Optical assembly and optical communication equipment

Abstract

The utility model provides an optical assembly and optical communication equipment, and belongs to the technical field of optical communication. The fixing structural member is independently arranged in the optical assembly, and the shell of the optical device is fixed on the surface of the circuit board through the fixing structural member, so that the optical device is fixed on the circuit board, and the optical device is fixed on the board. Moreover, the housing of the optical device abuts against the surface of the circuit board, so that the optical device does not introduce the tolerance of the fixing structural member itself in the height direction of the board, and the tolerance caused by the flattening and welding between the fixing structural member and the housing, thereby enabling the tolerance of the optical device in the height direction of the board to be smaller. And the thickness of the heat conduction pad required by the heat dissipation block of the optical device is reduced. The optical communication device may be an FTTR device.

Description

Technical Field

[0001] The present application relates to the field of optical communication technology, and in particular to an optical component and an optical communication device. Background Art

[0002] In optical communication equipment, optical devices are usually directly integrated onto the circuit board in the optical communication equipment to achieve optical device on board (BOB). The optical device can be a bi-directional optical sub-assembly (BOSA), which includes an optical transmitter and receiver. The board where the optical device is located is a circuit board.

[0003] When BOSA is fixed on the circuit board, the structural parts are generally designed according to the shape of the BOSA's pigtail protective cover, and then fixed to the lower shell of the shielding cover with screws. Since the BOSA is tightened, the optical transmitter assembly goes out of tolerance and tilts upward. At this time, when the upper cover of the shielding cover is buckled, a seesaw is formed between the optical transmitter assembly and the pigtail protective cover with the optical device shell as the fulcrum, causing the optical path to deform under stress. In severe cases, the optical power of the optical transmitter assembly drops by more than 3dB. To prevent the above problems from occurring, the inner diameter of the structural parts is increased. This actually fails to completely fix the BOSA, resulting in the BOSA not being completely fixed and increasing the reliability risk during long-term use. Utility Model Content

[0004] This application provides an optical assembly and optical communication equipment in which the optical device is completely fixed to the circuit board, thereby reducing reliability risks during long-term use. Furthermore, the tolerance of the optical device in the board height direction is relatively small, thereby reducing the thickness of the thermal pad required for the heat sink of the optical device, thereby improving the thermal conductivity. The technical solution adopted is as follows:

[0005] In a first aspect, the present application provides an optical component, which includes an optical device, a fixing structure and a circuit board, wherein the optical device and the fixing structure are both located on the surface of the circuit board, and the housing of the optical device is fixed to the surface of the circuit board through the fixing structure; the fixing structure is located between the housing and the circuit board, and the housing abuts against the surface of the circuit board.

[0006] In the solution presented in this application, a separate fixing structure is provided in the optical assembly, and the housing of the optical device is fixed to the surface of the circuit board via the fixing structure, thereby securing the optical device to the circuit board and achieving a fixed connection between the optical device and the circuit board. Furthermore, the housing of the optical device abuts the surface of the circuit board, so that the tolerance of the optical device in the board height direction is related to the optical device itself, without introducing the tolerance of the fixing structure itself or the tolerance caused by the flatness and welding between the fixing structure and the housing. This results in a smaller tolerance of the optical device in the board height direction, which in turn reduces the thickness of the thermal pad required for the heat sink of the optical device, thereby improving the thermal conductivity.

[0007] In one optional embodiment, the fixing structure comprises a flat plate, and the housing is fixed to the surface of the circuit board via the flat plate, i.e., the housing is fixedly connected to the flat plate, and the flat plate is fixedly connected to the circuit board. Thus, since the fixing structure is a flat plate, the fixing structure is easier to manufacture, easier to fix to the housing, and easier to fix to the circuit board.

[0008] In an optional embodiment, the bottom of the housing has at least one support column, the at least one support column abuts against the surface of the circuit board, and the height of the at least one support column is greater than or equal to the thickness of the flat plate. In this way, the support column achieves abutment with the surface of the circuit board.

[0009] In an optional embodiment, the at least one support column includes two support columns positioned opposite each other, with the tablet being accommodated between the two support columns. Thus, the two support columns abutting against the surface of the circuit board make the housing easier to manufacture, easier to connect the housing to the tablet, and more stable.

