Complete structure of miniature solid distance measuring module

Abstract

The utility model discloses a miniature solid ranging module complete machine structure, and relates to the technical field of laser ranging. A structure main body of the micro solid distance measuring module is provided with a transmitting channel and a receiving channel; a circuit board of the circuit board assembly is installed on the side face of the structure body and located on a plane parallel to the length and / or width direction of the structure body. The receiving optical assembly is mounted on the structural main body along the receiving path; the emission optical assembly is installed on the structure body along the emission path and comprises a miniature solid laser and a laser beam expanding system, the miniature solid laser is located on the upstream of the light path of the emission path, and an emission part of the miniature solid laser is arranged towards the downstream along the emission path; and the laser beam expanding system is positioned at the downstream of the light path of the emission path and is used for controlling the divergence angle of the laser beam emitted by the micro solid laser. According to the whole structure of the miniature solid distance measuring module, the miniature solid laser is carried, so that the distance measuring module is smaller, more efficient and more stable.

Description

Technical Field

[0001] The present application relates to the field of laser ranging technology, and in particular to a complete structure of a micro solid-state ranging module. Background Art

[0002] Laser ranging technology is based on the Time of Flight (ToF) principle, which calculates the distance by measuring the time it takes for the laser to be emitted and reflected by the target back to the receiver.

[0003] The increasing prevalence of portable devices and intelligent systems, such as handheld devices, in-vehicle systems, and drones, has led to higher requirements for the size and weight of laser ranging modules. Currently, the overall structural design of a laser ranging module requires the integration of multiple aspects, including the laser, optical system, electronic control, and signal processing. The design must ensure a compact layout of all components while guaranteeing system stability and reliability. To meet market demand, the development of smaller, more efficient, and more reliable laser ranging devices is needed. Utility Model Content

[0004] The purpose of this application is to provide a micro solid-state ranging module structure, which makes the ranging module more compact, efficient and stable by equipping it with a micro solid-state laser.

[0005] To achieve the above objectives, the present application provides a micro solid-state ranging module complete structure, including:

[0006] A structural body, provided with a transmitting path and a receiving path parallel to the length direction of the structural body;

[0007] A circuit board assembly, comprising at least one circuit board, wherein the circuit board is mounted on a side surface of the structural body, and the circuit board is located in a plane parallel to the length and / or width direction of the structural body;

[0008] a receiving optical component, mounted on the structural body along the receiving path;

[0009] An emission optical component is mounted on the structural main body along the emission path, and the emission optical component includes:

[0010] a micro solid-state laser located upstream of the optical path of the emission path, wherein the emission portion of the micro solid-state laser is arranged downstream along the emission path;

[0011] The laser beam expansion system is located downstream of the optical path of the emission channel, and the laser beam expansion system is used to control the divergence angle of the laser beam emitted by the micro solid-state laser.

[0012] In some embodiments, the laser beam expansion system is installed inside the structural body, the micro solid-state laser is installed on the back side of the structural body, and the optical axis of the micro solid-state laser coincides with the optical axis of the laser beam expansion system.

[0013] In some embodiments, the micro solid-state laser is provided with a mounting end plate, the mounting end plate is located at the end of the micro solid-state laser that is the same as the emitting portion, the mounting end plate is provided with a mounting end surface, the mounting end surface is perpendicular to the optical axis of the micro solid-state laser, and the mounting end surface is in contact with the back side of the structural body.

[0014] In some embodiments, a photoelectric sensor is further included. The photoelectric sensor is located in the optical path of the emission path, and the photoelectric sensor is used to detect the photoelectric signal of the laser emitted by the micro solid-state laser.

[0015] In some embodiments, the laser beam expansion system is installed inside the structural body;

[0016] The circuit board assembly includes a control circuit board, and the control circuit board is mounted on the top side of the structural body;

[0017] The photoelectric sensor is installed on the top side of the structural body and is electrically connected to the control circuit board.

[0018] In some embodiments, a laser hole and a laser mounting hole are provided on the back side of the structural body. The laser mounting holes are distributed around the laser hole, and the laser hole is used to align with the emitting portion.

[0019] In some embodiments, the receiving optical assembly includes:

[0020] a lens barrel body, formed integrally with the structural main body, wherein the optical axis of the lens barrel body coincides with the receiving passage;

[0021] The receiver circuit board is mounted on the back side of the lens barrel.

[0022] In some embodiments, a receiving hole and a receiver mounting hole are provided on the back side of the lens barrel body, the receiver mounting holes are distributed around the receiving hole, and the receiving hole is used to align with the receiving portion of the receiver circuit board.

[0023] In some embodiments, the device further comprises a photoelectric sensor, wherein the photoelectric sensor is mounted on the structural body and an insulating sleeve is provided on the outer cover of the photoelectric sensor; and / or,

[0024] The receiving optical assembly comprises a lens barrel body and a receiver circuit board. The receiver circuit board is mounted on the back side of the lens barrel body and an outer cover of the receiver circuit board is provided with a shielding cover.

