Pre-pasting module

By designing the pre-stick module of the movable suction film disc and the film guide roller assembly, the problem of friction and abrasion during the pre-sticking process of dry film is solved, and the damage-free adhesion of the dry film is achieved, and the production quality of PCB is improved.

CN223168474UActive Publication Date: 2025-07-29GUANGDONG SOWOTECH CO LTD
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Patent Information

Application Number
CN202421640549.2
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-07-11
Publication Date
2025-07-29
Estimated Expiration
2034-07-11

AI Technical Summary

Technical Problem

In traditional film stickers, dry films are easily bruised by friction caused by abrasions by the suction film disc during pre-sticking.

Method used

A pre-stick module is designed, including a movable suction disc and a film guide roller assembly. The movement of the suction disc is controlled by driving the assembly to avoid direct contact between the dry film and the suction disc. The cooperation between the film roller and the film guide roller is used to ensure that the dry film is not worn during the adhesion process.

Benefits of technology

It effectively avoids friction and wear between the dry film and the absorbent film disc during stretching and adhesion, improves the integrity and adhesion effect of the dry film, and improves the yield and quality of the PCB.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model provides a pre-pasting module. The pre-pasting module comprises a rack; the two groups of pre-film pasting mechanisms are symmetrically arranged on the rack along the film pasting base surface; a pre-pasting module in the pre-pasting mechanism comprises a film roller arranged on a rack, a film suction disc and a film guide roller assembly which are both movably arranged on the rack, a first driving assembly used for driving the film suction disc to move and a second driving assembly used for driving the film guide roller assembly to move, and the film roller is arranged on the side, away from a pasting film base face, of the film suction disc. The film guide roller is arranged close to the film pasting base surface, and a dry film sequentially winds around the film roller, the film suction disc and the film guide roller and then is attached to the surface of the base plate; the second driving assembly is used for driving the film guide roller assembly to get close to or away from the film pasting base surface; the first driving assembly is used for driving the film suction disc to move so that a gap can be formed between a film guide plane formed by connecting the film roller and the film guide roller assembly and the surface of the film suction disc. According to the pre-pasting module provided by the invention, the problem that the dry film is abraded due to friction between the dry film and the film suction disc in the stretching, conveying and pasting processes can be avoided.
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Description

Technical Field

[0001] This application belongs to the technical field of circuit board production equipment, and more specifically, relates to a pre-pasting module. Background Art

[0002] Dry film is an important material in the PCB manufacturing process, used for transferring and making circuit board patterns. In the film pasting process, the dry film is first pre-attached to the surface of the copper-clad laminate, and then the film pasting is completed through vacuum film pressing to improve the filling performance and adhesion between the dry film and the surface of the copper-clad laminate, thereby improving the yield and quality of the PCB.

[0003] In the pre-pasting mechanism of a traditional film pasting machine, the driving source drives the suction film disc to move so as to pre-paste the front end of the dry film adsorbed on the suction film disc onto the PCB substrate. Then, the negative pressure supply is disconnected, and the suction film disc returns to its original position. The clamping jaw device clamps the PCB substrate and the dry film together and pulls them away from the pre-pasting station to make the dry film adhere to the PCB substrate. During the process of the clamping jaw device clamping the PCB substrate and the dry film and moving, since the suction film disc is fixedly arranged, friction will occur between the film surface of the dry film and the support surface on the suction film disc, thus there is a risk of scratching the dry film. Utility Model Content

[0004] The purpose of the embodiments of this application is to provide a pre-pasting module to solve the technical problem that the surface of the dry film is scratched during the pre-pasting process in the prior art.

