally, the first ground electrodes 36 other than the third ground electrode 36a are not shown in Figure 5 . Also, when observed in the vertical direction, the distance a1 between the first signal electrode 32 and the first branch electrode 34 is longer than the distance b1 between the first signal electrode 32 and the third ground electrode 36a and the distance c1 between the first branch electrode 34 and the third ground electrode 36a (Condition 1). The other configurations of the circuit module 1a are the same as those of the circuit module 1, and thus the description thereof is omitted. The circuit module 1a can achieve the effects (a) to (e).

[0141] (f) According to the circuit module 1a, leakage of the electromagnetic field between the first signal electrode 32 and the first branch electrode 34 can be suppressed. More specifically, when observed in the vertical direction, the distance a1 between the first signal electrode 32 and the first branch electrode 34 is longer than the distance b1 between the first signal electrode 32 and the third ground electrode 36a and the distance c1 between the first branch electrode 34 and the third ground electrode 36a. Therefore, in the circuit module 1a, the distance between the first signal electrode 32 and the first branch electrode 34 is long. However, the third ground electrode 36a is located near the first signal electrode 32 and near the first branch electrode 34. The third ground electrode 36a is connected to the ground potential. Thereby, the third ground electrode 36a shields between the first signal electrode 32 and the first branch electrode 34. As a result, according to the circuit module 1a, leakage of the electromagnetic field between the first signal electrode 32 and the first branch electrode 34 can be suppressed.

[0142] (Second Modified Example)

[0143] Hereinafter, the circuit module 1b according to the second modified example will be described with reference to the drawings. Figure 6 is a top view of the first signal conductor layer 18, the first branch conductor layer 19, the first signal electrode 32, the first branch electrode 34, and the third ground electrode 36a of the circuit module 1b.

[0144] In circuit module 1b, the first branched conductor layer 19 does not extend rightward from the right end of the first signal conductor layer 18. Instead, it extends rearward from between the left and right ends of the first signal conductor layer 18. In other words, the first branched conductor layer 19 has a structure that branches from the first signal conductor layer 18. Furthermore, in circuit module 1b, as in circuit module 1a, the distance a1 between the first signal electrode 32 and the first branched electrode 34, viewed in the vertical direction, is longer than the distance b1 between the first signal electrode 32 and the third ground electrode 36a, and the distance c1 between the first branched electrode 34 and the third ground electrode 36a. The remaining structure of circuit module 1b is identical to that of circuit module 1a, and therefore its description is omitted. Circuit module 1b can achieve the effects (a) to (f).

[0145] (Third Modification)

[0146] Hereinafter, a circuit module 1 c according to a third modification will be described with reference to the drawings. Figure 7 1 is a plan view of the first signal conductor layer 18 , the first branch conductor layer 19 , the first signal electrode 32 , the first branch electrode 34 , the third ground electrode 36 a , and the fourth ground electrode 36 b of the circuit module 1 c .

[0147] In circuit module 1c, at least one first ground electrode 36 further includes a fourth ground electrode 36b. When viewed in the vertical direction, the distance a2 between the first signal electrode 32 and the first branch electrode 34 is shorter than the distance b2 between the first signal electrode 32 and the fourth ground electrode 36b or the distance c2 between the first branch electrode 34 and the fourth ground electrode 36b. In this embodiment, when viewed in the vertical direction, the distance a2 between the first signal electrode 32 and the first branch electrode 34 is longer than the distance b2 between the first signal electrode 32 and the fourth ground electrode 36b. When viewed in the vertical direction, the distance a2 between the first signal electrode 32 and the first branch electrode 34 is shorter than the distance c2 between the first branch electrode 34 and the fourth ground electrode 36b. As described above, circuit module 1c may include a fourth ground electrode 36b that does not satisfy condition 1, which is satisfied in circuit module 1a. The remaining structure of circuit module 1c is identical to that of circuit module 1a, and therefore its description is omitted. The circuit module 1 c can achieve the effects (a) to (f).

[0148] (Fourth Modification)

[0149] Hereinafter, a circuit module 1d according to a fourth modification will be described with reference to the drawings. Figure 8 It is a plan view of the first signal conductor layer 18 , the first branch conductor layer 19 , the first signal electrode 32 , the first branch electrode 34 , the third ground electrode 36 a , and the fourth ground electrode 36 b of the circuit module 1 d .

[0150] Circuit module 1d has the same structure as circuit module 1b. However, in circuit module 1d, one or more first ground electrodes 36 further include a fourth ground electrode 36b. When viewed in the vertical direction, the distance a2 between the first signal electrode 32 and the first branch electrode 34 is shorter than the distance b2 between the first signal electrode 32 and the fourth ground electrode 36b, or the distance c2 between the first branch electrode 34 and the fourth ground electrode 36b. In this embodiment, when viewed in the vertical direction, the distance a2 between the first signal electrode 32 and the first branch electrode 34 is longer than the distance b2 between the first signal electrode 32 and the fourth ground electrode 36b. When viewed in the vertical direction, the distance a2 between the first signal electrode 32 and the first branch electrode 34 is shorter than the distance c2 between the first branch electrode 34 and the fourth ground electrode 36b. As described above, circuit module 1d may include a fourth ground electrode 36b that does not satisfy condition 1, which is satisfied in circuit module 1a. The remaining structure of circuit module 1d is the same as that of circuit module 1b, and therefore its description is omitted. The circuit module 1d can achieve the effects (a) to (f).

[0151] (Fifth Modification)

[0152] Hereinafter, a circuit module 1e according to a fifth modification will be described with reference to the drawings. Figure 9 1 is a plan view of the first signal conductor layer 18 , the first branch conductor layer 19 , the open stub conductor layer 70 a , the first signal electrode 32 , and the first branch electrode 34 of the circuit module 1 e .

[0153] The first circuit substrate 10e of the circuit module 1e may further include an open stub conductor layer 70a. The open stub conductor layer 70a is electrically connected to the first signal conductor layer 18 or the first branch conductor layer 19. In this embodiment, the open stub conductor layer 70a is in contact with the first signal conductor layer 18. The open stub conductor layer 70a is not electrically connected to any electrodes other than the electrode electrically connected to the first signal conductor layer 18. More precisely, the open stub conductor layer 70a is not in contact with any conductor layer other than the first signal conductor layer 18. Thus, the front end of the open stub conductor layer 70a becomes an open end. The rest of the structure of the circuit module 1e is the same as that of the circuit module 1. The circuit module 1e can achieve the effects (a) to (e).

[0154] (g) In the circuit module 1e, the open-stub conductor layer 70a functions as an open-stub. Therefore, the characteristic impedance generated at the connection between the first circuit board 10 and the second circuit board 110 is more closely matched with the characteristic impedance generated by the first signal conductor layer 18 and the characteristic impedance generated by the second signal conductor layer 118.

[0155] (Sixth Modification)

[0156] Hereinafter, a circuit module 1f according to a sixth modification will be described with reference to the drawings. Figure 10 1 is a plan view of the first signal conductor layer 18 , the first branch conductor layer 19 , the open stub conductor layers 70 a and 70 b , the first signal electrode 32 , and the first branch electrode 34 of the circuit module 1 f .

[0157] Circuit module 1f has the same structure as circuit module 1b. However, the first circuit substrate 10f of circuit module 1f further includes open stub conductor layers 70a and 70b. The open stub conductor layers 70a and 70b are electrically connected to the first signal conductor layer 18 or the first branch conductor layer 19. In this embodiment, the open stub conductor layers 70a and 70b are in contact with the first signal conductor layer 18. The open stub conductor layer 70a is in contact with the first signal conductor layer 18 between the left end of the first signal conductor layer 18 and the front end of the first branch conductor layer 19. The open stub conductor layer 70b is in contact with the first signal conductor layer 18 between the right end of the first signal conductor layer 18 and the front end of the first branch conductor layer 19. The open stub conductor layers 70a and 70b are not electrically connected to any electrodes other than the electrodes electrically connected to the first signal conductor layer 18. More precisely, the open-stub conductor layers 70a and 70b do not contact any conductor layer other than the first signal conductor layer 18. Consequently, the tips of the open-stub conductor layers 70a and 70b are open-circuited. The remaining structure of circuit module 1f is the same as that of circuit module 1b. Circuit module 1e can achieve the effects (a) through (g).

[0158] (7th Modification)

[0159] Hereinafter, a circuit module 1g according to a seventh modification will be described with reference to the drawings. Figure 11 It is a plan view of the first signal conductor layer 18 , the first branch conductor layer 19 , the second branch conductor layer 72 a , the first signal electrode 32 , the first branch electrode 34 , and the third branch electrode 38 a of the circuit module 1 g . Figure 12 yes Figure 11 Cross-sectional view at A-A.

