Novel electronic tag

Abstract

The utility model discloses a novel electronic tag, which comprises a radio frequency identification (RFID) chip and a flexible circuit board arranged below the RFID chip, and the RFID chip is mounted on the flexible circuit board through an upside-down mounting process. The RFID chip is mounted on the flexible circuit board by adopting an inverted mounting process, so that the purposes of improving the heat dissipation performance of the electronic tag, improving the stability of the electronic tag and reducing the production cost of the electronic tag are achieved.

Description

Technical Field

[0001] The utility model relates to the field of production and application of electronic tags, in particular to a new type of electronic tag. Background Art

[0002] RFID (Radio Frequency Identification), commonly known as electronic tags, is a technology used to identify and track objects. It consists of a microchip and an antenna. It automatically identifies the target object and obtains relevant data through radio frequency signals, and can be used to store and transmit data.

[0003] Current RFID packaging technology, while the chip circuitry is relatively simple, typically involves face-up bonding followed by plastic encapsulation and flip-chip mounting, and then attachment to a flexible printed circuit board via surface-mount mounting (SMT). This traditional packaging technique results in the following drawbacks for RFID chips: 1. Low heat dissipation; 2. Low reliability, which can easily damage the bond wire neck; and 3. High cost.

[0004] How to overcome the technical problems in traditional processes is a technical problem that needs to be solved urgently at this stage.

[0005] Explanation of relevant terms:

[0006] 1.RFID: (Radio Frequency Identification) radio frequency identification.

[0007] 2.PAD: Pass ivat ion opening.

[0008] 3.UMB: (under bump metallization) bump bottom metallization.

[0009] 4. Bump: A bump that provides a window for electrical interconnection of the chip.

[0010] 5.SIM: (Subscriber Identity Module) subscriber identification card.

[0011] The information disclosed in this background technology section is only intended to deepen the understanding of the overall background technology of the present invention, and should not be regarded as an admission or any form of suggestion that the information constitutes the prior art already known to those skilled in the art. Utility Model Content

[0012] In order to solve the above technical problems, the present invention proposes a new type of electronic tag to achieve the purpose of improving the heat dissipation performance of the electronic tag, increasing the stability of the electronic tag and reducing the production cost of the electronic tag.

[0013] In order to achieve the above-mentioned purpose, the technical solution of the present utility model is as follows:

[0014] A novel electronic tag comprises an RFID chip and a flexible circuit board arranged below the RFID chip, wherein the RFID chip is mounted on the flexible circuit board through a flip-chip process.

[0015] The utility model achieves the purpose of improving the heat dissipation performance of the electronic tag, increasing the stability of the electronic tag and reducing the production cost of the electronic tag by mounting the RFID chip on the flexible circuit board using a flip-chip process.

[0016] As a further preference, the RFID chip is provided with a plurality of PAD pads, and the PAD pads are metallized.

[0017] As a further preferred embodiment, the PAD pad undergoes metallization treatment by depositing a UBM layer on the surface of the PAD pad. The metal used for the UBM layer is any one of TiW, Au, Ni, and Cu. The UBM layer can extract the PN performance of the semiconductor chip. Depositing a UBM layer on the surface of the PAD pad further improves chip performance and enhances adhesion, providing a secure bonding interface.

[0018] As a further preferred embodiment, the UBM layer is formed with BUMP metal bumps through a BUMP process, and the BUMP metal bumps can improve the electrical connection characteristics of the PAD.

[0019] As a further preference, the material of the BUMP metal bump is Au.

[0020] As a further preference, a groove is provided on the top surface of the BUMP metal protrusion.

[0021] As a further preference, the BUMP metal bump is connected to the antenna via a conductive adhesive.

[0022] The utility model has the following advantages:

[0023] 1. The present invention achieves the purpose of improving the heat dissipation performance of the electronic tag, increasing the stability of the electronic tag and reducing the production cost of the electronic tag by mounting the RFID chip on the flexible circuit board using a flip-chip process.

[0024] 2. The present invention further improves the performance of the chip by depositing a UBM layer on the surface of the PAD pad, and also enhances the adhesion and provides a strong bonding interface. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art.

[0026] Figure 1 This is a schematic structural diagram of a new type of electronic tag disclosed in an embodiment of the present utility model;

[0027] Figure 2 This is a schematic diagram of the layout of the PAD pads in a new type of electronic tag disclosed in an embodiment of the utility model;

[0028] The numbers and letters in the figure represent the corresponding component names:

[0029] 1. RFID chip 2. Flexible circuit board 3. PAD pad 4. BUMP metal bump. DETAILED DESCRIPTION

[0030] The technical solutions in the embodiments of the present invention will be described clearly and completely below with reference to the accompanying drawings in the embodiments of the present invention.

[0031] The utility model provides a novel electronic tag, the working principle of which is to mount an RFID chip on the flexible circuit board using a flip-chip process, thereby achieving the purpose of improving the heat dissipation performance of the electronic tag, improving the stability of the electronic tag and reducing the production cost of the electronic tag.

[0032] The present invention will be further described in detail below with reference to the embodiments and specific implementation methods.