[0025] In some embodiments, the circuit board assembly includes a control circuit board and a driver circuit board, the control circuit board is mounted on the top side of the structural body, the driver circuit board is mounted on the bottom side of the structural body, and the control circuit board is electrically connected to the driver board connector on the driver circuit board through a control board connector.

[0026] In some embodiments, the control circuit board is mounted on the integrally formed part of the lens barrel and the structural body through a first fastener; the drive circuit board is mounted on the integrally formed part of the lens barrel and the structural body through a second fastener.

[0027] In some embodiments, there are two first fasteners, one is mounted on the structural body, and the other is mounted on the lens barrel; and / or,

[0028] There are two second fasteners, one is installed on the structural main body, and the other is installed on the lens barrel.

[0029] Compared with the above-mentioned background technology, the overall structure of the micro solid ranging module provided by the present application mainly includes a structural body, a circuit board assembly, a receiving optical assembly and a transmitting optical assembly; the structural body is provided with a transmitting path and a receiving path parallel to the length direction of the structural body; the circuit board assembly includes at least one circuit board, the circuit board is installed on the side of the structural body, and the circuit board is located in a plane parallel to the length and / or width direction of the structural body; the receiving optical assembly is installed on the structural body along the receiving path; the transmitting optical assembly is installed on the structural body along the transmitting path, and the transmitting optical assembly includes a micro solid laser and a laser beam expansion system, the micro solid laser is located upstream of the optical path of the transmitting path, and the transmitting part of the micro solid laser is arranged downstream along the transmitting path; the laser beam expansion system is located downstream of the optical path of the transmitting path, and the laser beam expansion system is used to control the divergence angle of the laser beam emitted by the micro solid laser.

[0030] During the operation of the entire structure of the micro solid-state ranging module, the main structure plays the role of installing and carrying various components such as the circuit board assembly, the receiving optical assembly and the transmitting optical assembly; the circuit board assembly plays the role of driving and controlling various components such as the receiving optical assembly and the transmitting optical assembly; the transmitting optical assembly plays the role of emitting laser; and the receiving optical assembly plays the role of receiving reflected laser. The ToF principle of laser ranging technology is then utilized to realize the ranging function of the entire structure of the micro solid-state ranging module.

[0031] In terms of the assembly of the entire structure of the micro solid-state ranging module, the structural body has side surfaces that provide mounting locations for components. The structural body is also provided with a transmitting path and a receiving path, thereby facilitating the integration of multiple components, including a circuit board assembly, a receiving optical assembly, and a transmitting optical assembly. This ensures a compact layout of each component and lays the foundation for the miniaturization of the entire structure. Because the transmitting and receiving paths are parallel to the length of the structural body, the optical axis parallelism of the transmitting and receiving paths can be ensured at the mechanical processing level of the structural body, eliminating the need for a debugging process and laying the foundation for the reliability of the entire structure. Regarding the circuit board assembly, the circuit board assembly includes at least one circuit board, all of which are mounted on the side surfaces of the structural body, and the circuit boards are located in a plane parallel to the length and / or width of the structural body, thereby achieving a compact overall layout and high space utilization. For the receiving optical component and the transmitting optical component, the receiving optical component is installed on the structural body along the receiving path, and the transmitting optical component is installed on the structural body along the transmitting path. In addition to the aforementioned integration method of the receiving optical component and the transmitting optical component on the structural body, especially for the transmitting optical component, the transmitting optical component includes a micro solid-state laser and a laser beam expansion system. The micro solid-state laser is the core component of the laser emission in the whole machine structure. Its application in the ranging module has brought about a reduction in the size of the whole machine, an improvement in efficiency and an enhancement in reliability. Specifically, due to the more compact structure of the micro solid-state laser, they can provide the same or higher output power in a smaller space, making the overall structure design lighter and more compact; in addition, the high electro-optical conversion efficiency of the micro solid-state laser means that more light energy can be generated when consuming the same amount of electrical energy, thereby improving the efficiency of energy utilization; in terms of reliability, the micro solid-state laser can maintain stable performance under various working conditions due to its excellent thermal stability and anti-environmental interference ability, reducing maintenance requirements and extending the service life of the equipment. These advantages make the whole machine structure using micro solid-state lasers more efficient and reliable in practical applications. For the laser beam expansion system, the laser beam expansion system is located downstream of the optical path of the emission path. Because the micro solid-state laser is located upstream of the optical path of the emission path and the emission part is arranged along the emission path toward the downstream, the laser emitted by the micro solid-state laser will pass through the laser beam expansion system along the emission path. The laser beam emitted by the micro solid-state laser is adjusted and controlled by the laser beam expansion system, thereby changing the divergence characteristics of the laser beam, realizing precise control of the shape and size of the laser beam, and further improving the reliability of the overall structure of the micro solid-state laser.

[0032] Combined with the above structure and process description, it can be seen that the overall structure of the micro solid-state ranging module has at least the following beneficial effects: the overall structure of the micro solid-state ranging module is equipped with a micro solid-state laser, making the ranging module more compact, efficient and stable. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are merely embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on the provided drawings without any creative work.

