LED backlight packaging structure and vehicle-mounted display module backlight structure

Abstract

An LED backlight packaging structure and a vehicle-mounted display module backlight structure are characterized in that a plurality of LED backlight packaging structures are arranged on a vehicle-mounted display module, LED chips of the LED backlight packaging structures are mounted on the top surface of a circuit board, and light emitted by the LED chips passes through fluorescent glue, a box dam and a top cover, then passes through an optical film and is emitted to a display screen. Therefore, a uniform illumination effect is formed on the display screen. Due to the fact that most of light rays of the LED chips can be emitted from the transparent box dam, only a small part of light rays can be emitted from the semitransparent top cover, and the illumination intensities of the light rays and the semitransparent top cover are very close, light spots can be prevented from being generated, the illumination uniformity is improved, and the number of the LED chips and the thickness of the whole vehicle-mounted display module can be reduced.

Description

Technical Field

[0001] The utility model relates to an in-vehicle display module, in particular to a backlight structure for encapsulating LEDs and the backlight structure of an in-vehicle display module. Background Art

[0002] At present, the direct-lit backlight design in automobiles generally uses 360° direction-emitting LED lamp beads with caps in 1515 package (i.e., the length and width of the package specification are 1.5mm * 1.5mm), or top-emitting LED lamp beads in 2016 (package specification 2mm * 1.6mm) or 3030 package (package specification 3mm * 3mm). The backlight structure in 1515 package has low luminous power and brightness due to volume limitation. The LED lamp beads in the 2016 or 3030 package backlight structure are installed in the bracket, and the light energy is concentrated above the LED lamp beads while the light energy around is weak, thus forming a light spot phenomenon; in order to eliminate the light spot and increase the uniformity of light, it is necessary to increase the distance between the LED lamp beads and the light-emitting surface, but this will inevitably increase the thickness of the entire backlight module, and the light intensity will also be weakened accordingly, resulting in a lower brightness of the display module. Summary of the Utility Model

[0003] The purpose of the utility model is to provide an LED backlight encapsulation structure and the backlight structure of an in-vehicle display module that can effectively improve the luminous uniformity, so as to reduce the thickness of the backlight module while ensuring the luminous effect.

[0004] The LED backlight encapsulation structure described in the utility model includes an LED chip installed on a circuit board. A dike is also installed on the circuit board. The dike is annular and encloses the LED chip inside. The opening on the side of the dike facing away from the circuit board is covered with a top cover. A fluorescent glue is filled between the inner side of the top cover, the inner side of the dike and the LED chip; both the dike and the top cover are made of light-transmitting materials.

[0005] Further, the light transmittance of the top cover is less than that of the dike.

[0006] Further, the dike is made of transparent or semi-transparent dike glue.

[0007] Further, the top cover is made of semi-transparent light-blocking glue, or semi-transparent resin material, or semi-transparent glue with diffusing particles.

[0008] Further, the cross-sectional shape of the dike is a circular ring or a square frame.

[0009] Further, the axial length of the dike is greater than the thickness of the LED chip.

[0010] Further, the top cover covers the side of the dam facing away from the circuit board, and the shape of the inner side surface of the top cover is a circle with a diameter equal to the outer diameter of the circular ring of the dam.

[0011] Further, the thickness of the top cover gradually decreases from the center to the periphery.

[0012] Further, the inner side surface of the top cover is recessed toward the side facing away from the circuit board, and the depth of the recess gradually decreases from the center to the periphery.

[0013] The backlight structure of the in-vehicle display module of the present utility model includes a circuit board disposed on one side of the display screen. An optical film is disposed between the circuit board and the display screen. A plurality of LED backlight packaging structures are spaced apart on the circuit board. The LED backlight packaging structure includes an LED chip mounted on the circuit board. A dam is also installed on the circuit board. The dam is annular and encloses the LED chip inside. The opening of the dam facing away from the circuit board is covered with a top cover. A fluorescent glue is filled between the inner side of the top cover, the inner side of the dam and the LED chip. Both the dam and the top cover are made of light-transmitting materials.

[0014] For the LED backlight packaging structure and the backlight structure of the in-vehicle display module of the present utility model, a plurality of LED backlight packaging structures are provided on the in-vehicle display module. The LED chips of these LED backlight packaging structures are mounted on the top surface of the circuit board. The top surface of the circuit board is made into an annular dam with a light-transmitting material to enclose the LED chip inside the dam. Then, a fluorescent glue is filled between the dam and the LED chip and covers the entire LED chip. Next, a top cover is made of a light-transmitting material on the top surface of the dam, that is, on the side of the dam facing away from the circuit board, to cover the fluorescent glue inside the opening of the dam. When working, after the light emitted by the LED chip passes through the fluorescent glue, most of the light will diverge from the surrounding dam, and the divergence angle is relatively large. The light emitted through the top cover is less, making the light intensity very close to that of the surrounding area. Thus, without increasing the distance between the LED chip and the light-emitting surface, the uniformity of the illumination can be effectively improved, and the generation of light spots can be prevented. It can also effectively reduce the thickness of the entire backlight module. As a result, the number of LED chips required can be reduced, and the corresponding resistors and capacitors will also be reduced, not only reducing the material cost but also the processing cost, and greatly improving the production efficiency. Description of the Drawings

[0015] Figure 1 、 2 is a schematic structural diagram of the first embodiment of the LED backlight packaging structure.

