Flexible printed circuit (FPC) antenna integrated with lead

Abstract

The utility model discloses an FPC antenna integrated with a lead, comprising an antenna module which comprises a first insulating layer, a first adhesive layer, a first conductive circuit layer, a second adhesive layer, a second insulating layer, a third adhesive layer, a second conductive circuit layer, a fourth adhesive layer and a third insulating layer, and a feed terminal is arranged at the joint of a radiation signal circuit and an oscillator signal circuit; a grounding terminal is arranged at the joint of the oscillator signal circuit and the grounding signal circuit, the second conductive circuit comprises a feed circuit and a grounding circuit, a feed electroless plating copper column is connected between the feed circuit and the feed terminal, and a grounding electroless plating copper column is connected between the grounding circuit and the grounding terminal; the wiring module is integrally formed on the antenna module, the wiring module comprises a wiring insulation substrate, a fifth glue layer, a third conductive circuit layer, a sixth glue layer and a fifth insulation layer, the feed wire is connected with the feed circuit, and the grounding wire is connected with the grounding circuit. The utility model has the advantages of simple operation, stable and firm structure, and stable and reliable electrical performance.

Description

Technical Field

[0001] The utility model relates to the field of flexible printed circuit boards, and particularly to an FPC antenna integrated with a wire. Background Art

[0002] Under the background of the rapid development of wireless communication technology, as a key component in wireless communication devices, FPC (Flexible Printed Circuit) has gradually become a design solution for antennas in wireless communication devices due to its characteristics of being thin, light, and bendable.

[0003] In related technologies, an FPC antenna is mainly prepared by laminating and bonding corresponding insulating diaphragms and conductive circuit layers with adhesive. Among them, the conductive circuit with signal radiation function is bonded between different insulating diaphragms. When applied to electronic devices, it is necessary to weld or plug in a wire coated with an insulating layer to corresponding solder joints on the FPC antenna. The operation of such installation and application is cumbersome and complex, and the structure obtained by such installation is prone to obvious loosening, or even falling off and separation, in application scenarios such as collision or pulling. The structural stability of this FPC antenna is weak, and the electrical performance is unstable. Summary of the Utility Model

[0004] The utility model aims to solve at least one of the technical problems existing in the prior art. For this purpose, the utility model provides an FPC antenna integrated with a wire, which has simple and convenient application operation, stable and reliable structure, and stable electrical performance.

[0005] An FPC antenna integrated with a wire according to an embodiment of the utility model includes:

[0006] An antenna module, including a first insulating layer, a first adhesive layer, a first conductive circuit layer, a second adhesive layer, a second insulating layer, a third adhesive layer, a second conductive circuit layer, a fourth adhesive layer, and a third insulating layer laminated in sequence. The first conductive circuit layer includes a radiation signal line, an oscillator signal line, and a ground signal line connected in sequence. A feeding terminal is provided at the connection between the radiation signal line and the oscillator signal line, and a grounding terminal is provided at the connection between the oscillator signal line and the ground signal line. The second conductive circuit layer includes a separated feeding line and a grounding line. A feeding through-hole copper column penetrating the second adhesive layer, the second insulating layer, and the third adhesive layer is connected between the feeding line and the feeding terminal, and a grounding through-hole copper column penetrating the second insulating layer is connected between the grounding line and the grounding terminal;

[0007] A wiring module integrally formed on one side of the antenna module. The wiring module includes a wiring insulating substrate, a fifth adhesive layer, a third conductive circuit layer, a sixth adhesive layer, and a fifth insulating layer laminated in sequence. The third conductive circuit layer includes a feeding wire and a grounding wire. One end of the feeding wire is connected to the feeding line, and one end of the grounding wire is connected to the grounding line.

[0008] In this embodiment, a feeding gold finger is provided at one end of the feeding wire away from the feeding line, a grounding gold finger is provided at one end of the grounding wire away from the grounding line, the wiring insulating substrate is provided with a feeding relief hole and a grounding relief hole, the feeding gold finger is located in the feeding relief hole, and the grounding gold finger is located in the grounding relief hole.

[0009] In this embodiment, a feeding plating layer covers the top surface of the feeding gold finger, and a grounding plating layer covers the top surface of the grounding gold finger.