[0160] The first circuit board 10g of the circuit module 1g further includes a second branch conductor layer 72a, a third branch electrode 38a, and an interlayer connecting conductor v4. The second branch conductor layer 72a is provided on the first substrate body 12. The second branch conductor layer 72a is electrically connected to the first signal conductor layer 18. In this embodiment, the second branch conductor layer 72a is in contact with the first signal conductor layer 18. The third branch electrode 38a is located on the first lower main surface S2. The third branch electrode 38a is electrically connected to the second branch conductor layer 72a. More specifically, the interlayer connecting conductor v4 electrically connects the tip of the second branch conductor layer 72a to the third branch electrode 38a.

[0161] The second circuit board 110g of the circuit module 1g further includes a fourth branch electrode 138a. The fourth branch electrode 138a is located on the second upper main surface S11. The fourth branch electrode 138a is electrically connected to the second ground conductor layer 120a. The fourth branch electrode 138a is joined to the third branch electrode 38a through a conductive bonding material 200d. Other configurations of the circuit module 1g are the same as those of the circuit module 1. The circuit module 1g can achieve the effects of (a) to (e).

[0162] (h)In the circuit module 1g, the second branch conductor layer 72a functions as a short - circuit stub. Therefore, the characteristic impedance generated at the connection portion between the first circuit board 10 and the second circuit board 110 becomes more matched with the characteristic impedance generated at the first signal conductor layer 18 and the characteristic impedance generated at the second signal conductor layer 118.

[0163] (The eighth modification)

[0164] Hereinafter, the circuit module 1h according to the eighth modification will be described with reference to the drawings. Figure 13 is a top view of the first signal conductor layer 18, the first branch conductor layer 19, the second branch conductor layers 72a, 72b, the first signal electrode 32, the first branch electrode 34, and the third branch electrodes 38a, 38b of the circuit module 1h. For the cross - sectional view of the circuit module 1h, refer to Figure 12 .

[0165] The circuit module 1h has the same configuration as the circuit module 1b. However, the first circuit board 10h of the circuit module 1h further includes the second branch conductor layers 72a, 72b, the third branch electrodes 38a, 38b, and the inter - layer connection conductors v4, v5. The second branch conductor layers 72a, 72b are electrically connected to the first signal conductor layer 18. The second branch conductor layer 72a contacts the first signal conductor layer 18 between the left end of the first signal conductor layer 18 and the front end of the first branch conductor layer 19. The second branch conductor layer 72b contacts the first signal conductor layer 18 between the right end of the first signal conductor layer 18 and the front end of the first branch conductor layer 19. In addition, the starting point of the second branch conductor layer 72b is the portion branched from the first signal conductor layer 18.

[0166] The third branch electrodes 38a, 38b are located on the first lower main surface S2. The third branch electrode 38a is electrically connected to the second branch conductor layer 72a. More specifically, the inter - layer connection conductor v4 electrically connects the front end of the second branch conductor layer 72a and the third branch electrode 38a. The third branch electrode 38b is electrically connected to the second branch conductor layer 72b. More specifically, the inter - layer connection conductor v5 (not shown) electrically connects the front end of the second branch conductor layer 72b and the third branch electrode 38b.

[0167] The second circuit board 110h of the circuit module 1h further includes fourth branch electrodes 138a and 138b (the fourth branch electrode 138b is not shown). The fourth branch electrodes 138a and 138b are located on the second upper main surface S11. The fourth branch electrodes 138a and 138b are electrically connected to the second ground conductor layer 120a. The fourth branch electrode 138a is joined to the third branch electrode 38a by a conductive bonding material 200d. The fourth branch electrode 138b is joined to the third branch electrode 38b by a conductive bonding material 200e (not shown). Other configurations of the circuit module 1h are the same as those of the circuit module 1b. The circuit module 1h can achieve the effects of (a) to (e) and (h).

[0168] (The ninth modification example)

[0169] Hereinafter, the circuit module 1i according to the ninth modification example will be described with reference to the drawings. Figure 14 It is a top view of the first signal conductor layer 18, the first branch conductor layer 19, the first signal electrode 32, and the first branch electrode 34 of the circuit module 1i.

[0170] In the circuit module 1i, when viewed in the vertical direction, the line width of a part of the first signal conductor layer 18 is different from the line width of the remaining part of the first signal conductor layer 18. Accordingly, the characteristic impedance generated in a part of the first signal conductor layer 18 is different from the characteristic impedance generated in the remaining part of the first signal conductor layer 18. In the present embodiment, when viewed in the vertical direction, the line width of a part of the first signal conductor layer 18 is larger than the line width of the remaining part of the first signal conductor layer 18. Accordingly, the characteristic impedance generated in a part of the first signal conductor layer 18 is lower than the characteristic impedance generated in the remaining part of the first signal conductor layer 18.

[0171] In addition, in the circuit module 1i, when viewed in the vertical direction, the line width of a part of the first branch conductor layer 19 is different from the line width of the remaining part of the first branch conductor layer 19. Accordingly, the characteristic impedance generated in a part of the first branch conductor layer 19 is different from the characteristic impedance generated in the remaining part of the first branch conductor layer 19. In the present embodiment, when viewed in the vertical direction, the line width of a part of the first branch conductor layer 19 is larger than the line width of the remaining part of the first branch conductor layer 19. Accordingly, the characteristic impedance generated in a part of the first branch conductor layer 19 is lower than the characteristic impedance generated in the remaining part of the first branch conductor layer 19. Other configurations of the circuit module 1i are the same as those of the circuit module 1, and thus the description thereof is omitted. The circuit module 1i can achieve the effects of (a) to (e).

[0172] (i) According to the circuit module 1i, by adjusting the characteristic impedance generated in a portion of the first signal conductor layer 18 and the characteristic impedance generated in a portion of the first branch conductor layer 19, the characteristic impedance generated in the connection portion between the first circuit board 10 and the second circuit board 110 becomes more closely matched with the characteristic impedance generated in the first signal conductor layer 18 and the characteristic impedance generated in the second signal conductor layer 118.

[0173] (10th Modification)

[0174] Hereinafter, a circuit module 1j according to a tenth modification will be described with reference to the drawings. Figure 15 is a cross-sectional view of the circuit module 1j.

[0175] The second circuit board 110j of the circuit module 1j includes a second radiating conductor layer 118a in place of the second signal conductor layer 118. Specifically, the second radiating conductor layer 118a is located on the lower main surface of the second dielectric layer 116b. When viewed in the vertical direction, the second radiating conductor layer 118a has a rectangular shape. Furthermore, the second circuit board 110j includes a second ground conductor layer 120a that overlaps with the second radiating conductor layer 118a when viewed in the vertical direction. This allows the second radiating conductor layer 118a to function as a patch antenna. Specifically, the second radiating conductor layer 118a transmits or receives electromagnetic waves.

[0176] Furthermore, the vertical thickness of the first substrate body 12 is smaller than that of the second substrate body 112. Furthermore, the dielectric constants of the second dielectric layers 116a and 116b are higher than those of the first dielectric layers 16a to 16c. The remaining structure of the circuit module 1j is the same as that of the circuit module 1, and therefore its description is omitted. The circuit module 1j can achieve the effects (a) to (e).

[0177] (j) According to the circuit module 1 j , the characteristic impedance generated in the first signal conductor layer 18 and the characteristic impedance generated in the second radiation conductor layer 118 a can be matched, thereby increasing the power supplied from the first signal conductor layer 18 to the second radiation conductor layer 118 a .

[0178] (k) According to the circuit module 1j, it is possible to improve the antenna characteristics while suppressing the increase of the circuit module 1j in the up-down direction. More specifically, if the thickness of the second substrate body 112 in the up-down direction becomes larger, the antenna characteristics are improved. Therefore, the thickness of the second substrate body 112 in the up-down direction is large. However, the circuit module 1j becomes larger. Therefore, in the circuit module 1j, the thickness of the first substrate body 12 in the up-down direction is smaller than the thickness of the second substrate body 112 in the up-down direction. Thus, the increase in the thickness of the second substrate body 112 in the up-down direction is offset by the decrease in the thickness of the second substrate body 112 in the up-down direction. As a result, it is possible to suppress the increase of the circuit module 1j in the up-down direction.

[0179] (l) In the circuit module 1j, the dielectric constants of the second dielectric layers 116a to 116c are higher than the dielectric constants of the first dielectric layers 16a to 16c. Thus, the dielectric constant between the second ground conductor layer 120a and the second radiation conductor layer 118a becomes higher. Therefore, it is possible to reduce the thickness of the second substrate body 112 in the up-down direction while maintaining the antenna characteristics.

