Double-layer circuit board, battery assembly and electronic equipment

Abstract

The utility model relates to a double-layer circuit board, a battery assembly and electronic equipment. The battery assembly comprises an upper-layer circuit board, a lower-layer circuit board and a conductive structure, the conductive structure is located between the upper-layer circuit board and the lower-layer circuit board and used for conducting the upper-layer circuit board and the lower-layer circuit board, and the upper surface of the upper-layer circuit board and the lower surface of the lower-layer circuit board are used for arranging electronic devices. The double-layer circuit board provided by the utility model is high in space utilization rate and low in heat dissipation cost.

Description

Technical Field

[0001] The utility model relates to the technical field of batteries, and more specifically, the utility model relates to a double-layer circuit board, a battery assembly and an electronic device. Background Art

[0002] Double-layer circuit boards are applied in many fields due to their high integration. However, in the prior art, electronic devices are usually arranged between the double-layer circuit boards, resulting in problems such as poor heat dissipation and low space utilization rate of the double-layer circuit boards. Summary of the Utility Model

[0003] An object of the utility model is to provide a double-layer circuit board, a battery assembly and an electronic device.

[0004] According to a first aspect of the utility model, there is provided a double-layer circuit board for use in a battery, comprising:

[0005] an upper circuit board, a lower circuit board and a conductive structure;

[0006] The conductive structure is located between the upper circuit board and the lower circuit board and conducts the upper circuit board and the lower circuit board. The upper surface of the upper circuit board and the lower surface of the lower circuit board are used for arranging electronic devices.

[0007] Optionally, the electronic devices include field effect transistors, current detection resistors, fuses and protection ICs.

[0008] Optionally, a gap is provided between the upper circuit board and the lower circuit board.

[0009] Optionally, it further comprises a support member, and the support member is arranged between the upper circuit board and the lower circuit board to form the gap between the upper circuit board and the lower circuit board.

[0010] Optionally, a plurality of the support members are provided and distributed at the edges of the upper circuit board or the lower circuit board.

[0011] Optionally, the conductive structure is a reed, one end of the reed is connected to the upper circuit board, and the other end is connected to the lower circuit board.

[0012] Optionally, the upper circuit board and / or the lower circuit board is a flexible circuit board.

[0013] According to a second aspect of the utility model, there is provided a battery assembly, comprising a battery and the double-layer circuit board according to the first aspect.

[0014] Optionally, the lower circuit board is connected to the battery, and the size of the lower circuit board is the same as the size of the battery.

[0015] Optionally, it further includes a temperature acquisition device and a functional device. The temperature acquisition device is disposed on the upper surface of the upper circuit board, and the functional device is disposed on the lower surface of the lower circuit board;

[0016] Alternatively, the temperature acquisition device is disposed on the lower surface of the lower circuit board, and the functional device is disposed on the upper surface of the upper circuit board.

[0017] According to the third aspect of the present invention, there is provided an electronic device including the battery assembly described in the second aspect.

[0018] One technical effect of the present invention is that the upper circuit board and the lower circuit board are electrically connected through the conductive structure, so that electronic devices can be disposed on the upper surface of the upper circuit board and the lower surface of the lower circuit board. On the one hand, the setting space of the electronic devices is increased, and the space utilization rate of the double-layer circuit board is improved. On the other hand, by setting the positions of the electronic devices on the two outer surfaces of the double-layer circuit board, the heat dissipation effect is improved.

[0019] Other features and advantages of the present invention will become clear from the following detailed description of the exemplary embodiments of the present invention with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] The drawings forming a part of the specification depict embodiments of the present invention and, together with the description, are used to explain the principles of the present invention.

[0021] Figure 1 is a schematic structural diagram of a double-layer circuit board provided by the present invention.

[0022] Figure 2 is Figure 1 a top view of

[0023] Figure 3 is a schematic structural diagram of a battery assembly provided by the present invention.

[0024] Description of the reference numerals:

[0025] 1. Upper circuit board; 2. Lower circuit board; 3. Conductive structure; 4. Support member; 5. Electronic device; 6. Communication interface; 7. Battery. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0026] Now, various exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings. It should be noted that: unless otherwise specifically stated, the relative arrangements of components and steps, numerical expressions and values set forth in these embodiments do not limit the scope of the present invention.

[0027] The following description of at least one exemplary embodiment is merely illustrative and in no way restrictive of the present utility model and its application or use.

[0028] Technologies and devices known to those of ordinary skill in the relevant art may not be discussed in detail, but where appropriate, such technologies and devices should be considered as part of the specification.

[0029] In all the examples shown and discussed herein, any specific values should be construed as merely exemplary and not as a limitation. Thus, other examples of the exemplary embodiments may have different values.

[0030] It should be noted that like reference numerals and letters denote like items in the following figures, and thus, once an item is defined in one figure, it need not be further discussed in subsequent figures.

