Novel fin heat dissipation device applied to inverter

Abstract

The utility model relates to a novel fin heat dissipation device applied to an inverter, which is designed for solving the technical problems that the existing similar products are inconvenient to produce and poor in heat dissipation, heat transfer, heat conduction and heat exchange effects, and particularly, the fin structure and the structure of a heat conduction piece embedded into fins need to be further improved. The novel fin heat dissipation device comprises a heat conduction substrate, a first heat conduction piece, a second heat conduction piece and a fin module, the LED lamp is characterized in that at least one first heat conduction piece is arranged in a matching groove in one side face of the heat conduction substrate and is provided with a heat source heat absorption section and another heat source heat dissipation section; the other side face of the heat conduction substrate is provided with at least one second heat conduction piece and is connected to the fin module in a heat conduction mode, a substrate heat absorption section of the second heat conduction piece is connected to the side face of the heat conduction substrate in a heat conduction mode, and the second heat conduction piece is provided with a substrate heat dissipation section which is bent and extends away from the heat conduction substrate. And the fin module is embedded into the substrate heat absorption section and the substrate heat dissipation section of the second heat conduction piece and is integrally connected with the substrate heat absorption section and the substrate heat dissipation section.

Description

Technical Field

[0001] The utility model relates to a heat dissipation device, which is a novel fin heat dissipation device applied to an inverter. Background Art

[0002] Nowadays, with the continuous development of the new energy industry, the power consumption of IGBT power modules on inverters is increasing. Traditional heat sinks, such as skived-tooth heat sinks and skived-tooth buried heat pipe heat sinks, can no longer meet the growing demand for heat dissipation. In particular, IGBT power modules have a large instantaneous power consumption factor. Due to the linear thermal conductivity of metal, traditional heat sinks are no longer able to conduct and dissipate the huge amount of heat generated instantly when the IGBT power module is working, thus affecting the normal operation of the IGBT power module. Fin heat sinks are an existing heat dissipation technology, which mainly includes a fin module and a thermal conductive substrate. This type of heat sink is mostly used in the PC industry or server industry for heat-generating components such as CPUs. It is connected to the thermal conductive substrate and transfers heat to the fins through heat conduction. Then, heat exchange is carried out with the help of water-cooling pipes or air-cooling fans to achieve the heat dissipation effect. This type of fin heat sink is rarely used in inverters. For example, Chinese patent application number 202110753929.1, published on September 24, 2021, is titled "Continuously Useable Temperature-Controlled Inverter Power Supply Based on Fin Heat Dissipation." Another example is Chinese patent application number 201810761218.7, published on December 14, 2018, titled "A Statically Balanced Inverter IGBT Packaging Structure." However, these and similar products are difficult to produce, and their heat dissipation, heat transfer, and heat conduction, as well as their exchange performance, are suboptimal. The fin structure, in particular, and the structure in which the heat conductor is embedded within the fin, require further improvement. Summary of the Invention

[0003] To overcome the aforementioned shortcomings, the present invention aims to provide a novel fin heat sink for inverters in the field. This device addresses the technical issues of existing similar products, which suffer from production inconvenience, poor heat dissipation, heat transfer, heat conduction, and heat exchange, and particularly from the need for further improvement in the fin structure and the structure in which the heat conductor is embedded within the fin. This objective is achieved through the following technical solution.

[0004] A novel fin heat sink device for an inverter comprises a heat-conducting substrate, a first heat-conducting member, a second heat-conducting member, and a fin module. The key points of its structural design are that one side of the heat-conducting substrate is heat-conductingly connected to the power module, and the device has at least one first heat-conducting member, which is flatly laid on one side of the heat-conducting substrate and heat-conductingly connected. The device has a heat source heat-absorbing section connected to the power module coverage area of the heat-conducting substrate, and a heat source heat-dissipating section, which is flatly laid on the power module coverage area away from the heat-conducting substrate. Extension; the other side of the thermally conductive substrate has at least one second thermally conductive member and is thermally connected to the fin module. The substrate heat absorption section of the second thermally conductive member is thermally connected to the side of the thermally conductive substrate and has a curved extension to form a substrate heat dissipation section, which is curved and extended away from the thermally conductive substrate; the fin module includes a plurality of heat dissipation fins, which are aligned with each other and fastened together through the snap-fit openings of their respective heat dissipation fins. The fin module is nested in the substrate heat absorption section and substrate heat dissipation section of the second thermally conductive member, and the fin module is connected to the thermally conductive substrate as a whole. Therefore, the new fin heat dissipation device diffuses the heat of the power module to the entire thermally conductive substrate through the first thermally conductive member, thereby improving the conduction efficiency of the thermally conductive substrate and reducing the conduction thermal resistance of the thermally conductive substrate; at the same time, the heat is quickly conducted to the end of the fin through the second thermally conductive member, thereby improving the heat transfer efficiency of the fin and thus improving the heat exchange efficiency.

