High-brightness LED light source packaging structure
By using a bowl-cup bracket and reflective white glue in the LED light source packaging structure, the problem of light being absorbed by the substrate is solved, and higher light efficiency and brightness are achieved.
Patent Information
- Application Number
- CN202422414045.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-30
- Publication Date
- 2025-08-05
- Estimated Expiration
- 2034-09-30
AI Technical Summary
In the existing LED light source packaging structure, light rays are absorbed by the substrate, resulting in lower light efficiency.
A packaging structure including LED chip, bracket and reflective white glue is adopted. The bracket forms a bowl and cup structure. The reflective white glue is sprayed on the bottom and side walls of the bowl and cup to reflect the light out of the chip to improve the light effect.
Through the design of reflecting white glue, all light can be effectively reflected and emitted from the front, improving the light effect of the LED light source.
Smart Images
Figure CN223195098U_ABST
Abstract
Description
Technical Field
[0001] The utility model belongs to the technical field of LED light source packaging, and in particular relates to a high-brightness LED light source packaging structure. Background Art
[0002] With the continuous improvement of LED chip packaging and manufacturing processes, as well as the development of materials science, the luminous efficiency and brightness of high-brightness LED light sources have been greatly improved. Compared with traditional light sources, LED light sources have obvious advantages such as high luminous efficacy, long life, and small size, and are widely used in high-brightness lighting.
[0003] Conventional LED light source packaging structures typically bond the LED chip to the upper side of a substrate and surround it with a reflective cup structure to reflect and focus light around the LED chip, effectively increasing the brightness of the LED light source. However, since some light is absorbed by the substrate, the luminous efficiency of the LED light source is difficult to improve. Utility Model Content
[0004] The technical problem to be solved by the present invention is to overcome the defect in the prior art that the light emitted by the LED light source is absorbed by the substrate, resulting in low light efficiency, thereby providing a high-brightness LED light source packaging structure.
[0005] A high-brightness LED light source packaging structure includes an LED chip, a bracket and reflective white glue; the bracket includes a bowl-shaped bottom and a bowl-shaped side wall, the bowl-shaped side wall and the bowl-shaped bottom form an integrated structure, the bowl-shaped side wall surrounds the upper side of the bowl-shaped bottom to form a chip area, and the inner side of the bowl-shaped side wall is inclined to form an upward inclined surface; the chip is fixed in the chip area and electrically connected to the bowl-shaped bottom; the reflective white glue covers the upper side of the chip area and fills the gap between the LED chip and the bowl-shaped bottom, and the reflective white glue covers the inner side of the bowl-shaped side wall.
[0006] Furthermore, four LED chips are provided, and the four LED chips are spaced apart from each other and arranged in two rows and two columns.
[0007] Furthermore, two sections of inclined surfaces are formed on the inner side of the side wall of the bowl, and the two sections of inclined surfaces are connected to form a horizontal plane. The upper inclined surface is located outside the lower stable plane.
[0008] Furthermore, the LED chip is a flip-chip LED chip.
[0009] Furthermore, it also includes a groove, the inner lower end of the bowl side wall is recessed to form the groove, a Zener diode is fixed in the groove, and the Zener diode is reversely connected in parallel with the LED chip; the reflective white glue fills the groove and forms a continuous flat plane at the groove of the bowl side wall.
[0010] Furthermore, it also includes a wall, which is fixed to the upper side of the bottom of the bowl cup, forming an integrated structure with the bottom of the bowl cup, surrounding the LED chip and spaced apart from the LED chip.
[0011] Furthermore, the wall forms gaps at the four corners of the LED chip.
[0012] Furthermore, the side wall of the bowl cup is a rectangular structure, and an outer corner of the side wall of the bowl cup is chamfered.
[0013] Furthermore, a soldering pad is formed on the upper side of the chip area, and the bottom electrode of the LED chip is fixedly welded to the soldering pad and conductively connected thereto.
[0014] Furthermore, the solder pad under each LED chip forms a rectangular solder point, and the four solder points are arranged in two rows and two columns, two of which are connected to the positive pole of the LED chip, and two of which are connected to the negative pole of the LED chip.
[0015] Furthermore, it also includes fluorescent glue, which is located on the upper side of the LED chip.
[0016] Beneficial effect: The utility model provides a high-brightness LED light source packaging structure, including an LED chip, a bracket and reflective white glue, a bowl-cup structure is formed inside the bracket, the reflective white glue is sprayed on the bottom of the bowl cup to form a reflective surface structure, the reflective white glue is sprayed on the side wall of the bowl cup to form a reflective cup structure, and the gap between the bottom of the bowl cup and the LED chip is filled with reflective white glue, so that the light output of the LED chip is reflected by the reflective surface of the bottom of the bowl cup of the bracket and the reflective cup on the side wall of the bowl cup, and all the light output can be reflected and finally emitted from the front, effectively improving the light efficiency of the LED light source. BRIEF DESCRIPTION OF THE DRAWINGS
[0017] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.