[0180] (11th modified example)

[0181] Hereinafter, the circuit module 1k according to the 11th modified example will be described with reference to the drawings. Figure 16 It is a cross-sectional view of the circuit module 1k.

[0182] The circuit module 1k further includes a first radiation conductor layer 80 electrically connected to the first signal conductor layer 18. Specifically, the first radiation conductor layer 80 is a conductor layer provided on the first substrate body 12. The first radiation conductor layer 80 is located on the upper main surface of the first dielectric layer 16a. When observed in the up-down direction, the first radiation conductor layer 80 has a rectangular shape. When observed in the up-down direction, the first radiation conductor layer 80 overlaps with the first ground conductor layer 20b. Thus, the first radiation conductor layer 80 functions as a patch antenna.

[0183] In addition, the thickness of the second substrate body 112 in the up-down direction is smaller than the thickness of the first substrate body 12 in the up-down direction. Moreover, the dielectric constants of the first dielectric layers 16a to 16c are higher than the dielectric constants of the second dielectric layers 116a to 116c. The other configurations of the circuit module 1k are the same as those of the circuit module 1, so the description thereof is omitted. The circuit module 1k can achieve the effects of (a) to (e).

[0184] (m) According to the circuit module 1k, it is possible to seek the matching of the characteristic impedance generated in the first signal conductor layer 18 and the characteristic impedance generated in the second signal conductor layer 118 as an antenna. Therefore, it is possible to increase the power supplied from the second signal conductor layer 118 to the antenna.

[0185] (n) According to the circuit module 1k, it is possible to improve the antenna characteristics while suppressing the increase of the circuit module 1k in the vertical direction. More specifically, if the thickness of the first substrate body 12 in the vertical direction becomes larger, the antenna characteristics are improved. Therefore, the thickness of the first substrate body 12 in the vertical direction is large. However, the circuit module 1k becomes larger. Therefore, in the circuit module 1k, the thickness of the second substrate body 112 in the vertical direction is smaller than the thickness of the first substrate body 12 in the vertical direction. Thus, the increase in the thickness of the first substrate body 12 in the vertical direction is offset by the decrease in the thickness of the second substrate body 112 in the vertical direction. Thereby, it is possible to suppress the increase of the circuit module 1k in the vertical direction.

[0186] (o) In the circuit module 1k, the dielectric constants of the first dielectric layers 16a to 16c are higher than the dielectric constants of the second dielectric layers 116a to 116c. Thereby, the dielectric constant between the first ground conductor layer 20b and the first radiation conductor layer 80 becomes higher. Thus, it is possible to reduce the thickness of the first substrate body 12 in the vertical direction while maintaining the antenna characteristics.

[0187] (First Twelfth Modification)

[0188] Hereinafter, the circuit module 1l according to the twelfth modification will be described with reference to the drawings. Figure 17 It is a cross-sectional view of the circuit module 1l.

[0189] In the first circuit board 10l of the circuit module 1l, the first ground conductor layer 20b is provided at the same position as the first branch electrode 34 in the vertical direction. In addition, when viewed in the vertical direction, the first ground conductor layer 20b surrounds the first branch electrode 34. Moreover, a part of the first ground conductor layer 20b is exposed to the outside of the first substrate body 12 together with the first branch electrode 34 through the opening provided in the first protective layer 17b. A part of the first ground conductor layer 20b and the first branch electrode 34 are joined to the second branch electrode 134 through the conductive bonding material 200b. In addition, the first ground electrode 36 is the part where the ground conductor is exposed from the first protective layer 17b. The first ground electrode 36 is electrically connected to the second ground electrode 136 through the conductive bonding material 200c. Other configurations of the circuit module 1l are the same as those of the circuit module 1, and thus the description thereof is omitted. The circuit module 1l can achieve the effects of (a) to (e).

[0190] (p) According to the circuit module 1l, the first branch electrode 34 is electrically connected to the first ground conductor layer 20b through the conductive bonding material 200b. Thereby, the first ground conductor layer 20b is more reliably connected to the ground potential. Moreover, even if there is a deviation in the thickness of the conductive bonding material 200b in the vertical direction due to the deviation in the distance between the first substrate body 12 and the second substrate body 112, the first ground conductor layer 20b is more reliably connected to the ground potential.

[0191] (The 13th modification example)

[0192] Hereinafter, the circuit module 1m according to the 13th modification example will be described with reference to the drawings. Figure 18 It is a cross-sectional view of the circuit module 1m.

[0193] The first circuit board 10m of the circuit module 1m further includes a fifth branch electrode 39. The fifth branch electrode 39 is located on the first lower main surface S2 and is electrically connected to the first ground conductor layer 20b.

[0194] The second circuit board 110m further includes a third branch conductor layer 119 and a sixth branch electrode 139. The third branch conductor layer 119 is provided on the second substrate body 112 and is electrically connected to the second signal conductor layer 118. The sixth branch electrode 139 is located on the second upper main surface S11 and is electrically connected to the third branch conductor layer 119. The sixth branch electrode 139 is joined to the fifth branch electrode 39 through the conductive bonding material 200e. Other configurations of the circuit module 1m are the same as those of the circuit module 1, so the description thereof is omitted. The circuit module 1m can achieve the effects of (a) to (e).

[0195] (q) In the circuit module 1m, a short - circuit stub is also provided on the second circuit board 110m. Thereby, for the same reason as in (a), it is possible to suppress the characteristic impedance generated at the connection portion between the first circuit board 10 and the second circuit board 110 from deviating from the desired characteristic impedance.

[0196] (The 14th modification example)

[0197] Hereinafter, the circuit module 1n according to the 14th modification example will be described with reference to the drawings. Figure 19 It is a cross - sectional view of the circuit module 1n.

[0198] The second circuit board 110n of circuit module 1n further includes an interlayer connection conductor v20, a fourth branch conductor layer 119a, and a ground conductor layer 120c. The ground conductor layer 120c (second ground conductor layer) is located on the upper main surface of the second dielectric layer 116b. The fourth branch conductor layer 119a is located on the upper main surface of the second dielectric layer 116b. When viewed in the vertical direction, the fourth branch conductor layer 119a has a linear shape extending in the horizontal direction. The right end of the fourth branch conductor layer 119a contacts the ground conductor layer 120c. The interlayer connection conductor v20 vertically penetrates the second dielectric layer 116a. The interlayer connection conductor v20 electrically connects the fourth branch conductor layer 119a to the second branch electrode 134. The remaining structure of circuit module 1n is identical to that of circuit module 1, and therefore its description is omitted. Circuit module 1n can achieve the effects (a) to (e).

[0199] In the circuit module 1 n as described above, the interlayer connection conductor v3 , the first branch electrode 34 , the second branch electrode 134 , the conductive bonding material 200 b , and the fourth branch conductor layer 119 a function as a short-circuit stub.

[0200] (Variant 15)

[0201] Hereinafter, a circuit module 1o according to a fifteenth modification will be described with reference to the drawings. Figure 20 is a cross-sectional view of the circuit module 1o.

[0202] Circuit module 10 differs from circuit module 1 in that it includes one or more other circuit substrates 400, including a second circuit substrate 110o and a third circuit substrate 310o. The one or more other circuit substrates 400 include one or more substrate bodies 412. The one or more substrate bodies 412 include the second substrate body 112 and the third substrate body 312.

[0203] The second circuit board 110o includes a second substrate body 112. A second signal conductor layer 118 is provided on the second substrate body 112. The second substrate body 112 is any one of the one or more substrate bodies 412. The second signal electrode 132 is located on the second upper main surface S11 of the second substrate body 112. The second substrate body 112 is the substrate body, among the one or more substrate bodies 412, on which the second signal conductor layer 118 is provided. The second signal electrode 132 is electrically connected to the second signal conductor layer 118.

[0204] The third circuit board 310o includes a third board body 312 having a third upper main surface S21 and a third lower main surface S22. The second ground conductor layer 220 is provided on the third board body 312. The third board body 312 is any one of one or more board bodies 412. The second branch electrode 134 is located on the third upper main surface S21 of the third board body 312. The third board body 312 is a board body among one or more board bodies 412 where the second ground conductor layer 220 is provided. The second branch electrode 134 is electrically connected to the second ground conductor layer 220.

[0205] As described above, the circuit module 1o has a structure in which the second circuit board 110 of the circuit module 1 is separated into the second circuit board 110o and the third circuit board 310o. Other structures of the circuit module 1o are the same as those of the circuit module 1, so the description thereof is omitted. The circuit module 1o can achieve the effects of (a) to (e).

