Wafer packaging device

Abstract

The utility model relates to the technical field of semiconductor packaging, in particular to a wafer packaging device which comprises a box body, a plurality of first clamping pieces are fixedly arranged on one side wall face in the box body, and second clamping pieces with the same number are movably arranged in the box body. The second clamping pieces correspond to the first clamping pieces, are located on the same horizontal line and are used for cooperatively clamping and separating the wafer, a plurality of groups of mounting parts are arranged between the first clamping pieces and the second clamping pieces at intervals, and the second clamping pieces can be detachably fixed to any mounting part. The wafer packaging device aims at solving the problem that a traditional wafer packaging device is only suitable for wafers with specific sizes.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor packaging, in particular to a wafer packaging device. Background Art

[0002] Wafers are fundamental materials in semiconductor manufacturing. They are typically thin slices of high-purity single-crystal semiconductor material and are primarily used in the manufacture of integrated circuits (ICs), microprocessors, memory chips, and other microelectronic devices. Wafer packaging systems are used for the storage, handling, and transportation of wafers, protecting them from environmental dust contamination. Internal partitions reduce impurities caused by friction during wafer movement.

[0003] However, it has been found that traditional wafer packaging devices are often designed to accommodate only wafers of a specific size, and separate accommodating slots must be designed for wafers of different sizes and specifications. This has poor versatility and makes the manufacturing cost of the packaging device high. Utility Model Content

[0004] In order to solve the problems in the above background technology, the present invention provides a wafer packaging device.

[0005] The solution adopted by the present invention to solve its technical problem is: a wafer packaging device, including a box body, a plurality of first clamping members are fixedly provided on one side wall of the box body, an equal number of second clamping members are movably provided in the box body, each second clamping member corresponds to the first clamping member and is located on the same horizontal line for cooperating to clamp and separate wafers, a plurality of groups of mounting parts are arranged between the first clamping members and the second clamping members, and the second clamping members can be detachably fixed to any mounting part.

[0006] By adopting the above technical solution, the distance between the second clamping member and the first clamping member can be adjusted to accommodate wafers of different sizes, thereby improving the versatility of the packaging device and reducing the need to replace the packaging device due to changes in wafer size.

[0007] Furthermore, the first clamping member is recessed inwardly toward one side of the second clamping member to form a first installation groove, and the second clamping member is recessed inwardly toward one side of the first clamping member to form a second installation groove.

[0008] By adopting the above technical solutions, a support interface is formed together, which can firmly fix the wafers and prevent them from displacement and mutual collision.

[0009] Furthermore, a snap-fit interface is provided on the bottom wall of the box body corresponding to each of the mounting portions, and a snap-fit component adapted to the snap-fit interface is provided at the bottom of each of the second clamping members, and the second clamping member is detachably fixedly installed in the snap-fit interface through the snap-fit component.

[0010] By adopting the above technical solution, the snap member is inserted into the snap interface, so that the second clamping member can be detachably fixedly installed in the box body.

[0011] Furthermore, protective pads are provided on the inner walls of the first installation groove and the second installation groove.

[0012] By adopting the above technical solution, direct contact between the wafer and the clamping member can be reduced, avoiding scratches or other physical damage to the wafer surface caused by contact with hard materials.

[0013] Furthermore, the box body is made of transparent material.

[0014] By adopting the above technical solution, it is convenient to observe the situation of the wafers inside the box from the outside.

[0015] To sum up, the beneficial effects of the present invention are as follows: by arranging multiple sets of mounting parts and an adjustable second clamping member on the box body, the present invention can adjust the distance between the first clamping member and the second clamping member according to the size of the loaded wafer to adapt to wafers of different sizes, effectively enhancing the versatility of the packaging device, reducing the need to replace the packaging device due to changes in wafer size, and reducing costs.

[0016] The above description is only an overview of the technical solution of the present invention. In order to more clearly understand the technical means of the present invention, it can be implemented in accordance with the contents of the specification. In addition, in order to make the above and other purposes, features and advantages of the present invention more obvious and easy to understand, the following preferred embodiments are specifically cited and described in detail with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 Schematic diagram of the internal structure of this embodiment;

[0018] Figure 2 is a schematic diagram of the second clamping member of this embodiment;

[0019] Figure 3 It is an overall schematic diagram of this embodiment.