[0034] Figure 1 Schematic diagram of the structure of the micro solid-state ranging module provided in the embodiment of the present application Figure 1 ;

[0035] Figure 2 Schematic diagram of the structure of the micro solid-state ranging module provided in the embodiment of the present application Figure 2 ;

[0036] Figure 3 Schematic diagram of the structure of the micro solid-state ranging module provided in the embodiment of the present application Figure 3 ;

[0037] Figure 4 Schematic diagram of the structure of the micro solid-state ranging module provided in the embodiment of the present application Figure 4 ;

[0038] Figure 5 This is a schematic diagram of the structure of the micro solid-state ranging module provided in an embodiment of the present application after removing the circuit board assembly;

[0039] Figure 6 This is a schematic diagram of the exploded structure of the micro solid-state ranging module provided in an embodiment of the present application after removing the circuit board assembly.

[0040] in:

[0041] 1-Structural body; 110-Transmitting path; 120-Receiving path; 101-Laser mounting hole; 102-Laser hole; 103-External fixing hole;

[0042] 2-circuit board assembly; 210-control circuit board; 211-control board connector; 212-external electrical interface; 213-first shield cover welding point; 214-receiver welding point; 215-sensor welding point; 220-driver circuit board; 221-driver board connector; 222-electrode welding point; 223-second shield cover welding point;

[0043] 3-receiving optical assembly; 310-lens barrel; 311-receiving hole; 312-receiver mounting hole; 320-receiver circuit board; 321-receiver fixing hole; 322-receiving part; 323-third shielding cover welding point; 324-control board welding point;

[0044] 4-emitting optical component; 410-micro solid-state laser; 411-emitting part; 412-mounting end plate; 413-mounting end surface; 414-laser fixing hole; 415-laser electrode; 420-laser beam expansion system;

[0045] 5-photoelectric sensor; 510-sensor electrode;

[0046] 8-Insulation sleeve;

[0047] 9-shielding cover; 910-bending card point; 911-vertical card point;

[0048] 10-Laser fasteners;

[0049] 11-Receiver fastener;

[0050] 12-first fastener;

[0051] 13-Second fastener. DETAILED DESCRIPTION

[0052] The present application relates to the field of laser ranging technology, and in particular to a micro solid-state ranging module overall structure.

[0053] Laser rangefinders are mainly used in surveying and mapping, security, and autonomous driving. They use the time difference between the emitted laser beam and the received laser beam to analyze and calculate the distance to an object.

[0054] At present, the technology of laser rangefinders is being gradually upgraded. The overall structure of the machine is pursuing lighter weight and smaller size, and is developing in the direction of miniaturization, so that its scope of use is wider.

[0055] The following will be combined with the drawings in the embodiments of this application to clearly and completely describe the technical solutions in the embodiments of this application. Obviously, the embodiments described are only part of the embodiments of this application, not all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0056] In order to enable those skilled in the art to better understand the present application, the present application is further described in detail below with reference to the accompanying drawings and specific implementation methods.

[0057] Please refer to Figure 1 , Figure 1 Schematic diagram of the structure of the micro solid-state ranging module provided in the embodiment of the present application Figure 1 .

[0058] like Figure 1As shown, in the first specific implementation manner, the overall structure of the micro solid-state ranging module provided by the embodiment of the present application mainly includes a structural body 1, a circuit board assembly 2, a receiving optical component 3 and a transmitting optical component 4.

[0059] In this embodiment, the structural body 1 is provided with a transmitting path 110 and a receiving path 120. The transmitting path 110 and the receiving path 120 are two parallel paths and are also parallel to the length direction of the structural body 1. From the perspective of the structural body 1 as a whole, the transmitting path 110 and the receiving path 120 are both paths that communicate front to back.

[0060] The circuit board assembly 2 includes at least one circuit board, which is mounted on a side surface of the structural body 1 and located in a plane parallel to the length and / or width of the structural body 1. From the perspective of the structural body 1 as a whole, the side surfaces of the structural body 1 include at least a front side and a back side along the length, a left side and a right side along the width, and a top side and a bottom side along the height. Since the circuit board is located in a plane parallel to the length and / or width of the structural body 1, the circuit boards of the circuit board assembly 2 are mounted on the top and bottom sides of the structural body 1.

[0061] The receiving optical component 3 is installed on the structural body 1 along the receiving path 120, and the transmitting optical component 4 is installed on the structural body 1 along the transmitting path 110. The purpose is to facilitate the laser emitted by the transmitting optical component 4 to be emitted through the transmitting path 110, and at the same time help the laser to be received by the receiving optical component 3 through the receiving path 120 after reaching the detection object and being reflected. The transmitting optical component 4 includes a micro solid-state laser 410 and a laser beam expansion system 420. The micro solid-state laser 410 is located upstream of the optical path of the transmitting path 110, and the transmitting part 411 of the micro solid-state laser 410 is arranged downstream along the transmitting path 110; the laser beam expansion system 420 is located downstream of the optical path of the transmitting path 110, and the laser beam expansion system 420 is used to control the divergence angle of the laser beam emitted by the micro solid-state laser 410.

