Open type air duct internal storage radiator
Through the open air duct memory radiator combined with flow diversion and heat conduction design, the problems of heat accumulation and large volume and high cost of traditional memory radiators are solved, achieving efficient heat dissipation and low-cost heat dissipation effects.
Patent Information
- Application Number
- CN202422376806.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-29
- Publication Date
- 2025-08-01
- Estimated Expiration
- 2034-09-29
AI Technical Summary
The closed structure of the traditional memory radiator causes air flow to be limited and heat accumulation. The heat conduction and flow guide designs are large in size, high in cost, and the heat dissipation effect is not ideal under high-frequency operation.
The open air duct design is adopted to surround the memory stick, the limiting member and the heat conduction medium to form an open area. Combined with the flow diversion and heat conduction design, the airflow allows free flow and rapid heat conduction.
It improves heat dissipation efficiency, avoids heat accumulation, reduces costs, and is adapted to memory sticks of various specifications, with a small size and a large heat dissipation area.
Smart Images
Figure CN223180633U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of heat dissipation, especially to the technical field of heat dissipation for personal computers, workstations and servers, and specifically to an open - air - duct memory heat sink. Background Art
[0002] With the continuous improvement of computer performance, the working frequency and power consumption of memory are getting higher and higher. During operation, a large amount of heat will be released, which also puts higher requirements on the design of memory heat sinks. Excessive memory temperature will lead to unstable operation or failures, and in severe cases, it will cause system crashes or hardware damage. This problem is particularly prominent in working scenarios and modes such as high - performance computing, gaming e - sports, and memory overclocking.
[0003] Traditional memory heat sinks generally adopt a closed structure, and on this basis, a heat - conduction design or a flow - guiding design is adopted; the closed structure restricts air flow and is prone to heat accumulation; the heat - conduction design conducts heat to heat - dissipation components such as heat - dissipation fins for heat dissipation. This design has a large volume, and the heat - conduction efficiency is not ideal under high - frequency memory operations; the flow - guiding design also has limitations such as a large volume and high cost. Summary of the Invention
[0004] In order to solve the above - mentioned technical problems, the utility model proposes an open - air - duct memory heat sink to overcome the problems of easy heat accumulation in the closed structure of traditional memory heat sinks, large volume, high cost, unsatisfactory heat - dissipation effect under high - frequency operations, single heat - dissipation method, and high cost of heat - conduction heat sinks or flow - guiding heat sinks.
[0005] In order to achieve the above purpose, the utility model provides the following technical solutions:
[0006] An open - air - duct memory heat sink, comprising:
[0007] An open - air - duct formed by a heat sink, a limiting member, and a heat - conducting medium surrounding a memory module; the open - air - duct extends along the length direction and height direction of the memory module, forming an opening and an open area; the size and shape of the opening and the open area are jointly defined by the heat sink, the limiting member, the heat - conducting medium, and the memory module;
[0008] Wherein:
[0009] The heat sinks are symmetrically arranged on both sides of the memory module, and a number of mounting holes are provided on the heat sinks. The heat sinks are made of materials with high thermal conductivity, such as: aluminum alloy, copper, or graphene;
[0010] The limiting member is arranged between the heat sinks, with both ends thereof respectively abutting against adjacent heat sinks, and the bottom thereof abutting against the top of the memory module. The limiting member is made of materials with high temperature resistance and anti-aging properties, such as rubber, aluminum alloy or copper;
[0011] The heat-conducting medium is arranged on the memory chips of the memory module and is in contact with the inner surfaces of adjacent heat sinks. The heat-conducting medium, such as heat-conducting silicone grease, heat-conducting silicone grease pad or heat-conducting double-sided adhesive pad;
[0012] Fasteners are arranged on one of the heat sinks and correspond to the mounting holes on the other side heat sink. The fasteners, such as metal screws, rivets or buckles.
[0013] Optionally, the heat sink is a strip-shaped metal heat sink, with a plurality of mounting threaded holes provided at both ends thereof and a plurality of toothed heat dissipation fins provided at the top thereof.
[0014] Optionally, through holes matching the mounting threaded holes of the heat sinks are provided at both ends of the limiting member.
[0015] Optionally, the fastener is a metal screw, and the metal screw sequentially passes through the mounting threaded hole of one heat sink, the through hole of the limiting member and the corresponding mounting threaded hole on the other side heat sink.
[0016] Optionally, an auxiliary fixing member is arranged between the memory module and the heat sink. The auxiliary fixing member is arranged on the surface of the memory module and is connected to the adjacent heat sink by an adhesive means.
[0017] Optionally, the specifications of the heat sink, the limiting member, the fastener, the heat-conducting medium and the auxiliary fixing member are adaptively adjusted according to the specifications of the memory module.
[0018] Optionally, the limiting member and the fastener can be integrally formed with the heat sink, and can be realized by means such as numerical control machine tool processing, bending processing, stamping processing or 3D printing.
