Drying device for silicon wafers
Through the design of clamping components and drivers, the problems of large contact area and no air circulation in the silicon wafer drying device are solved, and a more efficient silicon wafer drying effect is achieved.
Patent Information
- Application Number
- CN202422441476.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-10-10
- Publication Date
- 2025-08-05
- Estimated Expiration
- 2034-10-10
AI Technical Summary
In existing silicon wafer drying devices, the fixed structure has a large contact area between the silicon wafer, resulting in low drying efficiency and no air in the equipment, affecting the drying effect.
The clamping assembly is adopted to include fixtures, support members and clamping parts. The driver is used to drive the fixtures to rotate, drive the silicon wafer to rotate, and swing the water droplets through centrifugal force, while enhancing the gas flow in the box and reducing the contact area between the clamping assembly and the silicon wafer.
The drying efficiency of silicon wafers is improved, and faster drying effect is achieved by reducing contact area and enhancing gas flow.
Smart Images
Figure CN223192022U_ABST
Abstract
Description
Technical Field
[0001] The utility model belongs to the technical field of silicon wafer drying, and particularly relates to a drying device for silicon wafers. Background Art
[0002] Monocrystalline silicon wafers, a fundamental material for photovoltaic power generation, enjoy widespread market demand. After scratching and cleaning, silicon wafers need to be dried before proceeding to the next step. Currently, this drying process typically involves securing the wafers with a fixed structure and placing them in a drying machine. However, this method creates a large contact area between the fixed structure and the wafer, making it difficult to dry the wafer. Furthermore, the lack of air circulation within the drying machine results in low drying efficiency. Utility Model Content
[0003] The embodiment of the utility model provides a drying device for silicon wafers to solve the technical problem of low silicon wafer drying efficiency in the prior art.
[0004] To achieve the above-mentioned purpose, the technical solution adopted by the present invention is to provide a drying device for silicon wafers, comprising:
[0005] A drying box with a dryer installed inside;
[0006] The clamping assembly is provided in the drying box body; the clamping assembly includes a fixing member, a support member and two clamping members; the fixing member is installed on the inner wall of the drying box body and is rotatably connected to the drying box body; the support member is fixed on the fixing member, and the support member is provided with a mounting groove for limiting the mounting position of the silicon wafer; the two clamping members are fixed on the fixing member and are located above the support member, the two clamping members are arranged at intervals, and a receiving cavity for accommodating the silicon wafer is formed between the two clamping members and the support member; the two clamping members have the freedom to rotate along the circumference of the silicon wafer to clamp or release the silicon wafer; the fixing member is provided with a limit member for controlling the rotation of the two clamping members;
[0007] The driver is arranged in the drying box body and is transmission-connected with the fixing member for driving the fixing member to rotate.
[0008] In one possible implementation, the clamping member includes a first rotating gear, a clamping rod and a first connecting rod; the first rotating gear is installed at one end of the fixing member away from the drying box body, and is rotatably connected to the fixing member, and the first rotating gears of the two clamping members are meshed and connected; a plurality of the mounting grooves are arranged in parallel and spaced apart on the clamping rod; the two ends of the first connecting rod are respectively fixedly connected to the first rotating gear and the clamping rod.
[0009] In one possible implementation, a fixing plate is provided at one end of the clamping rod away from the fixing member; both clamping rods are slidingly connected to the fixing plate; the support member is fixedly connected to the fixing plate; and the free end of the driver is transmission-connected to the fixing plate.
[0010] In one possible implementation, a second rotating gear is provided at one end of the fixed plate close to the clamping rod, the second rotating gear is rotatably connected to the fixed plate, and a second connecting rod fixedly connected to the clamping rod is fixed on the second rotating gear; the second rotating gears of the two clamping members are meshed and connected.
[0011] In one possible implementation, the limiting member is provided with a limiting hole, and the fixing member passes through the limiting hole, and a plurality of limiting teeth engaging with the first rotating gear are provided on the inner wall of the limiting hole; the limiting member has the freedom to move along the length direction of the fixing member and engage with the two first rotating gears.
[0012] In a possible implementation, a limiting flange slidably connected to the fixing member is provided in the limiting hole.
