Solder resist windowing structure of display panel

Abstract

The utility model discloses a solder resist windowing structure of a display panel, comprising a PCB, the PCB is provided with a plurality of wafers, the PCB is also provided with a solder resist windowing, the wafers are arranged in the solder resist windowing, two opposite ends of the solder resist windowing are respectively communicated with the side wall of the PCB, the solder resist windowing is filled with protective glue, and the protective glue covers the wafers. According to the solder resist windowing structure of the display panel provided by the utility model, the solder resist windowing is designed on the PCB and filled with the protective glue, the structural design effectively isolates the potential influence of external environmental factors on the wafer, such as moisture, dust and other pollutants, the filling of the protective glue enhances the stability of the wafer when the wafer is subjected to mechanical shock or vibration, and the service life of the wafer is prolonged. And the dead light phenomenon is reduced. The design of the solder resist window allows the protective glue to uniformly cover the wafer, thereby avoiding the problem of non-uniform display or optical performance reduction caused by non-uniform filling.

Description

Technical Field

[0001] The utility model relates to the technical field of display panels, in particular to a solder mask opening structure for a display panel. Background Art

[0002] In the manufacturing process of existing Mini / Micro LED integrated packaging display products, a direct film pasting method is usually adopted to protect the display panel. However, this film pasting method has the following disadvantages: First, the airtightness is poor, and it is easy to absorb moisture during long-term storage, resulting in the failure of the lamp beads; Second, the protection of the edge lamp beads is insufficient, which is easy to cause the phenomenon of dead lamps; Finally, the flatness of the film is affected by the circuit on the board surface. If the board surface is uneven, stripes are likely to appear on the film surface after film pasting, affecting the display effect. Content of the Utility Model

[0003] The technical problem to be solved by the utility model is: to provide a solder mask opening structure for a display panel to solve the problems of poor airtightness, poor protection and poor film flatness existing in the existing display panel during the film pasting process.

[0004] To solve the above technical problem, the technical solution adopted by the utility model is: a solder mask opening structure for a display panel, including a PCB board, on which a plurality of wafers are provided, a solder mask opening is also provided on the PCB board, the wafers are located within the solder mask opening, opposite ends of the solder mask opening are respectively communicated with the side wall of the PCB board, and a protective glue is filled in the solder mask opening, and the protective glue covers the wafers.

[0005] Further, the material of the protective glue is epoxy resin, silicone rubber, acrylic resin, polyurethane, polyimide, photocurable resin, thermosetting resin, conductive glue, UV curable glue, transparent silica gel, cyanate resin, silicone gel, polyether ether ketone or nanocomposite material.

[0006] Further, anti - detachment protrusions are provided on the side wall of the solder mask opening, and the protective glue adheres to the anti - detachment protrusions.

[0007] Further, anti - detachment grooves are provided on the side wall of the solder mask opening, and the protective glue adheres to the anti - detachment grooves.

[0008] Further, the solder mask opening extends along the length direction of the PCB board.

[0009] Further, the solder mask opening extends along the width direction of the PCB board.

[0010] Further, the number of the solder mask openings is multiple.

[0011] Further, the top surface of the protective glue is flush with the surface of the PCB board, or the top surface of the protective glue is higher than the surface of the PCB board, or the top surface of the protective glue is lower than the surface of the PCB board.

[0012] Further, the material of the PCB board is epoxy resin material.

[0013] Further, the gap between the chip and the side wall of the solder mask opening is less than or equal to 5 mm.

[0014] The beneficial effects of the present utility model are as follows: The solder mask opening structure of the display panel provided by the present utility model realizes comprehensive protection of the chip by designing a solder mask opening on the PCB board and filling it with protective glue. This structural design effectively isolates the potential influence of external environmental factors on the chip, such as moisture, dust, and other pollutants, thereby significantly improving the reliability and service life of the chip. In addition, the filling of the protective glue also enhances the stability of the chip when subjected to mechanical shock or vibration, reducing the phenomenon of dead lights caused by physical damage. The design of the solder mask opening allows the protective glue to evenly cover the chip, avoiding problems such as uneven display or degradation of optical performance caused by uneven filling. At the same time, this structure simplifies the manufacturing process and improves production efficiency because the solder mask opening can be directly aligned with the chip on the PCB board, reducing the complexity of alignment and positioning. Generally speaking, the display panel structure of the present utility model shows significant technical advantages in improving display performance, enhancing environmental adaptability, extending product life, and optimizing the production process. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a top view of the solder mask opening structure of the display panel according to Embodiment 1 of the present utility model (virtual pixel horizontal opening);

[0016] Figure 2 It is a top view of the solder mask opening structure of the display panel according to Embodiment 1 of the present utility model (virtual pixel vertical opening);

[0017] Figure 3 It is a top view of the solder mask opening structure of the display panel according to Embodiment 1 of the present utility model (real pixel vertical opening);

[0018] Figure 4 It is a top view of the solder mask opening structure of the display panel according to Embodiment 1 of the present utility model (real pixel horizontal opening);

[0019] Figure 5 It is a cross-sectional structural schematic diagram of the solder mask opening structure of the display panel according to Embodiment 1 of the present utility model.