[0062] During the operation of the entire structure of the micro solid-state ranging module, the structural body 1 plays the role of installing and carrying various components such as the circuit board assembly 2, the receiving optical assembly 3 and the transmitting optical assembly 4; the circuit board assembly 2 plays the role of driving and controlling various components such as the receiving optical assembly 3 and the transmitting optical assembly 4; the transmitting optical assembly 4 plays the role of emitting laser light, and the receiving optical assembly 3 plays the role of receiving reflected laser light. The ToF principle of laser ranging technology is then utilized to realize the ranging function of the entire structure of the micro solid-state ranging module.

[0063] Please refer to Figure 6 , Figure 6This is a schematic diagram of the exploded structure of the micro solid-state ranging module provided in an embodiment of the present application after removing the circuit board assembly.

[0064] Regarding the assembly of the micro solid-state ranging module, the structural body 1 has side surfaces that provide mounting locations for components. Furthermore, the structural body 1 is provided with a transmitting path 110 and a receiving path 120, facilitating the integration of multiple components, including the circuit board assembly 2, the receiving optical assembly 3, and the transmitting optical assembly 4. This ensures a compact layout of each component and lays the foundation for the miniaturization of the overall structure. Because the transmitting path 110 and the receiving path 120 are parallel to the length of the structural body 1, the optical axis parallelism of the transmitting path 110 and the receiving path 120 can be ensured during machining of the structural body 1, eliminating the need for debugging and laying the foundation for the reliability of the overall structure. Regarding the circuit board assembly 2, it includes at least one circuit board, all of which are mounted on the side surfaces of the structural body 1 and located in a plane parallel to the length and / or width of the structural body 1, resulting in a compact overall layout and high space utilization. As for the receiving optical component 3 and the transmitting optical component 4, the receiving optical component 3 is installed on the structural body 1 along the receiving path 120, and the transmitting optical component 4 is installed on the structural body 1 along the transmitting path 110. In addition to the aforementioned integration of the receiving optical component 3 and the transmitting optical component 4 on the structural body 1, in particular, for the transmitting optical component 4, the transmitting optical component 4 includes a micro solid-state laser 410 and a laser beam expansion system 420. The micro solid-state laser 410 is the core component of the laser emission in the overall structure. Its application in the ranging module brings about a reduction in the size of the overall machine, an improvement in efficiency, and an enhancement in reliability. Specifically, due to the more compact structure of the micro solid-state laser 410, they can provide the same or higher output power in a smaller space, thereby making the overall structure design lighter and more compact. In addition, the high electro-optical conversion efficiency of the micro solid-state laser 410 means that more light energy can be generated when the same electrical energy is consumed, thereby improving the efficiency of energy utilization. In terms of reliability, the micro solid-state laser 410 can maintain stable performance under various working conditions due to its excellent thermal stability and anti-environmental interference ability, reducing maintenance requirements and extending the service life of the equipment. These advantages make the overall structure using the micro solid-state laser 410 more efficient and reliable in practical applications. Regarding the laser beam expansion system 420, the laser beam expansion system 420 is located downstream of the optical path of the emission path 110. Because the micro solid-state laser 410 is located upstream of the optical path of the emission path 110 and the emission unit 411 is arranged downstream along the emission path 110, the laser light emitted by the micro solid-state laser 410 will pass through the laser beam expansion system 420 along the emission path 110. The laser beam expansion system 420 adjusts and controls the laser beam emitted by the micro solid-state laser 410, thereby changing the divergence characteristics of the laser beam, achieving precise control of the shape and size of the laser beam, and further improving the reliability of the overall structure using the micro solid-state laser 410.

[0065] Combined with the above structure and process description, it can be seen that the overall structure of the micro solid-state ranging module has at least the following beneficial effects: the overall structure of the micro solid-state ranging module is equipped with a micro solid-state laser 410, making the ranging module more compact, efficient and stable.

[0066] Please continue to refer to Figure 1 and Figure 6 , and refer to Figures 2 to 5 ,in, Figure 2 Schematic diagram of the structure of the micro solid-state ranging module provided in the embodiment of the present application Figure 2 , Figure 3 Schematic diagram of the structure of the micro solid-state ranging module provided in the embodiment of the present application Figure 3 , Figure 4 Schematic diagram of the structure of the micro solid-state ranging module provided in the embodiment of the present application Figure 4 , Figure 5 This is a schematic diagram of the structure of the micro solid-state ranging module provided in an embodiment of the present application after removing the circuit board assembly.

[0067] In a specific embodiment, the structural body 1 is the main load-bearing member of the entire structure, and the transmitting path 110 and the receiving path 120 provided on the structural body 1 are both front-to-back communicating paths. Figure 1 As shown, the front sections of the receiving optical component 3 and the transmitting optical component 4 are arranged side by side on the front side of the structural body 1; Figure 2 As shown, the rear sections of the receiving optical component 3 and the transmitting optical component 4 are arranged on the back side of the structural body 1 .