[0206] (The 16th modification example)

[0207] Hereinafter, the circuit module 1p according to the 16th modification example will be described with reference to the drawings. Figure 21 It is a cross-sectional view of the circuit module 1p.

[0208] The difference between the circuit module 1p and the circuit module 1j is that it includes one or more other circuit boards 400 including the second circuit board 110p and the third circuit board 310p. One or more other circuit boards 400 include one or more board bodies 412. One or more board bodies 412 include the second board body 112 and the third board body 312.

[0209] The second circuit board 110p includes the second board body 112. The second radiation conductor layer 118a is provided on the second board body 112. The second board body 112 is any one of one or more board bodies 412. The second signal electrode 132 is located on the second upper main surface S11 of the second board body 112. The second board body 112 is a board body among one or more board bodies 412 where the second radiation conductor layer 118a is provided. The second signal electrode 132 is electrically connected to the second radiation conductor layer 118a.

[0210] The third circuit board 310p includes a third board body 312 having a third upper main surface S21 and a third lower main surface S22. The second ground conductor layer 220 is provided on the third board body 312. The third board body 312 is any one of one or more board bodies 412. The second branch electrode 134 is located on the third upper main surface S21 of the third board body 312. The third board body 312 is a board body among one or more board bodies 412 on which the second ground conductor layer 220 is provided. The second branch electrode 134 is electrically connected to the second ground conductor layer 220.

[0211] As described above, the circuit module 1p has a structure in which the second circuit board 110j of the circuit module 1j is separated into the second circuit board 110p and the third circuit board 310p. Other structures of the circuit module 1p are the same as those of the circuit module 1j, so the description thereof is omitted. The circuit module 1p can achieve the effects of (a) to (e), (j), (k), and (l).

[0212] (The 17th modification example)

[0213] Hereinafter, the circuit module 1q according to the 17th modification example will be described with reference to the drawings. Figure 22 It is a cross-sectional view of the circuit module 1q.

[0214] The difference between the circuit module 1q and the circuit module 1o is that it further includes a first ground electrode 60, a sixth ground electrode 62, a fourth ground conductor layer 90, a seventh ground electrode 162, and a second ground conductor layer 220. The fourth ground conductor layer 90 is provided on the second board body 112. The fifth ground electrode 160 is located on the second upper main surface S11 and is electrically connected to the fourth ground conductor layer 90. When observed in the vertical direction, the fifth ground electrode 160 is located between the second signal electrode 132 and the second branch electrode 134.

[0215] The second ground conductor layer 220 is provided on the third board body 312. The seventh ground electrode 162 is located on the third upper main surface S21 and is electrically connected to the second ground conductor layer 220. When observed in the vertical direction, the seventh ground electrode 162 is located between the second signal electrode 132 and the second branch electrode 134.

[0216] The first ground electrode 60 is joined to the fifth ground electrode 160 through a conductive bonding material 200f. The sixth ground electrode 62 is joined to the seventh ground electrode 162 through a conductive bonding material 200g. Other structures of the circuit module 1q are the same as those of the circuit module 1o, so the description thereof is omitted. The circuit module 1q can achieve the effects of (a) to (e).

[0217] In the circuit module 1q, when observed in the up-down direction, the fifth ground electrode 160 is located between the second signal electrode 132 and the second branch electrode 134. When observed in the up-down direction, the seventh ground electrode 162 is located between the second signal electrode 132 and the second branch electrode 134. Thus, the leakage of the electromagnetic field between the second signal electrode 132 and the second branch electrode 134 can be suppressed.

[0218] (The 18th modification example)

[0219] Hereinafter, the circuit module 1r according to the 18th modification example will be described with reference to the drawings. Figure 23 It is a cross-sectional view of the circuit module 1r.

[0220] The difference between the circuit module 1r and the circuit module 1o is that the third circuit board 310r further includes a wiring conductor layer 330, a fifth ground conductor layer 332, and an interlayer connection conductor v20. The wiring conductor layer 330 and the fifth ground conductor layer 332 are provided on the third substrate main body 312. The wiring conductor layer 330 is in contact with the fifth ground conductor layer 332. However, the line width of the wiring conductor layer 330 is thinner than the line width of the fifth ground conductor layer 332.

[0221] The interlayer connection conductor v20 electrically connects the second branch electrode 134 and the wiring conductor layer 330. Thus, the second branch electrode 134 is electrically connected to the fifth ground conductor layer 332 via the wiring conductor layer 330. Other configurations of the circuit module 1r are the same as those of the circuit module 1o, and thus the description thereof is omitted. The circuit module 1r can achieve the effects of (a) to (e).

[0222] (The 19th modification example)

[0223] Hereinafter, the circuit module 1s according to the 19th modification example will be described with reference to the drawings. Figure 24 It is a cross-sectional view of the circuit module 1s.

[0224] The difference between the circuit module 1s and the circuit module 1k is that it includes one or more other circuit boards 400 including the second circuit board 110s and the third circuit board 310s. The one or more other circuit boards 400 include one or more substrate main bodies 412. The one or more substrate main bodies 412 include the second substrate main body 112 and the third substrate main body 312.

[0225] The second circuit board 110s includes the second substrate main body 112. The second signal conductor layer 118 is provided on the second substrate main body 112. The second signal electrode 132 is located on the second upper main surface S11. The second signal electrode 132 is electrically connected to the second signal conductor layer 118.

[0226] The third circuit board 310s includes a third board body 312 having a third upper main surface S21 and a third lower main surface S22. The second ground conductor layer 220 is provided on the third board body 312. The second branch electrode 134 is located on the third upper main surface S21. The second branch electrode 134 is electrically connected to the second ground conductor layer 220.

[0227] As described above, the circuit module 1s has a structure in which the second circuit board 110k of the circuit module 1k is separated into the second circuit board 110s and the third circuit board 310s. Other structures of the circuit module 1s are the same as those of the circuit module 1k, so the description thereof is omitted. The circuit module 1s can achieve the effects of (a) to (e), (m), (n), and (o).

[0228] (The 20th modification example)

[0229] Hereinafter, a circuit module 1t according to the 20th modification example will be described with reference to the drawings. Figure 25 It is a cross-sectional view of the circuit module 1t.

[0230] The circuit module 1t is different from the circuit module 1o in the position of the third circuit board 310t. More specifically, the third circuit board 310t is located above the first circuit board 10t. Therefore, the first branch electrode 34 is located on the first upper main surface S1. The second branch electrode 134 is located on the third lower main surface S22. Moreover, the first branch electrode 34 is joined to the second branch electrode 134 by a conductive joining material 200b. Other structures of the circuit module 1t are the same as those of the circuit module 1o, so the description thereof is omitted. The circuit module 1s can achieve the effects of (a) to (e).

[0231] (Other embodiments)

[0232] The circuit module according to the present utility model is not limited to the circuit modules 1, 1a to 1s, and can be changed within the scope of its gist. In addition, the structures of the circuit modules 1, 1a to 1s can be arbitrarily combined.

[0233] The first circuit board according to the present utility model is not limited to the first circuit boards 10, 10a to 10s, and can be changed within the scope of its gist. In addition, the structures of the first circuit boards 10, 10a to 10s can be arbitrarily combined.

[0234] In addition, the third ground conductor layer 20a, the first ground conductor layer 20b, the first ground electrode 36, the ground conductor layer 120b, the second ground electrode 136, the protective layer 17a, the first protective layer 17b, the second protective layer 117a, and the protective layer 117b are not essential components.

[0235] Furthermore, the first circuit board 10h may include three or more second branch conductor layers and three or more third branch electrodes, and the second circuit board 110h may include three or more fourth branch electrodes.

[0236] Furthermore, in the first circuit board 10i, the line width of a portion of the first signal conductor layer 18 may be smaller than the line width of the remaining portion of the first signal conductor layer 18 when viewed in the vertical direction. In the first circuit board 10i, the line width of a portion of the first branch conductor layer 19 may be smaller than the line width of the remaining portion of the first branch conductor layer 19 when viewed in the vertical direction.

[0237] In addition, in the circuit module 1 j , the thickness of the first substrate body 12 in the vertical direction may be greater than the thickness of the second substrate body 112 in the vertical direction.

[0238] In circuit module 1j, second circuit board 110j may also have the following structure. Second dielectric layers 116a and 116b include one or more third dielectric layers. Furthermore, the dielectric constant of the third dielectric layer is higher than the dielectric constants of first dielectric layers 16a to 16c and the dielectric constants of the second dielectric layers 116a and 116b other than the third dielectric layer. For example, the one or more third dielectric layers are second dielectric layer 116b. In this case, the dielectric constant of second dielectric layer 116b, serving as the third dielectric layer, is higher than the dielectric constants of first dielectric layers 16a to 16c and the dielectric constant of second dielectric layer 116a.

