Cutting mechanism for semiconductor chip processing

Abstract

The utility model belongs to the field of semiconductor chip processing, and particularly relates to a cutting mechanism for semiconductor chip processing, which is characterized in that a first top plate is arranged between a first side plate and a first bracket, a second top plate is arranged between the first bracket and a second bracket, and a third top plate is arranged between the second bracket and a third bracket; a clamping assembly is slidably arranged on the lower end face of the first top plate, a linear cutting assembly is arranged in the first support, a movable adsorption assembly is arranged on the lower end face of the second top plate, a plurality of hollow rotating rollers are rotationally arranged on the lower end face of the second top plate and located in the base, a plurality of first through holes are formed in the hollow rotating rollers, and a plurality of water sprayers are arranged on one sides of the hollow rotating rollers. And a transmission drying assembly is rotationally arranged in the base under the third top plate. According to the utility model, through the arrangement of the hollow rotating roller, the first through hole, the water sprayer and the like, the surface of the wafer is cleaned and air-dried while the wafer is conveyed.

Description

Technical Field

[0001] The utility model belongs to the technical field of semiconductor chip processing, in particular to a cutting mechanism for semiconductor chip processing. Background Art

[0002] The semiconductor chip processing process includes multiple parts, among which cutting the crystal rod into wafers and transporting the cut wafers are relatively important links. Due to the high precision requirements of cutting, wire cutting is generally used, and some cutting fluid and cutting debris will remain on the surface of the cut wafer, so the wafer needs to be cleaned and dried.

[0003] As disclosed in patent application number CN202022319963.1, a raw material slicing device for semiconductor chip production and processing includes a concave plate, a moving mechanism is installed above the concave plate, a vertical plate is attached to the right end of the raw material, a handle is fixed to the middle of the top of the vertical plate, and a slider is fixed to the bottom end of the vertical plate. In the raw material slicing device for semiconductor chip production and processing, a rotating rod drives a threaded rod to rotate so that the threaded rod moves to the right in a box body, the threaded rod rotates in a connecting block through an internal bearing, so that the connecting block moves to the right, the connecting block drives a push rod to move to the right in the box body, and the push rod drives a rubber block to move to the right to limit the raw material. After a layer of raw material is cut, a spring gives the raw material a force to the left, so that the raw material continues to press against the rubber block, thereby improving the continuity of the slicing, thereby improving the slicing efficiency of the raw material, and solving the problem that the existing raw material slicing device for semiconductor chip production and processing needs to be manually held to cut slices one by one, which is inefficient and delays the work process.

[0004] In the prior art, structures such as ejector pins and springs are provided so that the crystal rods can be cut into wafers without manual hand-held slicing one by one. However, due to the high hardness of the crystal rods, cutting fluid is generally required during cutting. The surface of the wafer after cutting, especially the side of the wafer on the wire cutting surface, will be contaminated with cutting fluid, cutting debris and other substances. If it is not cleaned in time, it will affect the accuracy of subsequent wafer segmentation and other problems. In severe cases, it may cause the processed chips to be unusable.

[0005] In addition, after the wafer is cleaned, some water stains will remain on the wafer. If it is not air-dried in time, it will also affect the subsequent wafer segmentation. The above problems have not been effectively solved by the existing technology. Utility Model Content

[0006] The present invention aims to overcome the shortcomings of the prior art and provides a cutting mechanism for semiconductor chip processing. The present invention utilizes hollow rollers, a first through hole, and a water sprayer to simultaneously clean the wafer surface while transporting the wafer. Furthermore, the hollow conveying rollers, a conveyor belt, and a hot air blower allow the wafer surface to be dried while being transported.

