Wafer packaging and cleaning device

Abstract

The utility model relates to the technical field of wafer cleaning, and discloses a wafer packaging and cleaning device which is characterized in that a sliding plate is connected in a sliding chute II in a sliding manner, one side, arranged in the sliding chute II, of the sliding plate is in threaded connection with a two-way screw rod, one side of the two-way screw rod is fixedly connected with a knob, the sliding plate is fixedly connected with a protection plate, and the protection plate is in threaded connection with the knob. An air cylinder is fixedly connected to the cleaning box, a hydraulic rod is fixedly connected to the output end of the air cylinder, and the side, away from the air cylinder, of the hydraulic rod is fixedly connected to the connecting frame. According to the wafer cleaning device, the water pump is arranged, the water pump sucks out cleaning liquid in the water tank through the water suction pipe and discharges the cleaning liquid into the switching block through the water drainage pipe, the cleaning liquid in the switching block is conveyed into the spraying pipe from the connecting hose and then sprayed out through the spraying holes to spray wafers on the sliding plate, and the wafer cleaning speed and efficiency can be effectively improved; the cleaning effect of the wafer is better, and the situation that packaging is affected due to a large amount of dust left in traditional manual cleaning is avoided.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer cleaning, in particular to a wafer packaging cleaning device. Background Art

[0002] Wafer packaging is a critical step in the semiconductor manufacturing process, and its cleanliness directly impacts subsequent packaging and the quality of the final product. During the manufacturing process, the wafer surface is susceptible to various contaminants, including particles, dust, organic residue, and metal ions. If these contaminants are not promptly removed, they can lead to defects during the packaging process, such as short circuits, open circuits, and leakage, which in turn can affect product performance and lifespan.

[0003] The existing technology has the following deficiencies: conventional wafer cleaning devices are not convenient for moving the wafer, resulting in poor flexibility and inconvenience in positioning the wafer during cleaning. Conventional wafer cleaning devices have poor cleaning effects, resulting in low efficiency during wafer cleaning. Utility Model Content

[0004] The purpose of the utility model is to solve the shortcomings of the prior art and to propose a wafer packaging cleaning device.

[0005] In order to achieve the above-mentioned purpose, the utility model adopts the following technical solutions: a wafer packaging cleaning device, comprising a cleaning box, a connecting block fixedly connected in the cleaning box, a slide groove 1 provided in the connecting block, a sliding block slidably connected in the slide groove 1, a connecting frame fixedly connected on the side of the sliding block away from the slide groove 1, a slide groove 2 provided in the connecting frame, a sliding plate slidably connected in the slide groove 2, a two-way screw rod threadedly connected on one side of the sliding plate provided in the slide groove 2, a knob fixedly connected on one side of the two-way screw rod, a protective plate fixedly connected on the sliding plate, a cylinder fixedly connected to the cleaning box, a hydraulic rod fixedly connected to the output end of the cylinder, and a hydraulic rod fixedly connected to the connecting frame on the side away from the cylinder.

[0006] As a further description of the above technical solution:

[0007] The hydraulic rod passes through and is slidably connected to one side of the cleaning box. The bidirectional screw rod is provided with two sets of opposite threads and is symmetrically arranged. The bidirectional screw rod passes through and is rotatably connected to the connecting frame.

[0008] As a further description of the above technical solution:

[0009] The connecting block, the first slide groove and the sliding block are each provided in two groups and are symmetrically arranged; the sliding plate and the protective plate are each provided in two groups and are symmetrically arranged; the second slide groove is provided in two groups and are symmetrically arranged.

[0010] As a further description of the above technical solution:

[0011] A box cover is hingedly connected to one side of the cleaning box, a handle is fixedly connected to one side of the box cover, a nozzle is fixedly connected to the inner side of the box cover, a spray block is fixedly connected to the nozzle, a spray hole is provided on the spray block, and the nozzle is communicated with the spray block.

[0012] As a further description of the above technical solution:

[0013] A connecting plate is fixedly connected to one side of the cleaning box, a water pump is fixedly connected to the connecting plate, a suction pipe is fixedly connected to one side of the water pump, a drain pipe is fixedly connected to the other side of the water pump, a transfer block is fixedly connected to the side of the drain pipe away from the water pump, a connecting hose is fixedly connected inside the transfer block, and the connecting hose passes through the side away from the transfer block and is arranged in the nozzle.

