Inverted lamp bead structure

Abstract

The utility model relates to an inverted lamp bead structure, which comprises an anode metal sheet, a cathode metal sheet, a first bracket sizing material, a second bracket sizing material, a lamp bead chip, a first solder paste, a second solder paste and a packaging adhesive, the positive electrode metal sheet and the negative electrode metal sheet are arranged at an interval, the positive electrode metal sheet and the negative electrode metal sheet are connected through the first support rubber material, and the second support rubber material surrounds the positive electrode metal sheet and the negative electrode metal sheet to form a containing groove; the first solder paste is arranged on the positive electrode metal sheet in the containing groove, the second solder paste is arranged on the negative electrode metal sheet in the containing groove, the positive electrode of the lamp bead chip is connected with the first solder paste, the negative electrode of the lamp bead chip is connected with the second solder paste, and gaps are formed between the first solder paste, the second solder paste and the lamp bead chip and the second support sizing material; the packaging glue wraps the lamp bead chip, and a gap is formed between the packaging glue and the second support glue material. In the process of secondary reflow soldering, pseudo soldering of the lamp bead chip on the first solder paste and the second solder paste can be avoided.

Description

Technical Field

[0001] The utility model relates to the technical field of lamp beads, in particular to a flip-chip lamp bead structure. Background Art

[0002] Existing flip-chip lamp beads structure, such as Figure 1 As shown, solder paste is usually used to flip-chip solder the lamp bead chip onto the bracket metal sheet in the bracket slot, and then packaging glue is applied on the flip-chip lamp bead chip so that the packaging glue fills the entire bracket slot.

[0003] However, in the flip-chip lamp bead structure produced by the above method, during the secondary reflow soldering process, the solder paste will lose its sticky connection with the lamp bead chip in a molten state. At this time, the lamp bead chip is easily squeezed and lifted by the packaging glue, that is, a gap is created between the solder paste and the lamp bead chip. As a result, after the temperature of the solder paste drops, the lamp bead chip cannot be re-soldered to the bracket metal sheet, resulting in the phenomenon of cold soldering of the lamp bead chip. Utility Model Content

[0004] Based on this, it is necessary to provide a flip-chip lamp bead structure.

[0005] The technical solution of the utility model for solving the above technical problems is as follows: A flip-chip lamp bead structure, comprising: a positive metal sheet, a negative metal sheet, a first bracket adhesive, a second bracket adhesive, a lamp bead chip, a first solder paste, a second solder paste and a packaging adhesive; the positive metal sheet and the negative metal sheet are arranged at intervals, and the positive metal sheet and the negative metal sheet are connected by the first bracket adhesive, and the second bracket adhesive is arranged around the positive metal sheet and the negative metal sheet to form a receiving groove; the first solder paste is arranged on the positive metal sheet in the receiving groove, and the second solder paste is arranged on the negative metal sheet in the receiving groove, the positive pole of the lamp bead chip is connected to the first solder paste, and the negative pole of the lamp bead chip is connected to the second solder paste, and there is a gap between the first solder paste, the second solder paste and the lamp bead chip and the second bracket adhesive; the packaging adhesive is wrapped and arranged on the outer surface of the lamp bead chip, there is a gap between the packaging adhesive and the second bracket adhesive, and there is a gap between the packaging adhesive and the positive metal sheet and the negative metal sheet.

[0006] In one embodiment, the cross-sectional area of the packaging glue gradually increases from an end close to the lamp bead chip to an end away from the lamp bead chip.

[0007] In one embodiment, a side of the packaging adhesive away from the lamp bead chip is flush with a side of the second bracket adhesive away from the negative electrode metal sheet.

[0008] In one embodiment, the cross-section of the packaging adhesive is circular.

[0009] In one embodiment, the inner side wall of the accommodating groove is inclined, and the cross-sectional area of the accommodating groove gradually decreases from the groove opening of the accommodating groove to the groove bottom of the accommodating groove.

