High-temperature-resistant probe card

Abstract

The utility model discloses a high-temperature-resistant probe card, which belongs to the technical field of probe cards and comprises a circuit board electrically connected with a plurality of electric appliance components. The first reinforcer is arranged on one side of the circuit board in the thickness direction; the second reinforcer is arranged on one side, deviating from the circuit board, of the first reinforcer; the plurality of probes are respectively arranged on the other side of the circuit board in the thickness direction; wherein the first reinforcer is matched with the second reinforcer so as to reinforce the structural strength of the circuit board. According to the probe card designed by the utility model, the first reinforcer is matched with the second reinforcer, so that the deformation of the circuit board at high temperature is effectively reduced, the position accuracy of the tip part of the probe is ensured, the problems of scratch and displacement are avoided, and the accuracy and reliability of wafer testing are improved.

Description

Technical Field

[0001] The utility model belongs to the technical field of probe cards, and in particular relates to a high-temperature resistant probe card. Background Art

[0002] In the related art, probe cards are widely used in wafer-level testing as an important testing tool during the production process of semiconductor devices. The main function of the probe card is to establish an electrical connection with the pads or pins of the chip to be tested during the wafer testing process to evaluate the function and performance of the chip. However, in a high-temperature testing environment, the probe card is easily affected by thermal stress. In particular, the circuit board of the probe card may be deformed due to high temperature, resulting in scratches and displacement problems on the probe tip, thereby affecting the accuracy and reliability of the test. Utility Model Content

[0003] The present invention aims to address at least one of the technical problems existing in the prior art. To this end, one objective of the present invention is to provide a high-temperature-resistant probe card. In the high-temperature-resistant probe card designed in this invention, the first and second reinforcement members cooperate to effectively reduce deformation of the circuit board at high temperatures, thereby ensuring the positional accuracy of the probe tip, avoiding problems such as scratches and misalignment, and improving the accuracy and reliability of wafer testing.

[0004] In order to achieve the above-mentioned purpose, the present invention provides the following technical solutions:

[0005] The utility model provides a high-temperature resistant probe card, comprising: a circuit board, on which a plurality of electrical components are electrically connected; a first reinforcement member, which is arranged on one side of the circuit board in the thickness direction; a second reinforcement member, which is arranged on the side of the first reinforcement away from the circuit board; and a plurality of probes, which are respectively arranged on the other side of the circuit board in the thickness direction; wherein the first reinforcement member cooperates with the second reinforcement member to strengthen the structural strength of the circuit board.

[0006] According to the high-temperature resistant probe card of the present invention, a first reinforcement is provided on the side of the circuit board away from the probe, and a second reinforcement is provided on the side of the first reinforcement away from the circuit board. The first reinforcement is connected to the circuit board to reduce the deformation of the circuit board, and the second reinforcement can provide additional mechanical support to increase the overall rigidity of the circuit board. Therefore, the cooperation between the first reinforcement and the second reinforcement effectively reduces the deformation of the circuit board at high temperature, thereby ensuring the position accuracy of the probe tip, avoiding the problem of scratches and displacement, and improving the accuracy and reliability of wafer testing.

[0007] Furthermore, the first reinforcement is constructed as a first annular plate, and one side of the first annular plate in the thickness direction is connected to the circuit board; the second reinforcement is constructed as a second annular plate, and the second annular plate is arranged on the other side of the first annular plate in the thickness direction.

[0008] Furthermore, the first annular plate is made of ceramic material.

[0009] Furthermore, the second annular plate is made of stainless steel.

[0010] Furthermore, a connecting groove is provided on a side of the second annular plate facing the first annular plate, resin is provided in the connecting groove, and the first annular plates are bonded to each other through the resin.

[0011] Furthermore, it also includes: a reinforcing plate, which is made of stainless steel material, and is arranged on the side of the second annular plate away from the circuit board, and the reinforcing plate is detachably connected to the second annular plate.