[0010] In this embodiment, the FPC antenna of the integrated wire further includes a reinforcing plate connected to one end of the wiring module away from the antenna module, and the reinforcing plate is located on the side of the fifth insulating layer away from the third conductive line layer.

[0011] In this embodiment, the wiring insulating substrate includes a first wiring insulating layer, a first wiring adhesive layer, a second wiring insulating layer, a second wiring adhesive layer, and a third wiring insulating layer stacked in sequence. The first wiring insulating layer is located at one edge of the first insulating layer, the first wiring adhesive layer is located at one edge of the first adhesive layer, the second wiring insulating layer is located at one edge of the first conductive line layer, the second wiring adhesive layer is located at one edge of the second adhesive layer, and the third wiring insulating layer is located at one edge of the second insulating layer.

[0012] In this embodiment, the radiation signal line layer is in a meandering snake shape.

[0013] In this embodiment, the radiation signal line layer is a nickel-plated copper foil layer.

[0014] The embodiment of the present utility model has at least the following beneficial effects:

[0015] By providing an integrated antenna module and wiring module, the integration degree of the FPC antenna structure can be effectively improved, the steps of application installation and use can be effectively simplified, the application operation is simple, and the design requirements of miniaturization and integration of electronic devices can be effectively adapted. It can not only effectively save the application installation cost, but also the integrally formed structure obtained by lamination is stable and reliable, has good mechanical and chemical resistance, and a long service life. The wiring module integrally formed with the antenna module has a stable and firm structure, can effectively ensure the electrical performance of the corresponding lines, thus effectively reducing signal interference and short-circuit problems, and further effectively improving the radiation communication performance of the FPC antenna, and ensuring that the FPC antenna can work at a stable frequency; in addition, by providing a second insulating layer to isolate the first conductive line layer and the second conductive line layer, and the third conductive line layer and the second conductive line layer are on the same layer, the lines with wire functions and the lines with antenna functions can be effectively separated on different layers. The electrical performance of the FPC antenna structure is stable and reliable, the degree of freedom in the layout design of the first conductive line layer and the second conductive line layer is high, and at the same time, the total area of the FPC antenna can be effectively controlled, which can effectively meet the design application requirements of miniaturized electronic devices. Description of the Drawings

[0016] The above and / or additional aspects and advantages of the present utility model will become obvious and easy to understand from the description of the embodiments in conjunction with the following drawings, where:

[0017] Figure 1 is a schematic three-dimensional structure diagram of the FPC antenna with an integrated wire according to an embodiment of the present utility model;

[0018] Figure 2 is a schematic perspective structure diagram of the FPC antenna with an integrated wire according to an embodiment of the present utility model from a top-down perspective;

[0019] Figure 3 is a schematic cross-sectional structure diagram along A-A' in Figure 2 ;

[0020] Figure 4 is a schematic cross-sectional structure diagram along B-B' in Figure 2 ;

[0021] Figure 5 is a schematic cross-sectional structure diagram along C-C' in Figure 2 .

[0022] Reference Numerals:

[0023] antenna module 1000, first insulating layer 1100, first adhesive layer 1200, first conductive circuit layer 1300, radiation signal line 1310, oscillator signal line 1320, ground signal line 1330, feed terminal 1340, feed-through copper column 1341, ground terminal 1350, ground-through copper column 1351, second adhesive layer 1400, second insulating layer 1500, third adhesive layer 1600, second conductive circuit layer 1700, feed line 1710, ground line 1720, fourth adhesive layer 1800, third insulating layer 1900;

[0024] wiring module 2000, wiring insulating substrate 2100, feed-through relief hole 2101, ground-through relief hole 2102, first wiring insulating layer 2110, first wiring adhesive layer 2120, second wiring insulating layer 2130, second wiring adhesive layer 2140, third wiring insulating layer 2150, fifth adhesive layer 2200, third conductive circuit layer 2300, feed wire 2310, ground wire 2320, sixth adhesive layer 2400, fifth insulating layer 2500, feed finger 2600, feed plating layer 2610, ground finger 2700, ground plating layer 2710;

[0025] reinforcement plate 3000. Detailed Embodiments

[0026] Embodiments of the present utility model will be described in detail below. Examples of the embodiments are shown in the accompanying drawings, where like or similar reference numerals denote like or similar elements or elements having like or similar functions throughout. The embodiments described below by referring to the accompanying drawings are exemplary only for explaining the present utility model and should not be construed as limiting the present utility model.

