Wafer cleaning device and wafer packaging equipment

Abstract

The utility model discloses a wafer cleaning device and wafer packaging equipment, the wafer cleaning device comprises a cleaning tank, a cover plate assembly and a spraying assembly, a material basket for loading wafers is placed in the cleaning tank, and the cover plate assembly is installed and covers an upper opening of the cleaning tank in an openable and closable manner. The spraying assembly is installed on the cover plate assembly, a spraying opening faces the interior of the cleaning tank, and the spraying angle of the spraying opening of the spraying assembly for spraying the cleaning liquid into the cleaning tank is changed through the cover plate assembly. According to the technical scheme of the utility model, the spraying angle of the nozzle can be changed in the wafer cleaning process, and the uniformity of the spraying surface can be improved by the movement of the nozzle, so that the cleaning effect of the wafer is better, the wafer can be cleaned more comprehensively without dead angles and blind areas, and impurities or stains stubborn on the wafer can be removed more thoroughly.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer equipment, in particular to a wafer cleaning device and wafer packaging equipment. Background Art

[0002] A wafer is the substrate used to manufacture semiconductor transistors or integrated circuits. It is a crystalline material, round in shape, hence the name. The wafer storage basket used in automated wafer processing equipment in the semiconductor industry is a multi-layered, slotted structure.

[0003] Wafer cleaning is a crucial process in the wafer packaging process. Optimizing wafer cleaning performance and ensuring comprehensive cleaning of all wafer areas are key research topics that require continuous improvement. In existing wafer cleaning processes, wafers are placed in a cleaning tank and then cleaned using ultrasonic vibration and cleaning fluid immersion. While this process removes most impurities and stains, some impurities and stains remain stubbornly attached to the wafer due to the constant immersion in the cleaning fluid, impacting the cleaning effect. Utility Model Content

[0004] One of the purposes of the present invention is to overcome the deficiencies in the prior art. In view of the problem in the prior art that impurities or stains still remain on the wafer when the wafer is immersed in a cleaning liquid for cleaning, a wafer cleaning device and a wafer packaging device are provided.

[0005] To achieve the above objectives, the present invention is implemented through the following technical solutions:

[0006] In the first aspect, the utility model provides a wafer cleaning device, comprising a cleaning tank, a cover assembly and a spray assembly, wherein a basket loaded with wafers is placed in the cleaning tank, the cover assembly is installed and can be opened and closed to cover the upper opening of the cleaning tank, the spray assembly is installed on the cover assembly with the nozzle facing into the cleaning tank, and the cover assembly is used to change the spray angle of the nozzle of the spray assembly to spray cleaning liquid into the cleaning tank.

[0007] In a preferred embodiment of the present application, the spray assembly includes a liquid storage tank and several nozzles, each of the nozzles has the nozzle, the liquid storage tank is used to store cleaning liquid, and the nozzles are connected to the liquid storage tank and deliver cleaning liquid to the nozzles.

[0008] In a preferred embodiment of the present application, the nozzle is rotatably provided on the liquid storage tank, and the spraying angle of the nozzle is adjusted by rotating the nozzle.

[0009] In a preferred embodiment of the present application, a plurality of nozzles are arranged in a row on the liquid storage tank, and the distance between two adjacent nozzles is equal.

[0010] In a preferred embodiment of the present application, the liquid storage tank is located above the cover plate assembly, and the nozzle is arranged below the cover plate assembly.

[0011] In a preferred embodiment of the present application, a liquid replenishing port is provided on the side of the liquid storage tank, and a control valve is provided on the liquid replenishing port, and the control valve controls the liquid replenishing port to replenish cleaning fluid into the liquid storage tank.

[0012] In a preferred embodiment of the present application, the nozzle is a fan-shaped nozzle, a cone-shaped nozzle or a circular cone-shaped nozzle.

[0013] In a preferred embodiment of the present application, the cover plate assembly includes a flip plate and a folding plate, the flip plate is flipably connected to the edge of the upper opening of the cleaning tank, the folding plate is foldably connected to the flip plate, and the spray assembly is mounted on the folding plate. By folding the folding plate relative to the flip plate into the cleaning tank and unfolding away from the cleaning tank, the nozzle of the spray assembly is driven to reciprocate between a first direction facing the wafer in the material basket and a second direction facing the inner wall of the cleaning tank to change the spray angle.

[0014] In a preferred embodiment of the present application, the number of the flip plates is two, and the two flip plates are respectively connected to two opposite edges of the upper opening of the cleaning tank. The number of the folding plates is at least two, and the folding plate is located between the two flip plates. The spray assembly is installed on each folding plate.

