Cleaning device for etched semiconductor

Abstract

The utility model discloses a cleaning device for a semiconductor after etching, which relates to the technical field of cleaning devices and comprises a cleaning mechanism and an adjusting mechanism, an overturning mechanism is fixedly connected in the cleaning mechanism, a limiting mechanism is mounted on the upper portion of the overturning mechanism, and the cleaning mechanism comprises an operation table and a cleaning water supply pipe assembly. The surface of the operation table is fixedly connected with a water storage tank. According to the device, the stepping motor drives the first synchronous wheel to rotate, then the synchronous belt drives the second synchronous wheel to rotate, then the semiconductor workpiece fixed to the side face of the limiting mechanism is driven to turn over, the second synchronous wheel drives the workpiece to turn over, and therefore all faces of the workpiece can be fully cleaned; and the cleaning speed and cleanliness of the cleaning mechanism on the semiconductor processing part are improved.

Description

Technical Field

[0001] The utility model relates to the technical field of cleaning devices, in particular to a semiconductor post-etching cleaning device. Background Art

[0002] Semiconductor etching is a common production process in semiconductor device manufacturing that selectively removes material from a thin film on a substrate and creates a pattern of the desired material on the substrate. During the etching process, residues will remain on the surface of the semiconductor, which will affect subsequent process steps or degrade device performance. Therefore, cleaning it with a cleaning device can effectively remove these residues and ensure the purity of the surface.

[0003] For example, announcement number: CN215613499U discloses "a semiconductor post-etching cleaning device", which includes a cleaning box, a screw block and a mounting plate. There are two screw blocks, which are respectively installed at the two ends of the upper surface of the cleaning box. A first screw rod is installed on one surface of the two screw blocks. There are two mounting plates, which are respectively installed at one end of the two first screw rods. Two first slide grooves are provided on one surface of the mounting plate, and first sliders are installed inside the two first slide grooves. A splint is installed on one surface of the two first sliders, and a number of springs are installed on the lower surface of the splint. A buffer plate is installed on one end of the spring, and fastening bolts are installed on both ends of the upper surface of the splint.

[0004] However, in the prior art, when the cleaning device is performing fixed cleaning on the etched semiconductor workpiece, it is unable to flip the semiconductor workpiece for cleaning. During the cleaning process, the wastewater generated by cleaning the upper part of the semiconductor workpiece will flow to the lower part of the semiconductor workpiece, and the lower part of the semiconductor workpiece itself will be attached with residues during the etching process. If the cleaning device does not flip the semiconductor workpiece for cleaning, it will be difficult to clean the semiconductor workpiece through one fixed cleaning. It needs to be turned over, fixed, and cleaned again, resulting in reduced cleaning efficiency of the semiconductor workpiece. Utility Model Content

[0005] The purpose of the utility model is to solve the problem that the existing cleaning device in the prior art cannot flip the semiconductor processing part for cleaning. During the cleaning process, the sewage generated by cleaning the upper part of the semiconductor processing part will flow to the lower part of the semiconductor processing part, and the lower part of the semiconductor processing part itself will be attached with residues during the etching process. If the cleaning device does not flip the semiconductor processing part for cleaning, it will cause the semiconductor processing part to be difficult to clean through a single fixed cleaning. A semiconductor post-etching cleaning device is proposed.

[0006] In order to achieve the above-mentioned purpose, the utility model adopts the following technical solutions: a semiconductor post-etching cleaning device, comprising a cleaning mechanism and an adjusting mechanism, wherein a flip mechanism is fixedly connected inside the cleaning mechanism, a limiting mechanism is installed on the upper part of the flip mechanism, the cleaning mechanism comprises an operating table and a cleaning water supply pipe assembly, the surface of the operating table is fixedly connected to a water storage tank, the upper part of the water storage tank is fixedly connected to a waste liquid collection tank, the upper part of the waste liquid collection tank is fixedly connected to a placement plate, one end of the cleaning water supply pipe assembly is fixedly connected to a water supply pump, the water supply pump is installed inside the water storage tank, and the other end of the cleaning water supply pipe assembly is fixedly connected to Water outlet pipe, the bottom of the water outlet pipe is fixedly connected to a nozzle, the adjusting mechanism is fixedly connected to the inner wall of the operating table, and the lower part of the adjusting mechanism is fixedly connected to the water outlet pipe, the flipping mechanism includes a mounting frame, a synchronous belt and a stepping motor, the surface of the mounting frame is rotatably connected to the first synchronous wheel and the second synchronous wheel, the second synchronous wheel is located above the first synchronous wheel, the synchronous belt is movably connected to the first synchronous wheel and the second synchronous wheel respectively, the stepping motor is installed on the side of the mounting frame, and the output end of the stepping motor is fixedly connected to the number one synchronous wheel, one end of the number two synchronous wheel is fixedly connected to the connecting frame, and a limiting mechanism is installed on the surface of the connecting frame.