[0013] In a possible implementation, the support member includes two fixing rods and a support rod, and the two fixing rods are respectively fixed on the fixing member and the fixing plate; the limiting member is located between the fixing rod and the first rotating gear; and the two ends of the support rod are respectively fixedly connected to the two fixing rods.
[0014] In a possible implementation, the support rod is provided with limiting grooves corresponding one-to-one to the plurality of mounting grooves.
[0015] In a possible implementation, an adsorption plate for adsorbing water droplets is provided on the inner wall of the drying box.
[0016] In a possible implementation, the drying box is provided with a material taking opening and a cover for opening or closing the material taking opening.
[0017] The beneficial effect of the silicon wafer drying device provided by the utility model is that, compared with the prior art, the silicon wafer drying device of the utility model, when in use, because the fixing part is installed on the inner wall of the drying box body, and the support part fixed on the fixing part is located below the two clamping parts, at the same time, the support part is provided with a mounting groove for limiting the mounting position of the silicon wafer, and the two clamping parts fixed on the fixing part have the freedom to rotate along the circumference of the silicon wafer to clamp or loosen the silicon wafer, so after the silicon wafer is installed in the mounting groove, the two clamping parts are controlled to rotate in the same direction, thereby making the two clamping rods and the support rod clamp the silicon wafer; because the fixing part is provided with a limiter for controlling the rotation of the two clamping parts, after the silicon wafer is fixed, the two clamping rods are fixed by using the limiter to prevent the clamping rods from rotating. The silicon wafer is then completely fixed; the silicon wafer is fixed by the support and the two clamping members, thereby reducing the contact area between the clamping assembly and the silicon wafer, thereby drying the silicon wafer faster; since the fixing member is rotatably connected to the inner wall of the drying box, and the driver is transmission-connected to the fixing member, when the silicon wafer is dried, the driver is used to drive the fixing member to rotate, thereby driving the silicon wafer to rotate, which not only can use centrifugal force to throw away water droplets attached to the silicon wafer, but also can make the gas inside the drying box flow, thereby drying the silicon wafer faster; in this way, the silicon wafer is fixed with the help of the support and the two clamping members, reducing the contact area between the clamping assembly and the silicon wafer, and at the same time, the driver is used to drive the fixing member to rotate, and drive the silicon wafer to rotate, thereby making the gas inside the drying box flow, thereby drying the silicon wafer faster. BRIEF DESCRIPTION OF THE DRAWINGS
[0018] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.
[0019] Figure 1 Schematic diagram of the connection between the drying device and the silicon wafer provided in the embodiment of the utility model Figure 1 ;
[0020] Figure 2 Schematic diagram of the connection between the drying device and the silicon wafer provided in the embodiment of the utility model Figure 2 ;
[0021] Figure 3 The structure of the drying device provided by the embodiment of the utility model is schematically shown. Figure 1 ;
[0022] Figure 4 The structure of the drying device provided by the embodiment of the utility model is schematically shown. Figure 2 ;
[0023] Figure 5 The structure of the drying device provided by the embodiment of the utility model is schematically shown. Figure 3 ;
[0024] Figure 6 A schematic diagram of the structure of the clamping assembly provided in the embodiment of the utility model Figure 1 ;
[0025] Figure 7 A schematic diagram of the structure of the clamping assembly provided in the embodiment of the utility model Figure 2 .
[0026] Among them, the reference numerals in the figures are:
[0027] 1. Drying box; 11. Material taking port; 12. Cover plate; 13. Adsorption plate; 2. Clamping assembly; 21. Fixing member; 22. Support member; 221. Fixing rod; 222. Support rod; 223. Limiting groove; 23. Clamping member; 231. First rotating gear; 232. Clamping rod; 233. First connecting rod; 234. Mounting groove; 24. Fixing plate; 241. Second rotating gear; 242. Second connecting rod; 25. Limiting member; 251. Limiting hole; 252. Limiting tooth; 253. Limiting flange; 3. Driver; 4. Dryer; 5. Silicon wafer. DETAILED DESCRIPTION
[0028] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.
[0029] It should be noted that when an element is referred to as being “fixed on” or “disposed on” another element, it may be directly on the other element or indirectly on the other element. When an element is referred to as being “connected to” another element, it may be directly connected to the other element or indirectly connected to the other element.