[0005] To achieve the above purpose, the technical solution adopted in the embodiments of this application is to provide a pre-pasting module, which includes:

[0006] A frame;

[0007] Two groups of pre-film pasting mechanisms, symmetrically arranged on the frame along the film pasting base surface;

[0008] Each pre-film pasting mechanism includes a film unwinding module and a pre-pasting module. The film unwinding module is used to release the dry film, and the pre-pasting module is used to attach the dry film to the upper surface or the lower surface of the substrate;

[0009] The pre-pasting module includes a film roller arranged on the frame, a suction film disc and a film guiding roller assembly both movably arranged on the frame, a first driving component for driving the suction film disc to move, and a second driving component for driving the film guiding roller assembly to move. The film roller is arranged on the side of the suction film disc away from the film pasting base surface, the film guiding roller is arranged near the film pasting base surface, and the dry film sequentially passes around the film roller, the suction film disc and the film guiding roller and then adheres to the surface of the substrate;

[0010] The second driving component is used to drive the film guiding roller assembly to approach or move away from the film pasting base surface;

[0011] The first driving assembly is used to drive the film suction disk to move so that a gap is formed between the film guide plane formed by the connection between the film roller and the film guide roller assembly and the surface of the film suction disk.

[0012] Optionally, the film guide roller assemblies in the two groups of the pre-film laminating mechanisms are arranged in linkage, and the two groups of the film guide roller assemblies are driven to rotate by the second driving assembly.

[0013] Optionally, the film guide roller assembly is swingably arranged on the frame.

[0014] Optionally, the second drive assembly includes a motor and a gear set driven by the motor, and the two sets of film guide roller assemblies are respectively connected to different gears in the gear set. When the motor rotates, the two sets of film guide roller assemblies rotate synchronously in opposite directions.

[0015] Optionally, the film guide roller assembly includes a rotating frame and two film guide rollers mounted on the rotating frame, wherein one of the film guide rollers is arranged away from the swing axis of the film guide roller assembly.

[0016] Optionally, the film roller is fixedly arranged on one side of the film suction disk and can move along with the film suction disk, and the peripheral surface of the film roller protrudes from the surface of the film suction disk.

[0017] Optionally, the film suction disk is tilted relative to a first direction; the first driving assembly includes a swing frame rotatably arranged on the frame and a slide slidably arranged on the swing frame, and a first driving device arranged on one side of the swing frame to push the slide to slide relative to the swing frame; the film suction disk and the film roller are arranged on the slide.

[0018] Optionally, a curved guide groove is provided on the frame at one side of the swing axis of the swing frame, and a guide block inserted in the guide groove is provided on the slide.

[0019] Optionally, the guide groove includes a straight groove section extending along the first direction and a curved groove section connected to one end of the straight groove section.

[0020] Optionally, the pre-lamination module further comprises a film cutting device, which is fixedly mounted on the frame and located between the film suction disc and the film guide roller assembly. The film cutting device comprises an adsorption bar and a cutting knife slidably mounted on the adsorption bar.

[0021] The pre-lamination module provided in the embodiment of the present application has at least the following beneficial effects:

[0022] By movably arranging the film suction disc, and arranging a film roller on one side of the film suction disc away from the film sticking base surface, and enabling the film suction disc to approach or move away from the film guiding plane formed by the connection between the film roller and the film guiding roller assembly when moving, after the film suction disc adsorbs and guides the dry film and makes one end of the dry film adhere to the PCB substrate, the film suction disc is moved away from the film guiding plane to avoid friction between the dry film and the film suction disc during the stretching, conveying and sticking processes, thereby causing the problem of dry film wear. Description of the Drawings

[0023] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following will briefly introduce the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present application. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0024] Figure 1 It is a perspective view of the pre-sticking module in some embodiments of the present application;

[0025] Figure 2 It is a perspective view of the film guiding assembly in some embodiments of the present application;

[0026] Figure 3 It is a perspective view of the structure of the film suction disc and related components in some embodiments of the present application;

[0027] Figure 4 It is a schematic diagram of the film suction disc initially sticking the dry film to the PCB substrate in some embodiments of the present application;

[0028] Figure 5 It is a schematic diagram of a gap between the film suction disc and the film guiding plane in some embodiments of the present application;

[0029] Figure 6 It is a schematic diagram of the film guiding roller assembly away from the film sticking base surface in some embodiments of the present application. Detailed Embodiments

[0030] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present application more clearly understood, the following further details the present application in conjunction with the drawings and embodiments.