[0020] Label Description:

[0021] 1. PCB board; 11. Solder mask opening; 2. Chip; 3. Protective glue. Detailed implementation manners

[0022] To describe in detail the technical content, achieved objectives and effects of the present utility model, the following is described in conjunction with the implementation manners and with reference to the drawings.

[0023] Please refer to Figures 1 to 5 , a structure of a solder mask opening 11 of a display panel, including a PCB board 1, wherein a plurality of chips 2 are provided on the PCB board 1, a solder mask opening 11 is further provided on the PCB board 1, the chip 2 is located within the solder mask opening 11, opposite ends of the solder mask opening 11 are respectively communicated with side walls of the PCB board 1, a protective glue 3 is filled within the solder mask opening 11, and the protective glue 3 covers the chip 2.

[0024] As can be seen from the above description, the beneficial effects of the present utility model are as follows: By designing a solder mask opening 11 on the PCB board 1 and filling it with a protective glue 3, comprehensive protection of the chip 2 is achieved. This structural design effectively isolates potential impacts of external environmental factors on the chip 2, such as moisture, dust, and other contaminants, thereby significantly improving the reliability and service life of the chip 2. In addition, the filling of the protective glue 3 also enhances the stability of the chip 2 when subjected to mechanical shock or vibration, reducing the phenomenon of dead lights caused by physical damage. The design of the solder mask opening 11 allows the protective glue 3 to uniformly cover the chip 2, avoiding problems such as uneven display or degradation of optical performance caused by uneven filling. At the same time, this structure simplifies the manufacturing process and improves production efficiency because the solder mask opening 11 can be directly aligned with the chips 2 on the PCB board 1, reducing the complexity of alignment and positioning. Generally speaking, the display panel structure of the present utility model demonstrates significant technical advantages in improving display performance, enhancing environmental adaptability, extending product life, and optimizing the production process.

[0025] Further, the material of the protective glue 3 is epoxy resin, silicone rubber, acrylic resin, polyurethane, polyimide, photocurable resin, thermosetting resin, conductive glue, UV curable glue, transparent silicone, cyanate resin, silicone gel, polyether ether ketone, or nanocomposite material.

[0026] As can be seen from the above description, a variety of protective glue 3 materials are provided to adapt to different application requirements and environmental conditions. Each material has its unique physical and chemical properties, such as high temperature resistance, good adhesiveness, transparency, etc., to meet specific technical requirements.

[0027] Further, anti - detachment protrusions are provided on side walls of the solder mask opening 11, and the protective glue 3 adheres to the anti - detachment protrusions.

[0028] As described above, setting the anti - detachment protrusion can increase the adhesion between the protective glue 3 and the side wall of the solder mask opening 11, prevent the protective glue 3 from falling off, and improve the stability and durability of the structure.

[0029] Furthermore, the side wall of the solder mask opening 11 is provided with an anti - detachment groove, and the protective glue 3 adheres to the anti - detachment groove.

[0030] As described above, the anti - detachment groove design can provide additional mechanical locking, enhance the adhesion between the protective glue 3 and the side wall of the solder mask opening 11, and ensure that the protective glue 3 is not easily detached due to vibration or impact.

[0031] Furthermore, the solder mask opening 11 extends along the length direction of the PCB board 1.

[0032] As described above, the solder mask opening 11 extending along the length direction of the PCB board 1 can provide a continuous protection area for the chip 2, and reduce potential weaknesses caused by structural interruptions.

[0033] Furthermore, the solder mask opening 11 extends along the width direction of the PCB board 1.

[0034] As described above, the solder mask opening 11 extending along the width direction of the PCB board 1 also provides continuous protection, and can flexibly adjust the protection area according to the layout of the chip 2 and the design of the PCB board 1.

[0035] Furthermore, the number of the solder mask openings 11 is multiple.

[0036] As described above, setting multiple solder mask openings 11 can provide protection for multiple chips 2, is suitable for large - scale integrated circuits or high - density chip 2 layouts, and improves the overall protection effect.