[0027] In the description of the present utility model, it should be understood that for orientation descriptions, such as those indicated by up, down, left, right, front, back, etc., the orientation or positional relationship is based on the orientation or positional relationship shown in the accompanying drawings. This is only for the convenience of describing the present utility model and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as limiting the present utility model.

[0028] In the description of the present utility model, if the first and second are described only for the purpose of distinguishing technical features, they should not be construed as indicating or implying relative importance or implicitly indicating the quantity of the indicated technical features or the sequence of the indicated technical features.

[0029] In the description of the present utility model, unless otherwise clearly defined, terms such as "arrangement", "installation", and "connection" should be understood in a broad sense. Those skilled in the art can reasonably determine the specific meanings of the above terms in the present utility model in combination with the specific content of the technical solution.

[0030] In the context of the rapid development of wireless communication technology, as a key component in wireless communication devices, FPC (Flexible Printed Circuit) has gradually become a design solution for antennas in wireless communication devices due to its characteristics of being thin, light, and bendable. In related technologies, FPC antennas are mainly prepared by laminating and bonding corresponding insulating film sheets and conductive circuits with adhesives. Among them, the conductive circuits with signal radiation functions are bonded between different insulating film sheets. When applied to electronic devices, wires coated with insulating layers need to be welded or plugged into corresponding solder joints on the FPC antenna. Such installation and application operations are cumbersome and complex, not only increasing the cost of application installation, but also the structure obtained by such installation is prone to obvious loosening, or even detachment and separation in application scenarios such as collision or pulling. The structural stability of such FPC antennas is weak, and the electrical performance is unstable.

[0031] However, there are still some challenges in the existing FPC antenna design. On the one hand, how to achieve smaller size and higher integration while ensuring antenna performance to meet the requirements of increasingly miniaturized and integrated electronic devices is an urgent problem to be solved. On the other hand, due to the complexity and multi-layer nature of the FPC antenna structure, how to ensure reliable connection between layers and avoid signal interference and short circuits is also a difficult point in the design. Therefore, developing an FPC antenna with excellent electrical performance, high integration, easy manufacturing and wiring has important practical significance and market demand.

[0032] The following refers to the attached Figure 1 to the attached Figure 5 to describe an FPC antenna with integrated conductors according to an embodiment of the present invention, which has simple operation, stable and reliable structure, and stable electrical performance.

[0033] Referring to Figures 1 to 5 , an FPC antenna with integrated conductors according to an embodiment of the present invention is characterized in that it includes:

[0034] An antenna module 1000, including a first insulating layer 1100, a first adhesive layer 1200, a first conductive line layer 1300, a second adhesive layer 1400, a second insulating layer 1500, a third adhesive layer 1600, a second conductive line layer 1700, a fourth adhesive layer 1800, and a third insulating layer 1900, which are stacked in sequence from top to bottom. The first conductive line layer 1300 includes a radiation signal line 1310, a vibrator signal line 1320, and a ground signal line 1330 that are connected in sequence. The radiation signal line 1310 is used to transmit or receive electromagnetic wave signals. The vibrator signal line 1320 is used to enhance the electromagnetic wave signal transmission or reception ability of the radiation signal line 1310. The ground signal line 1330 is used to form an electrical loop after grounding to achieve the function of transmitting or receiving electromagnetic wave signals of the radiation signal line 1310. A feeding terminal 1340 is provided at the connection between the radiation signal line 1310 and the vibrator signal line 1320. A grounding terminal 1350 is provided at the connection between the vibrator signal line 1320 and the ground signal line 1330. The second conductive line layer 1700 includes a separated feeding line 1710 and a grounding line 1720. The feeding line 1710 and the grounding line 1720 are not in contact, that is, they are disconnected, which can effectively avoid short circuits between them. A feeding through hole copper column 1341 that penetrates the second adhesive layer 1400, the second insulating layer 1500, and the third adhesive layer 1600 is connected between the feeding line 1710 and the feeding terminal 1340, so as to achieve electrical conduction between the feeding line 1710 and the feeding terminal 1340. A grounding through hole copper column 1351 that penetrates the second insulating layer 1500 is connected between the grounding line 1720 and the grounding terminal 1350, so as to achieve electrical conduction between the grounding line 1720 and the grounding terminal 1350;