[0014] As a further description of the above technical solution:

[0015] The drainage pipe, the water suction pipe and the connecting hose are communicated with each other.

[0016] As a further description of the above technical solution:

[0017] The connecting plate is fixedly connected with a water tank, the water tank is provided with a feeding port, and the side of the water suction pipe away from the water pump passes through and is arranged in the water tank.

[0018] As a further description of the above technical solution:

[0019] The lower surface of the cleaning box is fixedly connected with support legs, and the support legs are provided in four groups and arranged around the lower surface of the cleaning box. A drainage hole is provided in the cleaning box, and the lower surface of the cleaning box is fixedly connected with a drainage valve, and the drainage valve is communicated with the drainage hole.

[0020] The utility model has the following beneficial effects:

[0021] 1. In the utility model, a water pump is provided, which sucks the cleaning liquid in the water tank out through the suction pipe and discharges it into the adapter block through the drain pipe. The cleaning liquid in the adapter block is transmitted from the connecting hose into the nozzle and then sprayed out through the spray hole to spray the wafers on the sliding plate. This can effectively improve the speed and efficiency of wafer cleaning, make the wafer cleaning effect better, and avoid the traditional manual cleaning that leaves a large amount of dust and affects the packaging.

[0022] 2. In the present invention, by setting up a cylinder, the connecting frame moves back and forth along the slide groove with the sliding block, the connecting frame moves back and forth with the sliding plate, and the sliding plate moves back and forth with the wafer, which can effectively improve the flexibility of the wafer packaging cleaning device and make the wafer packaging cleaning device easier to adjust, thereby effectively improving the practicality of the wafer packaging cleaning device. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 This is a schematic diagram of the three-dimensional structure of a wafer packaging cleaning device proposed in this utility model. Figure 1 ;

[0024] Figure 2 This is a schematic diagram of the three-dimensional structure of a wafer packaging cleaning device proposed in this utility model Figure 2 ;

[0025] Figure 3 This is a schematic diagram of the three-dimensional structure of a wafer packaging cleaning device proposed in this utility model Figure 3 ;

[0026] Figure 4 This is a partial structural diagram of a wafer packaging cleaning device proposed by the present invention.

[0027] Legend:

[0028] 1. Cleaning box; 2. Cylinder; 3. Hydraulic rod; 4. Box cover; 5. Handle; 6. Nozzle; 7. Spray block; 8. Spray hole; 9. Connecting plate; 10. Water tank; 11. Feeding port; 12. Water pump; 13. Drain pipe; 14. Suction pipe; 15. Adapter block; 16. Connecting hose; 17. Support leg; 18. Drain valve; 19. Drain hole; 20. Connecting block; 21. Slide 1; 22. Sliding block; 23. Connecting frame; 24. Slide 2; 25. Bidirectional screw; 26. Knob; 27. Sliding plate; 28. Protective plate. DETAILED DESCRIPTION

