Laser cutting platform

Abstract

The utility model discloses a laser cutting platform, which belongs to the technical field of wafer laser cutting, and comprises a support, a placing groove is arranged in the support, a leakage groove is arranged at one end of the placing groove, a push plate is arranged in the placing groove, the top of the push plate is fixedly connected with a handle, two ends of the push plate are respectively provided with an extension block, and the extension blocks are fixedly connected with the handle. According to the laser cutting device, the push plate can be pulled firstly to stretch the first spring, then a wafer needing to be subjected to laser cutting is placed in the containing groove, at the moment, the push plate is loosened, the wafer can be clamped under the action of the first spring, the wafer can be placed in the containing groove, the wafer can be placed in the containing groove, the wafer can be placed in the containing groove, and the wafer can be placed in the containing groove. At the moment, the motor is started to drive the threaded rod to rotate in a reciprocating mode, the laser cutter body circularly cuts the wafer, the cutting efficiency is high, the cutting speed is high, and the push plate can always push the wafer which is not cut to the position below the laser cutter body.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer laser cutting, in particular to a laser cutting platform. Background Art

[0002] As the core component of electronic products, the performance and quality of semiconductor chips directly determine the performance and reliability of the entire electronic product. In the manufacturing process of semiconductor chips, wafer cutting is a crucial link. Its cutting accuracy and efficiency directly affect the final quality of the chip and production cost. Traditionally, wafer cutting mostly uses mechanical cutting methods, such as diamond wheel cutting machines. However, with the continuous advancement of semiconductor technology, chip size is getting smaller and smaller, and the integration level is getting higher and higher, and the requirements for cutting accuracy are also increasing. Due to its inherent physical contact and wear characteristics, mechanical cutting methods cannot meet the high-precision and high-efficiency cutting requirements, and are prone to thermal and mechanical stress, resulting in wafer edge damage and unstable cutting quality.

[0003] On this basis, wafer laser cutting is currently a very popular cutting technology, which is widely favored due to its high cutting precision and high efficiency. However, during cutting, the wafer needs to be pushed to the bottom of the laser cutter for cutting, which greatly affects the progress of the cutting process and delays the work time and efficiency. At the same time, during cutting, the position needs to be adjusted and fixed at the same time. During fixation, certain structures will delay time and affect work efficiency. Utility Model Content

[0004] The utility model solves the technical problems in the above-mentioned background technology and provides a laser cutting platform.

[0005] In order to solve the above technical problems, the technical solution provided by the utility model is:

[0006] A laser cutting platform includes a bracket, a placement groove is provided in the bracket, a leakage groove is provided at one end of the placement groove, a push plate is provided in the placement groove, a handle is fixedly connected to the top of the push plate, extension blocks are respectively provided at both ends of the push plate, a slide groove is provided on the bracket, the extension block slides in the slide groove, and a first spring is fixedly connected in the slide groove.

[0007] Preferably, connecting plates are fixedly connected to both sides of the bracket, a top plate is fixedly connected to the top of the connecting plate, a motor is fixedly connected to one side of the connecting plate, a threaded rod is fixedly connected to the output end of the motor, a mounting plate is threadedly connected to the threaded rod, a laser cutter body is fixedly connected to the bottom of the mounting plate, a limiting plate is fixedly connected to the top of the mounting plate, and a limiting groove is provided below the top plate.

[0008] Preferably, a guide plate is fixedly connected to the bottom of the bracket, a collection box is fixedly connected to the guide plate, a second spring is fixedly connected inside the collection box, a collection plate is provided inside the collection box, a lifting handle is provided at both ends of the collection plate, a card slot is provided on the collection box, and the lifting handle slides in the card slot.

[0009] Preferably, the bottom of the bracket is fixedly connected to a supporting leg, the supporting legs are provided in four groups and are evenly distributed, and one end of the collection box is fixedly connected to the supporting leg.

[0010] Preferably, the placement groove is in an arc shape, the push plate is in a semicircular shape, one end of the first spring is fixedly connected to the extension block, and the handle is in a U shape.

[0011] Preferably, the connecting plate is U-shaped, the top plate is located directly above the drain groove, and the limiting plate slides in the limiting groove.

[0012] Preferably, the second spring is provided in several groups, the collecting plate is attached to one side of the guide plate, the guide plate is located directly below the drain groove, and one end of the second spring is attached to the bottom of the collecting plate.

[0013] With the above structure, the utility model has the following advantages:

[0014] 1. The utility model can first pull the push plate to stretch the first spring, and then place the wafer to be laser cut in the placement slot. At this time, the push plate is released to tighten the wafer under the action of the first spring. At this time, the motor is started to drive the threaded rod to rotate back and forth, so that the laser cutter body cuts the wafer in a cycle. The cutting efficiency is high and the speed is fast, and the push plate will continue to push the uncut wafer to the bottom of the laser cutter body.

