Cleaning device

Through the combination of remote plasma source and electrode plate assembly, the problem of poor cleaning uniformity of the cleaning device is solved, and a more uniform and efficient cleaning effect is achieved.

CN223197663UActive Publication Date: 2025-08-08LAPLACE RENEWABLE ENERGY TECH CO LTD
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Patent Information

Application Number
CN202422362152.8
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-09-26
Publication Date
2025-08-08
Estimated Expiration
2034-09-26

AI Technical Summary

Technical Problem

The cleaning device has poor cleaning uniformity of the cleaning parts to be washed, and some plasma is compounded into cleaning gas during the long path transmission process, losing the cleaning effect.

Method used

The first plasma is provided using a remote plasma source, and an electric field is formed through the electrode plate assembly to ionize the composite generated cleaning gas into the first plasma, thereby improving the cleaning uniformity.

Benefits of technology

The cleaning uniformity of the cleaning parts to be cleaned by the cleaning device is improved, the probability of cleaning unevenness is reduced, and the cleaning effect and efficiency are enhanced.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model relates to the technical field of deposition coating, in particular to a cleaning device, and solves the problem that the uniformity of a cleaning device for cleaning a to-be-cleaned part is poor. The cleaning device comprises a cavity, at least one remote plasma source, an electrode plate assembly and a power supply assembly. The cavity is provided with a cavity body used for containing a to-be-cleaned part, the remote plasma source is connected with the cavity body and can provide first plasma for the cavity body, and the first plasma is used for cleaning the to-be-cleaned part in the cavity body. Part of the first plasmas are compounded into cleaning gas in the cavity, the power supply assembly is electrically connected with the electrode plate assembly, so that the electrode plate assembly forms an electric field, and the electric field ionizes the cleaning gas into the first plasmas; the probability of poor cleaning uniformity of the cleaning device for the to-be-cleaned part due to the fact that part of the cleaning gas generated by compounding of the first plasmas loses the cleaning effect is reduced, and the cleaning uniformity of the cleaning device for the to-be-cleaned part is improved.
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Description

Technical Field

[0001] The present disclosure relates to the technical field of deposition and coating, and in particular to a cleaning device. Background Art

[0002] In the semiconductor and photovoltaic fields, cleaning equipment widely uses a remote plasma source (RPS) to provide plasma, which is used to remove residual silicon powder or parasitic silicon coating deposits from components within the process equipment chamber. The RPS typically generates a high-ionization-rate fluorine- or oxygen-containing plasma using a transformer and connects to the process equipment chamber to provide plasma.

[0003] However, during the long-path transmission of plasma in the chamber of the process equipment, part of the plasma will recombine into cleaning gas, losing the cleaning effect, resulting in poor cleaning uniformity of the cleaning device on the workpiece to be cleaned. Utility Model Content

[0004] In view of this, an embodiment of the present disclosure provides a cleaning device that solves the problem of poor uniformity in cleaning the workpieces to be cleaned by the cleaning device.

[0005] In a first aspect, an embodiment of the present disclosure provides a cleaning device, comprising: a chamber having a chamber configured to accommodate a workpiece to be cleaned; at least one remote plasma source connected to the chamber and configured to provide a first plasma to the chamber, wherein the first plasma is used to clean the workpiece to be cleaned in the chamber, wherein a portion of the first plasma is recombined into a cleaning gas in the chamber; an electrode plate assembly disposed in the chamber; and a power supply assembly electrically connected to the electrode plate assembly so that the electrode plate assembly forms an electric field, wherein the electric field is used to ionize the cleaning gas into the first plasma.

[0006] In some embodiments, the electrode plate assembly includes a first electrode plate and a second electrode plate arranged opposite to each other; wherein, the power supply assembly includes: an excitation power supply electrically connected to the first electrode plate; a bias power supply electrically connected to the second electrode plate, configured to load a negative bias voltage to the second electrode plate so as to generate a negative bias electric field between the first electrode plate and the second electrode plate, wherein the negative bias electric field is used to accelerate the movement of the first plasma.