[0015] When the cover assembly is in a closed state, the flip plate lies flat on the upper opening, the folding plates are butted against each other to close the upper opening of the cleaning tank, and the spray angle is in the first direction;

[0016] When the cover assembly is in a half-open state, the flip plate flips up toward the edge, driving the folding plate to unfold toward the edge, a first angle is formed between the flip plate and the folding plate, and the spray assembly is in the second orientation.

[0017] In a second aspect, the present invention provides a wafer packaging device, comprising a plurality of wafer cleaning devices as described in the first aspect.

[0018] The wafer cleaning device and wafer packaging equipment disclosed in the utility model can change the spray angle of the nozzle during the wafer cleaning process. The movement of the nozzle can improve the uniformity of the spray surface, thereby achieving a better cleaning effect on the wafer. The wafer can be cleaned more comprehensively without dead angles or blind spots, and stubborn impurities or stains on the wafer can be removed more thoroughly. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] The present invention is described with the help of the following drawings:

[0020] Figure 1 It is a structural schematic diagram of a wafer packaging device in an embodiment of the present utility model;

[0021] Figure 2 This is a schematic structural diagram of the wafer cleaning device in an embodiment of the present invention when it is in a closed state;

[0022] Figure 3 This is a schematic diagram of the interior of the wafer cleaning device according to an embodiment of the present invention when it is in a closed state;

[0023] Figure 4 This is a structural schematic diagram of the wafer cleaning device in an embodiment of the present invention when it is in a half-open state;

[0024] Figure 5 It is a schematic diagram of the interior of the wafer cleaning device of the embodiment of the present invention when it is in a half-open state.

[0025] Reference numerals:

[0026] 1-wafer packaging equipment; 2-wafer cleaning device; 3-material basket; 4-wafer;

[0027] 10-cleaning tank; 11-upper opening; 20-cover assembly; 21-flip plate; 22-folding plate; 30-spray assembly; 31-liquid storage tank; 32-nozzle; 33-nozzle; 34-liquid filling port; 35-control valve; 40-spray angle; 41-edge part; 42-center part; D1-first direction; D2-second direction; α-first angle. DETAILED DESCRIPTION

[0028] In order to better understand the technical solution of the present application, the embodiments of the present application are described in detail below with reference to the accompanying drawings.

[0029] It should be clear that the embodiments described are only part of the embodiments of this application, not all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of this application.

[0030] like Figure 1As shown, an embodiment of the present invention provides a wafer packaging equipment 1, including a plurality of wafer cleaning devices 2, which are arranged in rows, groups or arrays in a cleaning area of the wafer packaging equipment 1 for cleaning wafers 4. When a basket 3 loaded with wafers 4 enters the cleaning area, a wafer cleaning device 2 where no basket 3 has been placed is selected, and the basket 3 is moved to the top of the wafer cleaning device 2 and then lowered to perform a wafer 4 cleaning process. The wafer 4 can be thoroughly cleaned in a comprehensive manner without dead angles through the wafer cleaning device 2, ensuring that stubborn impurities or stains on the wafer 4 can be completely removed.

[0031] like Figures 2 to 5 As shown, the wafer cleaning device 2 of this embodiment includes a cleaning tank 10, a cover assembly 20 and a spray assembly 30. The cleaning tank 10 is a square container, in which a basket 3 loaded with wafers 4 is placed. The cover assembly 20 is installed and can be opened and closed to cover the upper opening 11 of the cleaning tank 10. The cover assembly 20 includes a flip plate 21 and a folding plate 22. The flip plate 21 is flipably connected to the edge of the upper opening 11 of the cleaning tank 10. The folding plate 22 is foldably connected to the flip plate 21. The spray assembly 30 is installed on the folding plate 22. The spray assembly 30 is installed on the cover assembly 20 with the nozzle 33 facing the inside of the cleaning tank 10. The spray assembly 30 includes a liquid storage tank 31 and a plurality of nozzles 32. Each nozzle 32 has a nozzle 33. The liquid storage tank 31 is used to store cleaning liquid. The nozzle 32 is connected to the liquid storage tank 31 and transports cleaning liquid to the nozzle 33. The cover assembly 20 is used to change the spray angle 40 of the nozzle 33 of the spray assembly 30 to spray the cleaning liquid into the cleaning tank 10. The way in which the cover assembly 20 changes the spray angle 40 includes but is not limited to opening and closing the cover assembly 20, providing a driving mechanism on the cover assembly 20 to drive the spray assembly 30 to change the spray angle 40, and providing a sensing mechanism on the cover assembly 20 to adjust the spray angle 40 of the spray assembly 30 in real time.