[0031] As Figures 1 to 3 shown, according to a first aspect of the present utility model, there is provided a double-layer circuit board applied to a battery 7, including: an upper circuit board 1, a lower circuit board 2, and a conductive structure 3; the conductive structure 3 is located between the upper circuit board 1 and the lower circuit board 2 and is used to conduct the upper circuit board 1 and the lower circuit board 2, and the upper surface of the upper circuit board 1 and the lower surface of the lower circuit board 2 are used to arrange electronic devices 5.

[0032] Specifically, in this embodiment, the conductive structure 3 conducts the upper circuit board 1 and the lower circuit board 2, so that electrical connections between the various electronic devices 5 on the two-layer circuit board can be realized between the upper circuit board 1 and the lower circuit board 2. When the double-layer circuit board is assembled on the battery 7, functions such as charging and discharging protection of the battery 7 can be realized. Among them, the conductive structure 3 can be a wire or a metal part, etc., and the electronic device 5 can be a MOSFET field effect transistor, an Rsense current detection resistor, a Fuse fuse, or a protection IC, etc., which can realize functions such as charging, discharging, and protection of the battery.

[0033] Compared with the double-layer circuit boards in the prior art, the double-layer circuit board provided in this embodiment can arrange the electronic devices 5 on the upper surface of the upper circuit board 1 and the lower surface of the lower circuit board 2, that is, the electronic devices 5 can be arranged on the outside of the double-layer circuit board, so that there is no need to set up heat dissipation devices such as a heat dissipation fan and a refrigeration sheet to dissipate heat from the electronic devices 5, which not only improves the heat dissipation capacity of the entire structure but also reduces the heat dissipation cost.

[0034] In addition, the double-layer circuit board provided by the present application has two surfaces on which electronic devices 5 can be arranged, improving the space utilization rate of the double-layer circuit board, reducing the board width of the circuit board when applied to the battery 7 and the board thickness of the double-layer circuit board, and being beneficial to the miniaturization of the battery 7. Further, since the electronic devices 5 are respectively assembled on different circuit boards, there is less dimensional correlation between the upper circuit board 1 and the lower circuit board 2, and the design is more flexible.

[0035] Optionally, as Figure 1 shown, a gap is provided between the upper circuit board 1 and the lower circuit board 2.

[0036] Specifically, in this embodiment, the conductive structure 3 is arranged between the upper circuit board 1 and the lower circuit board 2, and a gap is provided between the upper circuit board 1 and the lower circuit board 2, which can improve the heat dissipation capacity of the conductive structure 3 and reduce the heat dissipation cost.

[0037] Optionally, as Figure 1 shown, the double-layer circuit board further includes a support member 4, and the support member 4 is arranged between the upper circuit board 1 and the lower circuit board 2 to form the gap between the upper circuit board 1 and the lower circuit board 2.

[0038] Specifically, in this embodiment, the support member 4 is used to connect and support the upper circuit board 1 and the lower circuit board 2 to ensure the stability and reliability of the double-layer circuit board. The support member 4 can be supported by an insulating material to ensure the safety of the circuit board.

[0039] In addition, a plurality of support members 4 are all located at the edges of the upper circuit board 1 or the lower circuit board 2, so that both the connection reliability and stability of the double-layer circuit board can be improved, and the connection of the conductive structure 3 can be avoided from being affected. Among them, when the sizes of the upper circuit board 1 and the lower circuit board 2 are different, a plurality of support members 4 are located at the edges of the smaller-sized circuit board.

[0040] Optionally, as Figure 1 shown, the conductive structure 3 is a reed, one end of the reed is connected to the upper circuit board 1, and the other end is connected to the lower circuit board 2.

[0041] Specifically, the reed is an elastic metal sheet, and its shape and structure can be designed according to actual needs. In this embodiment, on the one hand, the setting of the reed can realize the electrical connection between the upper circuit board 1 and the lower circuit board 2, and on the other hand, directly using the metal sheet can improve the heat dissipation capacity and electrical conductivity of the conductive structure 3. For example, the reed can be made of a copper sheet.

[0042] Optionally, as Figures 1 to 2 shown, the upper circuit board 1 and / or the lower circuit board 2 is a flexible circuit board.

[0043] Specifically, in this embodiment, the upper circuit board 1 and / or the lower circuit board 2 adopt flexible circuit boards, which have stronger folding and stretching properties compared to rigid boards and can be applied to the field of miniaturized electronic devices. In practical applications, using flexible circuit boards is also beneficial for making the circuit boards into shapes such as L-shaped and straight boards to adapt to different electronic devices.

[0044] According to the second aspect of the present utility model, as Figure 3 shown, a battery assembly is provided, including a battery 7 and the double-layer circuit board described in the first aspect.

[0045] Specifically, in this embodiment, the battery assembly is made of a battery 7 and the double-layer circuit board provided in the first aspect. Since the double-layer circuit board provided in the first aspect of the present utility model has better heat dissipation ability, higher space utilization rate, and lower heat dissipation cost, when it is applied to the battery 7, on the one hand, it can reduce the size of the entire battery assembly, which is beneficial to the miniaturization of the battery assembly, and on the other hand, it can also reduce the production cost of the entire battery assembly. In practical applications, a communication interface 6 can be set on the double-layer circuit board to facilitate connection with electronic devices and the like to achieve communication functions.

