Batch polishing device for multi-layer PCB sampling

Abstract

The utility model discloses a batch polishing device for multi-layer PCB sampling, which comprises a rack, a processing area, a first driving structure and a second driving structure are arranged on the rack, a working assembly is connected on the rack above the processing area through the first driving structure and the second driving structure, the working end of the working assembly is provided with a polishing sheet, and the polishing sheet is provided with a polishing head. The first driving structure and the second driving structure can drive the working assembly to move in the length direction and the width direction of the processing area. According to the polishing device, the first driving structure and the second driving structure are used for driving the working assembly with the polishing piece to move regionally, so that all sample pieces arranged on the processing area in batches can be polished, the disadvantage of polishing one by one is avoided, and the batch processing capacity of the polishing device is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of PCB board processing, in particular to a batch polishing device for multi-layer PCB sampling. Background Art

[0002] With the rapid development of electronic products, PCBs, as a crucial component of electronic equipment, are becoming increasingly sophisticated in their manufacturing processes. The emergence of multi-layer PCBs, in particular, has significantly improved the functional integration and performance stability of electronic devices. During the PCB production process, PCBs are sampled and inspected to verify their production status. This process involves sampling, cutting, sampling, and polishing to assess the production quality of batch parts. However, during the production process, multi-layer PCBs can be subject to burrs, adhesive residue, copper shavings, and other residues on and within the board due to interlayer lamination, drilling, and etching, which can seriously affect the electrical performance and reliability of the board.

[0003] Traditionally, surface treatment of multi-layer PCBs is usually done by manual polishing or a single automatic polishing device. However, manual polishing has problems such as low efficiency, poor consistency, and high cost, which has led to the emergence of equipment polishing.

[0004] However, existing multi-layer PCB polishing equipment mostly focuses on single-piece processing, lacks efficient batch processing capabilities, and has a low degree of automation, making it difficult to meet the needs of modern large-scale production. Utility Model Content

[0005] The purpose of the utility model is to provide a batch polishing device for multi-layer PCB sampling to solve the technical problem in the prior art that the prior art does not meet the requirements of modern large-scale production due to the focus on single-piece processing.

[0006] In order to solve the above technical problems, the present invention specifically provides the following technical solutions:

[0007] A batch polishing device for multi-layer PCB sampling includes a platform, a processing area, a first drive structure, and a second drive structure provided on the platform. A working component is connected to the platform above the processing area via the first drive structure and the second drive structure. A polishing disc is provided at the working end of the working component. The first drive structure and the second drive structure can drive the working component to move along the length and width of the processing area.

[0008] The first driving structure includes two parallel tracks opened on both sides of the processing area, two slide mechanisms are arranged in the two parallel tracks, and the second driving structure is arranged on the slides of the two slide mechanisms;

[0009] The second driving structure includes a base, both ends of the base are arranged on the slide, a processing cavity facing the processing area is provided in the middle of the base, a slide is provided in the processing cavity, and the slide is slidably installed in the processing cavity along the length direction of the base through a slide rod structure, and the working component is installed on the slide.

[0010] As a preferred solution of the present invention, two second driving structures are provided on the slide mechanism, and the two driving mechanisms are both provided with the working components, wherein the grinding disc and the polishing disc are respectively provided at the ends of the two working components.

[0011] As a preferred solution of the present invention, the working assembly includes a driving motor fixedly mounted on the slide, and a grinding rod is coaxially fixedly mounted on the working end of the driving motor;

[0012] The grinding sheet and the polishing sheet are respectively arranged at the ends of the grinding rod.

[0013] As a preferred solution of the present invention, the grinding rod includes a first rod and a second rod, the first rod is fixedly connected to the working end of the drive motor, and the second rod is connected to the first rod by threaded engagement;

[0014] The grinding sheet and the polishing sheet are respectively arranged on the ends of the second rod.

[0015] As a preferred solution of the present invention, the grinding plate and the polishing plate are detachably connected to the end of the grinding rod.

[0016] As a preferred solution of the present invention, the two parallel rails extend to one side of the stand and form a replacement gap between the two parallel rails. The working component can be moved into the replacement gap through the first driving structure to replace the grinding plate and the polishing plate.

[0017] Compared with the prior art, the present invention has the following beneficial effects:

[0018] The utility model utilizes the first drive structure and the second drive structure to drive the working assembly with the grinding disc to move regionally, so that all the sample pieces arranged in batches in the processing area can be polished, avoiding the disadvantage of polishing each one individually and improving the batch processing capacity of the polishing device.