[0010] In an optional embodiment, the flat plate has a through hole, and the at least one support column includes one support column, which passes through the through hole and abuts against the surface of the circuit board. In this way, the housing can abut against the surface of the circuit board through one support column.

[0011] In an optional manner, the flat plate is fixedly connected to the bottom of the housing at a position where no support column is provided by laser welding, thereby making the fixed connection between the flat plate and the housing more secure.

[0012] In one optional embodiment, the housing has a recessed groove on the surface facing the circuit board, the depth of which is greater than or equal to the thickness of the flat plate, and the recessed groove is used to accommodate the flat plate. In this way, by digging a recessed groove in the bottom of the housing, it is possible to achieve abutment with the circuit board and a fixed connection with the fixed structure.

[0013] In an optional embodiment, the cross-section of the sink is circular, and the shape of the plate is also circular. In this way, the sink can be a transistor outline (TO) opening, and the plate can be a TO socket, which is easy to manufacture.

[0014] In an optional manner, the flat plate is fixedly connected to the side wall of the sink by press-fitting, thus providing a possible connection manner.

[0015] In an optional manner, the flat plate and the side wall of the sink are further fixedly connected by laser welding. In this way, after the press-fit connection, the connection is further fixed by laser welding, which makes the connection more stable.

[0016] In an optional embodiment, the fixing structure further comprises a plurality of pins, and the flat panel is plugged into the circuit board via the plurality of pins and fixed by wave soldering. In this way, the fixing structure is connected to the circuit board via the plurality of pins and fixed by wave soldering, thereby improving the connection stability.

[0017] In a second aspect, the present application provides an optical communication device, which includes the optical component as described in the first aspect, or any optional embodiment of the first aspect.

[0018] The description of the effects in the second aspect refers to the description in the first aspect or any optional method of the first aspect, and will not be repeated here. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is a schematic diagram of the structure of a BOSA fixed on a circuit board;

[0020] Figure 2 This is a structural diagram of an optical component provided by an exemplary embodiment of the present application;

[0021] Figure 3 This is a structural diagram of a fixed structural member provided by an exemplary embodiment of the present application;

[0022] Figure 4 is another structural schematic diagram of an optical component provided by an exemplary embodiment of the present application;

[0023] Figure 5 This is another structural schematic diagram of a fixed structural member provided by an exemplary embodiment of the present application;

[0024] Figure 6 This is another structural schematic diagram of an optical component provided by an exemplary embodiment of the present application;

[0025] Figure 7This is another structural schematic diagram of a fixed structural member provided by an exemplary embodiment of the present application;

[0026] Figure 8 FIG. 1 is a schematic diagram of a fiber to the room (FTTR) system provided by an exemplary embodiment of the present application.

[0027] Illustration

[0028] 1. Optical device; 2. Fixed structural member; 3. Circuit board; 11. Housing; 111. Support column; 112. Sink; 21. Flat plate; 22. Pin. DETAILED DESCRIPTION

[0029] In order to make the objectives, technical solutions and advantages of this application clearer, the implementation methods of this application will be further described in detail below with reference to the accompanying drawings.

[0030] The BOB connection method is commonly used in optical components of optical communication equipment. Considering the engineering implementation issues faced by optical communication equipment, such as heat dissipation, BOB assembly, and electromagnetic compatibility (EMC), the entire BOB structure has been designed in a relatively complex manner. In particular, the BOSA fixing solution has low production efficiency and also poses reliability risks.

[0031] One BOSA fixing scheme involves attaching the BOSA to the circuit board. A structural component is typically designed to mimic the shape of the BOSA's pigtail cover and then screwed to the lower housing of the shielding case. As the BOSA is tightened, the optical transmitter assembly tilts upward, exceeding tolerances. When the upper cover of the shielding case is engaged, a seesaw-like structure forms between the optical transmitter assembly and the pigtail cover, with the optical component housing as the fulcrum. This causes the optical path to deform under stress. In severe cases, the optical output power of the optical transmitter assembly can drop by more than 3dB. To prevent this, the inner diameter of the structural component is increased. This effectively fails to fully secure the BOSA, resulting in an incomplete BOSA fixation and increased reliability risks during long-term use. Furthermore, the BOSA's heat sink, located between the BOSA and the upper cover of the shielding case, requires a thicker thermal pad to absorb the tolerances, lengthening the heat dissipation path. For example, the thermal pad is soft, and the distance between BOSA and the upper cover varies greatly. In order to fill this gap, a thermal pad with a relatively thick thickness is required.