[0031] It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0032] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it can be directly on the other element or indirectly on the other element.

[0033] When an element is referred to as being "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element.

[0034] It should be understood that the orientation or positional relationship indicated by the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as a limitation to the present application.

[0035] In addition, the terms "first" and "second" are only used for descriptive purposes and cannot be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include one or more of such features.

[0036] In the description of the present application, "a plurality of" means two or more, unless otherwise specifically defined.

[0037] Please refer to Figures 1 to 6 for an explanation of the pre-pasting module provided in the embodiments of the present application.

[0038] It should be noted that the pre-pasting module described in the present application is provided on a pre-pasting machine. A substrate conveying line 400 for conveying the PCB substrate B is provided on the pre-pasting machine. It should be understood that there are two substrate conveying lines 400; the substrate conveying line 400 located at the front end of the pre-pasting film mechanism is only used for conveying the PCB substrate B, and this substrate conveying line 400 is also the film pasting surface A; the substrate conveying line 400 located at the front end of the pre-pasting film mechanism is used for conveying the PCB substrate B and tightly covering the dry film S on the upper and lower surfaces of the PCB substrate B on the surface of the PCB substrate B.

[0039] Refer to Figures 1 to 6 It can be understood that the pre-pasting module described in the present application includes a frame 100 and two sets of symmetrically arranged pre-pasting film mechanisms. The two sets of pre-pasting film mechanisms on the pre-pasting module are symmetrically arranged on the frame 100 along the film pasting surface A.

[0040] Each set of pre-pasting film mechanisms includes a film unwinding module 200 and a pre-pasting module 300. Among them, the film unwinding module 200 is used for winding and releasing the dry film roll, and the pre-pasting module 300 is arranged in the film conveying direction of the film unwinding module 200, and it is used for adsorbing, guiding the dry film S released by the film unwinding module 200 and attaching the front end thereof to the upper and lower surfaces of the PCB substrate B conveyed by the substrate conveying line 400.

[0041] Specifically, each set of pre-pasting modules 300 includes a film roller 310, a film suction disc 320, and a film guiding roller assembly 330 that are sequentially arranged in the conveying direction of the dry film S. A film guiding plane for conveying the dry film S is formed between the film roller 310 and the film guiding roller assembly 330. It should be understood that the film guiding plane is the plane where the tangents of the circumferences of the film roller 310 and the film guiding roller assembly 330 are connected respectively; it should also be understood that when the film roller 310 is movably arranged, the position of the film guiding plane changes dynamically following the movement of the film roller 310.

[0042] Both the film suction disc 320 and the film guiding roller assembly 330 are movably arranged on the frame 100 and can be individually controlled to move; the film roller 310 can be individually rotatably arranged on the frame 100 or integrally arranged with the film suction disc 320 so that the film roller 310 can move following the movement of the film suction disc 320. More specifically, the film guiding roller is arranged above or below the film pasting base surface A. Meanwhile, a first driving component 340 for driving the film suction disc 320 to move and a second driving component 350 for driving the film guiding roller assembly 330 to move are arranged on the frame 100.

[0043] When the first driving component 340 drives the film suction disc 320 to move, the film suction disc 320 can be driven to approach, move away from, or pass through the film guiding plane, that is, the film suction disc 320 can be driven to move to any two sides of the film guiding plane. Specifically, before the dry film S is attached to the surface of the PCB substrate B, the first driving component 340 drives the film suction disc 320 to move to coincide with the film guiding plane to be able to adsorb the dry film S, and then the first driving component 340 continues to drive the film suction disc 320 to pass through the film guiding plane so that the bottom end of the film suction disc 320 can approach and contact the surface of the PCB substrate B until the front end of the dry film S is attached to the surface of the PCB substrate B; after the front end of the dry film S is pasted to the surface of the PCB substrate B, the first driving component 340 drives the film suction disc 320 to retreat until its surface is away from the film guiding plane, so that the dry film S wound between the film guiding roller assembly 330 and the film roller 310 can avoid contacting the surface of the film suction disc 320.