[0018] Figure 1 It is a schematic diagram of the cross-sectional structure of the utility model;
[0019] Figure 2 It is a schematic diagram of the overall structure of the utility model;
[0020] Figure 3 This is a schematic diagram of the top view of the bracket of the utility model.
[0021] Explanation of the accompanying drawings: 1. LED chip; 2. bracket; 21. bottom of the bowl; 22. side wall of the bowl; 3. reflective white glue; 4. wall; 5. chamfer; 6. groove. DETAILED DESCRIPTION
[0022] To make the above-mentioned objects, features, and advantages of the present application more clearly understood, the specific embodiments of the present application are described in detail below with reference to the accompanying drawings. The following description sets forth many specific details to facilitate a full understanding of the present application. However, the present application can be implemented in many other ways than those described herein, and those skilled in the art can make similar improvements without violating the scope of the present application. Therefore, the present application is not limited to the specific embodiments disclosed below.
[0023] In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.
[0024] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being referred to. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of such features. Throughout the description of this application, "plurality" means at least two, for example, two, three, etc., unless otherwise specifically defined.
[0025] Reference Figures 1 to 3As shown, this embodiment provides a high-brightness LED light source packaging structure, including an LED chip 1, a bracket 2 and a reflective white glue 3; the bracket 2 includes a bowl cup bottom 21 and a bowl cup side wall 22, the bowl cup side wall 22 and the bowl cup bottom 21 form an integrated structure, the bowl cup side wall 22 surrounds the upper side of the bowl cup bottom 21 to form a chip area, and the inner side of the bowl cup side wall 22 is inclined to form an upward inclined surface; the chip is fixed in the chip area and electrically connected to the bowl cup bottom 21; the reflective white glue 3 covers the upper side of the chip area and fills the gap between the LED chip 1 and the bowl cup bottom 21, and the reflective white glue 3 covers the inner side of the bowl cup side wall 22.
[0026] In this embodiment, the reflective white glue 3 on the upper side of the chip area and the reflective white glue 3 on the inner side of the bowl cup side wall 22 are connected to each other and form an overly smooth integrated structure, so that the upper side of the chip area and the inner side of the bowl cup side wall 22 are completely covered with the reflective white glue 3.
[0027] This embodiment provides a high-brightness LED light source packaging structure, including an LED chip 1, a bracket 2 and reflective white glue 3. A bowl-cup structure is formed inside the bracket 2, and the reflective white glue 3 is sprayed on the bottom 21 of the bowl cup to form a reflective surface structure. The reflective white glue 3 is sprayed on the side wall 22 of the bowl cup to form a reflective cup structure, and the reflective white glue 3 is filled in the gap between the bottom 21 of the bowl cup and the LED chip 1, so that the light output from the LED chip 1 is reflected by the reflective surface of the bottom 21 of the bowl cup of the bracket and the reflective cup of the side wall 22 of the bowl cup. All the output light can be reflected and finally emitted from the front, which effectively improves the light efficiency of the LED light source.
[0028] Specifically, four LED chips 1 are provided, spaced apart from each other and arranged in two rows and two columns. The LED chips 1 are flip-chip LED chips, offering stronger frontal light intensity and improved heat dissipation. Fluorescent adhesive is also included, positioned above the LED chips 1. This adhesive enables light color conversion, enabling the LED light source to emit light of the desired color.
[0029] As a further improvement to this embodiment, the inner side of the bowl sidewall 22 forms two upper and lower inclined surfaces, which connect to form a horizontal plane. The upper inclined surface is located outside the lower stable plane. Through the design of these inclined surfaces, the white glue forms a continuous inclined surface on the inner side of the bowl sidewall 22. As a preferred embodiment of this embodiment, the bracket 2 has a square structure, and the bowl sidewall 22 forms a square frame surrounding the chip area, with the four sides of the square frame being four wall segments.
[0030] As a further improvement to this embodiment, a groove 6 is further included. The inner lower end of the bowl side wall 22 is recessed to form the groove 6. A Zener diode is fixed in the groove 6. The Zener diode is reversely connected in parallel with the LED chip 1. The reflective white glue 3 fills the groove 6 and forms a continuous and flat surface at the groove 6 of the bowl side wall 22. The reverse-parallel Zener diode has a stable breakdown voltage when reverse biased, thereby effectively protecting the LED chip 1 from damage by reverse voltage. In this embodiment, by setting the groove 211 on the bowl side wall 22, the Zener diode is set in the groove 6 and filled and covered with the reflective white glue 3. This can prevent the exposed Zener diode from occupying the light-emitting surface of the bowl of the bracket and absorbing light, thereby affecting the effective reflection of the light emitted by the LED chip 1 on the bracket 2. Setting the Zener diode in the groove 6 increases the reflection area of the reflective white glue, ensures the integrity of the light pattern of the LED light source, and improves the reflection brightness.