[0007] In some embodiments, the remote plasma source is further configured to provide a second plasma to the chamber, and the second plasma is used to coat the parts to be cleaned in the chamber; the bias power supply is further configured to load a forward bias voltage to the second electrode plate to generate a positive bias electric field between the first electrode plate and the second electrode plate, wherein the positive bias electric field is used to suppress the movement of the second plasma.

[0008] In some embodiments, the excitation power supply is a direct current power supply.

[0009] In some embodiments, the chamber extends along a first direction, and the cavity has a first end and a second end in the first direction. There are multiple remote plasma sources, and the multiple remote plasma sources are respectively arranged at the first end and the second end of the cavity.

[0010] In some embodiments, a plurality of remote plasma sources disposed at the first end of the cavity and the second end of the cavity alternately provide the first plasma to the chamber; wherein, when the remote plasma source disposed at the first end of the cavity provides the first plasma to the chamber, the remote plasma source disposed at the second end of the cavity is further configured to extract gas from the chamber.

[0011] In some embodiments, the chamber extends along a first direction; the number of the electrode plate assemblies is multiple groups, and the first electrode plate and the second electrode plate of at least one group of the electrode plate assemblies are arranged relative to each other in a vertical direction, and / or, the first electrode plate and the second electrode plate of at least one group of the electrode plate assemblies are arranged relative to each other in a second direction; wherein, the first direction is a horizontal direction, and the second direction is perpendicular to the first direction and to the vertical direction; wherein, the number of the power supply assemblies is consistent with the number of the electrode plate assemblies, and the power supply assemblies are electrically connected to the electrode plate assemblies one by one, or, the number of the power supply assemblies is less than the number of the electrode plate assemblies, and at least one group of the power supply assemblies is electrically connected to at least two groups of the electrode plate assemblies.

[0012] In some embodiments, the first electrode plate and the second electrode plate both extend along the first direction from the first end of the chamber to the second end of the chamber.

[0013] In some embodiments, the remote plasma source is further configured to provide a predetermined volume of the first plasma to the chamber at predetermined intervals.

[0014] In some embodiments, the workpiece to be cleaned includes a boat structure, which includes a plurality of stacked and spaced boat blades, and the boat blades are made of a conductive material; wherein the power supply component is electrically connected to the boat blades to form an electric field between adjacent boat blades, so as to utilize the electric field to ionize the cleaning gas into the first plasma.

[0015] The cleaning device provided by the embodiment of the present disclosure utilizes a remote plasma source to provide a first plasma, and utilizes an electrode plate assembly to ionize the recombined cleaning gas to ionize the cleaning gas into the first plasma, thereby reducing the probability that the cleaning device will perform poor cleaning uniformity on the workpiece to be cleaned due to the cleaning gas recombined and partially losing its cleaning effect, thereby improving the cleaning uniformity of the workpiece to be cleaned by the cleaning device. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 Shown is a schematic structural diagram of a cleaning device and an object to be cleaned provided in one embodiment of the present disclosure.

[0017] Figure 2 Shown is a schematic diagram of an application scenario of a cavity and a remote plasma source provided in one embodiment of the present disclosure.

[0018] Figure 3 Shown is a schematic structural diagram of a cleaning device provided in one embodiment of the present disclosure.

[0019] Figure 4 Shown is a schematic structural diagram of a cleaning device and an object to be cleaned provided in another embodiment of the present disclosure.

[0020] Figure 5 Shown Figure 4 The cleaning device and the parts to be cleaned in the A area are shown in an enlarged view.

[0021] Figure 6 Shown is a structural schematic diagram of a boat structure provided by an embodiment of the present disclosure.

[0022] Figure 7 Shown Figure 6 Schematic diagram of the structure of the boat blades and power supply components of the boat structure shown.

[0023] Reference numerals:

[0024] 10. Cleaning device; 100. Cavity; 101. First end of the cavity; 102. Second end of the cavity; 1001. Chamber; 1011. First end of the chamber; 1021. Second end of the chamber; 200. Remote plasma source; 210. Gas inlet unit; 220. Gas extraction unit; 201. First plasma; 202. Cleaning gas; 203. Second plasma; 300. Electrode plate assembly; 310. First electrode plate; 320. Second electrode plate; 400. Power supply assembly; 410. Excitation power supply; 420. Bias power supply; X1. First direction; 2. Parts to be cleaned; 21. Boat structure; 211. Boat blade. DETAILED DESCRIPTION

[0025] The following will clearly and completely describe the technical solutions in the embodiments of the present disclosure in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present disclosure, not all of the embodiments. All other embodiments obtained by ordinary technicians in this field based on the embodiments of the present disclosure without making any creative efforts shall fall within the scope of protection of the present disclosure.