[0010] In one embodiment, the first bracket rubber material, the positive electrode metal sheet, and the negative electrode metal sheet are flush with each other.

[0011] In one embodiment, the positive metal sheet protrusion is provided with a first welding portion, the negative metal sheet protrusion is provided with a second welding portion, and the first welding portion is flush with the second welding portion, the first solder paste is provided on the first welding portion, and the second solder paste is provided on the second welding portion.

[0012] In one embodiment, the second bracket adhesive material extends and is laid on the bottom of the accommodating groove except for the first welding portion and the second welding portion.

[0013] In one embodiment, the second bracket adhesive material located at the bottom of the receiving groove is flush with the first welding portion and the second welding portion.

[0014] In one embodiment, the packaging glue is fluorescent glue.

[0015] The beneficial effects of the present invention are as follows: the present invention provides a flip-chip lamp bead structure in which the encapsulation glue is only wrapped around the lamp bead chip, and the encapsulation glue is not connected to the side walls of the accommodating groove, that is, the encapsulation glue is not connected to the second bracket glue material, so that the lamp bead chip will not be squeezed by the encapsulation glue. During the secondary reflow soldering process, even if the first solder paste and the second solder paste are in a molten state, the lamp bead chip will not be squeezed by the encapsulation glue. Therefore, the lamp bead chip will always remain connected to the first solder paste and the second solder paste under the action of gravity. When the temperature drops and the first solder paste and the second solder paste solidify, the lamp bead chip can be welded and fixed to the positive metal sheet and the negative metal sheet, thereby avoiding the phenomenon of cold solder joints. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following is a brief introduction to the drawings required for use in the embodiments. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can be obtained based on these drawings without creative work.

[0017] Figure 1 It is a schematic diagram of the existing flip-chip lamp bead structure;

[0018] Figure 2This is a schematic cross-sectional view of a flip-chip lamp bead structure according to one embodiment;

[0019] Figure 3 The figure is a schematic planar structural diagram of an inverted lamp bead structure according to an embodiment.

[0020] In the accompanying drawings, 10 is a flip-chip lamp bead structure; 100 is a positive metal sheet; 110 is a first welding part; 200 is a negative metal sheet; 210 is a second welding part; 300 is a first bracket adhesive; 400 is a second bracket adhesive; 410 is a receiving groove; 500 is a lamp bead chip; 600 is a first solder paste; 700 is a second solder paste; 800 is a packaging adhesive. DETAILED DESCRIPTION

[0021] It should be noted that, in the absence of conflict, the embodiments and features of the embodiments of the present invention can be combined with each other. The following will further describe the technical solution of the present invention in conjunction with the drawings of the embodiments of the present invention, and the present invention is not limited to the following specific implementation methods.

[0022] It should be understood that the same or similar reference numerals in the drawings of the embodiments correspond to the same or similar components. In the description of the present invention, it should be understood that if there are terms such as "upper", "lower", "front", "back", "left", "right", "top", "bottom", etc. indicating an orientation or positional relationship, they are based on the orientation or positional relationship shown in the drawings. This is only for the convenience of describing the present invention and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, the terms describing the positional relationship in the drawings are only used for illustrative purposes and cannot be understood as limiting this patent. For those of ordinary skill in the art, the specific meanings of the above terms can be understood according to the specific circumstances.