[0068] In some cases, the circuit board assembly 2 includes a control circuit board 210 and a drive circuit board 220, the control circuit board 210 is arranged on the top side of the structural body 1, and the drive circuit board 220 is arranged on the bottom side of the structural body 1. The receiving optical component 3 includes a lens barrel 310 and a receiver circuit board 320, and the receiver circuit board 320 is arranged on the back side of the lens barrel 310. The transmitting optical component 4 includes a micro solid-state laser 410 and a laser beam expansion system 420, and the micro solid-state laser 410 is arranged on the back side of the laser beam expansion system 420.

[0069] Optionally, an external fixing hole 103 is further provided on the structural body 1, and the external fixing hole 103 is arranged on the front side of the structural body 1. The external fixing hole 103 can be used to externally fix the entire structure, thereby facilitating the fixation of the entire structure in equipment that requires a laser ranging function.

[0070] In a specific embodiment, for the circuit board assembly 2, the circuit board assembly 2 includes a control circuit board 210 and a driving circuit board 220. The control circuit board 210 is electrically connected to the driving circuit board 220. The control circuit board 210 and the driving circuit board 220 can also be electrically connected to the circuit parts of the receiving optical component 3 and the transmitting optical component 4 as needed, so that various circuit control functions are realized through the control circuit board 210, and power is provided to each component that requires power through the driving circuit board 220.

[0071] In this embodiment, the control circuit board 210 is mounted on the top side of the structural body 1, and the driver circuit board 220 is mounted on the bottom side of the structural body 1. Optionally, the control circuit board 210 is electrically connected to the driver board connector 221 on the driver circuit board via a control board connector 211. This connector connection improves the modularity and maintainability of the system, ensures stable signal transmission, simplifies maintenance procedures, and facilitates system expansion and upgrades.

[0072] Optionally, the control circuit board 210 is further provided with an external electrical interface 212, which is arranged on the back side of the control circuit board 210. The external electrical interface 212 is also equivalent to being located on the back side of the structural body 1. The arrangement position of the external electrical interface 212 helps to maintain the neatness of the overall surface of the control circuit board 210, and provides the control circuit board 210 with more effective space for arranging circuit components, thereby optimizing the overall design; at the same time, the design of the back side interface makes it easier to connect external devices, reduces interference, improves safety, and enhances maintainability and reliability.

[0073] In a specific embodiment, for the receiving optical component 3, the receiving optical component 3 includes a lens barrel 310 and a receiver circuit board 320. The lens barrel 310 and the receiver circuit board 320 are both arranged along the receiving path 120, so that the reflected laser is guided by the lens barrel 310, ensuring that the laser is accurately transmitted along the receiving path 120, and the reflected laser is received by the receiver circuit board 320.

[0074] In this embodiment, the receiver circuit board 320 is electrically connected to the control circuit board 210. The reflected laser is received by the receiver circuit board 320, and the optical signal is converted into an electrical signal and transmitted to the control circuit board 210. The control circuit board 210 analyzes and processes the data and outputs the test data to the outside. At this time, the receiver circuit board 320 is powered by the driver circuit board 220.

[0075] Optionally, the outer cover of the receiver circuit board 320 is provided with a shielding cover 9 , which covers the exposed surface of the receiver circuit board 320 , thereby preventing the receiver circuit board 320 from being affected by electromagnetic interference.

[0076] In some embodiments, the lens barrel 310 is integrally formed with the structural body 1 , and the optical axis of the lens barrel 310 coincides with the receiving path 120 ; the laser beam expansion system 420 is installed inside the structural body 1 , and the optical axis of the laser beam expansion system 420 coincides with the transmitting path 110 .

[0077] It should be noted that conventional laser solutions require parallel debugging of the entire laser and the receiving optical component to ensure maximum reflected laser energy. Therefore, conventional laser solutions require a debugging process. In contrast, the lens barrel 310 in this embodiment is integrally formed with the structural main body 1. Because the optical axis of the lens barrel 310 coincides with the receiving path 120, the optical axis of the receiving optical component 3 can be accurately guaranteed through machining precision. On this basis, the laser beam expansion system 420 is then installed inside the structural main body 1. This allows the laser beam expansion system 420 and the lens barrel 310 to be designed into the same structural main body 1. This ensures the parallelism of the optical axes of the receiving optical component 3 and the transmitting optical component 4 through machining precision, omitting the debugging process.

[0078] In some embodiments, the receiver circuit board 320 is mounted on the back side of the lens barrel 310 .

[0079] Optionally, the receiver circuit board 320 is provided with a receiver fixing hole 321, which cooperates with the receiver mounting hole 312 on the back side of the lens barrel body 310. The receiver fastener 11 is used to penetrate the receiver fixing hole 321 and the receiver mounting hole 312 to fix the receiver circuit board 320 to the lens barrel body 310.