[0007] In order to achieve the above-mentioned objectives, the utility model provides the following technical solutions: a cutting mechanism for semiconductor chip processing, comprising a base, wherein a first side plate, a first bracket, a second bracket and a third bracket are sequentially arranged on the base, a first top plate is arranged between the first side plate and the first bracket, a second top plate is arranged between the first bracket and the second bracket, and a third top plate is arranged between the second bracket and the third bracket, a clamping assembly is slidably arranged on the lower end surface of the first top plate, a wire cutting assembly is arranged inside the first bracket, a movable adsorption assembly is arranged on the lower end surface of the second top plate, a plurality of hollow rollers are rotatably arranged on the lower end surface of the second top plate inside the base, a plurality of first through holes are arranged on the hollow roller, a plurality of water sprinklers are arranged on one side of the hollow roller, a transmission drying assembly is rotatably arranged directly below the third top plate and inside the base, and an air dryer is arranged above the transmission drying assembly on the lower end surface of the third top plate.

[0008] Optionally, the transmission drying assembly includes two hollow conveying rollers rotatably arranged in the base, the two hollow conveying rollers are provided with conveyor belts, each of the hollow conveying rollers is provided with a plurality of second through holes, and the conveyor belt is provided with a plurality of third through holes.

[0009] Optionally, a second rotating shaft and an air supply rotating shaft are respectively provided at both ends of the hollow conveying roller, an air supply pipe is rotatably provided at the input end of the air supply rotating shaft, a hot air blower is provided on one side of the base, and the output end of the hot air blower is connected to the air supply pipe.

[0010] Optionally, a water tank is provided directly below the hollow roller, a filter is provided inside the water tank, a water pump is provided on one side of the water tank, a water pipe is provided at the output end of the water pump, a rotating connecting sleeve is provided at the input end of the water pipe, and a first rotating shaft and a water supply rotating shaft are provided at both ends of each of the hollow rollers, and the water supply rotating shaft passes through the side wall of the base and is rotatably connected to the rotating connecting sleeve.

[0011] Optionally, the movable adsorption assembly includes a rotating cylinder slidably arranged on the lower end surface of the second top plate, the output end of the rotating cylinder is provided with a rotating plate, and the side wall of the rotating plate is provided with an adsorber.

[0012] Optionally, a screw is rotatably provided in the second top plate, a moving block is rotatably provided on the screw, a second push cylinder is provided on the lower end surface of the moving block, and an output end of the second push cylinder is fixedly connected to one side of the rotating cylinder.

[0013] Optionally, the clamping assembly includes a movable plate slidably disposed between the base and the first top plate, and a three-jaw chuck is disposed on a side surface of the movable plate between the movable plate and the first bracket.

[0014] Optionally, a first push cylinder is provided on one side of the base, and an output end of the first push cylinder passes through the first side plate and is connected to the side wall of the movable plate.

[0015] In summary, compared with the prior art, the beneficial effects of this solution are:

[0016] (1) The utility model uses the hollow roller, the first through hole, and the water sprayer to clean the surface of the wafer while transporting the wafer. Moreover, the lubrication of water and the action of water pressure greatly reduce the collision between the wafer and the hollow roller during transportation. While ensuring the safety of wafer transportation, the surface of the wafer can also be cleaned.

[0017] (2) The utility model uses hollow conveyor rollers, conveyor belts, and hot air blowers to transport wafers while drying the moisture on the surface of the cleaned wafers. While drying the surface of the wafers, the conveyor belt's water absorption performance is ensured, thereby improving the wafer drying efficiency and ensuring that the drying effect of multiple wafers remains unchanged.

[0018] (3) The utility model can recycle the water after cleaning by setting a filter net, thus saving water resources. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 This is a three-dimensional diagram of the utility model from the first perspective;

[0020] Figure 2 A perspective view of the second viewing angle of the present invention;

[0021] Figure 3 This is the main view of the utility model;

[0022] Figure 4 This is a side view of the utility model;

[0023] Figure 5 This is a top view of the utility model;

[0024] Figure 6 for Figure 4 A three-dimensional cross-section at AA in the middle;

[0025] Figure 7 for Figure 6 A partial enlarged view of point B in the middle;

[0026] Figure 8 for Figure 1 A partial enlarged view of point C in the middle;

[0027] Figure 9 for Figure 1 A partial enlarged view of point D in the middle.