[0044] When the second driving component 350 drives the film guiding roller assembly 330 to move, the film guiding roller assemblies 330 on the two sets of pre-film pasting mechanisms can approach or move away from the film pasting base surface A simultaneously. When the two sets of film guiding roller assemblies 330 approach the film pasting base surface A, each film guiding roller assembly 330 can respectively press and fit the dry film S with its front end preliminarily attached to the surface of the PCB substrate B or effectively support the dry film S before covering the PCB substrate B.

[0045] When the two sets of film guiding roller assemblies 330 move away from the film pasting base surface A, the gradually increasing gap between them can allow the clamping device 500 on the pre-pasting machine to pass through, so that the clamping device 500 can move horizontally along the film pasting base surface A and pull out the PCB substrate B with the front end of the dry film S pre-pasted.

[0046] Generally speaking, the operation process of the pre-pasting module in the embodiments of the present application is as follows:

[0047] The dry film S is released by the unwinding module 200 and is pre-wound between the film guiding roller assembly 330 and the film roller 310. At this time, the film sucking disc 320 is located at the first state position far from the film guiding plane and not in contact with the dry film S.

[0048] Reference Figure 4 , the first driving component 340 drives the film sucking disc 320 to approach the film guiding plane to adsorb the dry film S. After the film sucking disc 320 adsorbs the dry film S, it is continuously driven by the first driving component 340 to pass through the film guiding plane, so as to make the dry film S close to the surface of the PCB substrate B, so that the front end of the dry film S can be preliminarily pasted on the surface of the PCB substrate B. During this process, the dry film S is stretched and gradually moves away from the film guiding plane;

[0049] Reference Figure 5 , after the front end of the dry film S is preliminarily pasted on the surface of the PCB substrate B, the first driving component 340 drives the film sucking disc 320 to return to the first state position. During this process, the supporting force of the dry film S by the film sucking disc 320 gradually becomes smaller and gradually approaches the film guiding plane until the dry film S is completely supported by the film guiding roller assembly 330 and the film roller 310;

[0050] Reference Figure 5 , the clamping device 500 on the pre-pasting machine moves to the gap between the two film guiding roller assemblies 330 to clamp and pull out the PCB substrate B with the front end of the dry film S preliminarily pasted; during this process, the substrate conveying line 400 presses the film section of the dry film S other than the front end to closely cover the surface of the PCB substrate B;

[0051] Reference Figure 5 , the second driving component 350 drives the film guiding roller assembly 330 to approach the PCB substrate B but not in contact, and provides support for the dry film S while the clamping device 500 pulls out the PCB substrate B, so that the dry film S can be closely covered on the surface of the PCB substrate B by the substrate conveying line 400.

[0052] By setting the pre-pasting module, after the film sucking disc 320 adsorbs and guides the dry film S and makes the front end of the dry film S adhere to the PCB substrate B, by moving the film sucking disc 320 away from the film guiding plane, it is possible to avoid the problem that the dry film S is worn due to friction with the film sucking disc 320 during the stretching transmission and pasting process.

[0053] Reference Figure 1 And Figure 2 , in some embodiments, the film guiding roller assemblies 330 in the two pre-pasting film mechanisms are linked, and both film guiding roller assemblies 330 are driven to rotate by the second driving component 350.

[0054] Specifically, the second driving assembly 350 includes a motor 351 and a gear set 352 driven by the motor 351. In some embodiments, the gear set 352 is composed of two meshing gears, and one of the gears is connected to both the output shaft of the motor 351 and one of the film guiding roller assemblies 330, while the other gear is connected to the other film guiding roller assembly 330. When the motor 351 rotates, the two groups of film guiding roller assemblies 330 rotate synchronously towards or away from each other.

