Automobile projection lamp with high heat dissipation performance
By setting air permeable holes, metal substrates and radiators in the automotive projection lamp, the problem of excessive temperature rise of LED lamps is solved, and higher brightness and optical effects are achieved.
Patent Information
- Application Number
- CN202422536965.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-10-19
- Publication Date
- 2025-08-01
- Estimated Expiration
- 2034-10-19
AI Technical Summary
The existing automotive projection lamp modules have excessive temperature rise due to the heating of LED lamps, unbalanced internal air pressure, and low thermal conductivity of PCB materials, resulting in light decay and reduced brightness.
The breathable structure, heat dissipation structure and sealing structure are designed, and metal substrates and radiators are used to discharge gas, heat conduction and heat convection through the breathable holes to achieve heat dissipation, forming a heat conduction, heat dissipation, exhaust gas and sealing system.
It effectively solves the problem of excessive LED lamp temperature, improves brightness and achieves higher optical effects.
Smart Images
Figure CN223178684U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of automotive projection lamps, and more specifically to an automotive projection lamp with high heat dissipation performance. Background Art
[0002] The existing automotive projection lamp module structure has the following disadvantages: 1. The existing LED lamp generates heat, resulting in high temperature rise due to internal air pressure. There are no ventilation holes in the outer shell and the rear shell, and the internal and external pressures of the module cavity cannot be balanced; 2. The PCB of the current LED lamp is made of FR4 material, and its thermal conductivity is very low, which is not conducive to heat dissipation. The temperature inside the module rises, leading to an increase in the temperature of the LED lamp, light decay phenomenon, blurred image, and reduced brightness. Summary of the Utility Model
[0003] In view of the deficiencies of the prior art, the utility model provides an automotive projection lamp with high heat dissipation performance. The automotive projection lamp with high heat dissipation performance forms a heat conduction, heat dissipation, exhaust, and sealing system by setting a ventilation structure, a heat dissipation structure, and a sealing structure, solving the light decay phenomenon caused by the too high temperature of the LED lamp in the automotive projection lamp. In addition, it provides a feasible and reliable solution for the optical effect scheme of increasing the power of the LED lamp to achieve higher brightness.
[0004] To achieve the above object, the utility model provides the following technical solutions:
[0005] An automotive projection lamp with high heat dissipation performance, comprising a housing, an MLA microlens module, an LED lamp, a PCB board, and a radiator. A plurality of ventilation holes are provided on the top side of the housing. The LED lamp and the MLA microlens module are both installed on the PCB board, and the MLA microlens module covers the LED lamp. The PCB board is installed inside the housing. The radiator includes a contact end and a heat dissipation end. The radiator is installed on the housing, and its contact end extends into the housing to contact the PCB board, and the heat dissipation end communicates with the outside.
[0006] Further, the housing includes an outer shell and a rear shell, and the outer shell and the rear shell are detachably connected.
[0007] Further, the plurality of ventilation holes are respectively provided on the top of the front of the outer shell and the top of the back of the rear shell, and a dust-proof gasket is provided at the ventilation holes.
[0008] Further, the PCB board includes a substrate and an inlaid board. The substrate is made of FR4 epoxy dense board material, the inlaid board is made of metal material, and the LED lamp is installed on the inlaid board.
[0009] Further, the PCB board includes a substrate, and the substrate is made of metal material.
[0010] Further, the metal material includes aluminum or copper.
[0011] Further, a number of heat dissipation structures are provided at the heat dissipation end of the radiator.
[0012] Further, the heat dissipation structure includes a number of heat dissipation fins or a number of heat dissipation ribs.
[0013] Further, a heat dissipation cavity is provided on the back surface of the rear shell. Heat dissipation holes communicating with the outside are provided at the top and bottom of the heat dissipation cavity, and the heat dissipation end of the radiator is located in the heat dissipation cavity.
[0014] Further, a sealing ring is provided at the installation position of the radiator and the housing.
[0015] Compared with the prior art, the beneficial effects of the present utility model are as follows:
[0016] 1. Aiming at the phenomenon that the heat generation and temperature rise of the LED lamp cause the air pressure inside the module to be too high, and at the same time to balance the internal and external pressures of the module cavity, by providing ventilation holes on both the outer shell and the rear shell, and placing the ventilation holes at the upper side position, it is more conducive to the exhaust of air flow, and a dust-proof gasket is attached at the ventilation hole to effectively achieve dust-proof while exhausting air.
[0017] 2. By designing the structure of the PCB board as an aluminum substrate or an aluminum-inlaid board, a copper substrate or a copper-inlaid board, the high thermal conductivity of the aluminum substrate and the copper substrate is conducive to heat dissipation, and the aluminum (copper)-inlaid method is conducive to arranging more electronic components on the PCB board. The all-aluminum (copper) substrate method requires sufficient area to arrange electronic components, but increases the heat dissipation volume and is more conducive to heat dissipation.