[0028] In the figure: base 10, first side plate 11, first bracket 12, second bracket 13, third bracket 14, first top plate 15, second top plate 16, third top plate 17, first push cylinder 18, movable plate 19, three-jaw chuck 20, wire cutting assembly 21, cutting fluid nozzle 22, movable block 23, screw 24, second push cylinder 25, rotary cylinder 26, rotating plate 27, adsorber 28, hollow roller 29, first through hole 30, first rotating shaft 31, first motor 32, water delivery shaft 33, water delivery pipe 34, rotating connecting sleeve 35, water pump 36, water storage tank 37, sprinkler 38, second motor 41, second rotating shaft 42, gas delivery shaft 43, hot air blower 44, gas delivery pipe 45, hollow conveyor roller 46, second through hole 47, conveyor belt 48, third through hole 49, third motor 50, air dryer 51, filter 52. DETAILED DESCRIPTION

[0029] In order to enable those skilled in the art to better understand the present invention, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention.

[0030] Example 1:

[0031] like Figure 1 、 Figure 2 、 Figure 3 、 Figure 4 、 Figure 5 、 Figure 6 、 Figure 7 、 Figure 8 and Figure 9 As shown, a cutting mechanism for semiconductor chip processing is provided on the base 10 in sequence. A first side plate 11, a first bracket 12, a second bracket 13 and a third bracket 14 are provided on the base 10, a first top plate 15 is provided between the first side plate 11 and the first bracket 12, a second top plate 16 is provided between the first bracket 12 and the second bracket 13, and a third top plate 17 is provided between the second bracket 13 and the third bracket 14. A clamping assembly is slidably provided on the lower end surface of the first top plate 15, a wire cutting assembly is provided inside the first bracket 12, a movable adsorption assembly is provided on the lower end surface of the second top plate 16, a plurality of hollow rollers 29 are provided on the lower end surface of the second top plate 16 for rotation inside the base 10, a plurality of first through holes 30 are provided on the hollow roller 29, and a plurality of water sprinklers 38 are provided on one side of the hollow roller 29, a transmission drying assembly is provided for rotation inside the base 10 directly below the third top plate 17, and an air dryer 51 is provided on the lower end surface of the third top plate 17 above the transmission drying assembly.

[0032] Specifically, the wire cutting assembly includes a cutting wire, a wire feeding mechanism, and a wire rack, which is a prior art. This scheme will not be elaborated in detail. A cutting fluid nozzle 22 is provided on the inner wall of the first bracket 12. When the cutting assembly cuts the silicon rod, the cutting fluid nozzle 22 sprays cutting fluid to assist in cutting. The interior of the hollow roller 29 is hollow, and the first through hole 30 is a water outlet. Water is supplied to the hollow roller 29 through a water pump 36, a water pipe 34, and a water supply shaft 33. The lower end surface of the wafer transported at the upper end of the hollow roller 29 is rinsed through the first through hole 30. The lower end surface in the above scheme is the cutting surface of the wafer. The water sprayer 38 is also supplied with water by the water pipe 34 and the water pump 36 to rinse the upper end surface of the wafer. The hollow roller 29 rinses while the wafer is moved. Due to the lubrication of water and the support of water pressure, the wafer can reduce collisions with the outer wall of the hollow roller 29 during contact and transportation.

[0033] The mobile adsorption assembly adsorbs and clamps one side of the silicon rod when the silicon rod is wire-cut. After each wafer is cut from the silicon rod, the mobile adsorption assembly adsorbs and transports it to the upper end surface of the hollow roller 29 for conveying and cleaning.

[0034] The transmission drying component absorbs and dries the moisture on the lower end surface of the wafer.