[0030] It should be understood that the terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.
[0031] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being referred to. Thus, a feature specified as "first" or "second" may explicitly or implicitly include one or more of such features. In the description of this utility model, "plurality" means two or more, unless otherwise specifically defined.
[0032] See also Figures 1 to 7 The silicon wafer drying device provided by the present invention is now described. A silicon wafer drying device includes a drying box 1, a clamping assembly 2, and a driver 3. A dryer 4 is installed inside the drying box 1. The clamping assembly 2 is disposed within the drying box 1. The clamping assembly 2 includes a fixing member 21, a support member 22, and two clamping members 23. The fixing member 21 is mounted on the inner wall of the drying box 1 and is rotatably connected to the drying box 1. The support member 22 is fixed to the fixing member 21 and is provided with a mounting groove 234 for limiting the mounting position of the silicon wafer 5. Two clamping members 23 are fixed on the fixing member 21 and are located above the supporting member 22. The two clamping members 23 are arranged at intervals and form a accommodating cavity for accommodating the silicon wafer 5 between them and the supporting member 22; the two clamping members 23 have the freedom to rotate circumferentially along the silicon wafer 5 to clamp or release the silicon wafer 5; a limiting member 25 for controlling the rotation of the two clamping members 23 is provided on the fixing member 21; the driver 3 is arranged in the drying box body 1 and is transmission-connected to the fixing member 21 for driving the fixing member 21 to rotate.
[0033] The silicon wafer drying device provided in this embodiment is different from the prior art. When in use, the silicon wafer drying device of the present invention has the following advantages: since the fixing member 21 is installed on the inner wall of the drying box 1, and the support member 22 fixed on the fixing member 21 is located below the two clamping members 23, and the support member 22 is provided with a mounting groove 234 for limiting the mounting position of the silicon wafer 5, and the two clamping members 23 fixed on the fixing member 21 have the freedom to rotate along the circumference of the silicon wafer 5 to clamp or release the silicon wafer 5. Therefore, after the silicon wafer 5 is installed in the mounting groove 234, the two clamping members 23 are controlled to rotate in the same direction, so that the two clamping rods 232 and the support rod 222 clamp the silicon wafer 5; since the fixing member 21 is provided with a limiting member 25 for controlling the rotation of the two clamping members 23, after the silicon wafer 5 is fixed, the limiting member 25 is used to fix the two clamping rods 232 to prevent the clamping rods 232 from rotating The support 22 and the two clamping members 23 are used to fix the silicon wafer 5, thereby reducing the contact area between the clamping assembly 2 and the silicon wafer 5, thereby drying the silicon wafer 5 faster. Since the fixing member 21 is rotatably connected to the inner wall of the drying box 1, and the driver 3 is transmission-connected to the fixing member 21, when the silicon wafer 5 is dried, the driver 3 is used to drive the fixing member 21 to rotate, thereby driving the silicon wafer 5 to rotate, which can not only use centrifugal force to throw away water droplets attached to the silicon wafer 5, but also enable the air inside the drying box 1 to flow, thereby drying the silicon wafer 5 faster. In this way, the silicon wafer 5 is fixed with the support 22 and the two clamping members 23, reducing the contact area between the clamping assembly 2 and the silicon wafer 5, and at the same time using the driver 3 to drive the fixing member 21 to rotate, and drive the silicon wafer 5 to rotate, thereby enabling the air inside the drying box 1 to flow, thereby drying the silicon wafer 5 faster.
[0034] See also Figures 1 to 4 As a specific embodiment of the silicon wafer drying device provided by the present invention, the clamping member 23 includes a first rotating gear 231, a clamping rod 232 and a first connecting rod 233; the first rotating gear 231 is installed at the end of the fixing member 21 away from the drying box 1 and is rotatably connected to the fixing member 21, and the first rotating gears 231 of the two clamping members 23 are meshed and connected; a plurality of mounting grooves 234 are arranged in parallel and spaced on the clamping rod 232; the two ends of the first connecting rod 233 are fixedly connected to the first rotating gear 231 and the clamping rod 232 respectively; the driving clamping When the part 23 rotates to clamp or release the silicon wafer 5, it directly pushes the clamping rod 232 to rotate. The rotation of the clamping rod 232 drives the first connecting rod 233 to rotate, and the first connecting rod 233 drives the first rotating gear 231 to rotate. Since the first rotating gears 231 of the two clamping parts 23 are engaged and connected, the first rotating gear 231 of the other clamping part 23 rotates in the opposite direction, thereby driving the other first connecting rod 233 and the other clamping rod 232 to rotate, so that the two clamping rods 232 rotate in the same or opposite directions, thereby clamping or releasing the silicon wafer 5.