[0019] Optionally, the heat-conducting medium can also be used as the auxiliary fixing member, such as a heat-conducting double-sided adhesive pad.
[0020] The beneficial effects of the present utility model are:
[0021] The utility model combines the diversion design of an open air duct with a direct heat conduction design. The open air duct design avoids the problem of heat accumulation caused by poor internal air circulation in traditional closed radiators. Ambient air can freely enter and exit the open air duct, discharging the internal heat in a timely manner, thereby improving the heat dissipation efficiency. The memory chips on the memory module are closely attached to the heat sink through a heat conducting medium, enabling the heat generated by them to be directly and quickly transferred to the heat sink, improving the heat conduction efficiency. In addition, both the inner and outer surfaces of the heat sink are involved in heat dissipation, saving space while increasing the heat dissipation area.
[0022] The utility model has high adaptability and can be adapted to various specifications of memory as needed. In addition, the utility model is small in size and low in cost. Description of the Drawings
[0023] Figure 1 Schematic diagram of the overall structure of the utility model;
[0024] Figure 2 Explosion diagram of the utility model;
[0025] Figure 3 Cross-sectional schematic diagram of the utility model;
[0026] Figure 4 Schematic diagram of the internal air duct of the utility model;
[0027] Figure 5 Schematic diagram of the air duct of the utility model;
[0028] Figure 6 Schematic diagram of the overall structure of the second embodiment of the utility model;
[0029] Figure 7 Explosion diagram of the second embodiment of the utility model;
[0030] Figure 8 Cross-sectional schematic diagram of the second embodiment of the utility model;
[0031] Figure 9 Schematic diagram of the internal air duct of the second embodiment of the utility model;
[0032] Figure 10 Schematic diagram of the air duct of the second embodiment of the utility model;
[0033] The reference numerals in the drawings are:
[0034] 1. Heat sink; 2. Limiting member; 3. Fastening member; 4. Heat conducting medium; 5. Auxiliary fixing member; 6. Memory module. Detailed Description of the Invention
[0035] To make the technical means, creative features, achieved purposes and functions of the present utility model easy to understand, the present utility model will be further described below in conjunction with specific embodiments.
[0036] The following will be a detailed description in conjunction with the embodiments of the device of the present utility model.
[0037] Embodiment 1
[0038] Please refer to Figures 1-5 As shown, an open - air - duct - type memory module cooler includes an open - air - duct formed by surrounding a memory module (6) with heat sinks (1), limiting members (2), and a heat - conducting medium (4). The open - air - duct extends in the length and height directions on both sides of the memory module (6) and intersects at the top, forming openings at both ends in the length direction and at the bottom of the memory module (6), and an open area at the top.
[0039] As Figures 4-5 shown, the open - air - duct in this embodiment is a channel inside the cooler for guiding the flow of air. Its shape and size are jointly defined by the heat sink (1), the limiting member (2), the heat - conducting medium (4), and the memory module (6). The open - air - duct allows ambient air to freely enter and exit, discharging the heat inside the cooler.
[0040] Among them:
[0041] Both of the two heat sinks (1) are long - strip - shaped aluminum alloy heat sinks. There is an installation threaded hole at each of the two ends of the top, and several toothed heat - dissipating fins are also provided on the top, and they are symmetrically arranged on both sides of the memory module (6).
[0042] Both of the two limiting members (2) are cuboid rubber blocks. There are through - holes at both ends that match the installation threaded holes on the heat sink (1). They are respectively arranged at both ends of the top of the memory module (6) between the two heat sinks (1), and correspond to the positions of the installation threaded holes on the heat sink (1). Each end of each limiting member (2) abuts against the adjacent heat sink (1), and the bottom abuts against the top of the memory module (6). Its length defines the width of the open - air - duct, and the bottom defines the height position of the memory module (6) in the cooler. Using rubber material can improve the stability of the memory module (6) inside the cooler and avoid damage during the assembly process.
[0043] All four heat - conducting media (4) are heat - conducting silicone grease pads, which are respectively arranged on the memory chips on both sides of the memory module (6), two on each side. One side of each heat - conducting medium (4) closely adheres to the memory chip of the memory module (6), and the other side closely adheres to the inner surface of the adjacent heat sink (1), for quickly conducting the heat generated when the memory chip works to the heat sink (1).
[0044] The four auxiliary fixing members (5) are all double-sided adhesive pads, which are respectively pasted on the printed circuit boards on both sides of the memory module (6), two on each side. One side of each auxiliary fixing member (5) is pasted on the printed circuit board of the memory module (6), and the other side is pasted on the inner surface of the adjacent heat sink (1) to assist in fixing the memory module (6) and the heat sink (1).