[0035] The air dryer 51 is an ordinary hot air blower, which is a prior art and will not be elaborated in detail in this solution. The air dryer 51 can dry the upper end surface of the wafer.

[0036] Further, such as Figure 1 、 Figure 3 and Figure 8 As shown, a water tank 37 is provided directly below the hollow roller 29, and a filter screen 52 is provided inside the water tank 37. A water pump 36 is provided on one side of the water tank 37. A water pipe 34 is provided at the output end of the water pump 36, and a rotating connecting sleeve 35 is provided at the input end of the water pipe 34. A first rotating shaft 31 and a water supply rotating shaft 33 are provided at both ends of each hollow roller 29. The water supply rotating shaft 33 passes through the side wall of the base 10 and is rotatably connected to the rotating connecting sleeve 35. A plurality of first motors 32 are provided on one side of the base 10, and the output end of the first motor 32 passes through the base 10 and is connected to the first rotating shaft 31.

[0037] Specifically, the water tank 37 is arranged directly below the hollow roller 29, so that the water used for wafer washing can be collected again into the water tank 37 to prevent waste of water resources. At the same time, the setting of the filter net 52 can filter the water flowing into the water tank 37 so that it can be reused.

[0038] The water pump 36 is a water pump with adjustable water pressure, which is an existing technology and will not be elaborated in detail in this solution. By adjusting the water pressure of the water pump 36, the water flow sprayed from the hollow roller 29 can support the wafer while not affecting the transportation of the wafer, thereby preventing the wafer from colliding with the surface of the hollow roller 29 due to the influence of gravity and causing damage to the wafer.

[0039] The rotating connecting sleeve 35 is set at the connection between the water supply shaft 33 and the water supply pipe 34. Since the water supply shaft 33 rotates in the working state, the setting of the rotating connecting sleeve 35 allows the water pump 36 to supply water to the hollow roller 29 without affecting the rotation of the water supply shaft 33.

[0040] The first motor 32 is an ordinary motor, which is a prior art and will not be elaborated in detail in this solution. The output end of the first motor 32 drives the first rotating shaft 31 to rotate, and the first rotating shaft 31 drives the hollow roller 29 to rotate.

[0041] Further, such as Figure 1 As shown, the clamping assembly includes a movable plate 19 slidably disposed between the base 10 and the first top plate 15 , and a three-jaw chuck 20 is disposed on the side of the movable plate 19 between the movable plate 19 and the first bracket 12 .

[0042] Specifically, the three-jaw chuck 20 is a common three-jaw chuck, which is a prior art and will not be elaborated in detail in this solution. When the silicon rod is clamped and cut, the axis of the silicon rod clamped by the three-jaw chuck is coaxial with the adsorber 28.

[0043] Further, such as Figure 1 As shown, a first push cylinder 18 is provided on one side of the base 10 , and an output end of the first push cylinder 18 passes through the first side plate 11 and is connected to the side wall of the movable plate 19 .

[0044] Specifically, the first push cylinder 18 is an ordinary electric push cylinder, a hydraulic push cylinder, etc., which is the existing technology and will not be elaborated in detail in this scheme. The output end of the first push cylinder 18 drives the first push cylinder 18 to move horizontally, thereby driving the silicon rod clamped on the three-jaw chuck 20 to perform horizontal cutting and feeding.

[0045] Further, such as Figure 2 As shown, the mobile adsorption assembly includes a rotary cylinder 26 slidably arranged on the lower end surface of the second top plate 16 , a rotating plate 27 is provided at the output end of the rotary cylinder 26 , and an adsorber 28 is provided on the side wall of the rotating plate 27 .

[0046] Specifically, an air pump is provided on one side of the rotating plate 27, and the air pump provides an air source for the rotating cylinder 26 and the adsorber 28. The rotating cylinder 26 is a rotating cylinder, which is a prior art and will not be elaborated in detail in this scheme. The rotation stroke of the rotating cylinder 26 is limited to a certain extent, and it rotates 90 degrees from the adsorption end of the adsorber 28 horizontally toward the three-jaw chuck 20 to vertically toward the upper top surface of the base 10.