[0005] The several heat dissipating fins of the fin module are arranged in mirror symmetry with a group of heat dissipating fin units on each side. The edges of the upper and lower connecting parts of each heat dissipating fin of the fin module are bent toward the middle side of the symmetrically arranged curved heat dissipating fin unit and are buckled together at the buckling opening.

[0006] The fin module is provided with a plurality of corresponding first holes, second holes and third holes that are connected and integrated; the first holes are provided on each heat dissipation fin and aligned with each other, and all the first holes aligned with each other are passed through by the substrate heat absorption section of one of the second heat-conducting parts that are connected equidistantly, integrated or connected and integrated; the second holes are provided on each heat dissipation fin and aligned with each other, and all the second holes aligned with each other are passed through by the substrate heat dissipation section of one of the second heat-conducting parts; the third hole is an outer opening groove of the bending avoidance tooling hole, and the third hole is adjusted and set according to the size and bending radius of the second heat-conducting part to meet its bending avoidance requirements; the second heat-conducting part is arranged in an annular shape in the fin module, and the second heat-conducting part portions of the third holes on both sides are exposed from the fin module. The above structure facilitates the second heat-conducting part and the fin module to be integrated into one body, which is a specific embodiment of the inlaid structure. The annular structure of the above second heat-conducting part is inserted with one side opening, or embedded with one end opening, or inserted symmetrically on both sides, which only needs to meet the production preparation requirements.

[0007] The first hole and the second hole of each heat dissipating fin of the fin module are provided with a plurality of annular protrusions, which surround the heat absorbing section or the heat dissipating section of the substrate connected to the second heat conducting member, thereby further improving the fixed buckling between the heat dissipating fins.

[0008] Each heat dissipating fin of the fin module has a plurality of extension holes, which are connected to each first hole or second hole on each heat dissipating fin, thereby further improving ventilation and heat conduction on the outer diameter side of the second heat conducting member in the fin module.

[0009] The second heat-conducting member's heat-absorbing and heat-dissipating sections are connected, integrated, or interconnected at the first holes of the fin module, and are arranged in a fan-shaped pattern with equal spacing toward the fin module. This facilitates heat transfer and exchange between the second heat-conducting member and the heat-dissipating section of the substrate, while also accelerating heat conduction and heat dissipation through the fin module.

[0010] The second heat-conducting member's heat-absorbing section has a gap in the middle of one side of the heat-conducting substrate aligned, while the first heat-dissipating section's heat-conducting substrate has a gradually narrowing middle within the fin module and connected, or has a gap in the middle. Alternatively, the second heat-conducting member can be inserted into corresponding slots on one side of the heat-conducting substrate and fin module. The above is a specific structural embodiment of the second heat-conducting member.

[0011] The first heat conducting member is arranged in a matching groove on one side of the heat conducting substrate. The above structure facilitates the installation and fixation of the first heat conducting member on the heat conducting substrate and is a specific structural embodiment.

[0012] The first heat conducting member is a heat pipe or coil that is equidistantly arranged or serpentine-shaped.

[0013] Liquid working medium is provided in the heat-conducting base plate, the first heat-conducting member, and the second heat-conducting member. The above structure adopts a liquid cooling plate structure, further improving the heat dissipation effect of the corresponding components. The filling amount of the liquid working medium can be saturated or unsaturated; it can also adopt an existing metal tube plate.

[0014] The utility model has a reasonable structural design, convenient production and processing, strong reliability, good heat transfer and heat exchange efficiency, high conduction efficiency, and low conduction thermal resistance; it is suitable for use as a new fin heat sink device for inverters and a further improvement of similar products. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a schematic diagram of the three-dimensional structure of an embodiment of the utility model.

[0016] Figure 2 yes Figure 1 Schematic diagram of the fin module structure in the open state.

[0017] Figure 3 yes Figure 1 Schematic diagram of the explosion structure, in which part A is framed.

[0018] Figure 4 yes Figure 3 Magnified view of part A.

[0019] Figure 5 yes Figure 3 Schematic diagram of the bottom structure of the fin module.

[0020] Figure 6 yes Figure 5 Schematic diagram of the heat dissipation fin unit structure on one side of the fin module, with part B framed in the figure.

[0021] Figure 7 yes Figure 6 Enlarged view of part B.