[0045] The two fasteners (3) are both metal screws, which sequentially pass through the mounting threaded holes on one of the heat sinks (1), the through holes on the limiting member (2), and the corresponding mounting threaded holes on the other heat sink (1) to fixedly connect the two heat sinks (1) and the limiting member (2) disposed between the two heat sinks (1).
[0046] In this embodiment, the memory module (6) is a standard-size dual in-line memory module (DIMM) with a double-sided layout.
[0047] Embodiment 2
[0048] Another embodiment provided by the present utility model is as follows Figures 6-10 As shown, this embodiment is applicable to a memory module with the VLP DIMM specification. The specifications of the heat sink (1), the limiting member (2), the fastener (3), and the heat-conducting medium (4) are all adapted and adjusted according to the VLP DIMM specification. The limiting member (2) and the fastener (3) are integrally processed on one of the heat sinks (1), which is beneficial to improving the assembly efficiency and reducing the production cost.
[0049] The specific implementation manner is as follows:
[0050] The two heat sinks (1) are symmetrically arranged on both sides of the memory module (6); at both ends of the top of one of the heat sinks (1), the limiting member (2) and the fastener (3) are integrally formed respectively, with both limiting and fastening functions; at both ends of the top of the other heat sink (1), mounting through holes matching the fastener (3) are respectively provided; the limiting members (2) are all cylindrical aluminum alloy blocks; the four heat-conducting media (4) are all double-sided adhesive pads with a high heat-conducting coefficient and can also be used as auxiliary fixing members; the fastener (3) is an aluminum alloy short column, which is fixed by welding after passing through the matching mounting through holes on the other heat sink (1) to connect the two heat sinks (1).
[0051] As Figures 1-10As shown, in the above two embodiments, the memory chips on the memory module are in close contact with the heat sink through a heat-conducting medium, and the heat generated during the operation of the memory is directly conducted to the heat sink, with high heat conduction efficiency; due to the design of the open air duct, both the inner and outer sides of the heat sink participate in heat dissipation simultaneously, significantly expanding the heat dissipation area without increasing the volume; the ambient air flow freely enters the interior of the radiator through the open air duct, discharging the internal heat in a timely manner, avoiding heat accumulation, and improving the heat dissipation efficiency; the radiator has a simple structure, is easy to manufacture and install, and can be adapted to memory modules of various specifications.
[0052] The foregoing has shown and described the basic principles, main features and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited by the above embodiments, and what is described in the above embodiments and the specification is only the principle of the present invention. Without departing from the spirit and scope of the present invention, the present invention will have various changes and improvements, and these changes and improvements fall within the scope of the present invention claimed. The scope of protection claimed by the present invention is defined by the appended claims and their equivalents.
Claims
1. An open - air duct internal radiator, characterized in that, Comprising: An open air duct formed by surrounding a memory module (6) with a heat sink (1), a limiting member (2), and a heat conductive medium (4); The open air duct extends along the length direction and height direction of the memory module (6) to form an opening and an open area; the size and shape of the opening and the open area are jointly defined by the heat sink (1), the limiting member (2), the heat conductive medium (4), and the memory module (6); wherein: the heat sinks (1) are symmetrically arranged on both sides of the memory module (6), and a plurality of mounting holes are provided on the heat sinks (1); the limiting member (2) is arranged between the heat sinks (1), and its two ends respectively abut against the adjacent heat sinks (1), and the bottom abuts against the top of the memory module (6); the heat conductive medium (4) is arranged on the memory chips of the memory module (6) and contacts the inner surface of the adjacent heat sink (1); A fastener (3) is arranged on one of the heat sinks (1) and corresponds to the mounting hole on the other heat sink (1).
2. An open-air duct internal radiator according to claim 1, wherein The heat sink (1) is a strip-shaped metal heat sink, and a plurality of mounting threaded holes are provided at both ends thereof, and a plurality of toothed heat dissipation fins are provided at the top.
3. An open-air duct internal radiator according to any one of claims 1 to 2, characterized in that, Through holes matching the mounting threaded holes of the heat sink (1) are provided at both ends of the limiting member (2).
4. An open-air duct internal radiator according to any one of claims 1 to 3, characterized in that, The fastener (3) is a metal screw, and the metal screw sequentially passes through the mounting threaded hole of one heat sink (1), the through hole of the limiting member (2), and the corresponding mounting threaded hole on the other heat sink (1).
5. An open-air duct internal radiator according to any one of claims 1 to 4, characterized in that, An auxiliary fixing member (5) is arranged between the memory module (6) and the heat sink (1), the auxiliary fixing member (5) is arranged on the surface of the memory module (6), and is connected to the adjacent heat sink (1) by an adhesive method.
6. An open - type air duct internal radiator according to any one of claims 1 to 5, characterized in that, The specifications of the heat sink (1), the limiting member (2), the fastener (3), and the heat conductive medium (4) are adaptively adjusted according to the specifications of the memory module (6).