[0047] The adsorber 28 is an adsorber. Since the surface of the wafer produced by wire cutting is smooth, the adsorber 28 can tightly adsorb one side of the wafer.

[0048] Further, such as Figure 1 and Figure 2 As shown, a screw 24 is rotatably provided in the second top plate 16, a moving block 23 is rotatably provided on the screw 24, a second push cylinder 25 is provided on the lower end surface of the moving block 23, and the output end of the second push cylinder 25 is fixedly connected to one side of the rotating cylinder 26, and a third motor 50 is provided on one side of the second bracket 13, and the output end of the third motor 50 passes through the second bracket 13 and is fixedly connected to one end of the screw 24.

[0049] Specifically, the third motor 50 is an ordinary motor, which is existing technology and will not be elaborated in detail in this solution. The output end of the third motor 50 drives the screw 24 to rotate, and the rotation of the screw 24 drives the moving block 23 to move horizontally. The horizontal movement of the moving block 23 drives the second push cylinder 25 to move horizontally.

[0050] The second push cylinder 25 is an ordinary electric push cylinder or a hydraulic push cylinder, etc., which is the existing technology and will not be elaborated in detail in this solution. The output end of the second push cylinder 25 drives the rotating cylinder 26 to move vertically, thereby driving the adsorber 28 to move vertically.

[0051] Further, such as Figure 5 、 Figure 6 and Figure 7 As shown, the transmission drying assembly includes two hollow conveying rollers 46 rotatably arranged in the base 10, the two hollow conveying rollers 46 are provided with a conveyor belt 48, each hollow conveying roller 46 is provided with a plurality of second through holes 47, and the conveyor belt 48 is provided with a plurality of third through holes 49.

[0052] Specifically, the second through hole 47 and the third through hole 49 are both hot air outlets, and the conveyor belt 48 is made of water-absorbing and breathable material. The conveyor belt 48 can absorb water on the wafer. The hot air contacts the lower bottom surface of the wafer through the second through hole 47 and the third through hole 49, and dries the water remaining on the lower bottom surface of the wafer. Without affecting the transmission of the wafer, the surface of the wafer can also be dried.

[0053] Further, such as Figure 2 and Figure 5As shown, a second rotating shaft 42 and an air supply rotating shaft 43 are respectively provided at both ends of the hollow conveying roller 46. An air supply pipe 45 is rotatably provided at the input end of the air supply rotating shaft 43. A hot air blower 44 is provided on one side of the base 10. The output end of the hot air blower 44 is connected to the air supply pipe 45. A second motor 41 is provided on the lower end surface of the base 10. The output end of the second motor 41 is connected to the second rotating shaft 42 through a belt.

[0054] Specifically, the second motor 41 is an ordinary motor, which is existing technology and will not be elaborated in detail in this solution. The output end of the second motor 41 drives the two second rotating shafts 42 to rotate, and the rotation of the second rotating shafts 42 drives the hollow conveying rollers 46 to rotate, thereby driving the conveyor belt 48 to rotate to transport the wafers.

[0055] First, the silicon rod is mounted on the three-jaw chuck 20, and the first push cylinder 18 is started for adjustment. The output end of the first push cylinder 18 drives the movable plate 19 to move horizontally, thereby driving the silicon rod to move horizontally until the distance between the cutting end of the silicon rod and the cutting line is equal to the required thickness of the wafer. Then the third motor 50 is started, and the output end of the third motor 50 drives the screw 24 to rotate. The rotation of the screw 24 drives the movable block 23 to move horizontally. The movable block 23 drives the second push cylinder 25 to move horizontally. The second push cylinder 25 drives the rotating cylinder 26 to move horizontally. The rotating cylinder 26 drives the rotating plate 27 to move horizontally. The rotating plate 27 drives the adsorber 28 to move horizontally until the adsorption end of the adsorber 28 is precisely connected to one end of the silicon rod. The air pump is started, and the air pump drives the adsorber 28 to adsorb one end of the silicon rod.