[0019] Furthermore, by providing a replacement notch and another set of working components with polishing pads, the overall device can achieve better polishing effect on multi-layer PCBs with more circuit elements, and the wear marks and deformed surfaces formed on the sample by the traditional polishing device can be reprocessed, thereby improving the polishing effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] To more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for the embodiments or the description of the prior art. Obviously, the drawings described below are merely illustrative, and those skilled in the art can, without inventive effort, derive other implementation drawings based on the provided drawings.

[0021] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0022] Figure 2 It is a side sectional view of the utility model;

[0023] Figure 3 For this utility model Figure 2 Enlarged view of point A in the middle.

[0024] The numbers in the figure represent the following:

[0025] 1. Stand; 2. Processing area; 3. First drive structure; 4. Second drive structure; 5. Working assembly; 6. Grinding disc; 7. Parallel track; 8. Slide mechanism; 9. Base; 10. Slide; 11. Processing cavity; 12. Slide plate; 13. Slide rod structure; 14. Drive motor; 15. Grinding rod; 16. First rod; 17. Second rod; 18. Changing gap; 19. Polishing disc. DETAILED DESCRIPTION

[0026] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0027] like Figure 1 As shown, the utility model provides a batch polishing device for multi-layer PCB sampling, including a stand 1, on which a processing area 2, a first drive structure 3 and a second drive structure 4 are provided, wherein the processing area 2 is arranged on the table of the stand 1, and is used to arrange slices of the multi-layer PCB. A plurality of arrangement points can be set on the processing area 2, and the arrangement points can use melt glue as an adhesive to fix the slices on the table, thereby providing a basis for subsequent polishing work.

[0028] The first driving structure 3 includes two parallel tracks 7 opened on both sides of the processing area 2 . Two slide mechanisms 8 are arranged in the two parallel tracks 7 . The second driving structure 4 is arranged on slides 10 of the two slide mechanisms 8 .

[0029] The second driving structure 4 includes a base 9, both ends of which are arranged on a slide 10, a processing cavity 11 is provided in the middle of the base 9 and faces the processing area 2, a slide 12 is provided in the processing cavity 11, and the slide 12 is slidably installed in the processing cavity 11 along the length direction of the base 9 through a slide rod structure 13, and the working component 5 is installed on the slide 12.

[0030] A working assembly 5 is connected to the gantry 1 above the processing area 2 via a first drive mechanism 3 and a second drive mechanism 4. A grinding disc 6 is provided at the working end of the working assembly 5. The first drive mechanism 3 and the second drive mechanism 4 can drive the working assembly 5 to move along the length and width of the processing area 2. The working assembly 5 moves along the length and width of the processing area 2 to grind slices at any position in the processing area 2.

[0031] Specifically, two second driving structures 4 are provided on the slide mechanism 8 , and both driving mechanisms are provided with a working component 5 , wherein the ends of the two working components 5 are provided with a grinding sheet 6 and a polishing sheet 19 , respectively.

[0032] In this device, the working assembly 5 is used to directly polish the slice. Depending on the grinding pad 6 and polishing pad 19 located at the ends of the working assembly 5, the multilayer PCB is then ground and polished, ensuring that the cross-section more closely meets inspection requirements. Therefore, the device is equipped with two working assemblies 5, each with a grinding pad 6 and polishing pad 19 located at its ends, enabling the slice sections to be processed sequentially.

[0033] The working assembly 5 includes a driving motor 14 fixedly mounted on the slide 12 , and a grinding rod 15 is coaxially fixedly mounted on the working end of the driving motor 14 .

[0034] The grinding plate 6 and the polishing plate 19 are respectively arranged at the ends of the grinding rod 15.

[0035] The grinding rod 15 includes a first rod 16 and a second rod 17 . The first rod 16 is fixedly connected to the working end of the driving motor 14 , and the second rod 17 is connected to the first rod 16 by screw thread engagement.

[0036] The threaded connection between the first rod 16 and the second rod 17 allows for adjustment of the height of the end of the second rod 17. Rotating the second rod 17 adjusts the height of the end of the second rod 17, and the height of the grinding disc 6 and polishing disc 19 at the end, thereby achieving a better polishing effect on slices with varying heights after polishing. This adjustment can be performed by sliding the entire assembly to the refitting notch 18.