[0055] Reference Figure 1 and Figure 2 Furthermore, each film guiding roller assembly 330 is swingably arranged on the frame 100. Specifically, the film guiding roller assembly 330 includes a rotating frame 333 and two film guiding rollers mounted on the rotating frame 333, namely a first film guiding roller 331 and a second film guiding roller 332. Among them, the second film guiding roller 332 is arranged away from the swing axis of the film guiding roller assembly 330. The first film guiding roller 331 can be coaxially arranged with the rotation axis of the rotating frame 333 or eccentrically arranged with the rotation axis of the rotating frame 333.

[0056] It should be understood that the aforementioned film guiding plane refers to the plane formed by the connection of the tangential directions of the film roller 310 and the second film guiding roller 332 respectively. The first film guiding roller 331 is used to press the dry film S tightly against the surface of the PCB substrate B or effectively support the dry film S before covering the PCB substrate B.

[0057] Reference Figure 2 、 Figures 4 to 6 It should be understood that the distances between the first film guiding roller 331 and the second film guiding roller 332 in the same group of film guiding roller assemblies 330 and the rotation axis of the rotating frame 333 are not equal. By arranging the film guiding roller assembly 330 in this way, when the motor 351 rotates, it can synchronously drive the two groups of film guiding roller assemblies 330 to swing, so that the dry film S on both sides of the PCB substrate B can be simultaneously pressed and attached or effectively supported.

[0058] Reference Figure 1 and Figure 3 In some embodiments, the film roller 310 is rotatably arranged on one side of the film suction disc 320 and can move together with the film suction disc 320. Moreover, the peripheral surface of the film roller 310 protrudes from the surface of the film suction disc 320. In this way, the variation range of the film guiding plane is relatively large, that is, the dry film S can not contact the film suction disc 320 for a relatively long time to avoid unnecessary wear of the dry film S.

[0059] More specifically, refer to Figure 1 and Figure 3, the suction film disc 320 is disposed obliquely with respect to the first direction. It should be understood that the first direction is perpendicular to the film application base surface A, and the included angle between the suction film disc 320 and the first direction is an acute angle. The first driving assembly 340 includes a swing frame 341 rotatably disposed on the frame 100, a carriage 342 slidably disposed on the swing frame 341, and a first driving device 343 disposed on one side of the swing frame 341 for pushing the carriage 342 to slide relative to the swing frame 341. The first driving device 343 can be a cylinder or a linear motor 351, and specifically is not limited thereto. The suction film disc 320 and the film roller 310 are disposed on the carriage 342.

[0060] By providing the swing frame 341 and the carriage 342, when the first driving device 343 drives the carriage 342 to move, the carriage 342 can not only slide relative to the swing frame 341, but also the swing frame 341 can rotate relative to the frame 100 at the same time, so that one end of the carriage 342 away from the swing frame 341 can move along an arc, so that the bottom end of the suction film disc 320 on the carriage 342 can approach, pass through or away from the film guiding plane along an arc trajectory to approach or away from the film application base surface A.

[0061] Reference Figure 3 , further, a curved guiding groove 110 is provided on the frame 100 on one side of the swing axis of the swing frame 341, and a guiding block inserted into the guiding groove 110 is provided on the carriage 342. In this way, the sliding of the carriage 342 can be more stable. More specifically, the guiding groove 110 includes a straight groove section extending along the first direction and a curved groove section connected to one end of the straight groove section. The curved groove section is provided at one end of the straight groove section away from the film application base surface A.