[0046] Optionally, as Figure 3 shown, the lower circuit board 2 is connected to the battery 7, and the size of the lower circuit board 2 is the same as the size of the battery 7.

[0047] Specifically, in this embodiment, the size of the lower circuit board 2 is the same as the size of the battery 7. That is, in practical applications, the double-layer circuit board realizes electrical connection with the battery 7 through the lower circuit board 2. The length of only the lower circuit board 2 can be designed to match the length of the battery 7 core, and the upper circuit board 1 can be designed shorter according to actual needs to reduce the size and weight of the battery assembly.

[0048] Optionally, as Figure 1 shown, the battery assembly further includes a temperature acquisition device and a functional device. The temperature acquisition device is arranged on the upper surface of the upper circuit board 1, and the functional device is arranged on the lower surface of the lower circuit board 2; or, the temperature acquisition device is arranged on the lower surface of the lower circuit board 2, and the functional device is arranged on the upper surface of the upper circuit board 1.

[0049] Specifically, in this embodiment, when the double-layer circuit board is applied to the battery 7, the electronic devices 5 arranged on the circuit board usually include temperature acquisition devices for collecting temperature, such as NTC thermistors, and functional devices for realizing the protection function of charging and discharging the battery 7, such as field effect transistors, current detection resistors, fuses, and protection ICs. These functional devices usually generate a relatively high amount of heat, which will affect the acquisition accuracy if they are close to the temperature acquisition devices.

[0050] In practical applications, the temperature acquisition devices and the functional devices are arranged separately. For example, the temperature acquisition devices are arranged on the upper surface of the upper-layer circuit board 1, and the functional devices are arranged on the lower surface of the lower-layer circuit board 2, or the temperature acquisition devices are arranged on the lower surface of the lower-layer circuit board 2, and the functional devices are arranged on the upper surface of the upper-layer circuit board 1, so as to improve the temperature acquisition accuracy and the reliability of protecting the battery 7.

[0051] Reference Figures 1 to 3 , according to the third aspect of the present invention, there is provided an electronic device including the battery 7 assembly described in the second aspect.

[0052] Specifically, in this embodiment, by applying the battery 7 assembly provided in the second aspect to the electronic device, it is beneficial to the miniaturization of the electronic device and the improvement of the safety of the electronic device. Among them, the electronic device is usually a tablet, a notebook, a mobile phone, etc., and the battery assembly can also realize the communication function with the electronic device by setting a communication interface 6 on the lower-layer circuit board.

[0053] In the above embodiments, the differences between the various embodiments are mainly described. As long as the different optimized features between the various embodiments are not contradictory, they can be combined to form a more optimal embodiment. Considering the simplicity of the writing, it will not be elaborated here.

[0054] Although some specific embodiments of the present invention have been described in detail by way of examples, those skilled in the art should understand that the above examples are only for illustration and not for limiting the scope of the present invention. Those skilled in the art should understand that the above embodiments can be modified without departing from the scope and spirit of the present invention. The scope of the present invention is defined by the appended claims.

Claims

1. A double-layer circuit board, which is applied to a battery, is characterized in that Comprising: an upper circuit board, a lower circuit board, and a conductive structure; the conductive structure is located between the upper circuit board and the lower circuit board and is used to conduct the upper circuit board and the lower circuit board, and the upper surface of the upper circuit board and the lower surface of the lower circuit board are used to arrange electronic devices.

2. The double-layer circuit board according to claim 1, wherein, The electronic devices include field effect transistors, current detecting resistors, fuses, and protection ICs.

3. The double-layer circuit board according to claim 1, wherein, A gap is provided between the upper circuit board and the lower circuit board.

4. The double-layer circuit board according to claim 3, wherein It further includes a support member, and the support member is arranged between the upper circuit board and the lower circuit board to form the gap between the upper circuit board and the lower circuit board.

5. The double-layer circuit board according to claim 4, characterized in that, There are multiple support members, which are distributed at the edges of the upper circuit board or the lower circuit board.

6. The double-layer circuit board according to claim 1, wherein The conductive structure is a reed, one end of the reed is connected to the upper circuit board, and the other end is connected to the lower circuit board.

7. The double-layer circuit board according to claim 1, wherein The upper circuit board and / or the lower circuit board is a flexible circuit board.

8. A battery assembly, characterized in that, Comprising a battery and the double-layer circuit board according to any one of claims 1-7.

9. The battery assembly according to claim 8, wherein, The lower circuit board is connected to the battery, and the size of the lower circuit board is the same as the size of the battery.

10. The battery assembly according to claim 8, characterized in that, It further includes a temperature acquisition device and a functional device, the temperature acquisition device is arranged on the upper surface of the upper circuit board, and the functional device is arranged on the lower surface of the lower circuit board; alternatively, the temperature acquisition device is arranged on the lower surface of the lower circuit board, and the functional device is arranged on the upper surface of the upper circuit board.

11. An electronic device, characterized in that, Comprising the battery assembly according to any one of claims 8-10.

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