[0037] Furthermore, the top surface of the protective glue 3 is flush with the surface of the PCB board 1.

[0038] As described above, the top surface of the protective glue 3 being flush with the surface of the PCB board 1 helps to maintain the flatness of the display panel, and avoid uneven display effects or mechanical stress concentration caused by uneven thickness of the protective glue 3.

[0039] Furthermore, the material of the PCB board 1 is epoxy resin material.

[0040] As described above, choosing epoxy resin as the material of the PCB board 1 can provide good electrical insulation performance and mechanical strength, and is easy to process and achieve high - precision circuit layouts at the same time.

[0041] Furthermore, the gap between the chip 2 and the side wall of the solder mask opening 11 is less than or equal to 5 mm.

[0042] As described above, the small gap between the chip 2 and the side wall of the solder mask opening 11 helps to reduce the adverse effects caused by the air gap, such as moisture penetration and dust accumulation, while ensuring that the protective glue 3 can fully fill and protect the edge of the chip 2.

[0043] Please refer to Figures 1 to 5 , Embodiment 1 of the present utility model is: A solder mask opening 11 structure of a display panel, including a PCB board 1, on which a plurality of chips 2 are provided. The display panel can be a real pixel or a virtual pixel; A solder mask opening 11 is further provided on the PCB board 1. The chip 2 is located within the solder mask opening 11. The opposite ends of the solder mask opening 11 are respectively connected to the side wall of the PCB board 1. The solder mask opening 11 is also filled with a protective glue 3, and the protective glue 3 covers the chip 2. By designing the solder mask opening 11 on the PCB board 1 and filling it with the protective glue 3, comprehensive protection of the chip 2 is achieved. This structural design effectively isolates the potential impact of external environmental factors on the chip 2, such as moisture, dust, and other pollutants, thereby significantly improving the reliability and service life of the chip 2. In addition, the filling of the protective glue 3 also enhances the stability of the chip 2 when subjected to mechanical shock or vibration, reducing the phenomenon of dead pixels caused by physical damage. The design of the solder mask opening 11 allows the protective glue 3 to evenly cover the chip 2, avoiding problems such as uneven display or degradation of optical performance caused by uneven filling. At the same time, this structure simplifies the manufacturing process and improves production efficiency because the solder mask opening 11 can be directly aligned with the chips 2 on the PCB board 1, reducing the complexity of alignment and positioning. Generally speaking, the display panel structure of the present utility model demonstrates significant technical advantages in terms of improving display performance, enhancing environmental adaptability, extending product life, and optimizing the production process.

[0044] Optionally, the material of the protective glue 3 is epoxy resin, silicone rubber, acrylic resin, polyurethane, polyimide, photocurable resin, thermosetting resin, conductive glue, UV curable glue, transparent silicone, cyanate resin, silicone gel, polyether ether ketone, or nanocomposite material, providing a variety of choices for the material of the protective glue 3 to adapt to different application requirements and environmental conditions. Each material has its unique physical and chemical properties, such as high temperature resistance, good adhesion, transparency, etc., to meet specific technical requirements. Further, the colloidal colors of the above materials include transparent, foggy, black, etc., and the curing methods of the above materials include thermosetting, UV curing, UV + thermosetting, UV + heat + moisture curing, UV + moisture curing, etc.

[0045] Optionally, anti - detachment protrusions are provided on the side walls of the solder mask opening 11, and the protective glue 3 adheres to the anti - detachment protrusions. The anti - detachment protrusions can increase the adhesion between the protective glue 3 and the side walls of the solder mask opening 11, prevent the protective glue 3 from falling off, and improve the stability and durability of the structure; or, anti - detachment grooves are provided on the side walls of the solder mask opening 11, and the protective glue 3 adheres to the anti - detachment grooves. The anti - detachment groove design can provide additional mechanical locking, enhance the adhesion between the protective glue 3 and the side walls of the solder mask opening 11, and ensure that the protective glue 3 is not easily detached due to vibration or impact.

[0046] Optionally, the number of the solder mask openings 11 is multiple. Providing multiple solder mask openings 11 can protect multiple wafers 2, which is suitable for large - scale integrated circuits or high - density wafer 2 layouts and improves the overall protection effect; further, the solder mask openings 11 extend along the length direction of the PCB board 1 (as Figure 1 and Figure 3 shown). The solder mask openings 11 extending along the length direction of the PCB board 1 can provide a continuous protection area for the wafers 2 and reduce potential weaknesses caused by structural interruptions; or, the solder mask openings 11 extend along the width direction of the PCB board 1 (as Figure 2 and Figure 4 shown). The solder mask openings 11 extending along the width direction of the PCB board 1 also provide continuous protection and can flexibly adjust the protection area according to the wafer 2 layout and the PCB board 1 design.