[0016] Figure 3 is a schematic structural diagram of the second embodiment of the LED backlight packaging structure.

[0017] Figure 4 is a schematic structural diagram of the third embodiment of the LED backlight packaging structure.

[0018] Figure 5 、 6 is a schematic structural view of the fourth embodiment of the LED backlight package structure.

[0019] Figure 7 is a schematic structural view of the backlight structure of the vehicle-mounted display module. Detailed implementation manners

[0020] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0021] It should be noted that if there are directional indications (such as up, down, left, right, front, back, top, bottom, inside, outside, vertical, horizontal, longitudinal, counterclockwise, clockwise, circumferential, radial, axial...) involved in the embodiments of the present invention, then the directional indications are only used to explain the relative positional relationship and movement conditions between components in a specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indications will also change accordingly.

[0022] If there are descriptions involving "first" or "second" in the embodiments of the present invention, then the descriptions of "first" or "second" are only for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include at least one of such features. In addition, the technical solutions between various embodiments can be combined with each other, but it must be based on the fact that those of ordinary skill in the art can implement it. When the combination of technical solutions is contradictory or cannot be implemented, it should be considered that such a combination of technical solutions does not exist and is not within the protection scope required by the present invention.

[0023] The present invention proposes an LED backlight package structure.

[0024] Embodiment 1, as shown in Figure 1 、 2 In this embodiment, the LED backlight package structure includes an LED chip 2 mounted on a circuit board 1. A dam 3 is also installed on the circuit board. The dam is annular and encloses the LED chip inside. A top cover 4 covers the opening on the side of the dam facing away from the circuit board. A fluorescent glue 5 is filled between the inner side of the top cover, the inner side of the dam and the LED chip; both the dam and the top cover are made of light-transmitting materials.

[0025] As shown in Figure 1, 2 As shown, the LED chip is installed on the top surface of the circuit board. The top surface of the circuit board is made into an annular dam using a light-transmitting material, and the LED chip is surrounded inside the dam. Then, a fluorescent glue is filled between the dam and the LED chip and covers the entire LED chip. Next, another light-transmitting material is used to make a top cover at the top surface of the dam, that is, on the side of the dam facing away from the circuit board, covering the fluorescent glue within the opening of the dam. When working, after the light emitted by the LED chip passes through the fluorescent glue, most of it will diverge from the surrounding dam, and the divergence angle is relatively large, thus covering a relatively large area; while a smaller area is covered by the light emitted through the top cover, and the light emitted through the top cover is less than that in the surrounding area, thereby making its light intensity close to that of the surrounding area. Thus, without increasing the distance between the LED chip and the light-emitting surface, the uniformity of illumination can be effectively improved, and the generation of light spots can be prevented.

[0026] For the LED backlight packaging structure described above, the light transmittance of the top cover 4 is less than that of the dam 3, so as to increase the light intensity in the surrounding area and reduce the light intensity in the top area, thereby better controlling the uniformity of illumination. For example, the dam 3 described above can be made of a transparent or semi-transparent dam glue, and the top cover 4 is made of a semi-transparent light-blocking glue to meet the requirements of the light transmittance. Or the top cover 4 is made of a semi-transparent resin material, and the light transmittance of this material can be conveniently adjusted according to the product needs, so as to meet different working requirements. Of course, both the dam and the top cover can be made of a transparent material, or both can be made of a semi-transparent material, and specifically, it can be selected according to the needs and the specific use environment.

[0027] For the LED backlight packaging structure described above, the dam 3 is a circular ring structure to improve the uniformity of the surrounding light, and the axial length of the dam 3, that is, Figure 1 the height protruding upward from the circuit board, is greater than the thickness of the LED chip 2, so as to leave a space between the LED chip and the top cover that can be filled with sufficient fluorescent glue. At the same time, the top cover 4 covers the side of the dam 3 facing away from the circuit board 1, and the shape of the inner side surface of the top cover, that is, the surface in contact with the dam, is a circle with a diameter the same as the outer diameter of the circular ring of the dam, so as to better cooperate with the dam; and the thickness of the top cover 4 gradually decreases from the center to the periphery, forming a bulging shape, so as to further improve the uniformity of illumination.

[0028] For the LED backlight packaging structure described above, a reflective coating is provided on the surface of the circuit board 1, which can reflect the light emitted by the LED chip towards the circuit board outward, making more full use of the light and improving the light intensity.

[0029] Embodiment 2, as Figure 3 shown.

[0030] In this embodiment, the inner side surface of the top cover 4 is recessed toward the side facing away from the circuit board 1, and the recess depth gradually decreases from the center to the periphery; the rest is the same as in the first embodiment. This can also fill the fluorescent glue between the top cover and the top surface of the dam. The light emitted by the LED chip will not pass through the dam and then through the top cover, avoiding the reduction of light in a specific area and forming light spots in another way.

