Target material cooling back plate of magnetron sputtering coating equipment

Abstract

The utility model discloses a target material cooling back plate of magnetron sputtering coating equipment, which comprises a cooling back plate body, the top of the cooling back plate body is fixedly connected with a target plate body, the top of the cooling back plate body is provided with a locking assembly, the locking assembly is used for locking the target plate body, and the cooling back plate body is internally provided with a cooling groove. The target plate body is firmly locked at the top of the cooling back plate body through the locking assembly, so that the temperature of the target plate body is conducted to the cooling back plate body more efficiently, when the target plate body carries out sputtering work, a water pump in the water storage tank conveys cooling water into the circulating cooling pipe through a water supply pipe, and the cooling water is cooled through the circulating cooling pipe. And the heated cooling water flows back to the water storage tank through the water return pipe, so that the target plate body is effectively cooled, the cooling effect of the cooling back plate is improved, the service life of the target plate is prolonged, and the efficiency and quality of magnetron sputtering coating are further improved.

Description

Technical Field

[0001] The utility model relates to the technical field of magnetron sputtering coating equipment, and particularly relates to a target cooling back plate of a magnetron sputtering coating equipment. Background Technique

[0002] The magnetron sputtering coating equipment is a physical vapor deposition (PVD) technology widely used in the preparation of thin film materials. This equipment uses a magnetic field to enhance the ionization process, thereby improving the deposition rate of materials and the quality of the film layer. The target cooling back plate is an important part of the magnetron sputtering coating equipment, mainly used to prevent the target from overheating due to continuous high-energy particle bombardment during the sputtering process. The design and function of the cooling back plate are crucial for maintaining the performance of the target and extending the service life of the equipment.

[0003] In the existing magnetron sputtering coating equipment, the target and the back plate are usually connected by welding. However, during the welding process, the positions of the target and the back plate are prone to shift, which may lead to a reduction in the coating quality in the later stage. Secondly, welding makes the replacement and maintenance of the target inconvenient. At the same time, the cooling effect of the traditional back plate is relatively low, and it cannot effectively extend the service life of the target. For this reason, we propose a target cooling back plate of a magnetron sputtering coating equipment. Content of the Utility Model

[0004] The purpose of the utility model is to provide a target cooling back plate of a magnetron sputtering coating equipment to solve the problems raised in the above background technique.

[0005] To achieve the above purpose, the utility model provides the following technical solution: A target cooling back plate of a magnetron sputtering coating equipment, including a cooling back plate body. A target plate body is fixedly connected to the top of the cooling back plate body. A locking component is arranged on the top of the cooling back plate body, and the locking component is used to lock the target plate body. A cooling groove is opened inside the cooling back plate body, and a circulating cooling pipe is fixedly connected between the inner walls of the cooling groove. A water storage tank is fixedly connected to the bottom of the cooling back plate body, and a water inlet is opened on one side of the water storage tank, and the water inlet penetrates through the inside of the water storage tank.

[0006] As a further preferred technical solution of the above, the locking component includes two card slots, and the two card slots are respectively opened on both sides of the target plate body. Two lock boxes are fixedly connected to the top of the cooling back plate body, and a limiting plate is slidably connected between the inner walls of the two lock boxes. A return spring is fixedly connected between one side of each of the two limiting plates and the inner side of each of the two lock boxes.

[0007] As a further preference of the technical solution, connecting rods are fixedly connected to one side of each of the two limiting plates. One ends of the two connecting rods respectively extend to the outside of the two lock boxes. Pull rods are fixedly connected to the outside of the extending ends of the two connecting rods. Blocks are fixedly connected to one sides of the two limiting plates respectively away from the two connecting rods. The two blocks are respectively slidably connected between the inner walls of the two lock boxes and the two card slots.

[0008] As a further preference of the technical solution, a return water pipe and a water supply pipe are fixedly connected between one side of the water storage tank and the bottom of the cooling backplane body. One ends of the return water pipe and the water supply pipe respectively extend into the cooling tank and are fixedly connected to both ends of the circulating cooling pipe. The ends of the return water pipe and the water supply pipe away from the cooling backplane body respectively extend into the interior of the water storage tank.

[0009] As a further preference of the technical solution, a water pump is fixedly installed between the inner walls of the water storage tank. The output end of the water pump is fixedly connected to the extending end of the water supply pipe.

[0010] As a further preference of the technical solution, two fixing brackets are fixedly connected to the bottom of the cooling backplane body and on both sides of the water storage tank.

[0011] As a further preference of the technical solution, two positioning holes are fixedly connected to the top of each of the two fixing brackets. The four positioning holes respectively penetrate through the two fixing brackets.

[0012] The utility model provides a target cooling backplane of a magnetron sputtering coating device, which has the following beneficial effects:

[0013] (1) In the utility model, the target plate body is firmly locked on the top of the cooling backplane body through the locking component, so that the temperature of the target plate body is more efficiently conducted to the cooling backplane body. When the target plate body is sputtering, the water pump in the water storage tank transports the cooling water into the interior of the circulating cooling pipe through the water supply pipe. The heated cooling water then flows back to the water storage tank through the return water pipe, thereby effectively cooling the target plate body, further improving the cooling effect of the cooling backplane, prolonging the service life of the target plate, and further enhancing the efficiency and quality of magnetron sputtering coating.