[0056] Next, the cutting assembly is started to cut the silicon rod. The cut wafer is tightly adsorbed by the absorber 28. Then the third motor 50 is started again to drive the wafer to move horizontally above the hollow roller 29. At this time, the rotating cylinder 26 is started. The output end of the rotating cylinder 26 drives the rotating plate 27 to rotate. The rotating plate 27 drives the absorber 28 to rotate. The absorber 28 drives the wafer to rotate until the output end of the absorber 28 is vertically facing the upper end surface of the base 10. Then the second push cylinder 25 is started. The output end of the second push cylinder 25 drives the rotating cylinder 26 to fall vertically. The rotating cylinder 26 drives the rotating plate 27 to fall vertically. The rotating plate 27 7 drives the adsorber 28 to fall vertically, and the adsorber 28 drives the adsorbed wafers to fall until the wafers are firmly placed on the upper end surface of the hollow roller 29. At the same time, the first motor 32 and the water pump 36 are started. The output end of the first motor 32 drives the hollow roller 29 to rotate to transport the wafers. The water pump 36 transports the water in the water tank 37 through the water pipe 34, the rotating connecting sleeve 35 and the water delivery shaft 33 to the inside of the hollow roller 29 and the water sprayer 38, and then rinses the wafers through the first through hole 30. The rinsed water falls into the water tank 37 and is filtered by the filter 52 provided on the water tank 37 for secondary use.

[0057] Finally, the wafer is transported to the conveyor belt 48 by the hollow roller 29, and the second motor 41, the hot air blower 44 and the air dryer 51 are started. The output end of the second motor 41 drives the second rotating shaft 42 to rotate through the belt, and the second rotating shaft 42 drives the hollow conveyor roller 46 to rotate, and the hollow conveyor roller 46 drives the conveyor belt 48 to rotate. While transporting the wafer, the hot air generated by the hot air blower 44 is transported to the hollow conveyor roller 46 through the air pipe 45, and then the lower end surface of the wafer is air-dried through the second through hole 47 and the third through hole 49, and the air dryer 51 air-dries the upper end surface of the wafer. Since the conveyor belt 48 absorbs too much water on the wafer, the adsorption effect will decrease, and the hot air generated by the hot air blower 44 can dry the conveyor belt 48 while drying the wafer, so that the conveyor belt 48 can always maintain a good water adsorption effect.

[0058] For example, certain words are used in the specification and claims to refer to specific components. Those skilled in the art should understand that hardware manufacturers may use different terms to refer to the same component. This specification and claims do not use differences in names as a way to distinguish components, but use differences in the functions of the components as the criteria for distinction. For example, "including" mentioned throughout the specification and claims is an open term, so it should be interpreted as "including but not limited to". "Approximately" means that within an acceptable error range, those skilled in the art can solve the technical problem within a certain error range and basically achieve the technical effect.

[0059] It should be noted that the terms "include," "comprises," or any other variations thereof are intended to encompass non-exclusive inclusion, such that a product or system comprising a series of elements includes not only those elements but also other elements not explicitly listed, or elements inherent to such product or system. In the absence of further limitations, an element defined by the phrase "comprising a..." does not exclude the presence of other identical elements in the product or system comprising the element.

[0060] The above description shows and describes several preferred embodiments of the present application. However, as previously mentioned, it should be understood that the present application is not limited to the form disclosed herein and should not be construed as excluding other embodiments. Instead, the present application can be used in various other combinations, modifications, and environments and can be modified within the scope of the application concept described herein through the above teachings or technology or knowledge in the relevant field. Modifications and changes made by those skilled in the art that do not depart from the spirit and scope of the present application should be protected by the claims appended hereto.