[0015] 2. The utility model is provided with a leakage groove, which can allow the wafers after cutting to fall onto the guide plate below, and stack the wafers above the collection plate. At this time, the wafers will continuously press down the second spring, sorting the wafers in order, and the collection plate is limited in the slot by the lifting handle and will not shake. At the same time, it is convenient to take out the collection plate after collecting the wafers, thereby improving the practicality of the device.

[0016] The above summary is for the purpose of description only and is not intended to be limiting in any way. In addition to the illustrative aspects, embodiments and features described above, further aspects, embodiments and features of the present invention will be readily apparent by reference to the accompanying drawings and the following detailed description. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or technical descriptions. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0018] Figure 1 This is a schematic diagram of the structure of a laser cutting platform of the utility model Figure 1 ;

[0019] Figure 2 This is a cross-sectional view of a laser cutting platform of the present utility model;

[0020] Figure 3 This is a schematic diagram of the structure of a laser cutting platform of the utility model Figure 2 ;

[0021] Figure 4 yes Figure 2 A in the enlarged view.

[0022] As shown in the figure: 1. Bracket; 2. Placement slot; 3. Leakage slot; 4. Push plate; 5. Grip; 6. Extension block; 7. Slide slot; 8. First spring; 9. Connecting plate; 10. Top plate; 11. Motor; 12. Threaded rod; 13. Mounting plate; 14. Laser cutter body; 15. Limit plate; 16. Limit slot; 17. Guide plate; 18. Collection box; 19. Second spring; 20. Collection plate; 21. Lifting handle; 22. Slot; 23. Support leg. DETAILED DESCRIPTION

[0023] The following describes in detail embodiments of the present application. Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application and are not to be construed as limiting the present application.

[0024] In the description of this application, it should be noted that, unless otherwise expressly specified or limited, the terms "installed," "connected," and "connected" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integral connections; they can refer to mechanical connections or electrical connections; they can refer to direct connections or indirect connections through an intermediate medium; they can refer to internal communication between two components or the interaction between two components. Those skilled in the art will understand the specific meanings of the above terms in this application based on the specific circumstances.

[0025] The following is a further detailed description of the present invention in conjunction with the full text:

[0026] Combined with attachment Figures 1 to 4 , a laser cutting platform includes a bracket 1, a placement slot 2 is provided in the bracket 1, a leakage slot 3 is provided at one end of the placement slot 2, a push plate 4 is provided in the placement slot 2, a handle 5 is fixedly connected to the top of the push plate 4, and an extension block 6 is respectively provided at both ends of the push plate 4, and a slide slot 7 is provided on the bracket 1, and the extension block 6 slides in the slide slot 7, and a first spring 8 is fixedly connected in the slide slot 7. The push plate 4 can be pulled to stretch the first spring 8 first, and then the wafer to be laser cut can be placed in the placement slot 2. At this time, the push plate 4 is released and the wafer can be tightened under the action of the first spring 8. At this time, the motor 11 is started to drive the threaded rod 12 to rotate back and forth, so that the laser cutter body 14 cuts the wafer cyclically, with high cutting efficiency and fast speed, and the push plate 4 will always push the uncut wafer to the bottom of the laser cutter body 14.

[0027] Among them, the two sides of the bracket 1 are fixedly connected with a connecting plate 9, the top of the connecting plate 9 is fixedly connected with a top plate 10, one side of the connecting plate 9 is fixedly connected with a motor 11, the output end of the motor 11 is fixedly connected with a threaded rod 12, and the threaded rod 12 is threadedly connected to a mounting plate 13. The bottom of the mounting plate 13 is fixedly connected with a laser cutter body 14, the top of the mounting plate 13 is fixedly connected with a limit plate 15, and a limit groove 16 is provided at the bottom of the top plate 10. The bottom of the bracket 1 is fixedly connected with a guide plate 17, and a collection box 18 is fixedly connected to the guide plate 17. A second spring 19 is fixedly connected in the collection box 18, and a collection plate 20 is provided in the collection box 18. Both ends of the collection plate 20 are respectively provided with a lifting handle 21, and a card slot 22 is provided on the collection box 18. The lifting handle 21 slides in the card slot 22. The bottom of the bracket 1 is fixedly connected with a supporting leg 23. The supporting leg 23 is provided with four groups and is evenly distributed. One end of the collection box 18 is fixed The support leg 23 is fixedly connected to the support leg 23, the shape of the placement slot 2 is arc-shaped, the shape of the push plate 4 is semicircular, one end of the first spring 8 is fixedly connected to the extension block 6, the shape of the handle 5 is U-shaped, the shape of the connecting plate 9 is U-shaped, the top plate 10 is located directly above the leakage slot 3, the limit plate 15 slides in the limit slot 16, the second spring 19 is provided with several groups, the collecting plate 20 is attached to one side of the guide plate 17, the guide plate 17 is located directly below the leakage slot 3, one end of the second spring 19 is attached to the bottom of the collecting plate 20, by providing the leakage slot 3, the wafers after cutting can be dropped onto the guide plate 17 below, and the wafers can be stacked above the collecting plate 20, at this time, the wafers will continuously press down the second spring 19, sorting the wafers in order, and the collecting plate 20 is limited in the slot 22 by the lifting handle 21, and will not shake. At the same time, it is convenient to take out the collecting plate 20 after collecting the wafers, thereby improving the practicality of the device.