[0047] In this embodiment, the top surface of the protective glue 3 is flush with the surface of the PCB board 1. The top surface of the protective glue 3 being flush with the surface of the PCB board 1 helps to maintain the flatness of the display panel and avoid uneven display effects or mechanical stress concentration caused by uneven thickness of the protective glue 3; specifically, the material of the PCB board 1 is an epoxy resin material. Selecting epoxy resin as the material of the PCB board 1 can provide good electrical insulation performance and mechanical strength, and is easy to process and achieve high - precision circuit layouts; optionally, the gap between the wafer 2 and the side wall of the solder mask opening 11 is less than or equal to 5 mm. The small gap between the wafer 2 and the side wall of the solder mask opening 11 helps to reduce the adverse effects caused by air gaps, such as moisture penetration and dust accumulation, and at the same time ensures that the protective glue 3 can fully fill and protect the edge of the wafer 2.

[0048] In addition, in some other embodiments, the top surface of the protective glue is higher than the surface of the PCB board, or the top surface of the protective glue is lower than the surface of the PCB board; that is to say, the filling height of the protective glue 3 can be higher than the surface of the PCB board 1 or lower than the surface of the PCB board 1.

[0049] In summary, the solder mask opening structure of the display panel provided by the present utility model realizes comprehensive protection of the wafer by designing a solder mask opening on the PCB board and filling it with a protective glue. This structural design effectively isolates the potential impact of external environmental factors on the wafer, such as moisture, dust, and other pollutants, thereby significantly improving the reliability and service life of the wafer. In addition, the filling of the protective glue also enhances the stability of the wafer when subjected to mechanical shock or vibration, reducing the phenomenon of dead lights caused by physical damage. The design of the solder mask opening allows the protective glue to evenly cover the wafer, avoiding problems such as uneven display or degradation of optical performance caused by uneven filling. At the same time, this structure simplifies the manufacturing process and improves production efficiency because the solder mask opening can be directly aligned with the wafer on the PCB board, reducing the complexity of alignment and positioning. Generally speaking, the display panel structure of the present utility model demonstrates significant technical advantages in improving display performance, enhancing environmental adaptability, extending product life, and optimizing the production process.

[0050] The above are only embodiments of the present utility model, and thus do not limit the patent scope of the present utility model. Any equivalent transformation made using the content of the specification and drawings of the present utility model, or directly or indirectly applied in the relevant technical fields, shall similarly be included within the patent protection scope of the present utility model.

Claims

1. A solder mask opening structure for a display panel, including a PCB board, wherein a plurality of wafers are provided on the PCB board, characterized in that, The PCB board is also provided with a soldermask opening, the chip is located within the soldermask opening, opposite ends of the soldermask opening are respectively communicated with the side wall of the PCB board, and the soldermask opening is further filled with a protective glue, and the protective glue covers the chip.

2. The solder mask opening structure of the display panel according to claim 1, wherein The material of the protective glue is epoxy resin, silicone rubber, acrylic resin, polyurethane, polyimide, photocurable resin, thermosetting resin, conductive glue, UV curable glue, transparent silica gel, cyanate resin, silicone gel, polyetheretherketone or nanocomposite material.

3. The solder mask opening structure of the display panel according to claim 1, wherein The side wall of the soldermask opening is provided with an anti - detachment protrusion, and the protective glue adheres to the anti - detachment protrusion.

4. The solder mask opening structure of the display panel according to claim 1, wherein The side wall of the soldermask opening is provided with an anti - detachment groove, and the protective glue adheres to the anti - detachment groove.

5. The solder mask opening structure of the display panel according to claim 1, wherein The soldermask opening extends along the length direction of the PCB board.

6. The solder mask opening structure of the display panel according to claim 1, wherein The soldermask opening extends along the width direction of the PCB board.

7. The solder mask opening structure of the display panel according to claim 1, wherein The number of the soldermask openings is multiple.

8. The solder mask opening structure of the display panel according to claim 1, wherein The top surface of the protective glue is flush with the surface of the PCB board, or the top surface of the protective glue is higher than the surface of the PCB board, or the top surface of the protective glue is lower than the surface of the PCB board.

9. The solder mask opening structure of the display panel according to claim 1, wherein The material of the PCB board is epoxy resin material.

10. The solder mask opening structure of the display panel according to claim 1, wherein The gap between the chip and the side wall of the soldermask opening is less than or equal to 5 mm.

Images