[0032] Another BOSA fixation solution is: Figure 1In the optical assembly, a separate structural component is welded to the BOSA housing, and then the entire assembly is welded to the circuit board. The final height of the BOSA on the board is affected by multiple factors, including the height tolerance of the structural component (tolerance refers to the height variation or error range of the structural component), the flatness of the contact surface between the structural component and the BOSA housing, the size of the weld seam between the structural component and the BOSA housing, and the height tolerance of the BOSA housing. A thicker thermal pad is required to absorb the tolerance. Furthermore, due to the small size and thin thickness of the structural component, it is easily deformed when the shielding cover is pressed down or there is external vibration.

[0033] Based on this, an embodiment of the present application provides an optical component, in which, when the optical device 1 is fixed on the board, a certain design is made to the bottom of the shell 11 of the optical device 1, and the fixing structure 2 is embedded in the shell 11 to reduce the tolerance of the optical device 1 in the board height. For example, a fixing structure 2 is separately provided in the optical component, and the shell 11 of the optical device 1 is fixed to the surface of the circuit board 3 through the fixing structure 2. The shell 11 is also in contact with the surface of the circuit board 3, so that the optical device 1 does not introduce the tolerance of the fixing structure 2 itself in the board height direction, and the tolerance caused by the flatness and welding between the fixing structure 2 and the shell 11, thereby making the tolerance of the optical device 1 in the board height direction smaller, thereby reducing the thickness of the thermal pad required for the heat dissipation block of the optical device 1, and improving the thermal conductivity effect.

[0034] Next, the structure of the optical component will be described.

[0035] The optical component includes an optical device 1, a fixed structure 2 and a circuit board 3. The optical device 1 and the fixed structure 2 are both located on the surface of the circuit board 3. The optical device 1 has a shell 11, which is used to support the main body of the optical device 1 to achieve a fixed connection between the optical device 1 and the fixed structure 2. The main body of the optical device 1 includes an optical emitting component and an optical receiving component, etc. The shell 11 is fixedly connected to the fixed structure 2, and the fixed structure 2 is fixed on the surface of the circuit board 3, so that the shell 11 is fixedly connected to the circuit board 3 through the fixed structure 2. The fixed structure 2 is located between the shell 11 and the circuit board 3, and the shell 11 abuts the surface of the circuit board 3. Abutment means that the shell 11 and the surface of the circuit board 3 are in contact and support each other. In this way, the fixed structure 2 is only used to fix the shell 11 to the circuit board 3, and does not play a role in supporting the shell 11. The fixed structure 2 is not easy to deform.

[0036] In an optional manner, the optical device 1 can be a BOSA, and the shell 11 of the optical device 1 can also be called a three-way shell. The reason is that the BOSA includes an optical receiving component and an optical emitting component, and is also connected to the circuit board 3, so it is considered that there is a connection in three directions, and the shell 11 of the optical device 1 is also called a three-way shell.

[0037] In another optional manner, the optical device 1 may include only a light receiving component, or may include only a light transmitting component.

[0038] In an optional manner, the fixing structure 2 and the circuit board 3 are fixedly connected as follows:

[0039] The fixed structure 2 comprises a flat plate 21 and multiple pins 22. The circuit board 3 has positioning holes that match the pins 22. The flat plate 21 is inserted into the corresponding positioning holes on the circuit board 3 via the pins 22 and secured by wave soldering. The pins 22 serve only as a fixed connection and do not provide an electrical connection; in other words, they do not transmit electrical signals.

[0040] Optionally, the plurality of pins 22 include three pins 22. The positions of the three pins 22 can be set according to actual needs. For example, the shape of the flat plate 21 is a square, wherein two pins 22 are located on one side of the square, and the other pin 22 is located on the side opposite to the side. For another example, the shape of the flat plate 21 is a circle, and the connection points of the three pins 22 and the flat plate 21 form an equilateral triangle. This is just an example, and the embodiment of the present application does not limit the number of pins 22. For example, the plurality of pins 22 include four pins, the shape of the flat plate 21 is a square, each pin 22 is located at a corner of the square, and different pins 22 are provided at different corners.