[0007] Preferably, a water inlet pipe is fixedly connected to the side of the water storage tank, a drain pipe is fixedly connected to the side of the waste liquid collection tank, and a valve is installed on the surface of the drain pipe.

[0008] Preferably, the surface of the mounting frame is rotatably connected to two number one synchronous wheels, and the two number one synchronous wheels are fixed to each other via a connecting shaft.

[0009] Preferably, the limiting mechanism includes a cylinder, which is fixedly connected to the connecting frame, and one end of the cylinder is fixedly connected to a connecting plate, a limiting rod is movably inserted on the surface of the connecting plate, one end of the limiting rod is fixedly connected to a splint, a spring is provided on the surface of the limiting rod, one end of the spring is fixedly connected to the connecting plate, and the other end of the spring is fixedly connected to the splint.

[0010] Preferably, the adjustment mechanism includes a No. 1 slide rail, a No. 1 slider is slidably connected to the interior of the No. 1 slide rail, and a No. 1 servo motor is installed on one side of the No. 1 slide rail, a No. 1 servo motor output end is fixedly connected to a No. 1 screw rod, the No. 1 screw rod is rotatably connected to the No. 1 slide rail, and the No. 1 screw rod is threadedly connected to the No. 1 slider.

[0011] Preferably, the side of the No. 1 slider is fixedly connected to a fixed plate, the bottom of the fixed plate is fixedly connected to a No. 2 slide rail, the interior of the No. 2 slide rail is slidably connected to the No. 2 slider, and a No. 2 servo motor is installed on one side of the No. 2 slide rail, the output end of the No. 2 servo motor is fixedly connected to a No. 2 screw rod, the No. 2 screw rod is rotatably connected to the No. 2 slide rail, and the No. 2 screw rod is threadedly connected to the No. 2 slider, and the No. 2 slider is fixedly connected to the water outlet pipe.

[0012] Compared with the prior art, the advantages and positive effects of the present invention are:

[0013] 1. In the present invention, after one side of the semiconductor workpiece is cleaned, the stepper motor drives the No. 1 synchronous wheel to rotate, and the synchronous belt drives the No. 2 synchronous wheel to rotate, thereby driving the semiconductor workpiece fixed on the side of the limit mechanism to flip over. The No. 2 synchronous wheel drives the workpiece to flip over so that all sides of the workpiece can be fully cleaned, thereby improving the cleaning speed and cleanliness of the semiconductor workpiece by the cleaning mechanism.

[0014] 2. In the present invention, the No. 1 servo motor drives the No. 1 screw rod to rotate, thereby driving the No. 1 slider to slide along the No. 1 slide rail, and then adjusting the left and right positions of the nozzle. Similarly, the No. 2 servo motor drives the No. 2 screw rod to rotate, causing the No. 2 slider to slide along the No. 2 slide rail, and then adjusting the front and rear positions of the nozzle. By adjusting the position of the nozzle, the nozzle can fully clean various positions on the surface of the semiconductor processing part, and the waste water generated by cleaning is collected through the waste liquid collection box. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 This is a first three-dimensional structural diagram of a semiconductor post-etching cleaning device proposed by the utility model;

[0016] Figure 2 This is a second three-dimensional structural diagram of a semiconductor post-etching cleaning device proposed by the present invention;

[0017] Figure 3 The utility model provides a schematic diagram of the cross-sectional three-dimensional structure of a water storage tank in a semiconductor post-etching cleaning device;

[0018] Figure 4 This is a front view structural diagram of a flip mechanism in a semiconductor post-etching cleaning device proposed by the present invention;

[0019] Figure 5 The utility model provides a three-dimensional structural schematic diagram of an adjustment mechanism in a semiconductor post-etching cleaning device.

