High-frequency microwave high-density HDI circuit board

Abstract

The utility model belongs to the technical field of circuit boards, and particularly relates to a high-frequency microwave high-density HDI circuit board which comprises an FPC body, a protective cover is movably installed on the upper surface of the FPC body, fixing holes are formed in the surface of the FPC body in a penetrating mode, the fixing holes are symmetrically arranged, positioning columns are movably inserted in inner cavities of the fixing holes, and the positioning columns are fixedly connected with the FPC body. A conical guide seat is fixedly connected to the top of the positioning column, a clamping groove is formed in the connecting position of the conical guide seat and the positioning column, inserting sleeves are welded to the positions, corresponding to the positioning column, of the surface of the outer wall of the protective cover, the top of the positioning column is connected with the inserting sleeves in an inserted mode through the conical guide seat, and limiting protrusions are arranged on the inner walls of the inserting sleeves. The limiting protrusions are connected with the clamping grooves in a clamped mode. The surface of the novel circuit board is protected through the protective cover, protection on the circuit board can be improved, meanwhile, water liquid is prevented from damaging the circuit board, meanwhile, the protective cover can be rapidly installed and detached, and the circuit board can be conveniently maintained.

Description

Technical Field

[0001] The utility model relates to the technical field of circuit boards, in particular to a high-frequency microwave high-density HDI circuit board. Background Art

[0002] Flexible printed circuits (FPCs), made from polyimide or polyester film, are highly reliable and flexible printed circuit boards (PCBs). These FPCs, often referred to as flexible printed circuit boards (FPCs), feature high wiring density, light weight, and thin thickness. High-density interconnect (HDI) manufacturing is the fastest-growing segment in the PCB industry. HDI utilizes micro-blind and buried via technology to achieve a high wiring density. The rapid development of PCB components, which require ever-smaller PCB feature sizes, is driving strong demand for HDI PCBs.

[0003] The invention patent, currently published with the publication number CN219437378U, discloses a high-frequency microwave printed high-density HDI circuit board. The clamping device not only improves the installation and removal efficiency of the HDI circuit board, but also avoids the need for punching and fixing the HDI circuit board, thereby improving the performance of the HDI circuit board. The heat dissipation performance of the HDI circuit board is improved by using a heat dissipation device to dissipate heat from the upper surface of the HDI circuit board and a heat conduction device to dissipate heat from the lower portion of the HDI circuit board. This solves the problem that most HDI circuit boards require mounting holes for installation, which not only easily damages the circuit board and affects the layout of the circuit board's control lines, but also uses screws to fix the HDI circuit board, which also reduces the installation and removal efficiency of the HDI circuit board.

[0004] The surface of the existing PCB circuit board is protected by installing a protective cover, which is adhered to the surface of the circuit board with glue. When the circuit board fails, the glue layer needs to be heated for removal, and glue needs to be applied again during installation, which makes disassembly and assembly very inconvenient. To solve the above problems, this application proposes a high-frequency microwave high-density HDI circuit board. Utility Model Content

[0005] (1) Purpose of the utility model

[0006] In order to solve the technical problems existing in the background technology, the utility model proposes a high-frequency microwave high-density HDI circuit board. The surface of the circuit board is protected by a protective cover, which can improve the protection of the circuit board and prevent water from damaging the circuit board. At the same time, the protective cover can be quickly installed and removed, which can facilitate the maintenance of the circuit board, thereby solving the problems raised in the background technology.

[0007] (2) Technical solution

[0008] To solve the above technical problems, the utility model provides a high-frequency microwave high-density HDI circuit board, comprising an FPC body, a protective cover movably mounted on the upper surface of the FPC body, fixing holes penetrating the surface of the FPC body, the fixing holes being symmetrically arranged, positioning posts movably inserted into the inner cavities of the fixing holes, a conical guide seat being fixedly connected to the top of the positioning post, and a slot being provided at the connection between the conical guide seat and the positioning post;

[0009] A plug-in sleeve is welded at the position corresponding to the outer wall surface of the protective cover and the position of the positioning column. The top of the positioning column is plugged into the plug-in sleeve through a conical guide seat. A limiting protrusion is provided on the inner wall of the plug-in sleeve, and the limiting protrusion is plugged into the slot.

[0010] Preferably, the bottom of each positioning column is fixedly connected with an expansion cone, and the expansion cone is located on the lower surface of the FPC body.

[0011] Preferably, the bottom surface of the conical guide seat is chamfered.

[0012] Preferably, an embedding groove is provided on the surface of the FPC body, and a rubber plug-in frame is movably plugged into the inner cavity of the embedding groove.

[0013] Preferably, a rubber frame is embedded in the bottom surface of the protective cover, and the rubber frame is plugged into a rubber plug-in frame.

[0014] Preferably, both end surfaces of the protective cover are provided with raised grooves, and the raised grooves are symmetrically distributed.