[0080] The receiving optical component 3 can be provided with lenses as needed, such as being provided in the lens barrel 310, which will not be described in detail here. As an option, the lenses of the receiving optical component 3 are glued, which is a simple and reliable process.

[0081] Furthermore, a receiving hole 311 and a receiver mounting hole 312 are provided on the back side of the lens barrel body 310 . The receiver mounting holes 312 are distributed around the receiving hole 311 . The receiving hole 311 is used to align with the receiving portion 322 .

[0082] In some embodiments, the control circuit board 210 is mounted on the integrally formed part of the lens barrel 310 and the structural main body 1 via a first fastener 12 ; the drive circuit board 220 is mounted on the integrally formed part of the lens barrel 310 and the structural main body 1 via a second fastener 13 .

[0083] In this embodiment, the control circuit board 210 is mounted on the integrally formed part of the lens barrel body 310 and the structural main body 1 under the fastening action of the first fastener 12, and the drive circuit board 220 is mounted on the integrally formed part of the lens barrel body 310 and the structural main body 1 under the fastening action of the second fastener 13. In this case, the control circuit board 210 is located on the top side of the structural main body 1, and the drive circuit board 220 is located on the bottom side of the structural main body 1. In order to further improve the vibration and impact resistance of the control circuit board 210 and the drive circuit board 220 after installation, thread glue can be applied to the surfaces of the first fastener 12 and the second fastener 13 to strengthen the fixing effect of the control circuit board 210 and the drive circuit board 220 on the integrally formed part of the lens barrel body 310 and the structural main body 1, thereby improving the vibration and impact resistance of the entire structure.

[0084] Furthermore, there are two first fasteners 12 , one mounted on the structural body 1 and the other mounted on the lens barrel 310 ; and / or there are two second fasteners 13 , one mounted on the structural body 1 and the other mounted on the lens barrel 310 .

[0085] In this embodiment, there are two first fasteners 12 and two second fasteners 13, so there are two installation points for the control circuit board 210 and two installation points for the drive circuit board 220. The advantage of this is that, on the one hand, compared with single-point fixation, it can significantly improve the fixing effect of the control circuit board 210 and the drive circuit board 220, thereby improving the vibration and impact resistance of the entire structure. On the other hand, compared with a four-point or other fixing form with more points, it saves the number of fasteners used, shortens the assembly time, and improves the assembly efficiency.

[0086] Optionally, both the first fastener 12 and the second fastener 13 are fixed screws, and thread glue is applied to the screw threads to enhance the fixing effect of the control circuit board 210 and the driver circuit board 220 on the structural body 1, thereby improving the vibration and impact resistance of the entire structure. Furthermore, the first fastener 12 and the second fastener 13 use fixed screws of the same specifications. This allows the fixed screws used on the control circuit board 210 and the driver circuit board 220 to be interchangeable, making it easier to identify materials and helping to improve the efficiency of material management and component installation.

[0087] In some cases, there are two receiver fasteners 11. In this case, the control circuit board 210, the drive circuit board 220 and the receiver circuit board 320 all adopt a two-point fixing form, which improves the vibration and impact resistance of the entire structure while saving the number of fasteners used, shortening the assembly time and improving the assembly efficiency.

[0088] Optionally, the receiver fastener 11 uses fixing screws, and the receiver fastener 11 and the first fastener 12 and the second fastener 13 use fixing screws of the same specifications. At this time, the fixing screws used on the control circuit board 210, the drive circuit board 220 and the receiver circuit board 320 can be interchangeable, thereby further improving material management efficiency and component installation efficiency.

[0089] In a specific embodiment, for the emitting optical component 4, the emitting optical component 4 includes a micro solid-state laser 410 and a laser beam expansion system 420. The laser beam expansion system 420 is installed inside the structural body 1, and the micro solid-state laser 410 is installed on the back side of the structural body 1. The optical axis of the micro solid-state laser 410 coincides with the optical axis of the laser beam expansion system 420. Among them, the emitting optical component 4 can be provided with lenses as needed, such as being provided in the laser beam expansion system 420, which will not be described in detail here. As an option, the lenses of the emitting optical component 4 are glued, which is a simple and reliable process.

[0090] In this embodiment, the emitting optical component 4 adopts a separate design of the micro solid laser 410 and the laser beam expansion system 420, so that the micro solid laser 410 and the laser beam expansion system 420 can be optimized separately. The micro solid laser 410 can generate high-efficiency and high-quality laser more concentratedly, while the laser beam expansion system 420 can control the laser more effectively. Due to the physical separation of the two, the thermal impact and space limitations can be reduced, thereby improving stability and reliability. When maintenance or upgrading is required, either one can be replaced or adjusted separately, thereby improving maintainability. The laser beam expansion system 420 is designed onto the structural body 1, and the optical axis of the laser beam expansion system 420 is kept coincident with the emission path 110. In this way, the parallelism of the optical axes of the receiving optical component 3 and the emitting optical component 4 can be ensured by mechanical processing precision, the debugging process is omitted, and the factory steps are simplified.