[0020] Legend: 1. Cleaning mechanism; 11. Operating table; 12. Water storage tank; 13. Waste liquid collection box; 14. Placement plate; 15. Water inlet pipe; 16. Drain pipe; 17. Valve; 18. Cleaning water supply pipe assembly; 19. Outlet pipe; 110. Nozzle; 2. Flipping mechanism; 21. Mounting frame; 22. No. 1 synchronous pulley; 23. Synchronous belt; 24. No. 2 synchronous pulley; 25. Stepper motor; 26. Connecting frame; 3. Limiting mechanism; 31. Cylinder; 32. Connecting plate; 33. Limiting rod; 34. Spring; 35. Clamp; 4. Adjusting mechanism; 41. No. 1 slide rail; 42. No. 1 slider; 43. No. 1 servo motor; 44. No. 1 screw rod; 45. Fixing plate; 46. No. 2 slide rail; 47. No. 2 slider; 48. No. 2 servo motor; 49. No. 2 screw rod. DETAILED DESCRIPTION

[0021] In order to more clearly understand the above-mentioned purpose, features and advantages of the present invention, the present invention is further described below with reference to the accompanying drawings and embodiments. It should be noted that the embodiments of the present application and the features therein can be combined with each other without conflict.

[0022] In the following description, many specific details are set forth to facilitate a full understanding of the present invention. However, the present invention may also be implemented in other ways than those described herein. Therefore, the present invention is not limited to the specific embodiments disclosed in the following specification.

[0023] Example 1: Figure 1 - Figure 5As shown, the utility model provides a semiconductor post-etching cleaning device, including a cleaning mechanism 1 and an adjusting mechanism 4, the cleaning mechanism 1 is fixedly connected to a flip mechanism 2 inside, and a limiting mechanism 3 is installed on the upper part of the flip mechanism 2, the cleaning mechanism 1 includes an operating table 11 and a cleaning water supply pipe assembly 18, the surface of the operating table 11 is fixedly connected to a water storage tank 12, the upper part of the water storage tank 12 is fixedly connected to a waste liquid collection box 13, the upper part of the waste liquid collection box 13 is fixedly connected to a placement plate 14, one end of the cleaning water supply pipe assembly 18 is fixedly connected to a water supply pump, and the water supply pump is installed inside the water storage tank 12, the other end of the cleaning water supply pipe assembly 18 is fixedly connected to a water outlet pipe 19, and the bottom of the water outlet pipe 19 is fixedly connected to The nozzle 110, the adjustment mechanism 4 is fixedly connected to the inner wall of the operating table 11, and the lower part of the adjustment mechanism 4 is fixedly connected to the water outlet pipe 19. The flip mechanism 2 includes a mounting frame 21, a synchronous belt 23 and a stepping motor 25. The surface of the mounting frame 21 is rotatably connected to the first synchronous wheel 22 and the second synchronous wheel 24. The second synchronous wheel 24 is located above the first synchronous wheel 22. The synchronous belt 23 is movably connected to the first synchronous wheel 22 and the second synchronous wheel 24. The stepping motor 25 is installed on the side of the mounting frame 21, and the output end of the stepping motor 25 is fixedly connected to the first synchronous wheel 22. One end of the second synchronous wheel 24 is fixedly connected to the connecting frame 26. The limiting mechanism 3 is installed on the surface of the connecting frame 26.

[0024] A water inlet pipe 15 is fixedly connected to the side of the water storage tank 12, and a drain pipe 16 is fixedly connected to the side of the waste liquid collection box 13. A valve 17 is installed on the surface of the drain pipe 16. Two No. 1 synchronous wheels 22 are rotatably connected to the surface of the mounting frame 21. The two No. 1 synchronous wheels 22 are fixed to each other by a connecting shaft. The limiting mechanism 3 includes a cylinder 31, which is fixedly connected to the connecting frame 26, and one end of the cylinder 31 is fixedly connected to a connecting plate 32. A limiting rod 33 is movably inserted on the surface of the connecting plate 32, and one end of the limiting rod 33 is fixedly connected to a splint 35. A spring 34 is provided on the surface of the limiting rod 33, and one end of the spring 34 is fixedly connected to the connecting plate 32, and the other end of the spring 34 is fixedly connected to the splint 35.