[0035] The wiring module 2000 is integrally formed at one edge of the antenna module 1000. The wiring module 2000 includes a wiring insulating substrate 2100, a fifth adhesive layer 2200, a third conductive circuit layer 2300, a sixth adhesive layer 2400, and a fifth insulating layer 2500 stacked in sequence from top to bottom. The wiring insulating substrate 2100 is connected to one edge of the stacked structure composed of the first insulating layer 1100, the first adhesive layer 1200, the first conductive circuit layer 1300, the second adhesive layer 1400, and the second insulating layer 1500. The thickness of the stacked structure composed of the first insulating layer 1100, the first conductive circuit layer 1300, and the second insulating layer 1500 is equal to the thickness of the wiring insulating substrate 2100. The fifth adhesive layer 2200 is connected to one edge of the third adhesive layer 1600. The third conductive circuit layer 2300 is connected to one edge of the second conductive circuit layer 1700. The sixth adhesive layer 2400 is connected to one edge of the fourth adhesive layer 1800. The fifth insulating layer 2500 is connected to one edge of the third insulating layer 1900. The third conductive circuit layer 2300 includes separated feeding conductors 2310 and grounding conductors 2320. One end of the feeding conductor 2310 is connected to the feeding line 1710, and one end of the grounding conductor 2320 is connected to the grounding line 1720. The feeding conductors 2310 and the grounding conductors 2320 are used to achieve corresponding electrical connections with an external circuit.

[0036] By providing the integrated antenna module 1000 and wiring module 2000, the integration degree of the FPC antenna structure can be effectively improved, and the steps of application installation can be effectively simplified. Compared with the welding or plugging methods in the traditional technology, the installation operation of the present utility model is convenient. It is easy to install and operate when applied to electronic devices such as mobile phones and tablet computers, and can effectively meet the design requirements of miniaturization and integration of current electronic devices. It can not only effectively save the application installation cost, but also the integrally formed structure obtained by stacking is stable and reliable, has good mechanical resistance and chemical resistance, and a long service life. The wiring module 2000 integrally formed on the antenna module 1000 has a stable and firm structure, can effectively ensure the electrical performance of the corresponding lines, thus effectively reducing problems such as signal interference and short circuit caused by the unstable position of the wiring structure, and further effectively improving the radiation communication performance of the FPC antenna and ensuring that the FPC antenna can work at a stable frequency;

[0037] In addition, by providing the second insulating layer 1500 in cooperation with the second adhesive layer 1400 and the third adhesive layer 1600 to isolate the first conductive line layer 1300 and the second conductive line layer 1700, and the third conductive line layer 2300 and the second conductive line layer 1700 being on the same layer, it is possible to effectively separate the lines with wire functions and the lines with antenna functions on different layers, effectively avoid direct contact between the first conductive line layer 1300 and the second conductive line layer 1700, effectively avoid the short-circuit influence of the feeding line 1710 and the grounding line 1720 in the second conductive line layer 1700 on the radiation signal line 1310, the oscillator signal line 1320, and the grounding signal line 1330 in the first conductive line layer 1300. The electrical performance of the FPC antenna structure is stable and reliable, the degree of freedom in the layout design of the first conductive line layer 1300 and the second conductive line layer 1700 is high, and at the same time, the total area of the FPC antenna can be effectively controlled, effectively meeting the design and application requirements of current miniaturized electronic devices.

[0038] It can be understood that a feeding gold finger 2600 is provided at one end of the feeding wire 2310 far from the feeding line 1710, a grounding gold finger 2700 is provided at one end of the grounding wire 2320 far from the grounding line 1720, and a separated feeding relief hole 2101 and a grounding relief hole 2102 are provided at one end of the wiring insulating substrate 2100 far from the antenna module 1000. The feeding relief hole 2101 and the grounding relief hole 2102 also penetrate through the sixth adhesive layer 2400. The feeding gold finger 2600 is located in the feeding relief hole 2101, the grounding gold finger 2700 is located in the grounding relief hole 2102, and the top surfaces of the feeding gold finger 2600 and the grounding gold finger 2700 are both on the plane of the top surface of the wiring insulating substrate 2100 or above. By providing the feeding gold finger 2600 and the grounding gold finger 2700, the end of the wiring module 2000 far from the antenna module 1000 can be directly inserted into the target socket by means of plugging, effectively saving the welding installation operation in the traditional technology, further simplifying the operation of installation and use, saving the manufacturing cost of the applied electronic product, and the electrical connection structure of the applied electronic product is stable and reliable.