[0091] In order to further improve the assembly effect and installation convenience of the micro solid-state laser 410, the micro solid-state laser 410 also adopts a front-end installation method.

[0092] In some embodiments, the micro solid-state laser 410 is provided with a mounting end plate 412, which is located at the same end of the micro solid-state laser 410 as the emitting portion 411, and the mounting end plate 412 is provided with a mounting end surface 413, which is perpendicular to the optical axis of the micro solid-state laser 410, and the mounting end surface 413 is in contact with the back side of the structural body 1.

[0093] In this embodiment, the mounting end plate 412 and the emitting portion 411 are located at the front end of the micro solid-state laser 410. The micro solid-state laser 410 is easily installed on the structural body 1 by utilizing the mounting end surface 413 on the mounting end plate 412 and the surface bonding on the back side of the structural body 1.

[0094] Optionally, the mounting end plate 412 is further provided with a laser fixing hole 414, which cooperates with the laser mounting hole 101 on the back side of the structural body 1. The laser fixing hole 414 and the laser mounting hole 101 are penetrated by a laser fastener 10 to fix the micro solid-state laser 410 to the structural body 1.

[0095] In some embodiments, a laser hole 102 and a laser mounting hole 101 are provided on the back side of the structural main body 1 . The laser mounting holes 101 are distributed around the laser hole 102 . The laser hole 102 is used to align with the emitting portion 411 .

[0096] In some cases, the laser fastener 10 is implemented as a set screw.

[0097] In a specific embodiment, the entire structure further includes a photoelectric sensor 5 , which is located in the optical path of the emission path 110 . The photoelectric sensor 5 is used to detect the photoelectric signal of the laser emitted by the micro solid-state laser 410 .

[0098] In this embodiment, because the photoelectric sensor 5 is located in the optical path of the transmitting channel 110, it can be regarded as that the photoelectric sensor 5 is installed on the laser beam expansion system 420 in the transmitting optical component 4, so that the laser emission energy can be detected at the position of the laser beam expansion system 420. Based on this, the photoelectric sensor 5 can be electrically connected to the control circuit board 210, so that the detection result of the photoelectric sensor 5 for the photoelectric signal is fed back to the control circuit board 210, and the control circuit board 210 controls and adjusts the driving circuit board 220 to supply power to the micro solid-state laser 410.

[0099] In some embodiments, the photoelectric sensor 5 is covered with an insulating sleeve 8 to separate the photoelectric sensor 5 from the structural body 1 , thereby preventing the photoelectric sensor 5 from being electrically connected to the structural body 1 and interfering with data collection.

[0100] Optionally, the photoelectric sensor 5 is mounted on the top side of the structural body 1 and is electrically connected to the control circuit board 210 . Specifically, the photoelectric sensor 5 is electrically connected to the bottom side of the control circuit board 210 .

[0101] In some cases, there are a first shielding cover welding point 213, a receiver welding point 214 and a sensor welding point 215 on the control circuit board 210, an electrode welding point 222 and a second shielding cover welding point 223 on the driving circuit board 220, a third shielding cover welding point 323 and a control board welding point 324 on the receiver circuit board 320, a laser electrode 415 on the micro solid-state laser 410, a sensor electrode 510 on the photoelectric sensor 5, and a bending card point 910 and a vertical card point 911 on the shielding cover 9.

[0102] In this embodiment, in terms of electrical connection, the control circuit board 210 is welded to the control board welding point 324 on the receiver circuit board 320 through the receiver welding point 214, thereby realizing the electrical connection between the control circuit board 210 and the receiver circuit board 320; the control circuit board 210 is welded to the sensor electrode 510 on the photoelectric sensor 5 through the sensor welding point 215, thereby realizing the electrical connection between the control circuit board 210 and the photoelectric sensor 5; the driving circuit board 220 is welded to the laser electrode 415 on the micro solid-state laser 410 through the electrode welding point 222, thereby realizing the electrical connection between the driving circuit board 220 and the micro solid-state laser 410.

[0103] In terms of structural fixation, the shielding cover 9 is clamped and welded with the second shielding cover welding point 223 on the driving circuit board 220 and the first shielding cover welding point 213 on the control circuit board 210 through the bending clamping point 910, and the shielding cover 9 is clamped and welded with the third shielding cover welding point 323 on the receiver circuit board 320 through the vertical clamping point 911.

[0104] In some cases, the entire machine structure adopts a square design to facilitate the placement and positioning of modules during installation.

[0105] It should be noted that many of the components mentioned in this application are universal standard parts or components known to those skilled in the art, and their structures and principles can be learned by those skilled in the art through technical manuals or conventional experimental methods.

[0106] It should be noted that, in this specification, relational terms such as first and second are merely used to distinguish one entity from other entities, but do not necessarily require or imply any actual relationship or order between these entities.