[0026] The specific structure of the cleaning device is described below in conjunction with embodiments.

[0027] Figure 1 Shown is a schematic structural diagram of a cleaning device and an object to be cleaned provided in one embodiment of the present disclosure. Figure 2 Shown is a schematic diagram of an application scenario of a cavity and a remote plasma source provided in one embodiment of the present disclosure. Figure 3 Shown is a schematic structural diagram of a cleaning device provided in one embodiment of the present disclosure. Figure 4 Shown is a schematic structural diagram of a cleaning device and an object to be cleaned provided in another embodiment of the present disclosure. Figure 5 Shown Figure 4 The cleaning device and the parts to be cleaned are shown in the enlarged view of the area A. Figures 1 to 5 As shown, the cleaning apparatus 10 includes a chamber 100 , at least one remote plasma source 200 , an electrode plate assembly 300 and a power supply assembly 400 .

[0028] The chamber 100 has a chamber 1001. The chamber 1001 is configured to accommodate a workpiece 2 to be cleaned. At least one remote plasma source 200 is connected to the chamber 100 and is configured to provide a first plasma 201 to the chamber 1001. The first plasma 201 is used to clean the workpiece 2 to be cleaned in the chamber 1001. During the long-path transmission of the first plasma 201 in the chamber 1001, part of the first plasma 201 is recombined into a cleaning gas 202 in the chamber 1001. The electrode plate assembly 300 is disposed in the chamber 1001. The power supply assembly 400 is electrically connected to the electrode plate assembly 300 so that the electrode plate assembly 300 forms an electric field, which is used to ionize the cleaning gas 202 into the first plasma 201.

[0029] The cleaning device 10 uses a remote plasma source 200 to provide a first plasma 201, and uses an electrode plate assembly 300 to ionize a cleaning gas 202 generated by the recombination of part of the first plasma 201, so as to ionize the cleaning gas 202 into the first plasma 201, thereby reducing the probability that the cleaning gas 202 generated by the recombination of part of the first plasma 201 loses its cleaning effect, resulting in poor cleaning uniformity of the cleaning device 10 on the workpiece 2 to be cleaned, thereby improving the uniformity of the cleaning device 10 in cleaning the workpiece 2 to be cleaned.

[0030] For example, the cross-section of the cavity 100 may be in the shape of a rectangular ring, a circular ring, other polygonal rings, or a ring of an irregular shape.

[0031] Exemplarily, the remote plasma source 200 may be disposed in the chamber 1001 or outside the cavity 100 . Figure 1 The remote plasma source 200 shown in FIG. 1 is disposed outside the chamber 100 .

[0032] Illustratively, the cleaning gas 202 is a fluorine-containing gas, such as carbon tetrafluoride (CF4) or sulfur hexafluoride (SF6). The cleaning gas 202 is ionized to generate fluorine-containing ions or other first plasma 201 for cleaning, thereby achieving the cleaning purpose. The present disclosure does not specifically limit the type of the cleaning gas 202.

[0033] For example, the arrangement direction of the electrode plate assembly 300 can be horizontal, vertical, etc. The arrangement position and arrangement direction of the electrode plate assembly 300 can be selected according to the placement position and placement direction of the workpiece 2 to be cleaned and the direction of the area to be cleaned of the workpiece 2 to be cleaned, so that the first plasma 201 generated after the electrode plate assembly 300 ionizes the cleaning gas 202 can better flow to the area to be cleaned of the workpiece 2 to be cleaned.

[0034] Exemplarily, the power supply assembly 400 may be a radio frequency AC power supply, a DC power supply, or the like.