[0020] In the figure: 1. Box body; 2. First clamping member; 21. First mounting slot; 3. Second clamping member; 31. Second mounting slot; 4. Snap-on interface; 5. Snap-on member; 6. Protective pad. DETAILED DESCRIPTION

[0021] In order to make the content of the present invention more clearly understood, the present invention will be further described below based on specific embodiments in conjunction with the accompanying drawings.

[0022] It should be noted that the terms "center," "upper," "lower," "front," "back," "left," "right," "inner," and "outer" used herein to indicate positions or locations are based on the positions or locations shown in the accompanying drawings and are intended solely to facilitate and simplify the description of the present invention. They are not intended to indicate or imply that the devices or components referred to must have a specific orientation, be constructed, or operate in a specific orientation. Therefore, they should not be construed as limitations on the present invention. Unless otherwise specified, "plurality" means two or more.

[0023] Unless otherwise specified or limited, the terms "mounted," "connected," and "connected" should be interpreted broadly. For example, they can refer to fixed, removable, or integral connections; mechanical or electrical connections; direct or indirect connections through an intermediary; and internal communication between two components. Those skilled in the art will understand the specific meanings of these terms in this utility model based on specific circumstances.

[0024] like Figures 1 to 3 As shown, a wafer packaging device includes a box body 1, wherein a plurality of first clamping members 2 are fixedly provided on a side wall surface of the box body 1 of this embodiment, and an equal number of second clamping members 3 are movably provided in the box body 1, each second clamping member 3 corresponds to the first clamping member 2 and is located on the same horizontal line for cooperating to clamp and separate wafers, and a plurality of groups of mounting portions are spaced between the first clamping member 2 and the second clamping member 3, and the second clamping member 3 can be detachably fixed to any mounting portion.

[0025] In this embodiment, a plurality of first clamping members 2 are arranged vertically and fixedly on one side of the interior of the box body 1. Furthermore, a plurality of second clamping members 3 are provided on the box body 1, corresponding one-to-one with the first clamping members 2 and located on the same horizontal line. Each second clamping member 3 cooperates with the first clamping member 2 to form an adjustable clamping system that can clamp, fix, and space each wafer, thereby ensuring the stability of the wafers during storage and transportation, while also avoiding impurities generated by wafer displacement and friction, thereby ensuring the quality of the wafers. Furthermore, a plurality of mounting portions for securing the second clamping members 3 are spaced apart on the horizontal line between each first clamping member 2 and the second clamping member 3. In this embodiment, the approximate distances between each group of mounting portions and the first clamping member 2 are 8 inches, 12 inches, and 18 inches, respectively. Multiple fixing areas are provided, allowing the second clamping member 3 to adjust its position between these fixing areas according to the size of the wafer, thereby tightly clamping wafers of different sizes and effectively enhancing the versatility of the packaging device.

[0026] like Figure 1 and Figure 2As shown, the first clamping member 2 of this embodiment is recessed inwardly toward the side of the second clamping member 3 to form a first mounting groove 21, and the second clamping member 3 is recessed inwardly toward the side of the first clamping member 2 to form a second mounting groove 31. The first mounting groove 21 and the second mounting groove 31 match the shape of the wafer, together forming a stable support interface. When the wafer is placed between the two clamping members, the edge of the wafer fits neatly into the two grooves, forming a stable support structure with three or four points of contact. Adjacent wafers are separated by the groove walls, preventing displacement of the wafers during transportation or storage and reducing the risk of damage to the wafers due to collision or friction.