[0041] Alternatively, the fixing structure 2 has a flat plate 21 , and the flat plate 21 is fixed on the surface of the circuit board 3 by gluing or other welding methods.

[0042] Optionally, the shape of the flat plate 21 may be regular or irregular, for example, the shape of the flat plate 21 includes but is not limited to circular, square, or oval.

[0043] It should be noted that the above are two possible structures for the fixed structure 2 and are not limited in this embodiment. For example, the surface of the plate 21 of the fixed structure 2 may not be flat, but may be a structure that mates with the housing 11. Furthermore, the structure of the fixed structure 2 must ensure both reliability and assembly efficiency during production.

[0044] It should also be noted that the flat plate 21 and the plurality of pins 22 of the fixed structure 2 can be manufactured separately and then assembled together, or can be integrally formed.

[0045] In an optional manner, when the structure of the shell 11 is different, the manner in which the shell 11 abuts against the circuit board 3 is also different, and the manner in which the shell 11 is fixedly connected to the circuit board 3 through the fixing structure 2 is also different.

[0046] Optionally, the bottom of the housing 11 has at least one support column 111, which can also be understood as a boss, for achieving alignment with the circuit board 3. The at least one support column 111 may include one support column 111 or multiple support columns 111. The housing 11 abuts the surface of the circuit board 3 via the at least one support column 111. The height of the at least one support column 111 is greater than or equal to the thickness of the flat plate 21. Thus, when the fixed structure 2 is located between the housing 11 and the circuit board 3, the fixed structure 2 does not provide support. When the bottom of the housing 11 has the support column 111, since alignment between the housing 11 and the circuit board 3 is achieved solely by the support column 111, the optical device 1 does not introduce tolerances of the fixed structure 2 itself in the board height direction, nor does it introduce tolerances caused by alignment and welding between the fixed structure 2 and the housing 11. This allows the optical device 1 to have a smaller tolerance in the board height direction, thereby minimizing the board height tolerance of the optical device 1.

[0047] Alternatively, see Figure 2 The at least one support column 111 includes two support columns 111 positioned opposite to each other, and the distance between the two support columns 111 is used to accommodate the flat plate 21. In other words, the distance between the two support columns 111 is greater than or equal to the target value, which is the length of the flat plate 21 in the direction of the line connecting the two support columns 111. Figure 2 In the embodiment, the connection direction of the two support columns 111 is consistent with the direction in which the optical device 1 transmits the optical signal. In another embodiment, the connection direction of the two support columns 111 is perpendicular to the direction in which the optical device 1 transmits the optical signal. In yet another embodiment, the angle between the connection direction of the two support columns 111 and the direction in which the optical device 1 transmits the optical signal is 45 degrees. These are just three possible examples, and the embodiments of the present application do not limit the positions of the two support columns 111.

[0048] Here, the cross-section of the at least one support column 111 may be circular, square, or other shapes, and the shapes of different support columns 111 may be the same or different.

[0049] Figure 3 Also provided Figure 2 A possible structural diagram of the fixed structural member 2 in FIG.

[0050] Alternatively, see Figure 4 The at least one support column 111 includes a support column 111, the flat plate 21 has a through hole, the through hole can accommodate the one support column 111, and the height of the one support column 111 is greater than or equal to the height of the flat plate 21, so that the one support column 111 can pass through the flat plate 21 and abut against the surface of the circuit board 3.

[0051] Optionally, a through hole is provided at the center of the flat plate 21. The embodiment of the present application does not limit the position of the through hole, which can be any position where the housing 11 is fixed to the circuit board 3.

[0052] Here, the cross-sectional shape of the support column 111 can be circular, square, or other shapes, and the cross-sectional shape of the through hole can be circular, square, or other shapes, as long as the support column 111 can pass through the flat plate 21 and abut against the surface of the circuit board 3. The embodiment of the present application does not limit this.