[0035] In some embodiments, as Figure 1 As shown, each group of electrode plate assemblies 300 includes a first electrode plate 310 and a second electrode plate 320 arranged opposite to each other, and the power supply assembly 400 includes an excitation power supply 410 and a bias power supply 420. The excitation power supply 410 is electrically connected to the first electrode plate 310, and the bias power supply 420 is electrically connected to the second electrode plate 320. It is configured to load a negative bias voltage to the second electrode plate 320 to generate a negative bias electric field between the first electrode plate 310 and the second electrode plate 320. The negative bias electric field is used to accelerate the movement of the first plasma 201 to improve the cleaning effect and cleaning efficiency.

[0036] In addition, the bias power supply 420 is used to accelerate the first plasma 201, thereby reducing the problem of the first plasma 201 recombining during the path transmission due to the limitation of the area or shape of the chamber 1001 during the cleaning process, losing the cleaning effect, and thus resulting in a decrease in the cleaning effect, thereby further improving the cleaning effect.

[0037] In some embodiments, the remote plasma source 200 is further configured to provide a second plasma 203 to the chamber 1001. The second plasma 203 is used to coat the workpiece 2 to be cleaned in the chamber 1001. The bias power supply 420 is further configured to apply a forward bias voltage to the second electrode plate 320 to generate a positive bias electric field between the first electrode plate 310 and the second electrode plate 320. The positive bias electric field is used to suppress the movement of the second plasma 203.

[0038] In order to increase the service life of the workpiece 2 to be cleaned, after cleaning the workpiece 2, it is necessary to coat the workpiece 2 to be cleaned. The bias power supply 420 is used to load a forward bias to suppress the movement of the second plasma 203 to reduce the bombardment damage of the second plasma 203 to the workpiece 2 to be cleaned, thereby improving the coating quality.

[0039] In some embodiments, the excitation power supply 410 is a direct current (DC) power supply. A DC power supply has a lower frequency than an alternating current (AC) power supply. Therefore, after the electric field formed by the electrode plate assembly 300 ionizes the cleaning gas 202 into the first plasma 201, the low-frequency DC power supply exerts less acceleration resistance on the first plasma 201 during its accelerated flow, resulting in a better bombardment effect, i.e., a better cleaning effect.

[0040] In some embodiments, the chamber 1001 extends along a first direction X1, and the cavity 100 has a first end and a second end in the first direction X1. There are multiple remote plasma sources 200, and the multiple remote plasma sources 200 are respectively arranged at the first end 101 and the second end 102 of the cavity.

[0041] By respectively arranging remote plasma sources 200 at the first end 101 and the second end 102 of the cavity, multiple remote plasma sources 200 respectively provide first plasma 201 to both ends of the chamber 1001, thereby improving the uniformity of the first plasma 201 in the chamber 1001 and thus improving the uniformity of cleaning.

[0042] In addition, multiple remote plasma sources 200 can provide the first plasma 201 to the chamber 1001 simultaneously, which can increase the amount of the first plasma 201 entering the chamber 1001 per unit time, thereby improving the cleaning efficiency.

[0043] In addition, a plurality of remote plasma sources 200 can simultaneously provide the first plasma 201 to the chamber 1001 to clean both ends of the workpiece 2 at the same time, thereby improving the cleaning efficiency.

[0044] Exemplarily, at least one remote plasma source 200 is disposed at the first end 101 of the chamber, and at least one remote plasma source 200 is disposed at the second end 102 of the chamber.

[0045] In some embodiments, a plurality of remote plasma sources 200 disposed at the first end 101 and the second end 102 of the chamber alternately provide the first plasma 201 to the chamber 1001. While the remote plasma source 200 disposed at the first end 101 of the chamber provides the first plasma 201 to the chamber 1001, the remote plasma source 200 disposed at the second end 102 of the chamber is further configured to extract gas from the chamber 1001.

[0046] In addition, when the remote plasma source 200 disposed at the second end 102 of the chamber provides the first plasma 201 to the chamber 1001 , the remote plasma source 200 disposed at the first end 101 of the chamber is also configured to extract gas from the chamber 1001 .

[0047] Multiple remote plasma sources 200 are used to alternately provide first plasma 201 to both ends of the chamber 1001 to alternately clean both ends of the workpiece 2 to be cleaned, which can greatly improve the ionization rate and utilization rate of expensive fluorine-containing cleaning gas, thereby effectively reducing cleaning costs.