Claims

1. A cutting mechanism for semiconductor chip processing, comprising a base (10), wherein a first side plate (11), a first bracket (12), a second bracket (13) and a third bracket (14) are sequentially arranged on the base (10), a first top plate (15) is arranged between the first side plate (11) and the first bracket (12), a second top plate (16) is arranged between the first bracket (12) and the second bracket (13), and a third top plate (17) is arranged between the second bracket (13) and the third bracket (14), characterized in that: The lower end surface of the first top plate (15) is provided with a clamping assembly for sliding, the first bracket (12) is provided with a wire cutting assembly, the lower end surface of the second top plate (16) is provided with a movable adsorption assembly, the lower end surface of the second top plate (16) is provided with a plurality of hollow rollers (29) for rotating inside the base (10), the hollow rollers (29) are provided with a plurality of first through holes (30), and a plurality of sprinklers (38) are provided on one side of the hollow rollers (29), a transmission drying assembly is provided for rotating inside the base (10) directly below the third top plate (17), and an air dryer (51) is provided above the transmission drying assembly on the lower end surface of the third top plate (17).

2. A cutting mechanism for semiconductor chip processing according to claim 1, characterized in that: The transmission drying assembly includes two hollow conveying rollers (46) rotatably arranged in a base (10), the two hollow conveying rollers (46) are provided with a conveyor belt (48), each of the hollow conveying rollers (46) is provided with a plurality of second through holes (47), and the conveyor belt (48) is provided with a plurality of third through holes (49).

3. A semiconductor chip processing cutting mechanism according to claim 2, characterized in that: A second rotating shaft (42) and an air transmission rotating shaft (43) are respectively provided at both ends of the hollow conveying roller (46); an air transmission pipe (45) is rotatably provided at the input end of the air transmission rotating shaft (43); a hot air blower (44) is provided on one side of the base (10); and an output end of the hot air blower (44) is connected to the air transmission pipe (45).

4. A cutting mechanism for semiconductor chip processing according to claim 1, characterized in that: A water storage tank (37) is provided directly below the hollow roller (29), a filter screen (52) is provided inside the water storage tank (37), a water pump (36) is provided on one side of the water storage tank (37), a water delivery pipe (34) is provided at the output end of the water pump (36), a rotating connection sleeve (35) is provided at the input end of the water delivery pipe (34), and a first rotating shaft (31) and a water delivery rotating shaft (33) are provided at both ends of each hollow roller (29), and the water delivery rotating shaft (33) passes through the side wall of the base (10) and is rotatably connected to the rotating connection sleeve (35).

5. The cutting mechanism for semiconductor chip processing according to claim 1, characterized in that: The movable adsorption assembly comprises a rotary cylinder (26) slidably arranged on the lower end surface of the second top plate (16); a rotating plate (27) is arranged at the output end of the rotary cylinder (26); and an adsorber (28) is arranged on the side wall of the rotating plate (27).

6. A cutting mechanism for semiconductor chip processing according to claim 5, characterized in that: A screw rod (24) is rotatably provided in the second top plate (16), a moving block (23) is rotatably provided on the screw rod (24), a second push cylinder (25) is provided on the lower end surface of the moving block (23), and an output end of the second push cylinder (25) is fixedly connected to one side of a rotary cylinder (26).

7. A cutting mechanism for semiconductor chip processing according to claim 1, characterized in that: The clamping assembly comprises a movable plate (19) slidably arranged between the base (10) and the first top plate (15), and a three-jaw chuck (20) is arranged on the side of the movable plate (19) between the movable plate (19) and the first bracket (12).

8. A cutting mechanism for semiconductor chip processing according to claim 7, characterized in that: A first push cylinder (18) is provided on one side of the base (10), and an output end of the first push cylinder (18) passes through the first side plate (11) and is connected to the side wall of the movable plate (19).

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