[0032] In this embodiment, the spray angle 40 of the spray assembly 30 is controlled by the opening and closing movement of the flip plate 21 and folding plate 22 in the cover assembly 20. Specifically, by folding the folding plate 22 relative to the flip plate 21 toward the cleaning tank 10 and unfolding it away from the cleaning tank 10, the nozzle 33 of the spray assembly 30 is driven to reciprocate between a first orientation D1 facing the wafers 4 in the basket 3 and a second orientation D2 facing the inner wall of the cleaning tank 10, thereby changing the spray angle 40. Compared to the side-view spraying method used in traditional cleaning devices, the top-view spraying method used in this embodiment can improve the uniformity of the spray surface, allowing all areas on the wafer 4 to be thoroughly cleaned.

[0033] In the spray assembly 30 of this embodiment, a plurality of nozzles 32 are arranged in a row on the liquid storage tank 31, and the spacing between two adjacent nozzles 32 is equal, so that the cleaning liquid sprayed on each area of the wafer 4 and the spraying pressure it is subjected to are roughly the same. The nozzle 32 is rotatably arranged on the liquid storage tank 31, and the spray angle 40 of the nozzle 33 is adjusted by rotating the nozzle 32, so that the spray angle 40 can be fine-tuned on the basis of coarse adjustment through the opening and closing movement of the cover assembly 20, further improving the cleaning accuracy of the wafer 4. The nozzle 32 is a fan-shaped nozzle 32, a conical nozzle 32, or a conical nozzle 32, with a larger spray surface and a better cleaning effect on the wafer 4. The liquid storage tank 31 is located above the cover assembly 20, and the nozzle 32 is arranged below the cover assembly 20, which is convenient for maintenance without limiting the spray angle 40. A liquid replenishing port 34 is provided on the side of the liquid storage tank 31, and a control valve 35 is provided on the liquid replenishing port 34. The control valve 35 controls the liquid replenishing port 34 to replenish cleaning liquid into the liquid storage tank 31. When the cleaning liquid in the liquid storage tank 31 is scarce or exhausted, cleaning liquid can be quickly and conveniently added to the liquid storage tank 31.

[0034] In the cover assembly 20 of this embodiment, there are two flip plates 21, and the two flip plates 21 are respectively connected to the two opposite edges of the upper opening 11 of the cleaning tank 10. The number of folding plates 22 is at least two. In this embodiment, the number of folding plates 22 is two, and the two folding plates 22 are located between the two flip plates 21. A spray assembly 30 is installed on each folding plate 22.

[0035] See also Figure 2 and Figure 3 When the cover assembly 20 is in a closed state, the flip plate 21 lies flat on the upper opening 11, and the folding plate 22 is docked, that is, the two flip plates 21 and the two folding plates 22 form a flat structure to close the upper opening 11 of the cleaning tank 10. At this time, the spray angle 40 is in the first direction D1, and the first direction D1 is toward most of the surface of the wafer 4. It can be a vertical downward direction, a direction toward the center of the wafer 4, or a direction toward the edge of the wafer 4. Under this first direction D1, the cleaning liquid sprayed from the nozzle 32 can clean most of the surface of the wafer 4 and can remove most impurities or stains on the wafer 4.

[0036] See also Figure 4 and Figure 5When the cover assembly 20 is in a half-open state, the flip plate 21 flips up toward the edge, driving the folding plate 22 to unfold toward the edge. There is a first angle α between the flip plate 21 and the folding plate 22. The first angle α can be an obtuse angle, a right angle or an acute angle, but cannot be 0° or 180°, that is, the two flip plates 21 and the two folding plates 22 are unfolded toward the two edges respectively, and the flip plate 21 and the folding plate 22 on each side form an inverted V shape together, and the lower end of the folding plate 22 and the lower end of the flip plate 21 are flush with the edge of the upper opening 11 of the cleaning tank 10. At this time, the spray assembly 30 is in the second direction D2. The second direction D2 is toward a small part of the surface of the wafer 4, and is an oblique outward direction. Under this second direction D2, the cleaning liquid sprayed from the nozzle 32 can clean those corners of the wafer 4 that are difficult to spray under the first direction D1. Since the spray pressure and cleaning effect of the edge portion 41 and the center portion 42 of the spray surface sprayed by the nozzle 32 are different, the spray pressure of the edge portion 41 is relatively large but the cleaning effect is limited, and it is impossible to achieve comprehensive cleaning of the target area, and some areas in the target area will remain uncleaned. The spray pressure of the center portion 42 is relatively small but the cleaning effect is not thorough enough, and it is impossible to achieve thorough cleaning of the target area, and some areas in the target area where impurities or stains are not completely removed will remain. Therefore, the wafer cleaning device 2 of this embodiment changes the spray angle 40 of the nozzle 32 from the first direction D1 to the second direction D2, so that some areas on the wafer 4 can receive secondary cleaning of the edge portion 41 and the center portion 42 of the spray surface, and the impurities or stains stubbornly attached to the wafer 4 are thoroughly removed, which can avoid cleaning blind spots and improve the cleaning effect of the wafer 4 through secondary cleaning.