[0018] 3. By providing radiator parts, the contact end of the radiator is in contact with the PCB board through thermal grease for heat conduction, and heat dissipation fins or heat dissipation rib structures are provided at the heat dissipation end of the radiator to increase the heat dissipation area. At the same time, a heat dissipation cavity and heat dissipation holes are provided on the rear shell, and the space between the heat dissipation fins or heat dissipation ribs and the heat dissipation cavity forms a heat dissipation solution of heat convection, and this solution can transfer the heat inside the automotive projection lamp module to the outside.
[0019] The present utility model forms a heat conduction, heat dissipation, exhaust, and sealing system for the automotive projection lamp by providing a ventilation structure, a heat dissipation structure, and a sealing structure, solves the light decay phenomenon caused by the too high temperature of the LED lamp in the automotive projection lamp, and also provides a feasible and reliable solution for the optical effect solution of increasing the power of the LED lamp to achieve higher brightness. Description of the Drawings
[0020] To more clearly illustrate the technical solutions in the embodiments of the present utility model, the following will briefly introduce the attached drawings required for the description of the embodiments. Obviously, the attached drawings in the following description are only some embodiments of the present utility model. For those of ordinary skill in the art, without creative efforts, other attached drawings can be obtained based on these drawings, where:
[0021] Figure 1 is a structural schematic diagram of an automotive projection lamp with high heat dissipation performance;
[0022] Figure 2 is a cross-section of an automotive projection lamp with high heat dissipation performance Figure 1 ;
[0023] Figure 3 is a cross-section of an automotive projection lamp with high heat dissipation performance Figure 2 ;
[0024] Figure 4 is a structural schematic diagram of a PCB board.
[0025] The labels in the figure are: 1. Housing; 101. Outer shell; 102. Rear shell; 103. Vent hole; 104. Dust-proof gasket; 105. Heat dissipation cavity; 106. Heat dissipation hole; 2. PCB board; 201. Substrate; 202. Inlay board; 3. LED lamp; 4. MLA microlens module; 5. Radiator; 6. Sealing ring. Specific embodiments
[0026] In the description of the present utility model, it should be noted that for orientation terms, such as terms "center", "transverse (X)", "longitudinal (Y)", "vertical (Z)", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc., the indicated orientation and position relationship are based on the orientation or position relationship shown in the attached drawings. It is only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and should not be construed as limiting the specific protection scope of the present utility model.
[0027] In addition, for terms "first" and "second", they are only used for descriptive purposes and cannot be construed as indicating or implying relative importance or implicitly specifying the quantity of technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include one or more of such features. In the description of the present utility model, the meanings of "several" and "a number of" are two or more, unless otherwise clearly and specifically defined.
[0028] An automotive projection lamp with high heat dissipation performance, such asFigures 1-4 As shown in the figure, it includes a housing 1, an MLA microlens module 4, an LED lamp 3, a PCB board 2, and a radiator 5. A plurality of ventilation holes 103 are provided on the side of the top of the housing 1. The LED lamp 3 and the MLA microlens module 4 are both installed on the PCB board 2, and the MLA microlens module 4 covers the LED lamp 3. The PCB board 2 is installed inside the housing 1. The radiator 5 includes a contact end and a heat dissipation end. The radiator 5 is installed on the housing 1, and its contact end extends into the housing 1 to contact the PCB board 2, and the heat dissipation end communicates with the outside.
[0029] Preferably, as Figures 2-3 shown in the figure, the housing 1 includes an outer shell 101 and a rear shell 102, and the outer shell 101 and the rear shell 102 are detachably connected.
[0030] Preferably, as Figure 3 shown in the figure, the plurality of ventilation holes 103 are respectively provided at the top of the front of the outer shell 101 and the top of the back of the rear shell 102, and a dust-proof gasket 104 is provided at the ventilation holes 103.
[0031] Preferably, as Figure 4 shown in the figure, the PCB board 2 includes a substrate 201 and an inlay board 202. The substrate 201 is made of FR4 epoxy dense board material, and the inlay board 202 is made of metal material, and the LED lamp 3 is installed on the inlay board 202.
[0032] Preferably, the PCB board 2 includes a substrate 201, and the substrate 201 is made of metal material.
[0033] Preferably, the metal material includes aluminum or copper.
[0034] Preferably, a plurality of heat dissipation structures are provided at the heat dissipation end of the radiator 5 to improve the heat dissipation efficiency of the radiator 5 through the heat dissipation structures.
[0035] Preferably, the heat dissipation structures include a plurality of heat dissipation fins or a plurality of heat dissipation ribs.
[0036] Preferably, as Figure 3 shown in the figure, a heat dissipation cavity 105 is provided on the back of the rear shell 102. Heat dissipation holes 106 communicating with the outside are provided at the top and bottom of the heat dissipation cavity 105, and the heat dissipation end of the radiator 5 is located in the heat dissipation cavity 105.