[0012] Furthermore, the second annular plate is provided with a plurality of threaded holes, and the reinforcing plate is provided with through holes corresponding to the plurality of threaded holes one by one. The screw passes through the through holes and is threadedly engaged with the corresponding threaded holes to connect the reinforcing plate to the second annular plate.

[0013] Furthermore, it also includes: a connecting seat, which is arranged on the side of the reinforcing plate away from the circuit board, and the connecting seat is suitable for connecting the reinforcing plate to the detection equipment.

[0014] Other advantages, objectives, and features of the present invention will be described in the following description and will be apparent to those skilled in the art to some extent, or they may be taught by those skilled in the art from the practice of the present invention. The objectives and other advantages of the present invention may be realized and obtained through the following description. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] In order to make the purpose, technical solution and beneficial effects of the present invention clearer, the present invention is described with the following drawings:

[0016] Figure 1 A schematic diagram of a probe card of the present invention;

[0017] Figure 2 This is a schematic diagram of the connection between the first annular plate, the second annular plate and the reinforcing plate of the present invention.

[0018] The following are marked in the accompanying drawings:

[0019] 1. Probe card; 2. Wafer;

[0020] 10. Circuit board;

[0021] 20. First annular plate;

[0022] 30. Second annular plate; 31. Threaded hole;

[0023] 40. Probe;

[0024] 50. Reinforcement plate; 51. Via hole;

[0025] 60. Connecting socket. DETAILED DESCRIPTION

[0026] In order to make the purpose, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below in conjunction with embodiments and drawings. The schematic implementation methods of the present invention and their descriptions are only used to explain the present invention and are not intended to limit the present invention.

[0027] In the following description, numerous specific details are set forth to provide a thorough understanding of the present invention. However, it will be apparent to one skilled in the art that these specific details are not necessarily required to practice the present invention. In other instances, well-known structures, circuits, materials, or methods are not described in detail to avoid obscuring the present invention.

[0028] Throughout this specification, references to "one embodiment," "an embodiment," "an example," or "an example" mean that a particular feature, structure, or characteristic described in conjunction with the embodiment or example is included in at least one embodiment of the present invention. Therefore, the phrases "one embodiment," "an embodiment," "an example," or "an example" appearing in various places throughout this specification do not necessarily refer to the same embodiment or example. In addition, the particular features, structures, or characteristics may be combined in one or more embodiments or examples in any suitable combination and / or subcombination. Furthermore, it will be understood by those of ordinary skill in the art that the figures provided herein are for illustrative purposes only and are not necessarily drawn to scale. As used herein, the term "and / or" includes any and all combinations of one or more of the associated listed items.

[0029] In the description of the present invention, it should be understood that the terms "front", "rear", "left", "right", "up", "down", "vertical", "horizontal", "high", "low", "inside", "outside", etc., indicating directions or positional relationships, are based on the directions or positional relationships shown in the accompanying drawings. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific direction, be constructed and operated in a specific direction. Therefore, they cannot be understood as limiting the scope of protection of the present invention.

[0030] Example 1:

[0031] like Figure 1-Figure 2 As shown, the utility model provides a high-temperature resistant probe card 1, comprising: a circuit board 10, a first reinforcement, a second reinforcement and a plurality of probes 40, wherein a plurality of electrical components are electrically connected to the circuit board 10, the first reinforcement is arranged on one side of the circuit board 10 in the thickness direction, the second reinforcement is arranged on the side of the first reinforcement away from the circuit board 10, and the plurality of probes 40 are respectively arranged on the other side of the circuit board 10 in the thickness direction; wherein the first reinforcement cooperates with the second reinforcement to strengthen the structural strength of the circuit board 10.