[0031] Embodiment 3, as Figure 4 shown.

[0032] In this embodiment, the top cover 4 is made of a translucent gel with diffusing particles; the rest is the same as in the first embodiment. This can make the light diffuse after passing through the top cover, further improving the uniformity of the illumination. On the vehicle-mounted module, it can also replace the diffusion sheet or diffusion plate, thereby reducing the thickness, structural complexity and manufacturing cost of the vehicle-mounted module.

[0033] Embodiment 4, as Figure 5 、 6 shown.

[0034] In this embodiment, the cross-sectional shape of the dam 3 is a square frame; and the outer side surface of the top cover 4, that is, the side facing away from the circuit board, is a plane; the rest is the same as in the first embodiment. This forms different lighting effects, meeting different usage needs while ensuring the uniformity of illumination.

[0035] The present utility model also proposes a backlight structure for a vehicle-mounted display module.

[0036] As Figure 7 shown, in this embodiment, the backlight structure for the vehicle-mounted display module includes a circuit board 1 disposed on one side of the display screen 6. An optical film 7 is disposed between the circuit board and the display screen. A plurality of LED backlight packaging structures are spaced apart on the circuit board; the LED backlight packaging structure includes an LED chip 2 mounted on the circuit board 1. A dam 3 is also installed on the circuit board. The dam is annular and surrounds the LED chip. The opening on the side of the dam facing away from the circuit board is covered with a top cover 4. A fluorescent glue 5 is filled between the inner side of the top cover, the inner side of the dam and the LED chip; both the dam and the top cover are made of light-transmitting materials.

[0037] For the backlight structure of the vehicle-mounted display module described above, after the light emitted by the LED chip passes through the fluorescent glue, the dam and the top cover, it then passes through the optical film and shines on the display screen, thereby forming a uniform lighting effect on the display screen. This can effectively improve the uniformity of illumination without increasing the distance between the LED chip and the light-emitting surface, and can also effectively reduce the thickness of the entire backlight module. As a result, the need for using the number of LED chips is also reduced, and the corresponding resistors and capacitors will also be reduced, not only reducing the material cost but also the processing cost, and greatly improving the production efficiency.

[0038] The above are only the preferred embodiments of the present utility model, and thus do not limit the patent scope of the present utility model. Any equivalent structural transformation made under the inventive concept of the present utility model by using the content of the specification and drawings of the present utility model, or any direct / indirect application in other related technical fields is included in the patent protection scope of the present utility model.

Claims

1. An LED backlight package structure, comprising an LED chip (2) mounted on a circuit board (1), characterized in that: The circuit board is also provided with a dam (3). The dam is annular and encloses the LED chip inside. The opening on the side of the dam facing away from the circuit board is covered with a top cover (4). A fluorescent glue (5) is filled between the inner side of the top cover, the inner side of the dam and the LED chip. Both the dam and the top cover are made of light-transmitting materials.

2. The LED backlight package structure according to claim 1, wherein: The light transmittance of the top cover (4) is less than that of the dam (3).

3. The LED backlight packaging structure according to claim 2, wherein: The dam (3) is made of a transparent or semi-transparent dam glue.

4. The LED backlight package structure according to claim 2 or 3, characterized in that: The top cover (4) is made of a semi-transparent light-blocking glue, or a semi-transparent resin material, or a semi-transparent gel with diffusing particles.

5. The LED backlight package structure according to claim 1, wherein: The cross-sectional shape of the dam (3) is a circular ring or a square frame.

6. The LED backlight package structure according to claim 1 or 5, wherein: The axial length of the dam (3) is greater than the thickness of the LED chip (2).

7. The LED backlight package structure according to claim 5, wherein: The top cover (4) covers the side of the dam (3) facing away from the circuit board (1), and the shape of the inner side of the top cover is a circle with a diameter the same as the outer diameter of the circular ring of the dam.

8. The LED backlight packaging structure according to claim 1, 5 or 7, characterized in that: The thickness of the top cover (4) gradually decreases from the center to the periphery.

9. The LED backlight package structure according to claim 1, 5 or 7, characterized in that: The inner side of the top cover is recessed towards the side facing away from the circuit board, and the recessed depth gradually decreases from the center to the periphery.

10. A backlight structure for a vehicle-mounted display module, the backlight structure of the vehicle-mounted display module includes a circuit board (1) disposed on one side of a display screen (6), and is characterized in that: An optical film (7) is provided between the circuit board and the display screen. A number of LED backlight packaging structures are arranged at intervals on the circuit board. The LED backlight packaging structure includes an LED chip (2) mounted on the circuit board (1). The circuit board is also provided with a dam (3). The dam is annular and encloses the LED chip inside. The opening on the side of the dam facing away from the circuit board is covered with a top cover (4). A fluorescent glue (5) is filled between the inner side of the top cover, the inner side of the dam and the LED chip. Both the dam and the top cover are made of light-transmitting materials.

Images