[0015] Preferably, warping supports are provided on the surface of the FPC body at positions corresponding to the warping grooves.

[0016] The above technical solution of the utility model has the following beneficial technical effects:

[0017] 1. In the present invention, the protective cover is covered on the surface of the FPC body, and the two ends of the protective cover are plugged into the positioning columns through the plug-in sleeves, and the limiting protrusions are snapped into the card slots, so that the protective cover can be quickly installed. At this time, the bottom of the protective cover is plugged into the rubber plug-in frame through the rubber frame. The rubber frame and the rubber plug-in frame can be matched to seal the connection between the protective cover and the FPC body. The protective cover not only protects the electronic components on the surface of the FPC body, but also prevents water from damaging the electronic components.

[0018] 2. In the present invention, one end of the crowbar is inserted into the tilting groove, and the fulcrum of the crowbar is in contact with the tilting support. The crowbar can tilt the protective cover by using the lever principle, and guide the limiting protrusion by chamfering, so that the limiting protrusion can be quickly separated from the slot, thereby realizing the rapid disassembly of the protective cover. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 This is a schematic diagram of the overall structure of a high-frequency microwave high-density HDI circuit board of the utility model;

[0020] Figure 2 This is a schematic diagram of the FPC body structure of a high-frequency microwave high-density HDI circuit board of the utility model;

[0021] Figure 3 This is a schematic diagram of the cross-sectional structure of a high-frequency microwave high-density HDI circuit board of the utility model;

[0022] Figure 4 This is a schematic diagram of the protective cover structure of a high-frequency microwave high-density HDI circuit board of the utility model;

[0023] Figure 5 This is a schematic diagram of the plug-in sleeve structure of a high-frequency microwave high-density HDI circuit board of the utility model;

[0024] Figure 6 The utility model is a schematic diagram of the positioning column structure of a high-frequency microwave high-density HDI circuit board.

[0025] Reference numerals:

[0026] 1. FPC body; 2. Protective cover; 3. Fixing hole; 4. Positioning column; 5. Expansion cone; 6. Card slot; 7. Conical guide seat; 8. Chamfer; 9. Connector sleeve; 10. Limiting protrusion; 11. Rubber connector frame; 12. Rubber frame; 13. Warping groove; 14. Warping support. DETAILED DESCRIPTION

[0027] To make the objectives, technical solutions, and advantages of the present invention more clearly understood, the present invention is further described below in conjunction with specific embodiments and with reference to the accompanying drawings. It should be understood that these descriptions are merely illustrative and are not intended to limit the scope of the present invention. Furthermore, descriptions of known structures and technologies are omitted in the following description to avoid unnecessary confusion regarding the concepts of the present invention.

[0028] like Figure 1-6 As shown, the utility model proposes a high-frequency microwave high-density HDI circuit board, including an FPC body 1, a protective cover 2 is movably installed on the upper surface of the FPC body 1, and fixing holes 3 are opened through the surface of the FPC body 1. The fixing holes 3 are symmetrically arranged. The inner cavities of the fixing holes 3 are all movably inserted with positioning posts 4. The tops of the positioning posts 4 are fixedly connected to conical guide seats 7. A card slot 6 is opened at the connection between the conical guide seats 7 and the positioning posts 4;

[0029] A plug-in sleeve 9 is welded on the outer wall surface of the protective cover 2 at the position corresponding to the positioning column 4. The top of the positioning column 4 is plugged into the plug-in sleeve 9 through a conical guide seat 7. A limiting protrusion 10 is provided on the inner wall of the plug-in sleeve 9, and the limiting protrusion 10 is engaged with the card slot 6.

[0030] It should be noted that the protective cover 2 is covered on the surface of the FPC body 1, and the two ends of the protective cover 2 are plugged into the positioning column 4 through the plug-in sleeve 9, and the limiting protrusion 10 is plugged into the card slot 6, which can realize the quick installation of the protective cover 2. At this time, the bottom of the protective cover 2 is plugged into the rubber plug-in frame 11 through the rubber frame 12. The rubber frame 12 and the rubber plug-in frame 11 are matched to seal the connection between the protective cover 2 and the FPC body 1. The protective cover 2 not only protects the electronic components on the surface of the FPC body 1, but also prevents water from damaging the electronic components.

[0031] In this embodiment, if Figure 6 As shown, the bottom of each positioning column 4 is fixedly connected with an expansion cone 5 , and the expansion cone 5 is located on the lower surface of the FPC body 1 .

[0032] It should be noted that the expansion cone 5 expands after passing through the fixing hole 3 , and can fix the positioning post 4 on the FPC body 1 , and the protective cover 2 covers the surface of the FPC body 1 .

[0033] In this embodiment, if Figure 2 and Figure 4 As shown, the surface of the FPC body 1 is provided with an embedding groove, the inner cavity of the embedding groove is movably plugged with a rubber plugging frame 11 , and the bottom surface of the protective cover 2 is embedded with a rubber frame 12 , which is plugged into the rubber plugging frame 11 .