[0023] In one embodiment, Figure 2 and Figure 3As shown, a flip-chip lamp bead structure 10 includes: a positive metal sheet 100, a negative metal sheet 200, a first bracket adhesive 300, a second bracket adhesive 400, a lamp bead chip 500, a first solder paste 600, a second solder paste 700 and a packaging glue 800; the positive metal sheet 100 and the negative metal sheet 200 are arranged at intervals, and the positive metal sheet 100 and the negative metal sheet 200 are connected by the first bracket adhesive 300, and the second bracket adhesive 400 is arranged around the positive metal sheet 100 and the negative metal sheet 200 to form a receiving groove 410; the first solder paste 600 is arranged on the positive metal sheet 100 in the receiving groove 410 0, the second solder paste 700 is arranged on the negative metal sheet 200 in the accommodating groove 410, the positive pole of the lamp bead chip 500 is connected to the first solder paste 600, and the negative pole of the lamp bead chip 500 is connected to the second solder paste 700, and there is a gap between the first solder paste 600, the second solder paste 700 and the lamp bead chip 500 and the second bracket adhesive 400; the packaging glue 800 is wrapped and arranged on the outer surface of the lamp bead chip 500, and there is a gap between the packaging glue 800 and the second bracket adhesive 400, and there is a gap between the packaging glue 800 and the positive metal sheet 100 and the negative metal sheet 200.

[0024] Specifically, the positive electrode of the lamp bead chip 500 is electrically connected to the positive metal sheet 100 through the first solder paste 600, and the negative electrode of the lamp bead chip 500 is electrically connected to the negative metal sheet 200 through the second solder paste 700. The first bracket adhesive 300 is arranged in the gap between the positive metal sheet 100 and the negative metal sheet 200, thereby avoiding a short circuit between the positive metal sheet 100 and the negative metal sheet 200, thereby improving safety. The encapsulation glue 800 does not contact the first bracket adhesive 300, and there is a gap between the encapsulation glue 800 and the second bracket adhesive 400, that is, the encapsulation glue 800 does not contact the second bracket adhesive 400. The encapsulation glue 800 is only wrapped and arranged on the side of the lamp bead chip 500 except for the side connected to the first solder paste 600 and the second solder paste 700, and the encapsulation glue 800 does not contact the first solder paste 600 and the second solder paste 700. The packaging glue does not contact the positive electrode metal sheet 100 and the negative electrode metal sheet 200 .

[0025] In this embodiment, the encapsulation glue 800 is only wrapped around the outer surface of the lamp bead chip 500, and the encapsulation glue 800 is not connected to the side wall of the accommodating groove 410, that is, the encapsulation glue 800 is not connected to the second bracket glue 400, so that the lamp bead chip 500 will not be squeezed by the encapsulation glue 800. During the secondary reflow process, even if the first solder paste 600 and the second solder paste 700 are in a molten state, since the lamp bead chip 500 is not squeezed by the encapsulation glue 800, the lamp bead chip 500 will always remain connected to the first solder paste 600 and the second solder paste 700 under the action of gravity. When the temperature drops, after the first solder paste 600 and the second solder paste 700 solidify, the lamp bead chip 500 can be welded and fixed to the positive metal sheet 100 and the negative metal sheet 200, thereby avoiding the phenomenon of cold solder joints.

[0026] In order to have a better lighting effect, in one embodiment, as Figure 2 As shown, the cross-sectional area of the encapsulant 800 gradually increases from the end closest to the lamp chip 500 to the end further away from the lamp chip 500. Specifically, the cross-sectional shape of the encapsulant 800 is an inverted isosceles trapezoid. This arrangement allows all light emitted by the lamp chip 500 to pass through the encapsulant 800, resulting in a more uniform and softer light emitted by the flip-chip lamp structure 10, providing a better luminous effect.

[0027] In one embodiment, Figure 2 As shown, the side of the encapsulant 800 facing away from the LED chip 500 is flush with the side of the second support material 400 facing away from the negative electrode metal sheet. Specifically, by flushing the encapsulant 800 with the second support material 400, the entire encapsulant 800 is located within the receiving groove 410. This arrangement prevents the encapsulant 800 from protruding from the receiving groove 410 and being easily rubbed off.