[0029] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0030] Reference Figures 1-4, the utility model provides an embodiment: a wafer packaging cleaning device, including a cleaning box 1, a connecting block 20 is fixedly connected in the cleaning box 1, a slide groove 21 is provided in the connecting block 20, a sliding block 22 is slidably connected in the slide groove 21, a connecting frame 23 is fixedly connected to the side of the sliding block 22 away from the slide groove 21, a slide groove 24 is provided in the connecting frame 23, a sliding plate 27 is slidably connected in the slide groove 24, a bidirectional screw rod 25 is threadedly connected to one side of the sliding plate 27 provided in the slide groove 24, a knob 26 is fixedly connected to one side of the bidirectional screw rod 25, and a sliding plate 27 is fixedly connected to the sliding plate 27. A protective plate 28 is fixedly connected to the plate 27, a cylinder 2 is fixedly connected to the cleaning box 1, a hydraulic rod 3 is fixedly connected to the output end of the cylinder 2, the hydraulic rod 3 is fixedly connected to the connecting frame 23 on the side away from the cylinder 2, the hydraulic rod 3 passes through and is slidably connected to one side of the cleaning box 1, and the bidirectional screw rod 25 is provided with two sets of opposite threads and is symmetrically arranged. The bidirectional screw rod 25 passes through and is rotatably connected to the connecting frame 23. The connecting block 20, the slide groove 21, and the sliding block 22 are all provided with two groups and are symmetrically arranged. The sliding plate 27 and the protective plate 28 are both provided with two groups and are symmetrically arranged. The second slot 24 is provided with two groups and is symmetrically arranged. One side of the cleaning box 1 is hingedly connected to a box cover 4, and a handle 5 is fixedly connected to one side of the box cover 4. A nozzle 6 is fixedly connected to the inner side of the box cover 4, and a spray block 7 is fixedly connected to the nozzle 6. The spray block 7 is provided with a spray hole 8. The nozzle 6 is communicated with the spray block 7. By placing the wafer on the two groups of sliding plates 27 and turning the knob 26, the knob 26 rotates and the bidirectional screw 25 rotates. The bidirectional screw 25 rotates to make the two groups of sliding plates 27 move inward along the slide slot 24 and the bidirectional screw 25 through the limit of the connecting frame 23. The two groups of sliding plates 27 are connected to the two groups of sliding plates 27. The plates 27 all move inward with the protective plates 28 to clamp the wafers on the sliding plates 27. A cylinder 2 is provided, and the output end of the cylinder 2 moves back and forth with the hydraulic rod 3. The hydraulic rod 3 moves the connecting frame 23 back and forth. The connecting frame 23 moves the sliding block 22 back and forth along the slide groove 21. The connecting frame 23 moves back and forth with the sliding plate 27, and the sliding plate 27 moves the wafer back and forth, which can effectively improve the flexibility of the wafer packaging cleaning device and make the wafer packaging cleaning device easier to adjust, thereby effectively improving the practicality of the wafer packaging cleaning device.

[0031] One side of the cleaning box 1 is fixedly connected with a connecting plate 9, a water pump 12 is fixedly connected to the connecting plate 9, one side of the water pump 12 is fixedly connected with a suction pipe 14, the other side of the water pump 12 is fixedly connected with a drain pipe 13, the side of the drain pipe 13 away from the water pump 12 is fixedly connected with an adapter block 15, a connecting hose 16 is fixedly connected in the adapter block 15, the side of the connecting hose 16 away from the adapter block 15 passes through and is arranged in the nozzle 6, the drain pipe 13, the suction pipe 14 and the connecting hose 16 are connected, a water tank 10 is fixedly connected to the connecting plate 9, a feeding port 11 is provided on the water tank 10, the suction pipe 14 passes through and is arranged in the water tank 10 away from the water pump 12, and the lower surface of the cleaning box 1 is fixedly connected There are support legs 17, and there are four groups of support legs 17 and they are arranged around the lower surface of the cleaning box 1. A drainage hole 19 is provided in the cleaning box 1. A drainage valve 18 is fixedly connected to the lower surface of the cleaning box 1. The drainage valve 18 is communicated with the drainage hole 19. By setting a water pump 12, the water pump 12 sucks the cleaning liquid in the water tank 10 out through the suction pipe 14 and discharges it into the adapter block 15 through the drainage pipe 13. The cleaning liquid in the adapter block 15 is introduced into the nozzle 6 from the connecting hose 16 and then sprayed out through the spray hole 8 to spray the wafer on the sliding plate 27, which can effectively improve the speed and efficiency of wafer cleaning, make the wafer cleaning effect better, and avoid traditional manual cleaning with a large amount of dust remaining, which affects the packaging.

[0032] Working principle: first, place the wafer on the two sets of sliding plates 27, turn the knob 26, and the rotation of the knob 26 drives the bidirectional screw 25 to rotate. The rotation of the bidirectional screw 25 causes the two sets of sliding plates 27 to move inward along the slide groove 24 and the bidirectional screw 25 through the limit of the connecting frame 23. The two sets of sliding plates 27 move inward with the protective plate 28 to clamp the wafer on the sliding plate 27. Pull the handle 5, and the handle 5 rotates and closes the box cover 4. Set the water pump 12, and the water pump 12 sucks the cleaning liquid in the water tank 10 out through the suction pipe 14 and discharges it into the adapter block 15 through the drain pipe 13. The cleaning liquid in the adapter block 15 is passed from the connecting hose 16 into the nozzle 6 and then sprayed out through the spray hole 8 to clean the wafer on the sliding plate 27. Spraying can effectively improve the speed and efficiency of wafer cleaning, make the wafer cleaning effect better, and avoid traditional manual cleaning that leaves a large amount of dust and affects the packaging. A cylinder 2 is set, and the output end of the cylinder 2 retracts with the hydraulic rod 3, and the hydraulic rod 3 moves back and forth with the connecting frame 23, and the connecting frame 23 moves back and forth with the sliding block 22 along the slide groove 21, and the connecting frame 23 moves back and forth with the sliding plate 27, and the sliding plate 27 moves back and forth with the wafer, which can effectively improve the flexibility of the wafer packaging cleaning device and make the wafer packaging cleaning device easier to adjust, thereby effectively improving the practicality of the wafer packaging cleaning device. Open the drain valve 18, and the cleaning liquid in the cleaning box 1 is discharged through the opened drain valve 18.