[0239] In addition, in the circuit module 1 k , the thickness of the second main substrate body 112 in the vertical direction may be greater than the thickness of the first main substrate body 12 in the vertical direction.

[0240] In the circuit module 1k, the second circuit board 110k may also have the following structure. The plurality of first dielectric layers 16a-16c include one or more fourth dielectric layers. Furthermore, the fourth dielectric layer has a higher dielectric constant than the dielectric constants of the dielectric layers other than the fourth dielectric layer in the first dielectric layers 16a-16c and the dielectric constants of the second dielectric layers 116a-116c. For example, the one or more fourth dielectric layers may be the first dielectric layer 16c. In this case, the dielectric constant of the first dielectric layer 16c, serving as the fourth dielectric layer, is higher than the dielectric constants of the first dielectric layers 16a and 16b and the dielectric constants of the second dielectric layers 116a-116c.

[0241] In addition, although the first circuit board and the second circuit board are referred to as circuit boards for convenience, this is a concept that also includes electronic components.

[0242] In addition, the second radiation conductor layer 118a and the first radiation conductor layer 80 may also be antennas other than the patch antenna. Antennas other than the patch antenna are dipole antennas, monopole antennas, etc.

[0243] In addition, the first circuit board and the second circuit board may not have flexibility.

[0244] In addition, either the third ground conductor layer 20a or the first ground conductor layer 20b may not be provided. In this case, the first signal conductor layer 18 and the third ground conductor layer 20a have a microstrip line structure. The first signal conductor layer 18 and the first ground conductor layer 20b have a microstrip line structure.

[0245] In addition, both the first substrate body 12 and the second substrate body 112 may be bent.

[0246] In addition, in the circuit module 1p, the third circuit board 310p may also be located above the first circuit board 10p. In this case, the first branch electrode 34 is located on the first upper main surface S1. The second branch electrode 134 is located on the third lower main surface S22. Moreover, the first branch electrode 34 is joined to the second branch electrode 134 by a conductive bonding material 200b.

[0247] The present utility model has the following structure. (1)

[0249] A circuit board, comprising:

[0250] A substrate body having an upper main surface and a lower main surface;

[0251] A signal conductor layer provided on the substrate body;

[0252] A branch conductor layer provided on the substrate body and electrically connected to the signal conductor layer;

[0253] A signal electrode located on the lower main surface; and

[0254] A branch electrode located on the upper main surface or the lower main surface,

[0255] The signal electrode is electrically connected to the signal conductor layer,

[0256] The branch electrode is electrically connected to the branch conductor layer and, when the circuit board is connected to one or more other circuit boards, is joined to the branch electrodes of the one or more other circuit boards by a conductive bonding material, thereby being connected to the ground potential. (2)

[0258] A circuit module, comprising:

[0259] a first circuit substrate; and

[0260] one or more other circuit substrates,

[0261] The one or more other circuit substrates have a portion that overlaps with the first circuit substrate when viewed in the vertical direction.

[0262] The first circuit substrate includes:

[0263] The first substrate body has a first upper main surface and a first lower main surface;

[0264] a first signal conductor layer, provided on the first substrate body;

[0265] a first branch conductor layer provided on the first substrate body and electrically connected to the first signal conductor layer;

[0266] a first signal electrode located on the first lower main surface; and

[0267] The first branch electrode is located on the first upper main surface or the first lower main surface,

[0268] The one or more other circuit substrates include:

[0269] One or more substrate bodies having an upper main surface and a lower main surface;

[0270] a second signal conductor layer provided on any one of the one or more substrate bodies;

[0271] a second ground conductor layer provided on any one of the one or more substrate bodies;

[0272] a second signal electrode located on the upper main surface of the substrate body on which the second signal conductor layer is provided, among the one or more substrate bodies; and

[0273] The second branch electrode is located on the upper main surface or the lower main surface of the substrate body provided with the second ground conductor layer among the one or more substrate bodies.

[0274] The first signal electrode is electrically connected to the first signal conductor layer.

[0275] The first branch electrode is electrically connected to the first branch conductor layer.

[0276] The second signal electrode is electrically connected to the second signal conductor layer and is bonded to the first signal electrode via a conductive bonding material.

[0277] The second branch electrode is electrically connected to the second ground conductor layer and is bonded to the first branch electrode via a conductive bonding material. (3)

[0279] The circuit module according to (2), wherein

[0280] the first circuit board further includes a first ground conductor layer provided on the first board main body. (4)

[0282] The circuit module according to (3), wherein

[0283] when observed in the up - down direction, the first ground conductor layer overlaps with the first signal conductor layer. (5)

[0285] The circuit module according to (3) or (4), wherein

[0286] the one or more other circuit boards include a second circuit board,

[0287] the second circuit board includes a second board main body having a second upper main surface and a second lower main surface,

[0288] the first branch electrode is located on the first lower main surface,

[0289] the second branch electrode is located on the second upper main surface,

[0290] the first circuit board further includes:

[0291] one or more first ground electrodes, located on the first lower main surface and electrically connected to the first ground conductor layer,

[0292] the second circuit board further includes:

[0293] one or more second ground electrodes, located on the second upper main surface and electrically connected to the second ground conductor layer,

[0294] the one or more second ground electrodes are joined to the one or more first ground electrodes through one or more conductive bonding materials. (6)

[0296] The circuit module according to (5), wherein

[0297] the one or more first ground electrodes include a third ground electrode,

[0298] when observed in the up - down direction, the distance between the first signal electrode and the first branch electrode is longer than the distance between the first signal electrode and the third ground electrode and the distance between the first branch electrode and the third ground electrode. (7)

[0300] The circuit module according to (6), wherein,

[0301] The one or more first ground electrodes further include a fourth ground electrode,

[0302] When observed in the up-down direction, the distance between the first signal electrode and the first branch electrode is shorter than the distance between the first signal electrode and the fourth ground electrode or the distance between the first branch electrode and the fourth ground electrode. (8)

[0304] The circuit module according to any one of (2) to (7), wherein,

[0305] The first circuit board further includes:

[0306] An open stub conductor layer, electrically connected to the first signal conductor layer or the first branch conductor layer,

[0307] The open stub conductor layer is not electrically connected to an electrode other than the electrode electrically connected to the first signal conductor layer. (9)

[0309] The circuit module according to any one of (2) to (8), wherein,

[0310] The one or more other circuit boards include a second circuit board,

[0311] The second circuit board includes a second substrate body having a second upper main surface and a second lower main surface,

[0312] The first branch electrode is located on the first lower main surface,

[0313] The second branch electrode is located on the second upper main surface,

[0314] The first circuit board further includes:

[0315] One or more second branch conductor layers, disposed on the first substrate body and electrically connected to the first signal conductor layer; and

[0316] One or more third branch electrodes, located on the first lower main surface,

[0317] The second circuit board further includes:

[0318] One or more fourth branch electrodes, located on the second upper main surface,

[0319] The one or more third branch electrodes are electrically connected to the one or more second branch conductor layers,

[0320] The above-described one or more fourth branch electrodes are electrically connected to the second ground conductor layer and are joined to the above-described one or more third branch electrodes by a conductive joining material. (10)

[0322] The circuit module according to any one of (2) to (9), wherein

[0323] When viewed in the vertical direction, the line width of a part of the first signal conductor layer is different from the line width of the remaining part of the first signal conductor layer. (11)

[0325] The circuit module according to any one of (2) to (10), wherein

[0326] When viewed in the vertical direction, the line width of a part of the first branch conductor layer is different from the line width of the remaining part of the first branch conductor layer. (12)

[0328] The circuit module according to (11), wherein

[0329] The one or more other circuit boards include a second circuit board,

[0330] The second circuit board includes a second board main body having a second upper main surface and a second lower main surface,

[0331] The first branch electrode is located on the first lower main surface,

[0332] The second branch electrode is located on the second upper main surface,

[0333] The thickness of the first board main body in the vertical direction is smaller than the thickness of the second board main body in the vertical direction. (13)

[0335] The circuit module according to (11) or (12), wherein

[0336] The first board main body has a structure in which a plurality of first dielectric layers are stacked in the vertical direction,

[0337] The second board main body has a structure in which a plurality of second dielectric layers are stacked in the vertical direction,

[0338] The plurality of second dielectric layers include one or more third dielectric layers,

[0339] The dielectric constant of the third dielectric layer is higher than the dielectric constant of the plurality of first dielectric layers and the dielectric constant of the dielectric layers other than the third dielectric layer in the plurality of second dielectric layers. (14)

[0341] The circuit module according to any one of (2) to (11), wherein

[0342] The first circuit substrate further comprises:

[0343] The antenna is provided on the first substrate body and is electrically connected to the first signal conductor layer. (15)

[0345] The circuit module according to (14), wherein

[0346] The one or more other circuit substrates include a second circuit substrate,

[0347] The second circuit substrate includes a second substrate body having a second upper main surface and a second lower main surface.