[0062] Reference Figure 1 and Figure 3 , on the basis of the above embodiments, the pre-pasting module 300 further includes a film cutting device 360. The film cutting device 360 is fixedly disposed on the frame 100 and is located between the suction film disc 320 and the film guiding roller assembly 330. The film cutting device 360 includes an adsorption strip and a cutting knife slidably disposed on the adsorption strip. The cutting knife slides along the adsorption strip to cut off the dry film S. After the dry film S is cut off, the clamping device 500 continuously pulls the PCB substrate B so that the tail of the cut dry film S can be supported by the film guiding roller assembly 330 and pressed and covered on the surface of the PCB substrate B by the substrate conveying line 400, thereby completing the entire pre-pasting operation.

[0063] The above are only the preferred embodiments of the present application and are not intended to limit the present application. Any modifications, equivalent replacements, and improvements made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A pre-pasted module, characterized in that, Comprising: A frame; Two groups of pre-film laminating mechanisms, symmetrically arranged on the frame along the film laminating surface; Each of the pre-film laminating mechanisms includes a film unwinding module and a pre-laminating module. The film unwinding module is used to release the dry film, and the pre-laminating module is used to laminate the dry film on the upper surface or the lower surface of the substrate; The pre-laminating module includes a film roller arranged on the frame, a suction film disc and a film guiding roller assembly both movably arranged on the frame, as well as a first driving assembly for driving the suction film disc to move and a second driving assembly for driving the film guiding roller assembly to move. The film roller is arranged on the side of the suction film disc away from the film laminating surface, the film guiding roller is arranged near the film laminating surface, and the dry film is sequentially wound around the film roller, the suction film disc and the film guiding roller and then laminated on the substrate surface; The second driving assembly is used to drive the film guiding roller assembly to approach or move away from the film laminating surface; The first driving assembly is used to drive the suction film disc to move so that there is a gap between the film guiding plane formed by the connection between the film roller and the film guiding roller assembly and the surface of the suction film disc.

2. The pre-pasted module according to claim 1, wherein: The film guiding roller assemblies in the two groups of pre-film laminating mechanisms are linked, and both groups of film guiding roller assemblies are driven to rotate by the second driving assembly.

3. The pre-pasted module according to claim 1 or 2, characterized in that: The film guiding roller assembly is swingably arranged on the frame.

4. The pre-pasted module according to claim 3, wherein: The second driving assembly includes a motor and a gear set driven by the motor. The two groups of film guiding roller assemblies are respectively connected to different gears in the gear set. When the motor rotates, the two groups of film guiding roller assemblies rotate synchronously towards or away from each other.

5. The pre-pasted module according to claim 3, wherein: The film guiding roller assembly includes a rotating frame and two film guiding rollers mounted on the rotating frame. One of the film guiding rollers is arranged away from the swing axis of the film guiding roller assembly.

6. The pre-pasted module according to claim 1, wherein: The film roller is fixedly arranged on one side of the suction film disc and can move together with the suction film disc, and the peripheral surface of the film roller protrudes from the surface of the suction film disc.

7. The pre-pasted module according to claim 6, wherein: The suction film disc is inclined relative to the first direction; the first driving assembly includes a swing frame rotatably arranged on the frame, a sliding frame slidably arranged on the swing frame, and a first driving device arranged on one side of the swing frame for pushing the sliding frame to slide relative to the swing frame; the suction film disc and the film roller are arranged on the sliding frame.

8. The pre-pasted module according to claim 7, wherein: On the frame, a curved guiding groove is arranged on one side of the swing axis of the swing frame, and a guiding block inserted into the guiding groove is arranged on the sliding frame.

9. The pre-pasted module according to claim 8, wherein: The guiding groove includes a straight groove section extending along the first direction and a curved groove section connected to one end of the straight groove section.

10. The pre-pasting module according to any one of claims 1, 2, 6 to 9, characterized in that: The pre-laminating module further includes a film cutting device. The film cutting device is fixedly arranged on the frame and is located between the suction film disc and the film guiding roller assembly. The film cutting device includes an adsorption strip and a cutting knife slidably arranged on the adsorption strip.