[0048] For example, Figure 4 As shown, the remote plasma source 200 includes a gas inlet unit 210 and a gas extraction unit 220 . The gas inlet unit 210 is configured to provide the first plasma 201 or the second plasma 230 into the chamber 1001 , and the gas extraction unit 220 is configured to extract gas from the chamber 1001 .

[0049] In some embodiments, as Figure 1 and Figure 3As shown, the chamber 1001 extends along the first direction X1. There are multiple groups of electrode plate assemblies 300. The first electrode plate 310 and the second electrode plate 320 of at least one group of electrode plate assemblies 300 are arranged opposite to each other in the vertical direction. The first direction X1 is the horizontal direction.

[0050] Exemplarily, the workpiece 2 to be cleaned extends along a first direction X1, the first electrode plate 310 of a group of electrode plate assemblies 300 is located above the workpiece 2 to be cleaned, the second electrode plate 320 is located below the workpiece 2 to be cleaned, and the first electrode plate 310 and the second electrode plate 320 both extend along the first direction X1, so that an electric field extending along the first direction X1 is formed between the first electrode plate 310 and the second electrode plate 320, and the electric field ionizes the cleaning gas 202 into a first plasma 201.

[0051] In some embodiments, as Figure 3 As shown, the chamber 1001 extends along a first direction X1. There are multiple sets of electrode plate assemblies 300, and the first electrode plate 310 and the second electrode plate 320 of at least one set of electrode plate assemblies 300 are arranged opposite each other along a second direction X2. The first direction X1 is a horizontal direction, and the second direction X2 is perpendicular to the first direction X1 and perpendicular to the vertical direction.

[0052] Exemplarily, the workpiece 2 to be cleaned extends in the vertical direction, the first electrode plate 310 of a group of electrode plate assemblies 300 is located on one side of the workpiece 2 to be cleaned, and the second electrode plate 320 is located on the other side of the workpiece 2 to be cleaned, and the first electrode plate 310 and the second electrode plate 320 both extend in the vertical direction and the first direction X1, so that the first electrode plate 310 and the second electrode plate 320 form an electric field extending in the vertical direction and the first direction X1, and the electric field ionizes the cleaning gas 202 into a first plasma 201.

[0053] In some embodiments, as Figure 3 and Figure 4 As shown, the chamber 1001 extends along a first direction X1. There are multiple groups of electrode plate assemblies 300. The first electrode plate 310 and the second electrode plate 320 of at least one group of electrode plate assemblies 300 are arranged opposite each other in a vertical direction. The first electrode plate 310 and the second electrode plate 320 of at least one group of electrode plate assemblies 300 are arranged opposite each other in a second direction X2. The first direction X1 is a horizontal direction, and the second direction X2 is perpendicular to the first direction X1 and perpendicular to the vertical direction.

[0054] In some embodiments, the number of power supply components 400 is consistent with the number of electrode plate components 300 , and the power supply components 400 are electrically connected to the electrode plate components 300 in a one-to-one correspondence.

[0055] The above-mentioned setting method facilitates the realization of multiple groups of power supply components 400 to separately control multiple groups of electrode plate components 300, so that multiple groups of electrode plate components 300 can form electric fields respectively, and use the electric fields of different regions to ionize the cleaning gas 202 in different regions into the first plasma 201, so as to clean different regions of the part 2 to be cleaned respectively.

[0056] In some embodiments, the number of power supply assemblies 400 is less than the number of electrode plate assemblies 300 , and at least one group of power supply assemblies 400 is electrically connected to at least two groups of electrode plate assemblies 300 .

[0057] Exemplarily, there are two groups of electrode plate assemblies 300. The first electrode plate 310 and the second electrode plate 320 of one group of electrode plate assemblies 300 are arranged relative to each other in a vertical direction, and the first electrode plate 310 and the second electrode plate 320 both extend along the first direction X1. The first electrode plate 310 and the second electrode plate 320 of one group of electrode plate assemblies 300 are arranged relative to each other in a second direction X2, and the first electrode plate 310 and the second electrode plate 320 both extend along the vertical direction and the first direction X1. There are two groups of power supply assemblies 400, and the two groups of power supply assemblies 400 are electrically connected to the two groups of electrode plate assemblies 300 in a one-to-one correspondence.