[0348] The first branch electrode is located on the first lower main surface,

[0349] The second branch electrode is located on the second upper main surface.

[0350] The thickness of the second substrate body in the up-down direction is smaller than the thickness of the first substrate body in the up-down direction. (16)

[0352] The circuit module according to (14) or (15), wherein:

[0353] The one or more other circuit substrates include a second circuit substrate,

[0354] The second circuit substrate includes a second substrate body having a second upper main surface and a second lower main surface.

[0355] The first branch electrode is located on the first lower main surface,

[0356] The second branch electrode is located on the second upper main surface.

[0357] The first substrate body has a structure in which a plurality of first dielectric layers are stacked in a vertical direction.

[0358] The second substrate body has a structure in which a plurality of second dielectric layers are stacked in the vertical direction.

[0359] The plurality of first dielectric layers include one or more fourth dielectric layers,

[0360] The fourth dielectric layer has a higher dielectric constant than dielectric constants of dielectric layers other than the fourth dielectric layer among the plurality of first dielectric layers and dielectric constants of the plurality of second dielectric layers. (17)

[0362] The circuit module according to any one of (14) to (16), wherein,

[0363] The first circuit board further includes:

[0364] A third ground conductor layer provided on the first substrate body,

[0365] The third ground conductor layer overlaps with the first signal conductor layer when viewed in the vertical direction, and overlaps with the first signal electrode and the first branch electrode when viewed in the vertical direction. (18)

[0367] The circuit module according to any one of (2) to (17), wherein,

[0368] The one or more other circuit boards include a second circuit board,

[0369] The second circuit board includes a second substrate body having a second upper main surface and a second lower main surface,

[0370] The first branch electrode is located on the first lower main surface,

[0371] The second branch electrode is located on the second upper main surface,

[0372] The first substrate body includes: a first protective layer laminated at the bottom in the first substrate body,

[0373] The second substrate body includes: a second protective layer laminated at the top in the first substrate body,

[0374] The first signal electrode and the first branch electrode are exposed to the outside of the first substrate body through an opening provided in the first protective layer,

[0375] The second signal electrode and the second branch electrode are exposed to the outside of the second substrate body through an opening provided in the second protective layer. (19)

[0377] The circuit module according to (18), wherein,

[0378] The first circuit board further includes:

[0379] A first ground conductor layer provided on the first substrate body and provided at the same position as the first branch electrode in the vertical direction,

[0380] When viewed in the vertical direction, the first ground conductor layer surrounds the first branch electrode,

[0381] A part of the first ground conductor layer is exposed to the outside of the first substrate body together with the first branch electrode through an opening provided in the first protective layer.

[0382] A part of the first ground conductor layer is joined to the second branch electrode together with the first branch electrode by a conductive bonding material. (20)

[0384] The circuit module according to any one of (3) to (7), wherein

[0385] The one or more other circuit boards include a second circuit board.

[0386] The second circuit board includes a second substrate body having a second upper main surface and a second lower main surface.

[0387] The first branch electrode is located on the first lower main surface.

[0388] The second branch electrode is located on the second upper main surface.

[0389] The first circuit board further includes:

[0390] A fifth branch electrode, located on the first lower main surface and electrically connected to the first ground conductor layer.

[0391] The second circuit board further includes:

[0392] A third branch conductor layer, provided on the second substrate body and electrically connected to the second signal conductor layer; and

[0393] A sixth branch electrode, located on the second upper main surface and electrically connected to the third branch conductor layer.

[0394] The sixth branch electrode is joined to the fifth branch electrode by a conductive bonding material. (21)

[0396] The circuit module according to any one of (2) to (20), wherein

[0397] The first substrate body is flexible.

[0398] The first substrate body has a first section and a second section.

[0399] The up-down direction in the first section is defined as the Z-axis direction.

[0400] The second section is bent in the Z-axis direction with respect to the first section. (22)

[0402] The circuit module according to any one of (2) to (21), wherein,

[0403] The one or more other circuit boards include a second circuit board,

[0404] The second circuit board includes a second substrate body having a second upper main surface and a second lower main surface,

[0405] The first branch electrode is located on the first lower main surface,

[0406] The second branch electrode is located on the second upper main surface,

[0407] The second substrate body is flexible,

[0408] The second substrate body has a fourth section and a fifth section,

[0409] The up-down direction in the fourth section is defined as the Z-axis direction,

[0410] The fifth section is bent in the Z-axis direction with respect to the fourth section. (23)

[0412] The circuit module according to (2), wherein,

[0413] The one or more other circuit boards include a second circuit board and a third circuit board,

[0414] The second circuit board includes a second substrate body having a second upper main surface and a second lower main surface,

[0415] The third circuit board includes a third substrate body having a third upper main surface and a third lower main surface,

[0416] The second signal conductor layer is provided on the second substrate body,

[0417] The second ground conductor layer is provided on the third substrate body,

[0418] The second signal electrode is located on the second upper main surface,

[0419] The second branch electrode is located on the third upper main surface or the third lower main surface. (24)

[0421] The circuit module according to (23), wherein,

[0422] The first circuit board further includes:

[0423] A first ground conductor layer provided on the first substrate body; and

[0424] a first ground electrode located on the first lower main surface and electrically connected to the first ground conductor layer;

[0425] The second substrate body further comprises:

[0426] a fourth ground conductor layer provided on the second substrate body; and

[0427] a fifth ground electrode located on the second upper main surface and electrically connected to the fourth ground conductor layer;

[0428] The first ground electrode is bonded to the fifth ground electrode via a conductive bonding material. (25)

[0430] The circuit module according to (24), wherein

[0431] When viewed in the vertical direction, the fifth ground electrode is located between the second signal electrode and the second branch electrodes. (26)

[0433] The circuit module according to any one of (23) to (25), wherein

[0434] The first circuit substrate further comprises:

[0435] a first ground conductor layer provided on the first substrate body; and

[0436] a sixth ground electrode located on the first lower main surface and electrically connected to the first ground conductor layer;

[0437] The third circuit substrate further comprises:

[0438] a seventh ground electrode located on the third upper main surface and electrically connected to the second ground conductor layer;

[0439] The sixth ground electrode is bonded to the seventh ground electrode via a conductive bonding material. (27)

[0441] The circuit module according to (26), wherein

[0442] When viewed in the vertical direction, the seventh ground electrode is located between the second signal electrode and the second branch electrodes. (28)

[0444] The circuit module according to any one of (23) to (27), wherein

[0445] The first circuit substrate further comprises:

[0446] The first radiation conductor layer transmits or receives electromagnetic waves, is provided on the first substrate body, and is electrically connected to the first signal conductor layer. (29)

[0448] The circuit module according to any one of (23) to (28), wherein

[0449] The third circuit substrate further comprises:

[0450] a fifth ground conductor layer provided on the third substrate body; and

[0451] A wiring conductor layer is provided on the third substrate body.

[0452] The second finger electrode is electrically connected to the fifth ground conductor layer via the wiring conductor layer. (30)

[0454] The circuit module according to (23), wherein

[0455] The first branch electrode is located on the first upper main surface,

[0456] The second branch electrode is located on the third upper main surface. (31)

[0458] A circuit module comprising:

[0459] a first circuit substrate; and

[0460] one or more other circuit substrates,

[0461] The one or more other circuit substrates have a portion that overlaps with the first circuit substrate when viewed in the vertical direction.

[0462] The first circuit substrate includes:

[0463] The first substrate body has a first upper main surface and a first lower main surface;

[0464] a first signal conductor layer, provided on the first substrate body;

[0465] a first branch conductor layer provided on the first substrate body and electrically connected to the first signal conductor layer;

[0466] a first signal electrode located on the first lower main surface; and

[0467] The first branch electrode is located on the first upper main surface or the first lower main surface,

[0468] The one or more other circuit substrates include:

[0469] One or more substrate bodies having an upper main surface and a lower main surface;

[0470] a second radiation conductor layer that transmits or receives electromagnetic waves and is provided on any one of the one or more substrate bodies;

[0471] a second ground conductor layer provided on any one of the one or more substrate bodies;

[0472] a second signal electrode located on the upper main surface of the substrate main body on which the second radiation conductor layer is provided, among the one or more substrate main bodies; and

[0473] The second branch electrode is located on the upper main surface or the lower main surface of the substrate body provided with the second ground conductor layer among the one or more substrate bodies.