[0037] The wafer cleaning device and wafer packaging equipment disclosed in the utility model can change the spray angle of the nozzle during the wafer cleaning process. The movement of the nozzle can improve the uniformity of the spray surface, thereby achieving a better cleaning effect on the wafer. The wafer can be cleaned more comprehensively without dead angles or blind spots, and stubborn impurities or stains on the wafer can be removed more thoroughly.

[0038] It should be understood that the above description of the specific embodiments of the present invention is merely for the purpose of illustrating the technical approach and features of the present invention. Its purpose is to enable those skilled in the art to understand the contents of the present invention and implement them accordingly. However, the present invention is not limited to the above-described specific embodiments. Any changes or modifications made within the scope of the claims of the present invention shall be included within the scope of protection of the present invention.

Claims

1. A wafer cleaning device, characterized in that: It includes a cleaning tank, a cover assembly and a spray assembly. A basket loaded with wafers is placed in the cleaning tank. The cover assembly is installed and can be opened and closed to cover the upper opening of the cleaning tank. The spray assembly is installed on the cover assembly with the nozzle facing the cleaning tank. The cover assembly is used to change the spray angle of the nozzle of the spray assembly to spray cleaning liquid into the cleaning tank.

2. The wafer cleaning device according to claim 1, wherein: The spray assembly includes a liquid storage tank and a plurality of nozzles, each of the nozzles has the nozzle opening, the liquid storage tank is used to store cleaning liquid, and the nozzles are connected to the liquid storage tank and deliver the cleaning liquid to the nozzle opening.

3. The wafer cleaning device according to claim 2, wherein: The nozzle is rotatably arranged on the liquid storage tank, and the spraying angle of the nozzle is adjusted by rotating the nozzle.

4. The wafer cleaning device according to claim 2, wherein: A plurality of nozzles are arranged in a row on the liquid storage tank, and the intervals between two adjacent nozzles are equal.

5. The wafer cleaning device according to claim 2, wherein: The liquid storage tank is located above the cover plate assembly, and the nozzle is arranged below the cover plate assembly.

6. The wafer cleaning device according to claim 2, characterized in that: A liquid replenishing port is provided on the side of the liquid storage tank. A control valve is provided on the liquid replenishing port. The control valve controls the liquid replenishing port to replenish cleaning liquid into the liquid storage tank.

7. The wafer cleaning device according to claim 2, wherein: The nozzle is a fan-shaped nozzle, a cone-shaped nozzle or a circular cone-shaped nozzle.

8. The wafer cleaning device according to claim 1, wherein: The cover plate assembly includes a flip plate and a folding plate, the flip plate is flipably connected to the edge of the upper opening of the cleaning tank, the folding plate is foldably connected to the flip plate, and the spray assembly is mounted on the folding plate. By folding the folding plate relative to the flip plate into the cleaning tank and unfolding away from the cleaning tank, the nozzle of the spray assembly is driven to reciprocate between a first direction facing the wafers in the basket and a second direction facing the inner wall of the cleaning tank to change the spray angle.

9. The wafer cleaning device according to claim 8, characterized in that: There are two flip plates, each of which is connected to two opposite edges of the upper opening of the cleaning tank. There are at least two folding plates, each of which is located between the two flip plates, and each of which is equipped with a spray assembly. When the cover assembly is in a closed state, the flip plate lies flat on the upper opening, the folding plates are connected to each other, the upper opening of the cleaning tank is closed, and the spray angle is in the first direction; when the cover assembly is in a half-open state, the flip plate flips up toward the edge, driving the folding plate to unfold toward the edge, there is a first angle between the flip plate and the folding plate, and the spray assembly is in the second direction.

10. A wafer packaging device, characterized in that: The device comprises a plurality of wafer cleaning devices as described in any one of claims 1 to 9.

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