[0025] The following is a detailed description of the specific settings and functions of this embodiment. The semiconductor processing part is placed between the clamps 35, and the cylinder 31 pushes the connecting plate 32, the limit rod 33 and the clamp 35 to clamp and limit it for easy fixation. Then, the cleaning water inside the water tank 12 is sprayed out through the cleaning water supply pipe assembly 18, the outlet pipe 19 and the nozzle 110 by the water supply pump, thereby cleaning the semiconductor processing part. After cleaning one side of the semiconductor processing part, the stepper motor 25 drives the No. 1 synchronous wheel 22 to rotate, and the synchronous belt 23 drives the No. 2 synchronous wheel 24 to rotate, thereby driving the semiconductor processing part fixed on the side of the limiting mechanism 3 to flip over, and the No. 2 synchronous wheel 24 drives the workpiece to flip so that all sides of the workpiece can be fully cleaned, thereby improving the speed and cleanliness of the cleaning mechanism 1 for the semiconductor processing part.

[0026] Example 2: Figure 1 - Figure 5 As shown, the adjustment mechanism 4 includes a No. 1 slide rail 41, which is internally slidably connected to a No. 1 slider 42, and a No. 1 servo motor 43 is installed on one side of the No. 1 slide rail 41, and the output end of the No. 1 servo motor 43 is fixedly connected to a No. 1 screw rod 44, which is rotatably connected to the No. 1 slide rail 41, and the No. 1 screw rod 44 is threadedly connected to the No. 1 slider 42, and a fixed plate 45 is fixedly connected to the side of the No. 1 slider 42, and a No. 2 slide rail 46 is fixedly connected to the bottom of the fixed plate 45, and the No. 2 slide rail 46 is internally slidably connected to a No. 2 slider 47, and a No. 2 servo motor 48 is installed on one side of the No. 2 slide rail 46, and a No. 2 screw rod 49 is fixedly connected to the output end of the No. 2 servo motor 48, and the No. 2 screw rod 49 is rotatably connected to the No. 2 slide rail 46, and the No. 2 screw rod 49 is threadedly connected to the No. 2 slider 47, and the No. 2 slider 47 is fixedly connected to the water outlet pipe 19.

[0027] The effect achieved by the entire embodiment is that, during the cleaning process, the No. 1 servo motor 43 drives the No. 1 screw rod 44 to rotate, thereby driving the No. 1 slider 42 to slide along the No. 1 slide rail 41, and then adjusting the left and right positions of the nozzle 110. Similarly, the No. 2 servo motor 48 drives the No. 2 screw rod 49 to rotate, causing the No. 2 slider 47 to slide along the No. 2 slide rail 46, and then adjusting the front and rear positions of the nozzle 110. By adjusting the position of the nozzle 110, the nozzle 110 can fully clean various positions on the surface of the semiconductor processing part, and the wastewater generated by cleaning is collected through the waste liquid collection box 13.

[0028] The usage and working principle of this device are as follows: the semiconductor processing part is placed between the clamping plates 35, and the connecting plate 32, the limiting rod 33 and the clamping plate 35 are pushed by the cylinder 31 to clamp and limit it, so as to fix it, and then the cleaning water in the water tank 12 is sprayed out through the cleaning water supply pipe assembly 18, the outlet pipe 19 and the nozzle 110 by the water supply pump, so as to clean the semiconductor processing part. During the cleaning process, the No. 1 servo motor 43 drives the No. 1 screw rod 44 to rotate, thereby driving the No. 1 slider 42 to slide along the No. 1 slide rail 41, and then adjusting the left and right position of the nozzle 110. Similarly, the No. 2 servo motor 48 drives the No. 2 screw rod 49 to rotate, so that the No. 2 slider 47 slides along the No. 2 slide rail 46, and then adjusting the front and rear position of the nozzle 110. By adjusting the position of the nozzle 110, the waste water generated by cleaning is collected through the waste liquid collection box 13;

[0029] After cleaning one side of the semiconductor workpiece, the stepping motor 25 drives the first synchronous wheel 22 to rotate, and the synchronous belt 23 drives the second synchronous wheel 24 to rotate, thereby driving the semiconductor workpiece fixed on the side of the limiting mechanism 3 to flip.

[0030] The above are only preferred embodiments of the present invention and are not intended to limit the present invention in any other form. Any technician familiar with the profession may use the technical content disclosed above to change or modify it into an equivalent embodiment with equivalent changes and apply it to other fields. However, any simple modification, equivalent change and modification of the above embodiment made according to the technical essence of the present invention without departing from the content of the technical solution of the present invention shall still fall within the scope of protection of the technical solution of the present invention.