[0035] See also Figures 3 to 5 As a specific embodiment of the silicon wafer drying device provided by the utility model, the clamping rod 232 is provided with a fixing plate 24 at the end away from the fixing part 21; the two clamping rods 232 are slidably connected to the fixing plate 24; the support member 22 is fixedly connected to the fixing plate 24; the free end of the driver 3 is transmission-connected to the fixing plate 24; a fixing plate 24 is provided at the end of the clamping rod 232 away from the fixing part 21, so that the structure of the entire clamping assembly 2 is more compact and stable; the clamping rod 232 is set to be slidably connected to the fixing plate 24, so that the clamping rod 232 can rotate circumferentially along the silicon wafer 5; the free end of the driver 3 is transmission-connected to the fixing plate 24, so that the driver 3 can drive the clamping assembly 2 and the silicon wafer 5 to rotate; the driver 3 is a motor; and the fixing part 21 is a round rod.
[0036] See also Figures 3 to 5 As a specific embodiment of the silicon wafer drying device provided by the utility model, a second rotating gear 241 is provided at one end of the fixing plate 24 close to the clamping rod 232, and the second rotating gear 241 is rotatably connected to the fixing plate 24. A second connecting rod 242 fixedly connected to the clamping rod 232 is fixed on the second rotating gear 241; the second rotating gears 241 of the two clamping members 23 are meshed and connected; with the help of the second rotating gear 241 and the second connecting rod 242 on the fixing plate 24, not only the rotation of the clamping rod 232 is smoother, but also the overall structure of the clamping assembly 2 is made more reliable and firm.
[0037] See also Figure 3 、 Figure 6 and Figure 7 As a specific embodiment of the silicon wafer drying device provided by the present invention, the limiting member 25 is provided with a limiting hole 251, and the fixing member 21 passes through the limiting hole 251. The inner wall of the limiting hole 251 is provided with a plurality of limiting teeth 252 that engage with the first rotating gear 231; the limiting member 25 has the freedom to move along the length direction of the fixing member 21 and engage with the two first rotating gears 231; when controlling the rotation of the clamping member 23, the limiting member 25 is moved on the fixing member 21 with the help of the limiting hole 251, and the plurality of limiting teeth 252 in the limiting hole 251 engage with the two first rotating gears 231, thereby limiting the rotation of the two first rotating gears 231, thereby controlling the rotation of the clamping member 23.
[0038] See also Figure 6 and Figure 7 As a specific embodiment of the silicon wafer drying device provided by the present invention, a limiting flange 253 is provided in the limiting hole 251 and is slidably connected to the fixing member 21; with the help of the limiting flange 253 slidably connected to the fixing member 21, the movement of the limiting member 25 can be smoother.
[0039] See also Figure 4 and Figure 5 As a specific embodiment of the silicon wafer drying device provided by the present invention, the support member 22 includes two fixing rods 221 and a support rod 222. The two fixing rods 221 are respectively fixed on the fixing member 21 and the fixing plate 24; the limit member 25 is located between the fixing rod 221 and the first rotating gear 231; the two ends of the support rod 222 are respectively fixedly connected to the two fixing rods 221; the support rod 222 is fixed by means of the two fixing rods 221, and the support rod 222 is located under the two clamping rods 232, thereby supporting and fixing the silicon wafer 5.
[0040] See also Figure 3 and Figure 4 As a specific embodiment of the silicon wafer drying device provided by the present invention, the support rod 222 is provided with a limiting groove 223 corresponding to the multiple mounting grooves 234; with the help of the multiple limiting grooves 223 on the support rod 222, the fixing effect of the silicon wafer 5 can be better.