[0032] In some embodiments, the second reinforcement, the first reinforcement, the circuit board 10 and the multiple probes 40 are arranged in sequence in the height direction, and the second reinforcement, the first reinforcement, the circuit board 10 and the multiple probes 40 are connected in sequence. The circuit board 10 serves as the basis of the probe card 1. The circuit board 10 carries multiple electrical components, and the multiple electrical components are responsible for functions such as signal transmission. The first reinforcement is arranged on one side of the circuit board 10. The first reinforcement is used to improve the structural strength of the circuit board 10 and reduce the deformation of the circuit board 10 at high temperatures. The second reinforcement is arranged on the side of the first reinforcement away from the circuit board 10. The second reinforcement is used in conjunction with the first reinforcement to jointly enhance the structural strength of the circuit board 10. Multiple probes 40 are arranged on the other side of the circuit board 10. The multiple probes 40 are used to contact the chips of the wafer 2 to be tested for electrical testing.

[0033] It is understood that the first reinforcement has a low coefficient of thermal expansion and can maintain a stable shape at high temperatures. The first reinforcement is connected to the circuit board 10 to reduce deformation of the circuit board 10, and the second reinforcement provides additional mechanical support to increase the overall rigidity of the circuit board 10. Therefore, the coordinated use of the first and second reinforcements can effectively reduce deformation of the circuit board 10 at high temperatures, thereby ensuring the positional accuracy of the probe tip 40 and avoiding problems such as scratches and misalignment.

[0034] In summary, the combined use of the first reinforcement and the second reinforcement significantly improves the structural strength of the circuit board 10, so that the probe card 1 can remain stable in a high-temperature environment, and the first reinforcement with a low thermal expansion coefficient and the second reinforcement that provides additional support effectively reduce the deformation of the circuit board 10. At the same time, since the deformation of the circuit board 10 at high temperatures is reduced, the position of the tip of the probe 40 is more accurate, avoiding the problem of scratches and displacement of the probe 40, thereby improving the accuracy and reliability of the test of the wafer 2.

[0035] According to the high-temperature resistant probe card 1 of the present invention, a first reinforcement is provided on the side of the circuit board 10 away from the probe 40, and a second reinforcement is provided on the side of the first reinforcement away from the circuit board 10. The first reinforcement is connected to the circuit board 10 to reduce the deformation of the circuit board 10, and the second reinforcement can provide additional mechanical support to increase the overall rigidity of the circuit board 10. Therefore, the cooperation between the first reinforcement and the second reinforcement effectively reduces the deformation of the circuit board 10 at high temperatures, thereby ensuring the position accuracy of the tip of the probe 40, avoiding the problem of scratches and displacement, and improving the accuracy and reliability of the test of the wafer 2.

[0036] Example 2:

[0037] In this embodiment, based on the first embodiment, the first reinforcement is constructed as a first annular plate 20, and the first annular plate 20 is connected to the circuit board 10 on one side in the thickness direction; the second reinforcement is constructed as a second annular plate 30, and the second annular plate 30 is arranged on the other side of the first annular plate 20 in the thickness direction.

[0038] It will be appreciated that first annular plate 20 has a low coefficient of thermal expansion and can effectively reduce deformation at the edges of circuit board 10; second annular plate 30 provides additional mechanical support to increase the overall rigidity of circuit board 10. The design of first annular plate 20 and second annular plate 30 allows them to better surround the edges of circuit board 10, providing uniform support to circuit board 10 and more effectively reducing deformation of circuit board 10 at high temperatures.

[0039] Therefore, the first annular plate 20 and the second annular plate 30 jointly enhance the structural strength of the edge of the circuit board 10, and can better disperse the pressure of the circuit board 10 and reduce the deformation of the edge of the circuit board 10. At the same time, the design of the first annular plate 20 and the second annular plate 30 makes the first reinforcement and the second reinforcement use less material, thereby reducing the manufacturing cost of the first reinforcement and the second reinforcement, thereby reducing the production cost of the probe card 1. Of course, the design of the first annular plate 20 and the second annular plate 30 can reduce the overall weight of the probe card 1.