[0028] In order to have a better lighting effect, in one embodiment, as Figure 3 As shown, the cross-section of the encapsulant 800 is circular. Specifically, the shape of the encapsulant 800 resembles an inverted truncated cone. This arrangement allows the light emitted by the lamp bead chip 500 to be better emitted from the encapsulant 800 in all directions, and the emitted light is softer and more uniform, providing a better lighting effect.

[0029] In this embodiment, the cross-sectional shape of the receiving groove 410 is circular. Specifically, to match the circular cross-sectional shape of the encapsulant 800, the cross-sectional shape of the receiving groove 410 is also set to a circular shape. This configuration ensures that all light can be emitted from the receiving groove 410.

[0030] In order to achieve better heat dissipation effect, in one embodiment, Figure 2 As shown, the inner sidewall of the accommodating groove 410 is inclined, and the cross-sectional area of the accommodating groove 410 gradually decreases from the notch of the accommodating groove 410 to the bottom of the accommodating groove 410. Through the above arrangement, after the secondary reflow is completed, the heat of the lamp bead chip 500 near the first solder paste 600 and the second solder paste 700 is higher than the heat of the lamp bead chip 500 near the packaging glue 800, that is, the heat at the bottom of the lamp bead chip 500 is higher than the heat above the lamp bead chip 500. The temperature difference between the top and bottom of the lamp bead chip 500 will form a chimney effect. Combined with the shape of the accommodating groove 410, it can accelerate the rise of heat and achieve better heat dissipation effect.

[0031] In order to avoid a short circuit between the positive electrode metal sheet 100 and the negative electrode metal sheet 200, in one embodiment, Figure 2 As shown, the first support rubber material 300, the positive electrode metal sheet 100, and the negative electrode metal sheet 200 are flush with each other. Specifically, by making the first support rubber material 300 flush with the positive electrode metal sheet 100 and the negative electrode metal sheet 200, the side wall of the positive electrode metal sheet 100 and the side wall of the negative electrode metal sheet 200 can be completely separated by the first support rubber material 300, thereby effectively preventing the positive electrode metal sheet 100 and the negative electrode metal sheet 200 from short-circuiting.

[0032] In order to facilitate welding the lamp bead chip 500 in the mounting groove, in one embodiment, as shown in FIG. Figure 2 As shown, the positive metal sheet 100 is provided with a raised first welding portion 110, and the negative metal sheet 200 is provided with a raised second welding portion 210, and the first welding portion 110 is flush with the second welding portion 210. The first solder paste 600 is provided on the first welding portion 110, and the second solder paste 700 is provided on the second welding portion 210. Specifically, through the above arrangement, the position of the bottom of the accommodating groove 410 for welding the lamp bead chip 500 can be quickly determined, that is, the positions of the first welding portion 110 and the second welding portion 210 can be quickly found, so that the lamp bead chip 500 can be quickly welded into the mounting groove.

[0033] In this embodiment, the first welding portion 110 and the second welding portion 210 are located in the middle of the bottom of the accommodating groove 410. This arrangement ensures that the lamp bead chip 500 is welded in the middle of the accommodating groove 410, thereby ensuring that the lamp bead chip 500 can better emit light within the accommodating groove 410.

[0034] In order to prevent the positive electrode metal sheet 100 and the negative electrode metal sheet 200 from being oxidized in the air, in one embodiment, Figure 2 As shown, the second support rubber material 400 extends and is laid on the bottom of the accommodating groove 410, excluding the first welding portion 110 and the second welding portion 210. Specifically, the second support rubber material 400 is laid on the bottom of the accommodating groove 410, but is not laid on the first welding portion 110 and the second welding portion 210; that is, the second support rubber material 400 is laid on the positive metal sheet 100, excluding the first welding portion 110, and the second support rubber material 400 is laid on the negative metal sheet 200, excluding the second welding portion. This arrangement can prevent the positive metal sheet 100 and the negative metal sheet 200 from being oxidized by contact with air.