[0474] The first signal electrode is electrically connected to the first signal conductor layer.

[0475] The first branch electrode is electrically connected to the first branch conductor layer.

[0476] The second signal electrode is electrically connected to the second radiation conductor layer and is bonded to the first signal electrode via a conductive bonding material.

[0477] The second branch electrode is electrically connected to the second ground conductor layer and is bonded to the first branch electrode via a conductive bonding material. (32)

[0479] The circuit module according to (31), wherein

[0480] The one or more other circuit substrates include a second circuit substrate and a third circuit substrate,

[0481] The second circuit substrate includes a second substrate body having a second upper main surface and a second lower main surface.

[0482] The third circuit substrate includes a third substrate body having a third upper main surface and a third lower main surface.

[0483] The second radiation conductor layer is provided on the second substrate body.

[0484] The second ground conductor layer is provided on the third substrate body.

[0485] The second signal electrode is located on the second upper main surface.

[0486] The second branch electrode is located on the third upper main surface or the third lower main surface.

[0487] Description of Reference Numerals

[0488] 1. 1a~1s: circuit module;

[0489] 10, 10a~10s: first circuit substrate;

[0490] 12: The first substrate main body;

[0491] 16a-16c: first dielectric layer;

[0492] 17a: protective layer;

[0493] 17b: 1st protective layer;

[0494] 18: 1st signal conductor layer;

[0495] 19: first branch conductor layer;

[0496] 20a: third ground conductor layer;

[0497] 20b: first ground conductor layer;

[0498] 30: upper surface signal electrode;

[0499] 32: 1st signal electrode;

[0500] 34: first branch electrode;

[0501] 36: 1st ground electrode;

[0502] 36a: 3rd ground electrode;

[0503] 36b: 4th ground electrode;

[0504] 38a, 38b: third branch electrodes;

[0505] 39: 5th branch electrode;

[0506] 50, 150: connector;

[0507] 70a, 70b: open circuit stub conductor layer;

[0508] 72a, 72b: second branch conductor layer;

[0509] 110, 110g, 110h, 110j, 110k, 110m, 110n: second circuit board;

[0510] 112: The second substrate main body;

[0511] 116a-116c: second dielectric layer;

[0512] 117a: second protective layer;

[0513] 117b: protective layer;

[0514] 118: second signal conductor layer;

[0515] 80: first radiation conductor layer;

[0516] 118a: second radiation conductor layer;

[0517] 119: third branch conductor layer;

[0518] 120a: second ground conductor layer;

[0519] 120b: ground conductor layer;

[0520] 130: bottom surface signal electrode;

[0521] 132: second signal electrode;

[0522] 134: second branch electrode;

[0523] 136: second ground electrode;

[0524] 138a, 138b: fourth branch electrodes;

[0525] 139: 6th branch electrode;

[0526] 200a~200e: conductive bonding material;

[0527] A1: Interval 1;

[0528] A2: Interval 2;

[0529] A3: Interval 3;

[0530] A4: Section 4;

[0531] A5: Section 5;

[0532] A6: Section 6;

[0533] S1: The first main surface;

[0534] S11: the second upper main surface;

[0535] S12: second lower main surface;

[0536] S2: First lower main surface.

Claims

1. A circuit board, characterized in that, Comprising: A substrate body having an upper main surface and a lower main surface; A signal conductor layer provided on the substrate body; A branch conductor layer provided on the substrate body and electrically connected to the signal conductor layer; A signal electrode located on the lower main surface; And A branch electrode located on the upper main surface or the lower main surface, The signal electrode is electrically connected to the signal conductor layer, The branch electrode is electrically connected to the branch conductor layer, and when the circuit board is connected to one or more other circuit boards, it is joined to the branch electrodes of the one or more other circuit boards through a conductive joining material, thereby being connected to the ground potential.

2. A circuit module, characterized in that, Providing: A first circuit board; and One or more other circuit boards, The one or more other circuit boards have a portion that overlaps with the first circuit board when viewed in the vertical direction, The first circuit board comprises: A first substrate body having a first upper main surface and a first lower main surface; A first signal conductor layer provided on the first substrate body; A first branch conductor layer provided on the first substrate body and electrically connected to the first signal conductor layer; A first signal electrode located on the first lower main surface; and A first branch electrode located on the first upper main surface or the first lower main surface, The one or more other circuit boards comprise: One or more substrate bodies having an upper main surface and a lower main surface; A second signal conductor layer provided on any one of the one or more substrate bodies; A second ground conductor layer provided on any one of the one or more substrate bodies; A second signal electrode located on the upper main surface of the substrate body provided with the second signal conductor layer among the one or more substrate bodies; And A second branch electrode located on the upper main surface or the lower main surface of the substrate body provided with the second ground conductor layer among the one or more substrate bodies, The first signal electrode is electrically connected to the first signal conductor layer, The first branch electrode is electrically connected to the first branch conductor layer, The second signal electrode is electrically connected to the second signal conductor layer and joined to the first signal electrode through a conductive joining material, The second branch electrode is electrically connected to the second ground conductor layer and joined to the first branch electrode through a conductive joining material.

3. The circuit module according to claim 2, wherein The first circuit board further comprises a first ground conductor layer provided on the first substrate body.

4. The circuit module according to claim 3, wherein When viewed in the vertical direction, the first ground conductor layer overlaps with the first signal conductor layer.

5. The circuit module according to claim 3 or claim 4, wherein The one or more other circuit boards comprise a second circuit board, The second circuit board comprises a second substrate body having a second upper main surface and a second lower main surface, The first branch electrode is located on the first lower main surface, The second branch electrode is located on the second upper main surface, The first circuit board further comprises: One or more first ground electrodes located on the first lower main surface and electrically connected to the first ground conductor layer, The second circuit board further includes: One or more second ground electrodes located on the second upper main surface and electrically connected to the second ground conductor layer, The one or more second ground electrodes are joined to the one or more first ground electrodes through one or more conductive joining materials.

6. The circuit module according to claim 5, wherein The one or more first ground electrodes include a third ground electrode, When observed in the up-down direction, the distance between the first signal electrode and the first branch electrode is longer than the distance between the first signal electrode and the third ground electrode and the distance between the first branch electrode and the third ground electrode.

7. The circuit module according to claim 6, wherein The one or more first ground electrodes further include a fourth ground electrode, When observed in the up-down direction, the distance between the first signal electrode and the first branch electrode is shorter than the distance between the first signal electrode and the fourth ground electrode or the distance between the first branch electrode and the fourth ground electrode.

8. The circuit module according to any one of claims 2 to 4, wherein The first circuit board further includes: An open stub conductor layer electrically connected to the first signal conductor layer or the first branch conductor layer, The open stub conductor layer is not electrically connected to any electrode other than the electrode to which the first signal conductor layer is electrically connected.

9. The circuit module according to any one of claims 2 to 4, wherein The one or more other circuit boards include a second circuit board, The second circuit board includes a second substrate body having a second upper main surface and a second lower main surface, The first branch electrode is located on the first lower main surface, The second branch electrode is located on the second upper main surface, The first circuit board further includes: One or more second branch conductor layers provided on the first substrate body and electrically connected to the first signal conductor layer; and One or more third branch electrodes located on the first lower main surface, The second circuit board further includes: One or more fourth branch electrodes located on the second upper main surface, The one or more third branch electrodes are electrically connected to the one or more second branch conductor layers, The one or more fourth branch electrodes are electrically connected to the second ground conductor layer and are joined to the one or more third branch electrodes through a conductive joining material.

10. The circuit module according to any one of claims 2 to 4, wherein When observed in the up-down direction, the line width of a part of the first signal conductor layer is different from the line width of the remaining part of the first signal conductor layer.

11. The circuit module according to any one of claims 2 to 4, wherein When observed in the up-down direction, the line width of a part of the first branch conductor layer is different from the line width of the remaining part of the first branch conductor layer.

12. The circuit module according to claim 11, wherein The one or more other circuit boards include a second circuit board, The second circuit board includes a second substrate body having a second upper main surface and a second lower main surface, The first branch electrode is located on the first lower main surface, The second branch electrode is located on the second upper main surface, The thickness of the first substrate body in the vertical direction is smaller than the thickness of the second substrate body in the vertical direction.