[0037] Preferably, as Figure 3 shown in the figure, a sealing ring 6 is provided at the installation position of the radiator 5 and the housing 1, so as to increase the sealing performance between the radiator 5 and the housing 1; specifically, the radiator 5 is installed on the rear shell 102, and the sealing ring 6 is installed at the installation position of the radiator 5 and the rear shell 102.
[0038] Principle and advantages:
[0039] 1. Regarding the phenomenon that the heat generation and temperature rise of the LED lamp 3 lead to too high air pressure inside the module, and at the same time to balance the internal and external pressures of the module cavity, by setting ventilation holes 103 on both the outer shell 101 and the rear shell 102, and placing the ventilation holes 103 on the upper side, it is more conducive to the exhaust of air flow, and a dust-proof gasket 104 is attached at the ventilation holes 103 to effectively achieve dust-proof while exhausting air.
[0040] 2. By designing the structure of the PCB board 2 as an aluminum substrate or an aluminum-inlaid board, a copper substrate or a copper-inlaid board, the high thermal conductivity of the aluminum substrate and the copper substrate is conducive to heat dissipation. The aluminum (copper)-inlaid method is conducive to arranging more electronic components on the PCB board 2. The all-aluminum (copper) substrate method requires sufficient area to arrange electronic components, but increases the heat dissipation volume and is more conducive to heat dissipation.
[0041] 3. By setting the radiator 5 component, the contact end of the radiator 5 is in contact with the PCB board 2 with thermal grease for heat conduction, and heat dissipation fins or heat dissipation ribs are arranged at the heat dissipation end of the radiator 5 to increase the heat dissipation area. At the same time, a heat dissipation cavity 105 and heat dissipation holes 106 are arranged on the rear shell 102. The heat dissipation fins or heat dissipation ribs and the space of the heat dissipation cavity 105 form a heat convection heat dissipation solution, and this solution can transfer the heat inside the automotive projection lamp module to the outside.
[0042] The utility model forms a heat conduction, heat dissipation, exhaust, and sealing system for the automotive projection lamp by setting a ventilation structure, a heat dissipation structure, and a sealing structure, solves the light decay phenomenon caused by too high temperature of the LED lamp 3 in the automotive projection lamp, and also provides a feasible and reliable solution for the optical effect solution of increasing the power of the LED lamp 3 to achieve higher brightness.
[0043] The above is only the preferred implementation mode of the utility model. The protection scope of the utility model is not limited to the above embodiments. All technical solutions within the idea of the utility model belong to the protection scope of the utility model. It should be pointed out that for those of ordinary skill in the art in this technical field, without departing from the principle of the utility model, several improvements and refinements should also be regarded as the protection scope of the utility model.
Claims
1. An automotive projection lamp with high heat dissipation performance, characterized in that: It includes a housing, an MLA microlens module, an LED lamp, a PCB board and a radiator. A number of ventilation holes are provided on the side of the top of the housing. The LED lamp and the MLA microlens module are both mounted on the PCB board, and the MLA microlens module covers the LED lamp. The PCB board is mounted inside the housing. The radiator includes a contact end and a heat dissipation end. The radiator is mounted on the housing, and its contact end extends into the housing to contact the PCB board, and the heat dissipation end communicates with the outside.
2. The automotive projection lamp with high heat dissipation performance according to claim 1, characterized in that: The housing includes an outer shell and a rear shell, and the outer shell and the rear shell are detachably connected.
3. The automotive projection lamp with high heat dissipation performance according to claim 2, characterized in that: A number of ventilation holes are respectively provided on the top of the front of the outer shell and the top of the back of the rear shell, and dust-proof gaskets are provided at the ventilation holes.
4. The automotive projection lamp with high heat dissipation performance according to claim 1, characterized in that: The PCB board includes a substrate and an inlay board. The substrate is made of FR4 epoxy dense board material, and the inlay board is made of metal material, and the LED lamp is mounted on the inlay board.
5. The automotive projection lamp with high heat dissipation performance according to claim 1, wherein: The PCB board includes a substrate, and the substrate is made of metal material.
6. The automotive projection lamp with high heat dissipation performance according to claim 4 or 5, characterized in that: The metal material includes aluminum or copper.
7. The automotive projection lamp with high heat dissipation performance according to claim 1, wherein: A number of heat dissipation structures are provided at the heat dissipation end of the radiator.
8. The automotive projection lamp with high heat dissipation performance according to claim 7, characterized in that: The heat dissipation structure includes a number of heat dissipation fins or a number of heat dissipation ribs.
9. The automotive projection lamp with high heat dissipation performance according to claim 2 or 3, characterized in that: A heat dissipation cavity is provided on the back of the rear shell. Heat dissipation holes communicating with the outside are provided at the top and bottom of the heat dissipation cavity, and the heat dissipation end of the radiator is located in the heat dissipation cavity.
10. A vehicle projection lamp with high heat dissipation performance according to claim 1, characterized in that: A sealing ring is provided at the installation place of the radiator and the housing.