[0058] The electrode plate assemblies 300 are arranged in different directions to accommodate the objects 2 to be cleaned that are arranged in different directions.

[0059] In some embodiments, as Figure 1 As shown, the first electrode plate 310 and the second electrode plate 320 both extend from the first end 1011 of the chamber to the second end 1021 of the chamber along the first direction X1 to increase the coverage area of the electric field formed by the first electrode plate 310 and the second electrode plate 320, thereby improving the ionization effect of the electric field on the cleaning gas 202 and improving the cleaning effect.

[0060] In some embodiments, the remote plasma source 200 is further configured to provide a preset volume of the first plasma 201 to the chamber 1001 at predetermined intervals.

[0061] The plasma cleaning process uses a low-flow or intermittent gas supply method to effectively improve the utilization rate of expensive fluorine-containing cleaning gas, which can effectively reduce cleaning costs. In addition, it can also avoid the serious environmental pollution caused by the residual non-ionized cleaning gas 202.

[0062] In some embodiments, as Figure 4 、 Figure 6 and Figure 7As shown, the workpiece 2 to be cleaned includes a boat structure 21, which includes a plurality of stacked and spaced-apart boat blades 211 made of a conductive material. A power supply assembly 400 is electrically connected to the boat blades 211, forming an electric field between adjacent boat blades 211. The electric field ionizes the cleaning gas 202 into a first plasma 201.

[0063] Exemplarily, the boat blade 211 is made of graphite, silicon carbide, etc.

[0064] The cleaning device 10 provided in the embodiment of the present disclosure can be independently arranged outside the process equipment, and can clean the workpiece 2 to be cleaned in advance. There is no need to clean the workpiece 2 to be cleaned when the process equipment is performing other process operations on the workpiece 2 to be cleaned, thereby improving the production efficiency of the process equipment.

[0065] In addition, the cleaning process of the cleaning device 10 on the workpiece 2 to be cleaned does not occupy the space of the chamber of the process equipment and does not affect other processes of the process equipment. Therefore, the production efficiency and capacity of the process equipment can be further improved.

[0066] In addition, the size and shape of the chamber 1001 of the cavity 100 of the cleaning device 10 can be set as needed to accommodate different types, sizes and shapes of the workpiece 2 to be cleaned. For example, the workpiece 2 to be cleaned can be a graphite boat, a quartz boat, a boat support, a boat paddle, etc.

[0067] In the various embodiments of the present disclosure, unless otherwise specified, the connection may be in the form of a detachable connection using bolts and nuts, screws, snaps, magnets, etc. In some connections, if there is no particular requirement for a detachable connection, a non-detachable connection may be achieved by welding, bonding, etc.

[0068] References in the specification to "one embodiment," "an embodiment," and the like indicate that the described embodiment may include a particular feature, structure, or characteristic, but not every embodiment necessarily includes that particular feature, structure, or characteristic. Furthermore, such phrases do not necessarily refer to the same embodiment. Furthermore, when a particular feature, structure, or characteristic is described in conjunction with an embodiment, it is within the knowledge of those skilled in the art to implement such feature, structure, or characteristic in conjunction with other embodiments, whether explicitly described or not.

[0069] It should be understood that “on,” “above,” and “over” in this disclosure should be interpreted in the broadest manner, so that “on” means not only “directly on something,” but also includes the meaning of “on something” with intervening features or layers therebetween, and “above” or “over” includes not only the meaning of “above” or “over,” but also includes the meaning of “above” or “over” with no intervening features or layers therebetween (i.e., directly on something).

[0070] Additionally, spatially relative terms, such as "below," "beneath," "beneath," "above," and the like, may be used herein for ease of description to describe the relationship of one component or feature relative to other components or features as depicted in the figures. Spatially relative terms are intended to encompass different orientations of a component in use or operation in addition to the orientation depicted in the figures. The device may be otherwise oriented (rotated 90 degrees or at other orientations), and the spatially relative descriptors used herein should be interpreted accordingly.