[0107] The above is a detailed introduction to the overall structure of the micro solid-state ranging module provided by this application. Specific examples are used herein to illustrate the principles and implementation methods of this application. The description of the above embodiments is only intended to help understand the method and core concept of this application. It should be noted that, for those skilled in the art, without departing from the principles of this application, several improvements and modifications can be made to this application, and these improvements and modifications also fall within the scope of protection of the claims of this application.

Claims

1. A micro solid-state ranging module complete structure, characterized in that: include: A structural body (1) is provided with a transmitting path (110) and a receiving path (120) parallel to the length direction of the structural body (1); A circuit board assembly (2) comprising at least one circuit board, wherein the circuit board is mounted on a side surface of the structural body (1), and the circuit board is located in a plane parallel to the length and / or width direction of the structural body (1); A receiving optical component (3) is mounted on the structural body (1) along the receiving path (120); An emission optical component (4) is mounted on the structural body (1) along the emission path (110), and the emission optical component (4) comprises: A micro solid laser (410) is located upstream of the optical path of the emission path (110), and an emission portion (411) of the micro solid laser (410) is arranged along the emission path (110) toward the downstream; A laser beam expansion system (420) is located downstream of the optical path of the emission path (110), and the laser beam expansion system (420) is used to control the divergence angle of the laser beam emitted by the micro solid-state laser (410).

2. The micro solid-state ranging module structure according to claim 1, characterized in that: The laser beam expansion system (420) is installed inside the structural body (1), the micro solid laser (410) is installed on the back side of the structural body (1), and the optical axis of the micro solid laser (410) coincides with the optical axis of the laser beam expansion system (420).

3. The micro solid-state ranging module structure according to claim 2, characterized in that: The micro solid laser (410) is provided with a mounting end plate (412), the mounting end plate (412) is located at the same end of the micro solid laser (410) as the emitting portion (411), the mounting end plate (412) is provided with a mounting end surface (413), the mounting end surface (413) is perpendicular to the optical axis of the micro solid laser (410), and the mounting end surface (413) is in contact with the back side of the structural body (1).

4. The micro solid-state ranging module structure according to claim 1, characterized in that: It also includes a photoelectric sensor (5), which is located in the optical path of the emission path (110), and is used to detect the photoelectric signal of the laser emitted by the micro solid-state laser (410).

5. The micro solid-state ranging module structure according to claim 4 is characterized in that: The laser beam expansion system (420) is installed inside the structural body (1); The circuit board assembly (2) comprises a control circuit board (210), and the control circuit board (210) is mounted on the top side of the structural body (1); The photoelectric sensor (5) is mounted on the top side of the structural body (1) and is electrically connected to the control circuit board (210).

6. The micro solid-state ranging module structure according to claim 1, characterized in that: The back side of the structural body (1) is provided with a laser hole (102) and a laser mounting hole (101), the laser mounting holes (101) are distributed around the laser hole (102), and the laser hole (102) is used to align with the emitting portion (411).

7. The micro solid-state ranging module structure according to claim 1, characterized in that: The receiving optical component (3) comprises: A lens barrel (310) is integrally formed with the structural main body (1), and the optical axis of the lens barrel (310) coincides with the receiving passage (120); A receiver circuit board (320) is mounted on the back side of the lens barrel (310).

8. The micro solid-state ranging module structure according to claim 7, characterized in that: A receiving hole (311) and a receiver mounting hole (312) are provided on the back side of the lens barrel body (310), the receiver mounting holes (312) are distributed around the receiving hole (311), and the receiving hole (311) is used to align with the receiving portion (322) of the receiver circuit board (320).

9. The micro solid-state ranging module structure according to claim 1, characterized in that: It also includes a photoelectric sensor (5), the photoelectric sensor (5) is installed on the structural body (1) and the outer sleeve of the photoelectric sensor (5) is provided with an insulating sleeve (8); and / or, The receiving optical assembly (3) comprises a lens barrel (310) and a receiver circuit board (320), wherein the receiver circuit board (320) is mounted on the back side of the lens barrel (310) and an outer cover of the receiver circuit board (320) is provided with a shielding cover (9).

10. The micro solid-state ranging module structure according to claim 1, characterized in that: The circuit board assembly (2) comprises a control circuit board (210) and a drive circuit board (220), wherein the control circuit board (210) is mounted on the top side of the structural body (1), and the drive circuit board (220) is mounted on the bottom side of the structural body (1), and the control circuit board (210) is electrically connected to a drive board connector (221) on the drive circuit board via a control board connector (211).

11. The micro solid-state ranging module structure according to claim 10, characterized in that: The control circuit board (210) is mounted on the integrally formed part of the lens barrel (310) and the structural main body (1) via a first fastener (12); and the drive circuit board (220) is mounted on the integrally formed part of the lens barrel (310) and the structural main body (1) via a second fastener (13).

12. The micro solid-state ranging module structure according to claim 11, characterized in that: There are two first fasteners (12), one is mounted on the structural body (1), and the other is mounted on the lens barrel (310); and / or, There are two second fasteners (13), one is installed on the structural main body (1), and the other is installed on the lens barrel (310).

Images