[0034] It should be noted that the connection between the rubber frame 12 and the rubber plug-in frame 11 can improve the sealing performance of the connection between the protective cover 2 and the FPC body 1 .

[0035] In this embodiment, if Figure 3 and Figure 4 As shown, the bottom surface of the conical guide seat 7 is provided with a chamfer 8, the surfaces of both ends of the protective cover 2 are provided with a tilting groove 13, the tilting grooves 13 are symmetrically distributed, and the surface of the FPC body 1 corresponding to the position of the tilting grooves 13 is provided with a tilting support 14.

[0036] It should be noted that one end of the crowbar is inserted into the tilting groove 13, and the fulcrum of the crowbar is in contact with the tilting support 14. The crowbar can use the lever principle to tilt the protective cover 2, and guide the limiting protrusion 10 through the chamfer 8, so that the limiting protrusion 10 can be quickly separated from the slot 6, thereby realizing the rapid disassembly of the protective cover 2.

[0037] The working principle and use process of the utility model are as follows: the bottom of the positioning column 4 is plugged into the fixing hole 3 through the expansion cone 5, and the expansion cone 5 expands after penetrating the fixing hole 3, which can fix the positioning column 4 on the FPC body 1, and the protective cover 2 is covered on the surface of the FPC body 1. The two ends of the protective cover 2 are plugged into the positioning column 4 through the plug-in sleeve 9, and the limiting protrusion 10 is snapped into the card slot 6, which can realize the rapid installation of the protective cover 2. At this time, the bottom of the protective cover 2 is plugged into the rubber plug-in frame 11 through the rubber frame 12, and the rubber frame 12 is connected to the protective cover 2. The rubber plug-in frame 11 can be matched to seal the connection between the protective cover 2 and the FPC body 1. The protective cover 2 not only protects the electronic components on the surface of the FPC body 1, but also prevents water from damaging the electronic components. One end of the crowbar is inserted into the tilting groove 13, and the fulcrum of the crowbar is against the tilting support 14. The crowbar can use the lever principle to tilt the protective cover 2, and guide the limiting protrusion 10 through the chamfer 8, so that the limiting protrusion 10 can be quickly separated from the card slot 6, thereby realizing rapid disassembly of the protective cover 2.

[0038] It should be understood that the above-described specific embodiments of the present invention are merely illustrative of or explanation of the principles of the present invention and do not constitute limitations of the present invention. Therefore, any modifications, equivalent substitutions, improvements, etc. made without departing from the spirit and scope of the present invention shall be included within the scope of protection of the present invention. In addition, the appended claims of the present invention are intended to cover all variations and modifications that fall within the scope and metes and bounds of the appended claims or their equivalents.

Claims

1. A high-frequency microwave high-density HDI circuit board, comprising an FPC body (1), characterized in that: A protective cover (2) is movably mounted on the upper surface of the FPC body (1); fixing holes (3) are provided through the surface of the FPC body (1); the fixing holes (3) are symmetrically arranged; positioning posts (4) are movably inserted into the inner cavities of the fixing holes (3); a conical guide seat (7) is fixedly connected to the top of the positioning post (4); a slot (6) is provided at the connection between the conical guide seat (7) and the positioning post (4); A plug-in sleeve (9) is welded to the outer wall surface of the protective cover (2) at a position corresponding to the position of the positioning column (4); the top of the positioning column (4) is plugged into the plug-in sleeve (9) through a conical guide seat (7); a limiting protrusion (10) is provided on the inner wall of the plug-in sleeve (9); and the limiting protrusion (10) is engaged with the card slot (6).

2. A high-frequency microwave high-density HDI circuit board according to claim 1, characterized in that: The bottoms of the positioning columns (4) are fixedly connected to expansion cones (5), and the expansion cones (5) are located on the lower surface of the FPC body (1).

3. A high-frequency microwave high-density HDI circuit board according to claim 2, characterized in that: The bottom surface of the conical guide seat (7) is provided with a chamfer (8).

4. A high-frequency microwave high-density HDI circuit board according to claim 3, characterized in that: An embedding groove is provided on the surface of the FPC body (1), and a rubber plug-in frame (11) is movably plugged into the inner cavity of the embedding groove.

5. The high-frequency microwave high-density HDI circuit board according to claim 4, characterized in that: A rubber frame (12) is embedded in the bottom surface of the protective cover (2), and the rubber frame (12) is plugged into the rubber plug-in frame (11).

6. The high-frequency microwave high-density HDI circuit board according to claim 5, characterized in that: Both ends of the protective cover (2) have warping grooves (13) formed on their surfaces, and the warping grooves (13) are symmetrically distributed.

7. The high-frequency microwave high-density HDI circuit board according to claim 6, characterized in that: Warping supports (14) are provided at positions on the surface of the FPC body (1) corresponding to the positions of the warping grooves (13).

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