[0022] Serial numbers and names of the accompanying drawings: 1. Heat-conducting substrate, 101. Matching groove, 2. First heat-conducting component, 201. Heat source heat absorption section, 202. Heat source heat dissipation section, 3. Second heat-conducting component, 301. Substrate heat absorption section, 302. Substrate heat dissipation section, 4. Fin module, 401. First hole, 402. Second hole, 403. Third hole, 404. Annular protrusion, 405. Extension hole. Implementation Method

[0023] Now, in conjunction with the accompanying drawings, the structure and use of the utility model are further described. Figure 1-Figure 7 As shown, the novel fin heat sink comprises a heat-conducting substrate 1, a first heat-conducting member 2, a second heat-conducting member 3 and a fin module 4. One side of the heat-conducting substrate is heat-conductingly connected to the power module and has at least one first heat-conducting member. The first heat-conducting member is flatly laid on one side of the heat-conducting substrate and is heat-conductingly connected. It has a heat source heat absorption section 201 connected to the power module coverage area of the heat-conducting substrate and a heat source heat dissipation section 202, which is flatly extended away from the power module coverage area of the heat-conducting substrate; the other side of the heat-conducting substrate is flatly laid on the power module coverage area of the heat-conducting substrate. One side has at least one second heat-conducting member and is thermally connected to the fin module 4. The substrate heat-absorbing section 301 of the second heat-conducting member is thermally connected to the side of the heat-conducting substrate and has a curved extension to form a substrate heat dissipation section 302, which is curved and extended away from the heat-conducting substrate; the fin module includes a plurality of heat dissipating fins, which are aligned with each other and fastened together through the snap-fitting openings of their respective heat dissipating fins. The fin module is nested in the substrate heat-absorbing section and the substrate heat dissipation section of the second heat-conducting member, and the fin module is connected to the heat-conducting substrate as a whole.

[0024] The several heat dissipating fins of the above-mentioned fin module are arranged in mirror symmetry with a group of heat dissipating fin units on each side. The edges of the upper and lower connecting parts of each heat dissipating fin of the fin module are bent toward the middle side of the symmetrically arranged curved heat dissipating fin unit and are buckled together at the buckling opening. The fin module is provided with a plurality of corresponding first holes 401, second holes 402 and third holes 403 that are interconnected and connected as a whole; the first holes are provided on each heat dissipation fin and aligned with each other, and all the first holes aligned with each other are passed through by the substrate heat absorption section of one of the second heat-conducting members that are connected equidistantly, connected as a whole or interconnected as a whole; the second holes are provided on each heat dissipation fin and aligned with each other, and all the second holes aligned with each other are passed through by the substrate heat dissipation section of one of the second heat-conducting members; the third holes are outer opening grooves for bending avoidance tooling holes, and the third holes are adjusted and set according to the size and bending radius of the second heat-conducting member to meet its bending avoidance requirements; the second heat-conducting member is arranged in an annular shape in the fin module, and the second heat-conducting member portions of the third holes on both sides are exposed from the fin module. The first holes and second holes at each heat dissipation fin of the fin module are provided with a plurality of annular protrusions 404, which surround the substrate heat absorption section or substrate heat dissipation section connected to the second heat-conducting member. Each heat dissipating fin of the fin module has a plurality of extension holes 405 , which are connected to each first hole or second hole on each heat dissipating fin.

[0025] The substrate heat absorption section and the substrate heat dissipation section of the second heat-conducting member are connected at equal distances, integrated or connected together at the first hole of the fin module, and are arranged in an equidistant fan-shaped manner toward one side of the fin module. The middle of the heat-conducting substrate on the heat-absorbing section of the second heat-conducting member is aligned with a disconnected gap, and the middle of the inner side of the fin module on the substrate heat dissipation section of the first heat-conducting member is gradually reduced and connected, or aligned with a disconnected gap, or the second heat-conducting member is inserted into the corresponding slot from one side of the heat-conducting substrate and the fin module. The first heat-conducting member is provided in a matching groove 101 on one side of the heat-conducting substrate; the first heat-conducting member is a heat pipe or coil arranged at equal distances or in a serpentine shape; the heat-conducting substrate, the first heat-conducting member and the second heat-conducting member are provided with a liquid working medium, or are hollow structure metal tube sheets.

[0026] When in use, the heat-conducting substrate on one side of the first heat-conducting member of the novel fin heat sink is heat-conductingly connected to the power module in the inverter.

[0027] In summary, this new fin heat sink not only meets the thermal conductivity requirements of high-power-density power modules, but also meets the heat dissipation requirements of high-power power modules, greatly reducing the thermal resistance of the radiator. At the same time, its production process is mature and simple, with strong reliability, and is suitable for large-scale promotion and use.