[0014] (2) In the utility model, the cooling backplane body is accurately positioned through the positioning holes, and through the connection of the two fixing brackets inside the magnetron sputtering coating device, the installation of the cooling backplane is facilitated, thereby improving the installation convenience of the cooling backplane, and at the same time enhancing the coating quality of the magnetron sputtering coating device. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a three-dimensional structural schematic diagram of the utility model;

[0016] Figure 2 Schematic diagram of the internal structure of the water storage tank of the present utility model;

[0017] Figure 3 Schematic diagram of the internal structure of the cooling tank of the present utility model;

[0018] Figure 4 Schematic diagram of the structure of the target plate body of the present utility model;

[0019] Figure 5 Schematic diagram of the structure at location A of the present utility model;

[0020] In the figure: 1, cooling backplane body; 2, target plate body; 3, fixing bracket; 4, positioning hole; 5, water storage tank; 6, water inlet; 7, return pipe; 8, lock box; 9, pull rod; 10, water pump; 11, cooling tank; 12, circulating cooling pipe; 13, clamping block; 14, water supply pipe; 15, clamping groove; 16, connecting rod; 17, return spring; 18, limiting plate. Specific embodiments

[0021] Next, the technical solutions in the embodiments of the present utility model will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present utility model.

[0022] The present utility model provides a technical solution: As Figures 1 - 5 shown, in this embodiment, a target cooling backplane of a magnetron sputtering coating device includes a cooling backplane body 1. A target plate body 2 is fixedly connected to the top of the cooling backplane body 1. A locking component is arranged on the top of the cooling backplane body 1 for locking the target plate body 2. A cooling tank 11 is opened inside the cooling backplane body 1. A circulating cooling pipe 12 is fixedly connected between the inner walls of the cooling tank 11. A water storage tank 5 is fixedly connected to the bottom of the cooling backplane body 1. A water inlet 6 is opened on one side of the water storage tank 5, and the water inlet 6 penetrates through to the inside of the water storage tank 5. A return pipe 7 and a water supply pipe 14 are fixedly connected between one side of the water storage tank 5 and the bottom of the cooling backplane body 1. One ends of the return pipe 7 and the water supply pipe 14 both extend into the cooling tank 11 and are respectively fixedly connected to both ends of the circulating cooling pipe 12. The ends of the return pipe 7 and the water supply pipe 14 far from the cooling backplane body 1 both extend into the inside of the water storage tank 5. A water pump 10 is fixedly installed between the inner walls of the water storage tank 5. The output end of the water pump 10 is fixedly connected to the extended end of the water supply pipe 14. Two fixing brackets 3 are fixedly connected to the bottom of the cooling backplane body 1 and on both sides of the water storage tank 5. Two positioning holes 4 are fixedly connected to the tops of the two fixing brackets 3, and the four positioning holes 4 respectively penetrate through the two fixing brackets 3.

[0023] When coating with a magnetron sputtering coating device, first, the cooling backplane body 1 is accurately positioned inside the coating device through the positioning function of four positioning holes 4. Then, the cooling backplane body 1 is accurately installed inside the coating device through two fixing brackets 3. Next, the target plate body 2 is locked on the top of the cooling backplane body 1 through a locking component, so that the target plate body 2 is closely fitted with the cooling backplane body 1. When the target plate body 2 is performing sputtering work, the cooling water inside the water storage tank 5 is conveyed along the water supply pipe 14 to the inside of the circulating cooling pipe 12 inside the cooling tank 11 by a water pump 10. Then, the heated cooling water flows back to the inside of the water storage tank 5 through the water return pipe 7, so as to achieve the effect of circulating cooling. At the same time, the cooling water is conveyed to the inside of the water storage tank 5 through the water inlet 6, thus ensuring the continuous cooling of the target plate body 2 by the cooling backplane body 1, and further improving the cooling efficiency of the cooling backplane and the coating quality of the coating device.

[0024] As Figures 1 - 5 shown, the locking component includes two card slots 15 which are respectively opened on both sides of the target plate body 2. Two lock boxes 8 are fixedly connected to the top of the cooling backplane body 1. A limiting plate 18 is slidably connected between the inner walls of the two lock boxes 8. A return spring 17 is fixedly connected between one side of each of the two limiting plates 18 and the inner side of each of the two lock boxes 8. A connecting rod 16 is fixedly connected to one side of each of the two limiting plates 18. One end of each of the two connecting rods 16 extends to the outside of each of the two lock boxes 8. A pull rod 9 is fixedly connected to the outside of the extended end of each of the two connecting rods 16. A clamping block 13 is fixedly connected to one side of each of the two limiting plates 18 away from each of the two connecting rods 16. The two clamping blocks 13 are respectively slidably connected between the inner walls of the two lock boxes 8 and the two card slots 15.