[0027] like Figure 1 and Figure 2 As shown, in this embodiment, the bottom wall of the box body 1 is provided with a snap interface 4 corresponding to each mounting portion, and a snap member 5 adapted to the snap interface 4 is provided at the bottom of each second clamping member 3. The second clamping member 3 is detachably fixed to the snap interface 4 through the snap member 5. The snap interface 4 is provided at the bottom wall of the box body 1 corresponding to each mounting portion, and the snap member 5 is provided on the back wall of each second clamping member 3 near the bottom. The connection mechanism between the snap interface 4 and the snap member 5 is based on the principle of elastic deformation. When the snap member 5 is inserted into the snap interface 4, the raised portion on the snap member 5 temporarily compresses the elastic component (such as a spring or elastic claw) in the snap interface 4 until the snap member 5 is fully in place. At this time, the elastic component returns to its original state, forming a locked state, preventing the snap member 5 from accidentally falling out of the interface. This locked state is maintained by the friction and elastic force between the snap member 5 and the snap interface 4, ensuring the stability of the connection. When disassembly is required, a certain force is applied to separate the buckle member 5 from the buckle interface 4 to overcome the resistance of the elastic component, and the second clamping member 3 can be easily taken out.

[0028] like Figure 1 As shown, a protective pad 6 is provided on the inner wall of the first mounting groove 21 and the second mounting groove 31 of this embodiment. The protective pad 6 can be a silicone pad, a rubber pad, or a sponge pad, which can reduce direct contact between the wafer and the clamping member and avoid scratches or other physical damage to the wafer surface caused by contact with hard materials. It also has a certain degree of elasticity and can absorb and disperse the vibration energy generated during handling or transportation, reducing the displacement or collision of the wafer caused by vibration. Anti-static materials can also be used to reduce static electricity accumulation and prevent electrostatic discharge from damaging the wafer.

[0029] Furthermore, the box body 1 of this embodiment is made of a transparent material. Using a material such as acrylic resin that is both pressure-resistant and transparent allows the status of the wafers inside to be directly observed without the need to frequently open the box body 1. This reduces the risk of external contaminants entering and facilitates checking the condition of the wafers at any time, such as whether they are damaged, contaminated, or displaced.

[0030] In summary, the beneficial effects of this embodiment are as follows: by providing multiple sets of mounting portions and an adjustable second clamping member 3 on the box body 1, this embodiment can adjust the distance between the first clamping member 2 and the second clamping member 3 according to the size of the loaded wafer to accommodate wafers of different sizes, effectively enhancing the versatility of the packaging device, reducing the need to replace the packaging device due to changes in wafer size, and reducing costs. The recessed design of the first mounting groove 21 and the second mounting groove 31 forms a stable support structure, reducing the displacement and friction of the wafers during transportation or storage. At the same time, the wafers are separated by the groove wall to avoid direct contact friction between adjacent wafers. The combined design of the snap interface 4 and the snap member 5 facilitates simple and quick adjustment of the second clamping member 3.

[0031] The embodiments described above are only preferred implementation methods of the present invention and cannot be used to limit the scope of protection of the present invention. Any non-substantial changes and modifications made by technicians in this field on the basis of the utility model shall fall within the scope of protection of the present invention.

Claims

1. A wafer packaging device, comprising a box body, characterized in that: A plurality of first clamping members are fixedly provided on one side wall of the box body, and an equal number of second clamping members are movably provided in the box body. Each of the second clamping members corresponds to the first clamping member and is located on the same horizontal line for cooperating in clamping and separating wafers. A plurality of mounting parts are spaced between the first clamping members and the second clamping members, and the second clamping members can be detachably fixed to any mounting part.

2. The wafer packaging device according to claim 1, characterized in that: The first clamping member is recessed inwardly toward one side of the second clamping member to form a first installation groove, and the second clamping member is recessed inwardly toward one side of the first clamping member to form a second installation groove.

3. The wafer packaging device according to claim 2, characterized in that: The bottom wall of the box body is provided with a snap interface corresponding to each of the mounting portions, and the bottom of each of the second clamping members is provided with a snap member adapted to the snap interface, and the second clamping member is detachably fixed to the snap interface through the snap member.

4. The wafer packaging device according to claim 3, characterized in that: Protective pads are provided on the inner walls of the first installation groove and the second installation groove.

5. The wafer packaging device according to claim 4, characterized in that: The box body is made of transparent material.

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