Claims

1. A novel fin heat sink device for an inverter, comprising a heat-conducting substrate (1), a first heat-conducting member (2), a second heat-conducting member (3) and a fin module (4); characterized in that One side of the heat-conducting substrate (1) is heat-conductingly connected to the power module and has at least one first heat-conducting member (2), which is flatly laid on one side of the heat-conducting substrate and heat-conductingly connected, and has a heat source heat-absorbing section (201) connected to the power module covering area of the heat-conducting substrate, and has a heat source heat-dissipating section (202) and extends flatly away from the power module covering area of the heat-conducting substrate; the other side of the heat-conducting substrate has at least one second heat-conducting member (3) and is heat-conductingly connected to the fin module (4), the substrate heat-absorbing section (301) of the second heat-conducting member is heat-conductingly connected to the side of the heat-conducting substrate, and has a curved extension to form a substrate heat-dissipating section (302), which extends curvedly away from the heat-conducting substrate; the fin module includes a plurality of heat-dissipating fins, which are aligned with each other and buckled together through the buckling openings of their respective heat-dissipating fins, the fin module is nested in the substrate heat-absorbing section and the substrate heat-dissipating section of the second heat-conducting member, and the fin module and the heat-conducting substrate are connected as one body.

2. The novel fin heat sink device for inverter according to claim 1 is characterized in that The plurality of heat dissipation fins of the fin module (4) are arranged in a mirror-symmetrical manner with a group of heat dissipation fin units on each side, and the edges of the upper and lower sides of the heat dissipation fins of the fin module are bent toward the middle side of the symmetrically arranged curved heat dissipation fin unit and are buckled together at the buckling opening.

3. The novel fin heat sink device for inverter according to claim 1 or 2, characterized in that The fin module (4) is provided with a plurality of corresponding first holes (401), second holes (402) and third holes (403) which are interconnected and connected as a whole; the first holes are provided on each heat dissipation fin and aligned with each other, and all the first holes aligned with each other are passed through by the substrate heat absorption section (301) of one of the second heat conducting members (3) which is connected equidistantly, connected as a whole or interconnected as a whole; the second holes are provided on each heat dissipation fin and aligned with each other, and all the second holes aligned with each other are passed through by the substrate heat dissipation section (302) of one of the second heat conducting members; the third hole is an outer opening groove of the bending avoidance tooling hole, and the third hole is adjusted and set according to the size and bending radius of the second heat conducting member to meet its bending avoidance requirements; the second heat conducting member is arranged in a ring shape in the fin module, and the second heat conducting member parts of the third holes on both sides are exposed from the fin module.

4. The novel fin heat sink device for inverter according to claim 3 is characterized in that The first hole (401) and the second hole (402) at each heat dissipation fin of the fin module (4) are provided with a plurality of annular protrusions (404), which surround the substrate heat absorption section (301) or the substrate heat dissipation section (302) connected to the second heat conducting member (3).

5. The novel fin heat sink device for inverter according to claim 3 is characterized in that Each heat dissipation fin of the fin module (4) has a plurality of extension holes (405), and the extension holes are connected to each first hole (401) or second hole (402) on each heat dissipation fin.

6. The novel fin heat sink device for inverter according to claim 3 is characterized in that The substrate heat absorption section (301) and the substrate heat dissipation section (302) of the second heat conducting member (3) are connected at equal distances, integrated or connected as one piece at the first hole (401) of the fin module (4), and are arranged in an equidistant fan shape toward one side of the fin module.

7. The novel fin heat sink device for inverter according to claim 1 is characterized in that The middle of one side of the heat-conducting substrate (1) on the substrate heat-absorbing section (301) of the second heat-conducting member (3) is arranged with a disconnected gap and aligned, and the middle of one side of the fin module (4) on the substrate heat-dissipating section (302) of the first heat-conducting member is arranged with a gradually narrowed and connected setting, or with a disconnected gap and aligned, or the second heat-conducting member is inserted into the corresponding slot from one side of the heat-conducting substrate and the fin module.

8. The novel fin heat sink device for inverter according to claim 1 is characterized in that The first heat-conducting component (2) is arranged in a matching groove (101) on one side of the heat-conducting substrate (1).

9. The novel fin heat sink device for inverter according to claim 1 is characterized in that The first heat conducting member (2) is a heat pipe or coil arranged equidistantly or in a serpentine shape.

10. The novel fin heat sink device for inverter according to claim 1 is characterized in that Liquid working medium is provided in the heat-conducting substrate (1), the first heat-conducting component (2), and the second heat-conducting component (3).

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