[0041] See also Figures 1 to 4 As a specific embodiment of the silicon wafer drying device provided by the utility model, an adsorption plate 13 for absorbing water droplets is provided on the inner wall of the drying box 1; when the driver 3 drives the clamping assembly 2 to rotate and drives the silicon wafer 5 to rotate, the silicon wafer 5 uses centrifugal force to throw away the water droplets attached to the silicon wafer 5. Therefore, the adsorption plate 13 is used to absorb the thrown water droplets, preventing the water droplets from being thrown above the silicon wafer 5 and then falling onto the silicon wafer 5.
[0042] See also Figure 1 and Figure 2 As a specific embodiment of the silicon wafer drying device provided by the utility model, a feeding port 11 and a cover 12 for opening or closing the feeding port 11 are provided on the drying box 1; the feeding port 11 is used to facilitate taking out the silicon wafer 5; the cover 12 for closing or opening the feeding port 11 is used to close the drying box 1 to prevent heat escape.
[0043] The above are only preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent replacements and improvements made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.
Claims
1. A drying device for silicon wafers, characterized in that: include: A drying box with a dryer installed inside; The clamping assembly is provided in the drying box body; the clamping assembly includes a fixing member, a support member and two clamping members; the fixing member is installed on the inner wall of the drying box body and is rotatably connected to the drying box body; the support member is fixed on the fixing member, and the support member is provided with a mounting groove for limiting the mounting position of the silicon wafer; the two clamping members are fixed on the fixing member and are located above the support member, the two clamping members are arranged at intervals, and a receiving cavity for accommodating the silicon wafer is formed between the two clamping members and the support member; the two clamping members have the freedom to rotate along the circumference of the silicon wafer to clamp or release the silicon wafer; the fixing member is provided with a limit member for controlling the rotation of the two clamping members; The driver is arranged in the drying box body and is transmission-connected with the fixing member for driving the fixing member to rotate.
2. A silicon wafer drying device according to claim 1, characterized in that: The clamping member includes a first rotating gear, a clamping rod and a first connecting rod; the first rotating gear is installed at one end of the fixing member away from the drying box body, and is rotatably connected to the fixing member, and the first rotating gears of the two clamping members are meshed and connected; a plurality of the mounting grooves are arranged in parallel and spaced apart on the clamping rod; the two ends of the first connecting rod are fixedly connected to the first rotating gear and the clamping rod respectively.
3. A silicon wafer drying device according to claim 2, characterized in that: A fixing plate is provided at one end of the clamping rod away from the fixing member; both the clamping rods are slidably connected to the fixing plate; the support member is fixedly connected to the fixing plate; and the free end of the driver is transmission-connected to the fixing plate.
4. A silicon wafer drying device according to claim 3, characterized in that: A second rotating gear is provided at one end of the fixing plate close to the clamping rod, the second rotating gear is rotatably connected to the fixing plate, and a second connecting rod fixedly connected to the clamping rod is fixed on the second rotating gear; the second rotating gears of the two clamping members are meshed and connected.
5. The silicon wafer drying device according to claim 2, wherein: The limiting member is provided with a limiting hole, and the fixing member passes through the limiting hole. The inner wall of the limiting hole is provided with a plurality of limiting teeth engaged with the first rotating gear; the limiting member has the freedom to move along the length direction of the fixing member and engage with the two first rotating gears.
6. A silicon wafer drying device according to claim 5, characterized in that: A limiting flange is provided in the limiting hole and is slidably connected to the fixing piece.
7. The silicon wafer drying device according to claim 3, wherein: The support member includes two fixing rods and a support rod, and the two fixing rods are respectively fixed on the fixing member and the fixing plate; the limiting member is located between the fixing rod and the first rotating gear; and the two ends of the support rod are respectively fixedly connected to the two fixing rods.
8. The silicon wafer drying device according to claim 7, wherein: The support rod is provided with limiting grooves corresponding to the plurality of mounting grooves one by one.
9. The silicon wafer drying device according to claim 1, wherein: An adsorption plate for adsorbing water droplets is provided on the inner wall of the drying box.
10. The silicon wafer drying device according to claim 1, wherein: The drying box body is provided with a material taking opening and a cover plate for opening or closing the material taking opening.