[0071] It should be noted that, in this document, the terms "comprises," "includes," or any other variations thereof are intended to encompass non-exclusive inclusion, such that a process, method, article, or apparatus comprising a series of elements includes not only those elements but also other elements not explicitly listed, or elements inherent to such process, method, article, or apparatus. In the absence of further limitations, an element defined by the phrase "comprising a ..." does not exclude the presence of other identical elements in the process, method, article, or apparatus comprising the element.

[0072] The above description is only a preferred embodiment of the present disclosure and is not intended to limit the present disclosure. Any modifications, equivalent substitutions, etc. made within the spirit and principles of the present disclosure should be included in the scope of protection of the present disclosure.

Claims

1. A cleaning device, characterized in that: include: a cavity having a chamber configured to accommodate an item to be cleaned; at least one remote plasma source connected to the chamber and configured to provide a first plasma to the chamber, wherein the first plasma is used to clean the workpiece to be cleaned in the chamber, wherein a portion of the first plasma is recombined into a cleaning gas in the chamber; an electrode plate assembly, disposed in the chamber; A power supply assembly is electrically connected to the electrode plate assembly so that the electrode plate assembly forms an electric field, and the electric field is used to ionize the cleaning gas into the first plasma.

2. The cleaning device according to claim 1, characterized in that The electrode plate assembly includes a first electrode plate and a second electrode plate arranged opposite to each other; Wherein, the power supply component includes: an excitation power supply, electrically connected to the first electrode plate; A bias power supply is electrically connected to the second electrode plate and is configured to apply a negative bias to the second electrode plate to generate a negative bias electric field between the first electrode plate and the second electrode plate, wherein the negative bias electric field is used to accelerate the movement of the first plasma.

3. The cleaning device according to claim 2, characterized in that The remote plasma source is further configured to provide a second plasma to the chamber, wherein the second plasma is used to coat the workpiece to be cleaned in the chamber; The bias power supply is further configured to apply a forward bias to the second electrode plate to generate a positive bias electric field between the first electrode plate and the second electrode plate, wherein the positive bias electric field is used to suppress movement of the second plasma.

4. The cleaning device according to claim 2, characterized in that: The excitation power supply is a direct current power supply.

5. The cleaning device according to any one of claims 1 to 4, characterized in that: The chamber extends along a first direction. The chamber has a first end and a second end in the first direction. There are multiple remote plasma sources, which are respectively arranged at the first end and the second end of the chamber.

6. The cleaning device according to claim 5, characterized in that: A plurality of remote plasma sources disposed at the first end and the second end of the cavity alternately provide the first plasma to the chamber; Wherein, when the remote plasma source disposed at the first end of the cavity provides the first plasma to the chamber, the remote plasma source disposed at the second end of the cavity is further configured to extract gas from the chamber.

7. The cleaning device according to any one of claims 2 to 4, characterized in that: The chamber extends along a first direction; The electrode plate assemblies are provided in a plurality of groups, and the first electrode plate and the second electrode plate of at least one group of the electrode plate assemblies are arranged relative to each other in a vertical direction, and / or the first electrode plate and the second electrode plate of at least one group of the electrode plate assemblies are arranged relative to each other in a second direction; wherein the first direction is a horizontal direction, and the second direction is perpendicular to the first direction and perpendicular to the vertical direction; In which, the number of the power supply components is consistent with the number of the electrode plate components, and the power supply components are electrically connected to the electrode plate components one-to-one, or the number of the power supply components is less than the number of the electrode plate components, and at least one group of the power supply components is electrically connected to at least two groups of the electrode plate components.

8. The cleaning device according to claim 7, characterized in that: The first electrode plate and the second electrode plate both extend along the first direction from the first end of the chamber to the second end of the chamber.

9. The cleaning device according to any one of claims 1 to 4, characterized in that: The remote plasma source is further configured to provide a preset volume of the first plasma to the chamber every preset time.

10. The cleaning device according to any one of claims 1 to 4, characterized in that: The object to be cleaned comprises a boat structure, the boat structure comprises a plurality of boat blades stacked and spaced apart, and the material of the boat blades is a conductive material; The power supply assembly is electrically connected to the boat blades, so that an electric field is formed between adjacent boat blades, and the cleaning gas is ionized into the first plasma by utilizing the electric field.