[0040] Preferably, the first annular plate 20 and the second annular plate 30 may be configured as square annular plates, circular annular plates or annular plates of other irregular shapes, which are not limited herein.

[0041] Example 3:

[0042] In this embodiment, based on the second embodiment, first annular plate 20 is made of ceramic material. It is understood that ceramic material has a very low coefficient of thermal expansion, and its dimensions change very little when the temperature changes. Therefore, first annular plate 20 made of ceramic material can effectively reduce the deformation of the edge of circuit board 10, thereby making the position of the tip of probe 40 more accurate, and improving the accuracy and reliability of wafer 2 testing.

[0043] According to some embodiments of the present invention, the second annular plate 30 is made of stainless steel. It is understood that stainless steel has excellent mechanical strength and thermal stability, making the second annular plate 30 made of stainless steel more resistant to deformation under external pressure and high temperature environments. Therefore, the second annular plate 30 made of stainless steel can provide additional support, helping to improve the overall structural strength of the circuit board 10 and further reducing deformation of the circuit board 10 under high temperature.

[0044] According to some embodiments of the present invention, a connection groove is provided on a side of the second annular plate 30 facing the first annular plate 20 , and resin is provided in the connection groove, and the first annular plates 20 are bonded to each other through the resin.

[0045] In some embodiments, a connecting groove is provided on the side of the second annular plate 30 facing the first annular plate 20 , and the connecting groove is filled with resin material. The first annular plate 20 and the second annular plate 30 are bonded together by the resin material filled in the connecting groove.

[0046] It can be understood that the resin material has good bonding properties and temperature resistance. The resin material can maintain good bonding strength in a high temperature environment to ensure that the connection between the first annular plate 20 and the second annular plate 30 is firm and reliable. At the same time, the design of the connecting groove can ensure that the resin material is evenly distributed between the first annular plate 20 and the second annular plate 30 to provide a stable connection point and ensure a stable connection between the first annular plate 20 and the second annular plate 30.

[0047] Thus, through resin bonding, a firm connection is formed between the first annular plate 20 and the second annular plate 30, which increases the stability of the entire structure of the probe card 1. At the same time, resin bonding provides additional support, which helps to reduce the deformation of the circuit board 10 under high temperature. In particular, the above-mentioned setting can reduce the deformation of the edge of the circuit board 10, thereby making the position of the tip of the probe 40 more accurate, thereby improving the accuracy and reliability of the test of the wafer 2.

[0048] Example 4:

[0049] In this embodiment, based on the third embodiment, the probe card 1 further includes: a reinforcing plate 50 , which is made of stainless steel and is disposed on a side of the second annular plate 30 facing away from the circuit board 10 , and is detachably connected to the second annular plate 30 .

[0050] It can be understood that the reinforcing plate 50 is made of stainless steel, and the reinforcing plate 50 is located on the side of the second annular plate 30 away from the circuit board 10. Stainless steel has good mechanical strength and thermal stability. Therefore, the reinforcing plate 50 made of stainless steel can provide additional support, which helps to improve the overall structural strength of the first annular plate 20 and the second annular plate 30, thereby improving the structural strength of the circuit board 10 and further reducing the deformation of the circuit board 10 at high temperatures.

[0051] It is worth noting that the reinforcing plate 50 is connected to the second annular plate 30 via a detachable connection to facilitate installation and removal, thereby facilitating maintenance and upgrades of the probe card 1. Of course, the reinforcing plate 50 can be constructed as a circular plate, a square plate, or a plate of other shapes, which is not limited here.

[0052] According to some embodiments of the present invention, the second annular plate 30 is provided with a plurality of threaded holes 31, and the reinforcing plate 50 is provided with through holes 51 corresponding one-to-one to the plurality of threaded holes 31. The screw passes through the through holes 51 and is threadably engaged with the corresponding threaded holes 31 to connect the reinforcing plate 50 to the second annular plate 30.