[0028] The working principle of the utility model is as follows: when in use, the operator holds the handle 5 and pulls the push plate 4 to make the extension block 6 slide in the slide groove 7 and stretch the two sets of first springs 8, and then places the wafer in the placement groove 2. At this time, the handle 5 is released, and the wafer is pushed and pressed under the action of the two sets of first springs 8, and one end of the wafer is attached to the side of the push plate 4 away from the placement groove 2. Then the motor 11 is started to drive the threaded rod 12 to rotate, and the threaded rod 12 drives the mounting plate 13 to move. At this time, the limit plate 15 slides in the limit groove 16. While the mounting plate 13 moves, the laser cutter body 14 is started to cut the wafer below, and the mounting plate 13 is attached to another set of connecting plates. 9, the starting motor 11 drives the threaded rod 12 to rotate in the opposite direction, and the wafers are cut repeatedly. The cut wafers will fall into the guide plate 17 below through the leakage groove 3, and fall onto the collection plate 20 through the guide plate 17. At this time, under the action of the gravity of the wafer, the collection plate 20 compresses the second spring 19 and makes the lifting handle 21 slide downward in the card slot 22. When a group of wafers is cut off, the first spring 8 will continue to pull the push plate 4 to fit the wafer, so that one side of the wafer is always in contact with the side of the placement groove 2 away from the push plate 4. After all the cutting is completed, hold the two sets of lifting handles 21 and take them out from the card slot 22, and then the collection plate 20 can be taken out of the collection box 18.

[0029] The above description of the present invention and its embodiments is non-limiting. What is shown in the full text is only one embodiment of the present invention, and the actual structure is not limited thereto. In short, if a person skilled in the art is inspired by this and, without departing from the purpose of the present invention, designs a structure and embodiment similar to the technical solution without creatively designing, they shall fall within the scope of protection of the present invention.

Claims

1. A laser cutting platform, comprising a bracket (1), characterized in that: The bracket (1) is provided with a placement groove (2), one end of the placement groove (2) is provided with a leakage groove (3), a push plate (4) is provided in the placement groove (2), the top of the push plate (4) is fixedly connected to a handle (5), and the two ends of the push plate (4) are respectively provided with extension blocks (6), the bracket (1) is provided with a slide groove (7), the extension block (6) slides in the slide groove (7), and the slide groove (7) is fixedly connected to a first spring (8).

2. A laser cutting platform according to claim 1, characterized in that: The two sides of the bracket (1) are respectively fixedly connected with connecting plates (9), the top of the connecting plate (9) is fixedly connected with a top plate (10), one side of the connecting plate (9) is fixedly connected with a motor (11), the output end of the motor (11) is fixedly connected with a threaded rod (12), the threaded rod (12) is threadedly connected with a mounting plate (13), the bottom of the mounting plate (13) is fixedly connected with a laser cutter body (14), the top of the mounting plate (13) is fixedly connected with a limiting plate (15), and a limiting groove (16) is provided below the top plate (10).

3. The laser cutting platform according to claim 2, characterized in that: The bottom of the bracket (1) is fixedly connected to a guide plate (17), the guide plate (17) is fixedly connected to a collection box (18), a second spring (19) is fixedly connected inside the collection box (18), a collection plate (20) is provided inside the collection box (18), and handles (21) are respectively provided at both ends of the collection plate (20), a card slot (22) is provided on the collection box (18), and the handle (21) slides in the card slot (22).

4. The laser cutting platform according to claim 3, characterized in that: The bottom of the bracket (1) is fixedly connected to a support leg (23), and the support legs (23) are provided in four groups and are evenly distributed. One end of the collection box (18) is fixedly connected to the support leg (23).

5. The laser cutting platform according to claim 4, characterized in that: The placement groove (2) is in an arc shape, the push plate (4) is in a semicircular shape, one end of the first spring (8) is fixedly connected to the extension block (6), and the handle (5) is in a U shape.

6. The laser cutting platform according to claim 5, characterized in that: The connecting plate (9) is U-shaped, the top plate (10) is located directly above the drain groove (3), and the limiting plate (15) slides in the limiting groove (16).

7. The laser cutting platform according to claim 6, characterized in that: The second spring (19) is provided in several groups, the collecting plate (20) is attached to one side of the guide plate (17), the guide plate (17) is located directly below the drain groove (3), and one end of the second spring (19) is attached to the bottom of the collecting plate (20).

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