[0031] As a preferred embodiment of this embodiment, it further includes a fence 4, which is fixed to the upper side of the bowl bottom 21, forming an integral structure with the bowl bottom 21, surrounding the LED chip 1 and spaced apart from the LED chip 1. By setting the fence 4, the LED chip 1 can be effectively positioned within the fence 4, thereby improving the packaging accuracy of the LED light source. As a further improvement of this embodiment, the fence 4 forms notches at the four corners of the LED chip 1, so that the reflective white glue 3 can enter and exit the fence 4 while ensuring that the LED chip 1 is positioned by the fence 4, thereby ensuring the uniformity of the reflective white glue 3 on the upper side of the bowl bottom 21.
[0032] In this embodiment, the bowl side wall 22 is a rectangular structure, and a corner on the outer side of the bowl side wall 22 forms a chamfer 5. In the packaging process, the chamfer 5 serves as an identification point to provide an identification for the LED light source.
[0033] Specifically, a solder pad is formed on the upper side of the chip area, and the bottom electrode of the LED chip 1 is soldered and fixed to the solder pad and conductively connected. The solder pad under each LED chip 1 forms a rectangular solder joint, and four of the solder joints are arranged in two rows and two columns, two of which are connected to the positive electrode of the LED chip 1, and two of which are connected to the negative electrode of the LED chip 1, so that the LED chip 1 can form an effective conductive and fixed connection with the bottom 21 of the bowl. In this embodiment, the electrode of the LED chip 1 is soldered to the solder pad using solder paste.
[0034] The technical features of the above-mentioned embodiments can be combined arbitrarily. In order to make the description concise, not all possible combinations of the technical features in the above-mentioned embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.
[0035] The above-described embodiments merely represent several implementation methods of the present application. While the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that a person of ordinary skill in the art may make various modifications and improvements without departing from the spirit of the present application, and these modifications and improvements fall within the scope of protection of the present application. Therefore, the scope of protection of the present patent application shall be determined by the appended claims.
Claims
1. A high-brightness LED light source packaging structure, characterized in that: The invention comprises an LED chip (1), a bracket (2) and a reflective white glue (3); a bowl-cup structure is formed inside the bracket (2), the bowl-cup structure comprises a bowl-cup bottom (21) and a bowl-cup side wall (22), the bowl-cup side wall (22) and the bowl-cup bottom (21) form an integral structure, the bowl-cup side wall (22) surrounds the upper side of the bowl-cup bottom (21) to form a chip area, and the inner side of the bowl-cup side wall (22) is inclined to form an upward inclined surface; the chip is fixed in the chip area and is electrically connected to the bowl-cup bottom (21); the reflective white glue (3) covers the upper side of the chip area and fills the gap between the LED chip (1) and the bowl-cup bottom (21), and the reflective white glue (3) covers the inner side of the bowl-cup side wall (22).
2. The high-brightness LED light source packaging structure according to claim 1, characterized in that: Four LED chips (1) are provided, and the four LED chips (1) are spaced apart from each other and arranged in two rows and two columns.
3. The high-brightness LED light source packaging structure according to claim 1, characterized in that: The inner side of the bowl side wall (22) forms two upper and lower inclined surfaces, which are connected to form a horizontal plane. The upper inclined surface is located outside the lower stable plane.
4. The high-brightness LED light source packaging structure according to claim 1, characterized in that: The invention also includes a groove (6), wherein the inner lower end of the bowl side wall (22) is recessed to form the groove (6), a Zener diode is fixed in the groove (6), and the Zener diode is reversely connected in parallel with the LED chip (1); the reflective white glue (3) fills the groove (6) and forms a continuous and flat plane at the groove (6) of the bowl side wall (22).
5. The high-brightness LED light source packaging structure according to claim 1, characterized in that: It also includes a wall (4), which is fixed to the upper side of the bowl bottom (21) and forms an integral structure with the bowl bottom (21), surrounds the LED chip (1) and is spaced apart from the LED chip (1).
6. The high-brightness LED light source packaging structure according to claim 5, characterized in that: The surrounding wall (4) forms gaps at the four corners of the LED chip (1).
7. The high-brightness LED light source packaging structure according to claim 1, characterized in that: The bowl side wall (22) is a rectangular structure, and a corner outside the bowl side wall (22) forms a chamfer (5).
8. The high-brightness LED light source packaging structure according to claim 1, characterized in that: A soldering pad is formed on the upper side of the chip area, and the bottom electrode of the LED chip (1) is fixedly soldered to the soldering pad and conductively connected thereto.
9. The high-brightness LED light source packaging structure according to claim 8, characterized in that: The solder pad below each LED chip (1) forms a rectangular solder point, and the four solder points are arranged in two rows and two columns, two of which are connected to the positive electrode of the LED chip (1), and two of which are connected to the negative electrode of the LED chip (1).
10. The high-brightness LED light source packaging structure according to claim 1, characterized in that: It also includes fluorescent glue, which is located on the upper side of the LED chip (1).