[0053] It is understood that the fit between the threaded hole 31 and the screw is a common mechanical connection method that can provide reliable connection strength. Furthermore, the threaded connection allows the reinforcement plate 50 to be easily installed or removed from the second annular plate 30, thereby facilitating maintenance and replacement. Preferably, the plurality of through-holes 51 are spaced apart circumferentially around the reinforcement plate 50 to provide a more uniform connection point between the reinforcement plate 50 and the second annular plate 30, thereby providing a more stable connection between the reinforcement plate 50 and the second annular plate 30.

[0054] According to some embodiments of the present invention, the probe card 1 further comprises a connection base 60, which is disposed on a side of the reinforcing plate 50 facing away from the circuit board 10, and is adapted to connect the reinforcing plate 50 to a testing device. It is understood that the connection base 60 is fixedly connected to the testing device, and the connection base 60 is fixedly connected to the reinforcing plate 50. Furthermore, since the second annular plate 30 is detachably connected to the reinforcing plate 50 via a threaded connection, the above arrangement simplifies the connection between the second annular plate 30 and the testing device, thereby facilitating the assembly and disassembly of the probe card 1 from the testing device.

[0055] Finally, it should be noted that the above preferred embodiments are only used to illustrate the technical solutions of the present invention and are not limiting. Although the present invention has been described in detail through the above preferred embodiments, those skilled in the art should understand that various changes can be made in form and details without departing from the scope defined by the claims of the present invention.

Claims

1. A high temperature resistant probe card, characterized in that: include: A circuit board (10), wherein a plurality of electrical components are electrically connected to the circuit board (10); a first reinforcement member, the first reinforcement member being arranged on one side of the circuit board (10) in the thickness direction; a second reinforcement member, the second reinforcement member being arranged on a side of the first reinforcement member facing away from the circuit board (10); A plurality of probes (40), wherein the plurality of probes (40) are respectively arranged on the other side of the circuit board (10) in the thickness direction; wherein The first reinforcement member cooperates with the second reinforcement member to strengthen the structural strength of the circuit board (10).

2. The high temperature resistant probe card according to claim 1, wherein: The first reinforcement member is configured as a first annular plate (20), and one side of the first annular plate (20) in the thickness direction is connected to the circuit board (10); the second reinforcement member is configured as a second annular plate (30), and the second annular plate (30) is arranged on the other side of the first annular plate (20) in the thickness direction.

3. The high temperature resistant probe card according to claim 2, wherein: The first annular plate (20) is made of ceramic material.

4. The high temperature resistant probe card according to claim 3, characterized in that: The second annular plate (30) is made of stainless steel.

5. The high temperature resistant probe card according to claim 4, characterized in that: A connecting groove is provided on one side of the second annular plate (30) facing the first annular plate (20), resin is provided in the connecting groove, and the first annular plates (20) are bonded to each other through the resin.

6. The high temperature resistant probe card according to claim 5, characterized in that: Also includes: A reinforcing plate (50) is made of stainless steel, and is arranged on a side of the second annular plate (30) facing away from the circuit board (10). The reinforcing plate (50) is detachably connected to the second annular plate (30).

7. The high temperature resistant probe card according to claim 6, characterized in that: The second annular plate (30) is provided with a plurality of threaded holes (31), and the reinforcing plate (50) is provided with through holes (51) corresponding to the plurality of threaded holes (31) one by one. The screw passes through the through holes (51) and is threadedly engaged with the corresponding threaded holes (31) to connect the reinforcing plate (50) to the second annular plate (30).

8. The high temperature resistant probe card according to claim 6, wherein: Also includes: A connecting seat (60) is provided on a side of the reinforcing plate (50) facing away from the circuit board (10), and the connecting seat (60) is suitable for connecting the reinforcing plate (50) to a detection device.

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