[0053] Figure 5 Also provided Figure 4 A possible structural diagram of the fixed structural member 2 in FIG.

[0054] Optionally, when the housing 11 has a support column 111, the flat panel 21 and the housing 11 are fixed as follows:

[0055] The flat plate 21 is fixedly connected to the position at the bottom of the shell 11 where there is no support column 111. For example, the flat plate 21 is fixedly connected to the position at the bottom of the shell 11 where there is no support column 111 by laser welding. When using laser welding for fixing, first use lap welding to connect the flat plate 21 and the position where there is no support column 111 together, and then use laser welding for welding. Alternatively, the flat plate 21 is fixedly connected to the position at the bottom of the shell 11 where there is no support column 111 by gluing. Alternatively, the flat plate 21 is fixedly connected to the position at the bottom of the shell 11 where there is no support column 111 by screws. These are just three possible examples. The embodiments of the present application do not limit the method for fixing the flat plate 21 to the shell 11. Any method that can fix the flat plate 21 to the shell 11 can be applied to the embodiments of the present application.

[0056] Optionally, when the housing 11 has a support column 111, the optical assembly is assembled as follows:

[0057] During assembly, the flat plate 21 of the fixing structure 2 is fixed to the bottom of the housing 11 at a position without the support column 111. Then, the plurality of pins 22 of the fixing structure 2 are inserted into the corresponding positioning holes on the circuit board 3, and finally fixed by wave soldering.

[0058] It should be noted that in the above scheme, when there is a support column 111 at the bottom of the shell 11, it only describes the case where at least one support column 111 includes one support column 111 and two support columns 111. The case of including more support columns 111 can be set according to actual needs and will not be listed one by one.

[0059] Optionally, the surface of the housing 11 facing the circuit board 3 has a recessed groove 112, allowing the housing 11 to abut against the surface of the circuit board 3 via the recessed groove 112. The sidewalls of the recessed groove 112 have a certain thickness, which improves stability after abutting against the circuit board 3. The depth of the recessed groove 112 is greater than or equal to the thickness of the flat plate 21, and the recessed groove 112 is used to accommodate the flat plate 21 of the fixing structure 2. Thus, because the flat plate 21 is completely contained within the housing 11, the alignment between the housing 11 and the circuit board 3 is achieved solely by the housing 11 itself. Consequently, the optical device 1 does not introduce tolerances inherent to the fixing structure 2 in the board height direction, thereby minimizing the board height tolerance of the optical device 1.

[0060] Alternatively, see Figure 6 and Figure 7 A transistor outline (TO) opening is added to the surface of the housing 11 facing the circuit board 3. The cross-section of the sink 112 is circular, and the size of the opening can be set according to actual needs, such as an outer diameter of 5.6 mm. The flat plate 21 is also a TO tube socket. The flat surface of the TO tube socket is formed by stamping, and the cross-section of the flat plate 21 is circular. Optionally, when the flat plate 21 is a TO tube socket, the flat plate 21 and the plurality of pins 22 can be manufactured as a whole, or they can be manufactured separately and then fixedly connected. For example, the flat plate 21 and the plurality of pins 22 are manufactured separately, and then the flat plate 21 and the plurality of pins 22 are fixedly connected by silver-copper soldering. Here, the surface of the TO tube socket can be flat or non-flat.

[0061] There are many ways to fix the flat panel 21 to the housing 11. Two optional ways are provided below:

[0062] Method 1: When the cross-section of the flat plate 21 is identical to that of the recessed groove 112, the cross-section of the flat plate 21 matches the cross-section area of the recessed groove 112, so that the flat plate 21 is fixed to the recessed groove 112 by a press fit, thereby achieving a fixed connection between the flat plate 21 and the housing 11. The flat plate 21 cannot be exposed from the recessed groove 112, so that the recessed groove 112 abuts the surface of the circuit board 3. Press fit refers to an assembly process that secures components by applying pressure through an interference fit.

[0063] During assembly, the flat plate 21 of the fixed structure 2 is secured to the sidewalls of the sink 112 by press-fitting. The multiple pins 22 of the fixed structure 2 are then inserted into corresponding positioning holes on the circuit board 3, and finally secured using wave soldering. While the flat plate 21 is used as an example here, in other embodiments, the structure of the fixed structure 2 that secures the sidewalls of the sink 112 may not be a planar structure.