[0025] By manually moving the two pull rods 9, the two connecting rods 16 are respectively slid between the inner walls of the two lock boxes 8, so that the two limiting plates 18 respectively exert pressure on or release the two return springs 17, and the two clamping blocks 13 respectively slide between the inner walls of the two lock boxes 8 and the two card slots 15, thus improving the convenience of target plate maintenance and replacement.

[0026] The utility model provides a target cooling backplane for a magnetron sputtering coating device, and the specific working principle is as follows: When the magnetron sputtering coating device is coating, first, the cooling backplane body 1 is accurately positioned inside the coating device through the positioning function of four positioning holes 4. Then, the cooling backplane body 1 is accurately installed inside the coating device through two fixing brackets 3. Next, an operator moves two pull rods 9 manually, thereby driving two connecting rods 16 to slide respectively between the inner walls of two lock boxes 8, so that two limiting plates 18 respectively exert pressure on or release two return springs 17, and two latch blocks 13 slide between the inner walls of two lock boxes 8 and two clamping grooves 15 respectively, thereby locking the target plate body 2 on the top of the cooling backplane body 1, making the target plate body 2 closely fit with the cooling backplane body 1. When the target plate body 2 is sputtering, the cooling water inside the water storage tank 5 is conveyed along the water supply pipe 14 to the inside of the circulating cooling pipe 12 inside the cooling tank 11 through a water pump 10. Then, the heated cooling water flows back to the inside of the water storage tank 5 through the water return pipe 7, thereby achieving the effect of circulating cooling. At the same time, the cooling water is conveyed to the inside of the water storage tank 5 through the water inlet 6, thereby ensuring the continuous cooling of the target plate body 2 by the cooling backplane body 1.

[0027] Although the embodiments of the present utility model have been shown and described, for those of ordinary skill in the art, it can be understood that various changes, modifications, substitutions, and variations can be made to these embodiments without departing from the principle and spirit of the present utility model. The scope of the present utility model is defined by the appended claims and their equivalents.

Claims

1. A target material cooling back plate for a magnetron sputtering coating device, comprising a cooling back plate body (1), characterized in that: The top of the cooling back plate body (1) is fixedly connected to the target plate body (2); a locking assembly is provided on the top of the cooling back plate body (1); the locking assembly is used to lock the target plate body (2); a cooling groove (11) is provided inside the cooling back plate body (1); a circulating cooling pipe (12) is fixedly connected between the inner walls of the cooling groove (11); the bottom of the cooling back plate body (1) is fixedly connected to a water storage tank (5); a water inlet (6) is provided on one side of the water storage tank (5); and the water inlet (6) is communicated with the interior of the water storage tank (5).

2. The target cooling back plate of the magnetron sputtering coating equipment according to claim 1, characterized in that: The locking assembly comprises two card slots (15), the two card slots (15) are respectively opened on both sides of the target plate body (2), the top of the cooling back plate body (1) is fixedly connected to two lock boxes (8), the inner walls of the two lock boxes (8) are slidably connected to a limit plate (18), and one side of the two limit plates (18) is fixedly connected to the inner sides of the two lock boxes (8) with a return spring (17).

3. The target cooling back plate of the magnetron sputtering coating equipment according to claim 2, characterized in that: One side of the two limit plates (18) is fixedly connected to a connecting rod (16), one end of the two connecting rods (16) extends to the outside of the two lock boxes (8), and the outside of the extended ends of the two connecting rods (16) is fixedly connected to a pull rod (9). The two limit plates (18) are fixedly connected to a card block (13) on one side away from the two connecting rods (16), and the two card blocks (13) are slidably connected between the inner walls of the two lock boxes (8) and the two card slots (15).

4. The target cooling back plate of the magnetron sputtering coating equipment according to claim 1, characterized in that: A return water pipe (7) and a water supply pipe (14) are fixedly connected between one side of the water storage tank (5) and the bottom of the cooling back plate body (1); one end of the return water pipe (7) and the water supply pipe (14) extend to the interior of the cooling trough (11) and are fixedly connected to the two ends of the circulating cooling pipe (12) respectively; one end of the return water pipe (7) and the water supply pipe (14) away from the cooling back plate body (1) extend to the interior of the water storage tank (5).

5. The target cooling back plate of the magnetron sputtering coating equipment according to claim 4, characterized in that: A water pump (10) is fixedly installed between the inner walls of the water storage tank (5), and the output end of the water pump (10) is fixedly connected to the extended end of the water supply pipe (14).

6. The target cooling back plate of the magnetron sputtering coating equipment according to claim 1, characterized in that: Two fixing brackets (3) are fixedly connected to the bottom of the cooling back plate body (1) and located on both sides of the water storage tank (5).

7. The target cooling back plate of the magnetron sputtering coating equipment according to claim 6, characterized in that: The tops of the two fixing brackets (3) are fixedly connected with two positioning holes (4), and the four positioning holes (4) respectively pass through the two fixing brackets (3).

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