13. The circuit module according to claim 11, wherein The first substrate body has a structure in which a plurality of first dielectric layers are stacked in the vertical direction, The second substrate body has a structure in which a plurality of second dielectric layers are stacked in the vertical direction, The plurality of second dielectric layers includes one or more third dielectric layers, The dielectric constant of the third dielectric layer is higher than the dielectric constant of the plurality of first dielectric layers and the dielectric constant of the dielectric layers other than the third dielectric layer in the plurality of second dielectric layers.

14. The circuit module according to any one of claims 2 to 4, wherein The first circuit board further includes: An antenna, disposed on the first substrate body and electrically connected to the first signal conductor layer.

15. The circuit module according to claim 14, wherein The one or more other circuit boards include a second circuit board, The second circuit board includes a second substrate body having a second upper main surface and a second lower main surface, The first branch electrode is located on the first lower main surface, The second branch electrode is located on the second upper main surface, The thickness of the second substrate body in the vertical direction is smaller than the thickness of the first substrate body in the vertical direction.

16. The circuit module according to claim 14, wherein The one or more other circuit boards include a second circuit board, The second circuit board includes a second substrate body having a second upper main surface and a second lower main surface, The first branch electrode is located on the first lower main surface, The second branch electrode is located on the second upper main surface, The first substrate body has a structure in which a plurality of first dielectric layers are stacked in the vertical direction, The second substrate body has a structure in which a plurality of second dielectric layers are stacked in the vertical direction, The plurality of first dielectric layers includes one or more fourth dielectric layers, The dielectric constant of the fourth dielectric layer is higher than the dielectric constant of the dielectric layers other than the fourth dielectric layer in the plurality of first dielectric layers and the dielectric constant of the plurality of second dielectric layers.

17. The circuit module according to claim 14, wherein The first circuit board further includes: A third ground conductor layer, disposed on the first substrate body, The third ground conductor layer overlaps with the first signal conductor layer when observed in the vertical direction, and overlaps with the first signal electrode and the first branch electrode when observed in the vertical direction.

18. The circuit module according to any one of claims 2 to 4, wherein The one or more other circuit boards include a second circuit board, The second circuit board includes a second substrate body having a second upper main surface and a second lower main surface, The first branch electrode is located on the first lower main surface. The second branch electrode is located on the second upper main surface. The first substrate body includes: a first protective layer, which is laminated at the bottom in the first substrate body. The second substrate body includes: a second protective layer, which is laminated at the top in the first substrate body. The first signal electrode and the first branch electrode are exposed to the outside of the first substrate body through an opening provided in the first protective layer. The second signal electrode and the second branch electrode are exposed to the outside of the second substrate body through an opening provided in the second protective layer.

19. The circuit module according to claim 18, wherein the first circuit board further includes: a first ground conductor layer, which is provided in the first substrate body and is provided at the same position as the first branch electrode in the vertical direction. When observed in the vertical direction, the first ground conductor layer surrounds the first branch electrode. A part of the first ground conductor layer is exposed to the outside of the first substrate body together with the first branch electrode through an opening provided in the first protective layer. A part of the first ground conductor layer is joined to the second branch electrode together with the first branch electrode through a conductive bonding material.

20. The circuit module according to claim 3 or claim 4, wherein the one or more other circuit boards include a second circuit board. The second circuit board includes a second substrate body having a second upper main surface and a second lower main surface. The first branch electrode is located on the first lower main surface. The second branch electrode is located on the second upper main surface. The first circuit board further includes: a fifth branch electrode, which is located on the first lower main surface and is electrically connected to the first ground conductor layer. The second circuit board further includes: a third branch conductor layer, which is provided in the second substrate body and is electrically connected to the second signal conductor layer; and a sixth branch electrode, which is located on the second upper main surface and is electrically connected to the third branch conductor layer. The sixth branch electrode is joined to the fifth branch electrode through a conductive bonding material.

21. The circuit module according to any one of claims 2 to 4, wherein the first substrate body is flexible. The first substrate body has a first section and a second section. The vertical direction in the first section is defined as the Z-axis direction. The second section is bent in the Z-axis direction with respect to the first section.

22. The circuit module according to any one of claims 2 to 4, wherein the one or more other circuit boards include a second circuit board. The second circuit board includes a second substrate body having a second upper main surface and a second lower main surface. The first branch electrode is located on the first lower main surface. The second branch electrode is located on the second upper main surface. The second substrate body is flexible. The second substrate body has a fourth section and a fifth section. The vertical direction in the fourth section is defined as the Z-axis direction. The fifth section is bent in the Z-axis direction with respect to the fourth section.

23. The circuit module according to claim 2, wherein the one or more other circuit boards include a second circuit board and a third circuit board, the second circuit board includes a second board body having a second upper main surface and a second lower main surface, the third circuit board includes a third board body having a third upper main surface and a third lower main surface, the second signal conductor layer is provided on the second board body, the second ground conductor layer is provided on the third board body, the second signal electrode is located on the second upper main surface, the second branch electrode is located on the third upper main surface or the third lower main surface.

24. The circuit module according to claim 23, wherein the first circuit board further includes: a first ground conductor layer provided on the first board body; and a first ground electrode located on the first lower main surface and electrically connected to the first ground conductor layer, the second board body further includes: a fourth ground conductor layer provided on the second board body; and a fifth ground electrode located on the second upper main surface and electrically connected to the fourth ground conductor layer, the first ground electrode is joined to the fifth ground electrode through a conductive bonding material.

25. The circuit module according to claim 24, wherein when observed in the up-down direction, the fifth ground electrode is located between the second signal electrode and the second branch electrode.

26. The circuit module according to any one of claims 23 to 25, wherein the first circuit board further includes: a first ground conductor layer provided on the first board body; and a sixth ground electrode located on the first lower main surface and electrically connected to the first ground conductor layer, the third circuit board further includes: a seventh ground electrode located on the third upper main surface and electrically connected to the second ground conductor layer, the sixth ground electrode is joined to the seventh ground electrode through a conductive bonding material.

27. The circuit module according to claim 26, wherein when observed in the up-down direction, the seventh ground electrode is located between the second signal electrode and the second branch electrode.

28. The circuit module according to any one of claims 23 to 25, wherein the first circuit board further includes: a first radiation conductor layer that transmits or receives electromagnetic waves, is provided on the first board body, and is electrically connected to the first signal conductor layer.

29. The circuit module according to any one of claims 23 to 25, wherein the third circuit board further includes: a fifth ground conductor layer provided on the third board body; and a wiring conductor layer provided on the third board body, the second branch electrode is electrically connected to the fifth ground conductor layer via the wiring conductor layer.

30. The circuit module according to claim 23, wherein the first branch electrode is located on the first upper main surface, the second branch electrode is located on the third upper main surface.

31. A circuit module, characterized in that, comprising: a first circuit board; and one or more other circuit boards, The above-mentioned one or more other circuit boards have portions that overlap with the first circuit board when viewed in the vertical direction. The first circuit board includes: A first substrate body having a first upper main surface and a first lower main surface; A first signal conductor layer provided on the first substrate body; A first branch conductor layer provided on the first substrate body and electrically connected to the first signal conductor layer; A first signal electrode located on the first lower main surface; and A first branch electrode located on the first upper main surface or the first lower main surface. The above-mentioned one or more other circuit boards include: One or more substrate bodies having an upper main surface and a lower main surface; A second radiation conductor layer that transmits or receives electromagnetic waves and is provided on any one of the above-mentioned one or more substrate bodies; A second ground conductor layer provided on any one of the above-mentioned one or more substrate bodies; A second signal electrode located on the upper main surface of the substrate body among the above-mentioned one or more substrate bodies on which the second radiation conductor layer is provided; And A second branch electrode located on the upper main surface or the lower main surface of the substrate body among the above-mentioned one or more substrate bodies on which the second ground conductor layer is provided. The first signal electrode is electrically connected to the first signal conductor layer. The first branch electrode is electrically connected to the first branch conductor layer. The second signal electrode is electrically connected to the second radiation conductor layer and is joined to the first signal electrode through a conductive bonding material. The second branch electrode is electrically connected to the second ground conductor layer and is joined to the first branch electrode through a conductive bonding material.

32. The circuit module according to claim 31, wherein The above-mentioned one or more other circuit boards include a second circuit board and a third circuit board. The second circuit board includes a second substrate body having a second upper main surface and a second lower main surface. The third circuit board includes a third substrate body having a third upper main surface and a third lower main surface. The second radiation conductor layer is provided on the second substrate body. The second ground conductor layer is provided on the third substrate body. The second signal electrode is located on the second upper main surface. The second branch electrode is located on the third upper main surface or the third lower main surface.

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