[0064] Optionally, when the flat plate 21 is fixed to the recess 112 of the housing 11 by press-fitting, a tinning process is added to the side walls of the flat plate 21 to achieve a better fixing effect. In this way, laser welding can be performed on the outside of the recess 112 to weld the side walls of the flat plate 21 to the inner walls of the recess 112, thereby enhancing the reliability of the fixed connection. During assembly, the flat plate 21 of the fixed structural member 2 is fixed to the side walls of the recess 112 by press-fitting, and laser welding is performed on the outside of the recess 112 to enhance reliability. Then, the multiple pins 22 of the fixed structural member 2 are inserted into the corresponding positioning holes on the circuit board 3, and finally fixed by wave soldering. Here, laser welding includes but is not limited to penetration welding.

[0065] In a second embodiment, the bottom of the sink 112 is flat, and the flat plate 21 is fixedly connected to the bottom of the sink 112, and the flat plate 21 cannot be exposed from the sink 112, so that the sink 112 abuts the surface of the circuit board 3. For example, the flat plate 21 is fixedly connected to the bottom of the sink 112 by laser welding, or by gluing, or by screws.

[0066] During assembly, the flat plate 21 of the fixed structure 2 is fixed to the bottom of the sink 112. Then, the plurality of pins 22 of the fixed structure 2 are inserted into the corresponding positioning holes on the circuit board 3, and finally fixed by wave soldering.

[0067] The cross-section of the flat plate 21 may be circular, square, or other shapes, as long as the cross-section area of the flat plate 21 is smaller than the bottom area of the sink 112 .

[0068] Optionally, in order to facilitate the insertion of the fixed structural member 2 into the sink groove 112 and insert it into the corresponding position, a positioning groove is provided on the side wall of the flat plate 21, and the positioning groove is a U-shaped groove, a V-shaped groove or a rectangular groove, etc., and a corresponding protrusion of a matching shape is provided on the inner wall of the sink groove 112 to be used for positioning the fixed structural member 2 when it is inserted into the sink groove 112.

[0069] Optionally, there may be one or more positioning grooves provided on the side wall of the flat plate 21. For example, the number of the positioning grooves is 3, and the 3 positioning grooves are equidistantly provided.

[0070] In one embodiment, circuit board 3 is a printed circuit board (PCB), which is a circuit board in an optical communication device to which the optical component belongs. Circuit board 3 includes a physical (PHY) chip and a media access control (MAC) chip.

[0071] In an optional embodiment, the optical device 1 and the circuit board 3 are also electrically connected to transmit electrical signals. For example, the optical emitting assembly is electrically connected to the circuit board 3 via a flexible circuit board. The optical emitting assembly receives the electrical signal to be transmitted by the optical emitting assembly through the flexible circuit board, converts the electrical signal to an optical signal, and then transmits the optical signal. The optical receiving assembly is electrically connected to the circuit board 3 via pins. After receiving the optical signal, the optical receiving assembly converts the optical signal to an electrical signal and transmits it to the circuit board 3 for processing.

[0072] In the above diagram of the optical component, the front view of the optical component is shown. Figure 2 、 Figure 4 and Figure 6 In the optical device 1 shown, the rightmost side is the light emitting component, the middle circle is the light receiving component, and the leftmost side is the optical fiber protective cover. In addition, the structure of the optical device 1 is not limited in the embodiment of the present application.

[0073] Embodiments of the present application also provide an optical communication device, including but not limited to an optical access network device. The optical access network device may be an optical network unit (ONU) or an optical network terminal (ONT), and the following description uses an ONT as an example. For example, the ONT is an access device in a fiber-to-the-home or fiber-to-the-office (FTTH / O) network. For another example, the ONT is a fiber-to-the-room (FTTR) device. The FTTR device may be a master device or a slave device in an FTTR network. The master device may also be referred to as a "master gateway," "master optical modem," or "main FTTR unit (MFU)." The slave device may also be referred to as a "sub-gateway," "sub-optical modem," or "sub-FTTR unit (SFU)."