[0033] Finally, it should be noted that the above is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art can still modify the technical solutions described in the aforementioned embodiments or make equivalent replacements for some of the technical features therein. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A wafer packaging cleaning device, comprising a cleaning box (1), characterized in that: The cleaning box (1) is fixedly connected with a connecting block (20), a slide groove (21) is provided in the connecting block (20), a sliding block (22) is slidably connected in the slide groove (21), a connecting frame (23) is fixedly connected to the sliding block (22) on the side away from the slide groove (21), a slide groove (24) is provided in the connecting frame (23), a sliding plate (27) is slidably connected in the slide groove (24), a bidirectional screw rod (25) is threadedly connected to one side of the sliding plate (27) provided in the slide groove (24), a knob (26) is fixedly connected to one side of the bidirectional screw rod (25), a protective plate (28) is fixedly connected to the sliding plate (27), a cylinder (2) is fixedly connected to the cleaning box (1), an output end of the cylinder (2) is fixedly connected to a hydraulic rod (3), and a side of the hydraulic rod (3) away from the cylinder (2) is fixedly connected to the connecting frame (23).

2. The wafer packaging cleaning device according to claim 1, characterized in that: The hydraulic rod (3) passes through and is slidably connected to one side of the cleaning box (1); the bidirectional screw rod (25) is provided with two sets of opposite threads and is symmetrically arranged; the bidirectional screw rod (25) passes through and is rotatably connected to the connecting frame (23).

3. The wafer packaging cleaning device according to claim 1, characterized in that: The connecting block (20), the first slide groove (21), and the sliding block (22) are each provided in two groups and are symmetrically arranged; the sliding plate (27) and the protective plate (28) are each provided in two groups and are symmetrically arranged; and the second slide groove (24) is provided in two groups and is symmetrically arranged.

4. The wafer packaging cleaning device according to claim 1, characterized in that: One side of the cleaning box (1) is hingedly connected to a box cover (4), one side of the box cover (4) is fixedly connected to a handle (5), the inner side of the box cover (4) is fixedly connected to a spray pipe (6), the spray pipe (6) is fixedly connected to a spray block (7), the spray block (7) is provided with a spray hole (8), and the spray pipe (6) is in communication with the spray block (7).

5. The wafer packaging cleaning device according to claim 1, characterized in that: A connecting plate (9) is fixedly connected to one side of the cleaning box (1), a water pump (12) is fixedly connected to the connecting plate (9), a water suction pipe (14) is fixedly connected to one side of the water pump (12), a drain pipe (13) is fixedly connected to the other side of the water pump (12), a transfer block (15) is fixedly connected to the side of the drain pipe (13) away from the water pump (12), a connecting hose (16) is fixedly connected inside the transfer block (15), and the connecting hose (16) passes through the side away from the transfer block (15) and is arranged in the nozzle (6).

6. The wafer packaging cleaning device according to claim 5, characterized in that: The drainage pipe (13), the water suction pipe (14) and the connecting hose (16) are interconnected.

7. The wafer packaging cleaning device according to claim 5, characterized in that: A water tank (10) is fixedly connected to the connecting plate (9), a feeding port (11) is provided on the water tank (10), and the water suction pipe (14) passes through the side away from the water pump (12) and is provided in the water tank (10).

8. The wafer packaging cleaning device according to claim 1, characterized in that: The lower surface of the cleaning box (1) is fixedly connected to support legs (17), and the support legs (17) are provided in four groups and arranged around the lower surface of the cleaning box (1). A drainage hole (19) is provided in the cleaning box (1), and the lower surface of the cleaning box (1) is fixedly connected to a drainage valve (18), and the drainage valve (18) is communicated with the drainage hole (19).

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