[0035] In one embodiment, the second support rubber material 400 located at the bottom of the receiving groove 410 is flush with the first welding portion 110 and the second welding portion 210. Specifically, the second support rubber material 400 located on the positive electrode metal sheet 100 is flush with the first welding portion 110, and the second support rubber material 400 located on the negative electrode metal sheet 200 is flush with the second welding portion 210. This arrangement ensures that the bottom of the receiving groove 410 is flat.

[0036] To enable the emission of light in various tones, in one embodiment, the encapsulating adhesive 800 is a fluorescent adhesive. Specifically, the fluorescent adhesive is made of a colored silicone rubber and a nitride phosphor. The colored silicone rubber is a translucent addition-type liquid silicone rubber. By evenly applying the nitride phosphor to the colored silicone rubber, the LED chip 500 emits light in various tones when light passes through it.

[0037] Obviously, the above embodiments of the present invention are merely examples for the purpose of clearly illustrating the present invention, and are not intended to limit the implementation methods of the present invention. A person skilled in the art will be able to make other variations or modifications based on the above description. It is not necessary and impossible to enumerate all implementation methods here. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention shall be included within the scope of protection of the claims of the present invention.

Claims

1. A flip-chip lamp bead structure, characterized in that: include: Positive metal sheet, negative metal sheet, first bracket rubber material, second bracket rubber material, lamp bead chip, first solder paste, second solder paste and packaging glue; The positive metal sheet and the negative metal sheet are spaced apart and connected to each other via the first support rubber material. The second support rubber material is disposed around the positive metal sheet and the negative metal sheet to form a receiving groove. The first solder paste is disposed on the positive metal sheet in the receiving groove, and the second solder paste is disposed on the negative metal sheet in the receiving groove. The positive electrode of the lamp bead chip is connected to the first solder paste, and the negative electrode of the lamp bead chip is connected to the second solder paste. There is a gap between the first solder paste, the second solder paste, and the lamp bead chip and the second bracket rubber material; The packaging glue is wrapped and arranged on the outer surface of the lamp bead chip, there is a gap between the packaging glue and the second bracket glue, and there is a gap between the packaging glue and the positive metal sheet and the negative metal sheet.

2. The flip-chip lamp bead structure according to claim 1, characterized in that: The cross-sectional area of the packaging glue gradually increases from an end close to the lamp bead chip to an end away from the lamp bead chip.

3. The flip-chip lamp bead structure according to claim 1, characterized in that: The side of the packaging glue away from the lamp bead chip is flush with the side of the second bracket glue away from the negative electrode metal sheet.

4. The flip-chip lamp bead structure according to claim 1, characterized in that: The cross-section of the packaging adhesive is circular.

5. The flip-chip lamp bead structure according to claim 1, characterized in that: The inner side wall of the accommodating groove is arranged to be inclined, and the cross-sectional area of the accommodating groove gradually decreases from the groove opening of the accommodating groove to the groove bottom of the accommodating groove.

6. The flip-chip lamp bead structure according to claim 1, characterized in that: The first bracket rubber material, the positive electrode metal sheet and the negative electrode metal sheet are flush with each other.

7. The flip-chip lamp bead structure according to claim 1, characterized in that: The positive metal sheet protrusion is provided with a first welding portion, the negative metal sheet protrusion is provided with a second welding portion, and the first welding portion is flush with the second welding portion, the first solder paste is provided on the first welding portion, and the second solder paste is provided on the second welding portion.

8. The flip-chip lamp bead structure according to claim 7, characterized in that: The second bracket adhesive material is extended and laid on the bottom of the accommodating groove except the first welding portion and the second welding portion.

9. The flip-chip lamp bead structure according to claim 8, characterized in that: The second bracket adhesive material located at the bottom of the accommodating groove is flush with the first welding portion and the second welding portion.

10. The flip-chip lamp bead structure according to any one of claims 1 to 9, characterized in that: The packaging glue is fluorescent glue.

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