[0074] In FTTH / O networks, the optical line terminal (OLT) is deployed in a central computer room, while the ONT is deployed in homes or offices. The master device in an FTTR network serves as both the ONT in the FTTH network and as an upstream device for the slave devices, managing them. The master device connects to the OLT via a passive optical network (PON) interface. The slave devices in an FTTR network can be deployed in various rooms in a home or office, providing signals to user terminals. The slave devices function as both ONTs and wireless access points (APs), connecting to user terminals via user network interfaces. The master device also functions as an ONT and a wireless AP.

[0075] See also Figure 8 In an FTTR network, multiple sub-devices can be deployed, each connected to a master device via an optical splitter. The master device can centrally manage and configure all sub-devices.

[0076] The optical communication equipment includes an optical component of any of the structures described above and a shielding cover, etc. The shielding cover is used to cover the optical component to shield electromagnetic radiation, etc.

[0077] Optionally, the ONT may be a single-mode device or a multi-mode device. For example, the single-mode device includes, but is not limited to, a 50G PON ONT, a 10G PON ONT, or a gigabit-capable PON (GPON) ONT, while the multi-mode device is an ONT that integrates at least two of the network functions of 50G PON, 10G PON, and GPON.

[0078] All of the above optional technical solutions can be combined in any way to form optional embodiments of the present application, and will not be described in detail here.

[0079] The above description is merely an exemplary embodiment of the present application, but the scope of protection of the present application is not limited thereto. Any person skilled in the art can easily conceive of various equivalent modifications or substitutions within the technical scope disclosed in this application, and such modifications or substitutions should be included in the scope of protection of this application. Therefore, the scope of protection of this application should be based on the scope of protection of the claims.

Claims

1. An optical component, characterized in that: The optical assembly comprises an optical device (1), a fixed structural component (2) and a circuit board (3); The optical device (1) and the fixing structure (2) are both located on the surface of the circuit board (3), and the housing (11) of the optical device (1) is fixed on the surface of the circuit board (3) via the fixing structure (2); The fixing structure (2) is located between the housing (11) and the circuit board (3), and the housing (11) abuts against the surface of the circuit board (3).

2. The optical assembly according to claim 1, wherein: The fixed structural member (2) has a flat plate (21); The flat plate (21) is fixedly connected to the housing (11), and the flat plate (21) is fixedly connected to the circuit board (3).

3. The optical assembly according to claim 2, wherein: The bottom of the housing (11) has at least one support column (111), and the height of the at least one support column (111) is greater than or equal to the thickness of the flat plate (21); The at least one supporting column (111) abuts against the surface of the circuit board (3).

4. The optical assembly according to claim 3, wherein: The at least one supporting column (111) comprises two supporting columns (111) positioned opposite to each other; The two support columns (111) are used to accommodate the flat plate (21).

5. The optical assembly according to claim 3, wherein: The flat plate (21) has a through hole; The at least one support column (111) comprises a support column (111); The one supporting column (111) passes through the through hole and abuts against the surface of the circuit board (3).

6. The optical assembly according to any one of claims 3 to 5, characterized in that: The flat plate (21) is fixedly connected to the bottom of the shell (11) at a position where no support column (111) is provided by laser welding.

7. The optical assembly according to claim 2, wherein: A surface of the housing (11) facing the circuit board (3) has a sink groove (112); The depth of the sink (112) is greater than or equal to the thickness of the flat plate (21); the sink (112) is used to accommodate the flat plate (21).

8. The optical assembly according to claim 7, wherein: The cross-section of the sink (112) is circular, and the shape of the flat plate (21) is circular.

9. The optical assembly according to claim 7 or 8, characterized in that: The flat plate (21) is fixedly connected to the side wall of the sink (112) by means of press-fitting.

10. The optical assembly according to claim 9, wherein: The flat plate (21) and the side wall of the sink (112) are also fixedly connected by laser welding.

11. The optical assembly according to any one of claims 2 to 5, 7 and 8, characterized in that: The fixed structure (2) further has a plurality of pins (22), and the flat plate (21) is plugged onto the circuit board (3) via the plurality of pins (22) and fixed by wave soldering.

12. An optical communication device, characterized in that: The optical communication device comprises the optical component according to any one of claims 1 to 11.

Images