Claims

1. A semiconductor post-etching cleaning device, comprising a cleaning mechanism (1) and an adjusting mechanism (4), wherein the cleaning mechanism (1) is internally fixedly connected to a turning mechanism (2), and a limiting mechanism (3) is installed on the upper portion of the turning mechanism (2), and the cleaning mechanism (1) comprises an operating table (11) and a cleaning water supply pipe assembly (18), wherein the surface of the operating table (11) is fixedly connected to a water storage tank (12), and the upper portion of the water storage tank (12) is fixedly connected to a waste liquid collection tank (13), and the waste liquid collection tank (13) The upper portion is fixedly connected to a placement plate (14), one end of the cleaning water supply pipe assembly (18) is fixedly connected to a water supply pump, and the water supply pump is installed inside the water storage tank (12), the other end of the cleaning water supply pipe assembly (18) is fixedly connected to a water outlet pipe (19), and the bottom of the water outlet pipe (19) is fixedly connected to a nozzle (110), the regulating mechanism (4) is fixedly connected to the inner wall of the operating table (11), and the lower portion of the regulating mechanism (4) is fixedly connected to the water outlet pipe (19), characterized in that: The flip mechanism (2) comprises a mounting frame (21), a synchronous belt (23) and a stepping motor (25); the surface of the mounting frame (21) is rotatably connected to a first synchronous wheel (22) and a second synchronous wheel (24); the second synchronous wheel (24) is located above the first synchronous wheel (22); the synchronous belt (23) is movably connected to the first synchronous wheel (22) and the second synchronous wheel (24); the stepping motor (25) is mounted on a side of the mounting frame (21); the output end of the stepping motor (25) is fixedly connected to the first synchronous wheel (22); one end of the second synchronous wheel (24) is fixedly connected to a connecting frame (26); and a limiting mechanism (3) is mounted on the surface of the connecting frame (26).

2. A semiconductor post-etching cleaning device according to claim 1, characterized in that: A water inlet pipe (15) is fixedly connected to the side of the water storage tank (12), a drain pipe (16) is fixedly connected to the side of the waste liquid collection tank (13), and a valve (17) is installed on the surface of the drain pipe (16).

3. The semiconductor post-etching cleaning device according to claim 1, characterized in that: The surface of the mounting frame (21) is rotatably connected to two number one synchronous wheels (22), and the two number one synchronous wheels (22) are fixed to each other via a connecting shaft.

4. The semiconductor post-etching cleaning device according to claim 1, characterized in that: The limiting mechanism (3) includes a cylinder (31), the cylinder (31) is fixedly connected to the connecting frame (26), and one end of the cylinder (31) is fixedly connected to a connecting plate (32), a limiting rod (33) is movably inserted on the surface of the connecting plate (32), one end of the limiting rod (33) is fixedly connected to a clamping plate (35), and a spring (34) is provided on the surface of the limiting rod (33), one end of the spring (34) is fixedly connected to the connecting plate (32), and the other end of the spring (34) is fixedly connected to the clamping plate (35).

5. The semiconductor post-etching cleaning device according to claim 1, characterized in that: The regulating mechanism (4) comprises a No. 1 slide rail (41), the No. 1 slide rail (41) is slidably connected to a No. 1 slider (42) inside, and a No. 1 servo motor (43) is installed on one side of the No. 1 slide rail (41), the No. 1 servo motor (43) is fixedly connected to the output end of the No. 1 servo motor (43) with a No. 1 screw rod (44), the No. 1 screw rod (44) is rotatably connected to the No. 1 slide rail (41), and the No. 1 screw rod (44) is threadedly connected to the No. 1 slider (42).

6. The semiconductor post-etching cleaning device according to claim 5, characterized in that: The side of the No. 1 slider (42) is fixedly connected to a fixed plate (45), the bottom of the fixed plate (45) is fixedly connected to a No. 2 slide rail (46), the interior of the No. 2 slide rail (46) is slidably connected to the No. 2 slider (47), and a No. 2 servo motor (48) is installed on one side of the No. 2 slide rail (46), the output end of the No. 2 servo motor (48) is fixedly connected to a No. 2 screw rod (49), the No. 2 screw rod (49) is rotatably connected to the No. 2 slide rail (46), and the No. 2 screw rod (49) is threadedly connected to the No. 2 slider (47), and the No. 2 slider (47) is fixedly connected to the water outlet pipe (19).

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