[0039] It can be understood that a feeding plating layer 2610 is covered on the top surface of the feeding gold finger 2600, and a grounding plating layer 2710 is covered on the top surface of the grounding gold finger 2700. Preferably, the feeding plating layer 2610 and the grounding plating layer 2710 can be set as precious metal plating layers such as gold, silver, tungsten, cobalt, and palladium, which can effectively improve the wire connection effect between the feeding gold finger 2600 and the grounding gold finger 2700 and the terminals of the target socket during plugging.

[0040] It can be understood that the FPC antenna of the integrated wire further includes a reinforcing plate 3000 connected to one end of the wiring module 2000 away from the antenna module 1000. The reinforcing plate 3000 is located on the side of the fifth insulating layer 2500 away from the third conductive line layer 2300. The reinforcing plate 3000 can provide a stable and firm structural foundation for the end of the wiring module 2000 away from the antenna module 1000, thereby effectively improving the stability of the plugging action when inserting the end of the wiring module 2000 away from the antenna module 1000 into the target socket, avoiding unnecessary displacement actions, having simple installation alignment operations, and facilitating the installation and use of this FPC antenna.

[0041] Specifically, the reinforcing plate 3000 is an epoxy glass cloth laminate structure, having high mechanical properties and dielectric properties, good heat resistance and moisture resistance, and good mechanical processability.

[0042] Preferably, an identification layer is provided on the side of the reinforcing plate 3000 away from the fifth insulating layer 2500. The identification layer can specifically be an insertion direction identification, a QR code identification, etc. The identification layer is provided on the reinforcing plate 3000, which can effectively avoid the direct influence of the identification layer on the antenna module 1000 and the wiring module 2000, and has high flexibility in manufacturing the identification layer, which can reduce the processing difficulty of the identification layer.

[0043] It can be understood that the wiring insulating substrate 2100 includes a first wiring insulating layer 2110, a first wiring adhesive layer 2120, a second wiring insulating layer 2130, a second wiring adhesive layer 2140, and a third wiring insulating layer 2150 stacked in sequence from top to bottom. The feed-through relief hole 2101 and the ground relief hole 2102 both penetrate through the first wiring insulating layer 2110, the first wiring adhesive layer 2120, the second wiring insulating layer 2130, the second wiring adhesive layer 2140, and the third wiring insulating layer 2150. The first wiring insulating layer 2110 is located at an edge of the first insulating layer 1100, the first wiring adhesive layer 2120 is located at an edge of the first adhesive layer 1200, the second wiring insulating layer 2130 is located at an edge of the first conductive line layer 1300, the second wiring adhesive layer 2140 is located at an edge of the second adhesive layer 1400, and the third wiring insulating layer 2150 is located at an edge of the second insulating layer 1500.

[0044] By setting the wiring insulating substrate 2100 as a multi-layer structure that forms a stacked structure with the first insulating layer 1100, the first adhesive layer 1200, the first conductive line layer 1300, the second adhesive layer 1400, and the second insulating layer 1500, during manufacturing, by stacking corresponding multi-layer structures with equal numbers of the antenna module 1000 and the wiring module 2000, an integrated wire FPC antenna can be obtained after pressing, which can effectively improve the reliability of the one-piece molding and stacking manufacturing action, and the manufacturing operation is convenient.

[0045] It can be understood that the radiation signal line layer 1310 is in a meandering serpentine shape, and the spatial utilization rate can be effectively improved through the meandering serpentine structure.

[0046] It can be understood that the radiation signal line layer 1310 is a nickel-plated copper foil layer forming the radiation signal line 1310. The nickel-plated copper foil is a composite material composed of a superconducting material and a nickel-plated electrolytic copper foil with good electrical conductivity. The superconducting material has zero resistance and perfect electromagnetic shielding effect, which can effectively enhance the reception and transmission effect of antenna signals. The nickel-plated electrolytic copper foil has excellent electrical conductivity, which can improve the stability and reliability of signal transmission.