[0033] like Figure 1 and Figure 2 As shown, a new type of electronic tag includes an RFID chip 1 and a flexible circuit board 2 arranged below the RFID chip. Specifically:

[0034] The RFID chip is provided with four PAD pads 3 [the number of PAD pads can be determined according to actual needs during actual operation], and the PAD pads are metallized.

[0035] The specific process of metallization treatment of the PAD pad is to deposit a UBM layer on the surface of the PAD pad, and the metal used in the UBM layer is any one of TiW / Au / Ni / Cu; the UBM layer can bring out the performance of PN in the semiconductor chip.

[0036] Then, a BUMP metal bump 4 is formed on the UBM layer through a BUMP process [BUMP metal bump types include Solder Bump, Copper Pillar Bump and Gold Bump]. The BUMP metal bump can metal-pad the electrical connection characteristics of the PAD.

[0037] The BUMP metal bump is made of Au (or Cu or Ni). A groove is formed on the top surface of the BUMP metal bump. The BUMP metal bump is connected to the antenna via conductive adhesive.

[0038] Finally, the RFID chip with the BUMP metal bumps is mounted on the flexible circuit board through a flip-chip process.

[0039] After the RFID chip is bumped, the flip-chip process is directly used to attach the electronic tag, eliminating the plastic packaging shell after wire bonding, reducing the height and weight, and reducing the overall size of the RFID chip. Since the RFID is directly flip-chip attached to the flexible circuit board without interconnecting wires, the parasitic inductance, resistance and capacitance are reduced, thereby ensuring smaller signal delay, better high frequency and better thermal channel on the back of the wafer. The flip-chip process only requires a probe test map to identify the chip during the processing, so the Bump process can greatly reduce costs [traditional shell and tube packaging processing requires not only wire bonding, but also an FT test process to ensure that the chips damaged during the shell and tube packaging process are removed. This cost is higher than the technical solution provided by the present invention].

[0040] By adopting the flip-chip direct patch method, RFID can be widely used in various industries, including retail, logistics, healthcare and other fields. The details are as follows:

[0041] Application 1: Interactive smart tags. These tags consist of a single-chip wireless micropower transceiver and a single-chip microcontroller. Using a bump process for flip-chip packaging, the tag's size can be further reduced, signal transmission is faster, and power consumption is lower, enabling ultra-low-power wireless long-distance transmission.

[0042] Application 2: Spatial Positioning and Tracking. RFID technology provides a new solution for spatial positioning and tracking services, particularly for indoor positioning, which satellite positioning systems struggle to address. It leverages the unique identification capabilities of tags and the low latency of bump-mount mounting to measure an object's spatial location based on the radio frequency signal strength between the reader and the tag attached to the object.

[0043] Application three: Mobile payments. RFID mobile payments are the product of the integration of the RFID and telecommunications industries. RF-SIM is a medium- and short-range wireless communication technology based on SIM cards. It involves flip-chipping an RFID chip inside the SIM card to establish a connection with the mobile device. RF-SIM cards are compatible with all mobile phones on the market, providing a comprehensive service platform that can replace wallets, keys, and ID cards.

[0044] Application 4: Anti-counterfeiting labels. Traditional anti-counterfeiting technologies such as physical, biometric, structural, barcode, and digital technologies lack true uniqueness and exclusivity, are easily copied, and therefore offer no real anti-counterfeiting effect. RFID electronic tag technology offers an absolute advantage in anti-counterfeiting, as each tag has a unique ID number that cannot be modified or counterfeited. RFID anti-counterfeiting labels also offer resistance to physical wear, a highly secure reader / writer interface, encrypted tag data, and mutual authentication between the reader / writer and the tag, making them impossible to copy. Currently, RFID anti-counterfeiting is gaining application in areas such as document management, ticket management, and electronic license plates.

[0045] Through the above method, the new electronic tag provided by the present invention achieves the purpose of improving the heat dissipation performance of the electronic tag, improving the stability of the electronic tag and reducing the production cost of the electronic tag by mounting the RFID chip on the flexible circuit board using a flip-chip process.

[0046] The above is only a preferred embodiment of a new type of electronic tag disclosed in the present invention. It should be pointed out that for ordinary technicians in this field, several modifications and improvements can be made without departing from the creative concept of the present invention, and these all fall within the scope of protection of the present invention.

Claims

1. A new type of electronic tag, characterized in that: It includes an RFID chip and a flexible circuit board arranged below the RFID chip, wherein the RFID chip is mounted on the flexible circuit board by a flip-chip process; The RFID chip is provided with a plurality of PAD pads, and the PAD pads are metallized; The PAD pad undergoes metallization treatment, specifically depositing a UBM layer on the surface of the PAD pad, wherein the metal used in the UBM layer is any one of TiW / Au / Ni / Cu; the UBM layer can bring out the performance of the PN in the semiconductor chip; The UBM layer is formed with BUMP metal bumps by generating a BUMP process, and the BUMP metal bumps can metal-pad the electrical connection characteristics of the PAD; The material of the BUMP metal bump is Au; The top surface of the BUMP metal bump is provided with a groove; The BUMP metal bump is connected to the antenna via conductive glue.

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