[0037] The grinding plate 6 and the polishing plate 19 are respectively arranged at the ends of the second rod 17.

[0038] The grinding plate 6 and the polishing plate 19 are detachably connected to the end of the grinding rod 15.

[0039] The two parallel rails 7 extend to one side of the platform 1 and form a replacement gap 18 between the two parallel rails 7. The working component 5 can be moved into the replacement gap 18 by the first driving structure 3 to replace the grinding plate 6 and the polishing plate 19.

[0040] The use of the replacement notch 18 facilitates the replacement of the grinding pad 6 and polishing pad 19 at the end of the working assembly 5. In practice, the grinding pad 6 and polishing pad 19 can be mounted on the end of the second rod 17 using a conventional quick-release mechanism. Specifically, multiple grinding pads 6 and polishing pads 19 with varying mesh sizes are available. When the working assembly 5 is moved to the replacement notch 18 via the first drive mechanism 3, the quick-release mechanism allows for quick and efficient replacement of the grinding pad 6 and polishing pad 19 at the end of the second rod 17.

[0041] In addition, a suction cup can be provided at the bottom of the stand 1, and the stand 1 can be fixedly adsorbed on the operating table by the suction cup, making the specific operation more convenient.

[0042] The above embodiments are merely exemplary embodiments of the present application and are not intended to limit the scope of the present application. The scope of protection of the present application is defined by the claims. Those skilled in the art may make various modifications or equivalent substitutions to the present application within the essence and scope of protection of the present application, and such modifications or equivalent substitutions shall also be deemed to fall within the scope of protection of the present application.

Claims

1. A batch polishing device for multi-layer PCB sampling, characterized in that: A stand (1), wherein a processing area (2), a first drive structure (3) and a second drive structure (4) are provided on the stand (1); a working component (5) is connected to the stand (1) above the processing area (2) via the first drive structure (3) and the second drive structure (4); a grinding plate (6) is provided at the working end of the working component (5); and the first drive structure (3) and the second drive structure (4) are capable of driving the working component (5) to move along the length direction and the width direction of the processing area (2); The first driving structure (3) comprises two parallel tracks (7) provided on both sides of the processing area (2), two slide mechanisms (8) are provided in the two parallel tracks (7), and the second driving structure (4) is provided on the slides (10) of the two slide mechanisms (8); The second driving structure (4) includes a base (9), both ends of the base (9) are arranged on the slide (10), a processing cavity (11) facing the processing area (2) is provided in the middle of the base (9), a slide (12) is provided in the processing cavity (11), and the slide (12) is slidably installed in the processing cavity (11) along the length direction of the base (9) through a slide rod structure (13), and the working component (5) is installed on the slide (12).

2. The batch polishing device for multi-layer PCB sampling according to claim 1, characterized in that: Two second drive structures (4) are provided on the slide mechanism (8), and the two second drive structures (4) are both provided with the working components (5), wherein the ends of the two working components (5) are respectively provided with the grinding sheet (6) and the polishing sheet (19).

3. The batch polishing device for multi-layer PCB sampling according to claim 2, characterized in that: The working assembly (5) includes a driving motor (14) fixedly mounted on the slide (12), and a grinding rod (15) is coaxially fixedly mounted on the working end of the driving motor (14); The grinding plate (6) and the polishing plate (19) are respectively arranged at the ends of the grinding rod (15).

4. The batch polishing device for multi-layer PCB sampling according to claim 3, characterized in that: The grinding rod (15) comprises a first rod (16) and a second rod (17), wherein the first rod (16) is fixedly connected to the working end of the driving motor (14), and the second rod (17) is connected to the first rod (16) by means of a threaded engagement; The grinding plate (6) and the polishing plate (19) are respectively arranged at the ends of the second rod (17).

5. The batch polishing device for multi-layer PCB sampling according to claim 4, characterized in that: The grinding plate (6) and the polishing plate (19) are detachably connected to the end of the grinding rod (15).

6. The batch polishing device for multi-layer PCB sampling according to claim 5, characterized in that: The two parallel rails (7) extend toward one side of the platform (1) and form a replacement gap (18) between the two parallel rails (7). The working component (5) can be moved into the replacement gap (18) by the first driving structure (3) to replace the grinding plate (6) and the polishing plate (19).

Images