[0047] Although the embodiments of the present invention have been shown and described, those of ordinary skill in the art can understand that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principle and spirit of the present invention. The scope of the present invention is defined by the claims and their equivalents.

Claims

1. An FPC antenna integrated with a wire, characterized in that Comprising: An antenna module (1000), including a first insulating layer (1100), a first adhesive layer (1200), a first conductive circuit layer (1300), a second adhesive layer (1400), a second insulating layer (1500), a third adhesive layer (1600), a second conductive circuit layer (1700), a fourth adhesive layer (1800), and a third insulating layer (1900) stacked in sequence. The first conductive circuit layer (1300) includes a radiation signal line (1310), an oscillator signal line (1320), and a ground signal line (1330) connected in sequence. A feeding terminal (1340) is provided at the connection of the radiation signal line (1310) and the oscillator signal line (1320), and a grounding terminal (1350) is provided at the connection of the oscillator signal line (1320) and the ground signal line (1330). The second conductive circuit layer (1700) includes a separated feeding line (1710) and a grounding line (1720). A feeding through-hole copper pillar (1341) passing through the second adhesive layer (1400), the second insulating layer (1500), and the third adhesive layer (1600) is connected between the feeding line (1710) and the feeding terminal (1340), and a grounding through-hole copper pillar (1351) passing through the second insulating layer (1500) is connected between the grounding line (1720) and the grounding terminal (1350). A wiring module (2000), integrally formed on one side of the antenna module (1000). The wiring module (2000) includes a wiring insulating substrate (2100), a fifth adhesive layer (2200), a third conductive circuit layer (2300), a sixth adhesive layer (2400), and a fifth insulating layer (2500) stacked in sequence. The third conductive circuit layer (2300) includes a feeding wire (2310) and a grounding wire (2320). One end of the feeding wire (2310) is connected to the feeding line (1710), and one end of the grounding wire (2320) is connected to the grounding line (1720).

2. The FPC antenna integrated with a wire according to claim 1, characterized in that, A feeding gold finger (2600) is provided at the end of the feeding wire (2310) away from the feeding line (1710), and a grounding gold finger (2700) is provided at the end of the grounding wire (2320) away from the grounding line (1720). The wiring insulating substrate (2100) is provided with a feeding relief hole (2101) and a grounding relief hole (2102). The feeding gold finger (2600) is located in the feeding relief hole (2101), and the grounding gold finger (2700) is located in the grounding relief hole (2102).

3. The FPC antenna integrated with a wire according to claim 2, characterized in that, A feeding plating layer (2610) covers the top surface of the feeding gold finger (2600), and a grounding plating layer (2710) covers the top surface of the grounding gold finger (2700).

4. The FPC antenna integrated with a wire according to claim 3, characterized in that, Further included is a reinforcement plate (3000) connected to one end of the wiring module (2000) away from the antenna module (1000), and the reinforcement plate (3000) is located on a side of the fifth insulating layer (2500) away from the third conductive line layer (2300).

5. The FPC antenna integrated with a wire according to claim 4, characterized in that, The wiring insulating substrate (2100) includes a first wiring insulating layer (2110), a first wiring adhesive layer (2120), a second wiring insulating layer (2130), a second wiring adhesive layer (2140), and a third wiring insulating layer (2150) stacked in sequence. The first wiring insulating layer (2110) is located at an edge of the first insulating layer (1100), the first wiring adhesive layer (2120) is located at an edge of the first adhesive layer (1200), the second wiring insulating layer (2130) is located at an edge of the first conductive line layer (1300), the second wiring adhesive layer (2140) is located at an edge of the second adhesive layer (1400), and the third wiring insulating layer (2150) is located at an edge of the second insulating layer (1500).

6. The FPC antenna integrated with a wire according to claim 1, characterized in that, The radiation signal line (1310) layer is in a meandering snake shape.

7. The FPC antenna integrated with a wire according to claim 6, characterized in that, The radiation signal line (1310) layer is a nickel-plated copper foil layer.

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