Two-dimensional sensor with protection function

By introducing the heat dissipation structure of semiconductor refrigeration sheet and cooling fan into the laser displacement sensor, combined with the disassembly and assembly design of the back plate and fixed block, the problems of poor heat dissipation effect and difficulty in disassembly are solved, and the stable operation and efficient maintenance of the equipment are achieved.

CN223204886UActive Publication Date: 2025-08-08KAIFENG KAILIU INSTR CO LTD
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Patent Information

Application Number
CN202420868592.8
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-04-24
Publication Date
2025-08-08
Estimated Expiration
2034-04-24

AI Technical Summary

Technical Problem

The heat dissipation structure of the existing laser displacement sensors is unreasonable, resulting in poor heat dissipation effect, affecting the stability and life of the equipment, and at the same time, the disassembly and maintenance efficiency is low.

Method used

The heat dissipation mechanism composed of semiconductor refrigeration sheet and cooling fan is combined with the disassembly and assembly mechanism of the back plate and the fixed block to achieve rapid disassembly and assembly and effective heat dissipation.

Benefits of technology

It improves the working stability of the laser module, extends the service life of the equipment, simplifies the maintenance process, and improves efficiency.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model relates to the technical field of two-dimensional sensors, and discloses a two-dimensional sensor with a protection function, which comprises a protection shell, a laser module fixedly mounted in the inner wall of the protection shell, a display module fixedly mounted in the inner wall of the protection shell, and a semiconductor chilling plate arranged at the top end of the inner wall of the protection shell. The heat dissipation mechanism is arranged in the protective shell, the heat dissipation mechanism is used for heat dissipation of the protective shell, the heat dissipation mechanism comprises a heat dissipation fan, and the heat dissipation fan is fixedly installed on the upper surface of the semiconductor chilling plate; the dismounting and mounting mechanism is arranged on the protective shell and used for dismounting and mounting the two-dimensional sensor and overhauling the interior of the two-dimensional sensor, the two-dimensional sensor with the protective function can blow cold air produced by the semiconductor chilling plate into the protective shell and effectively dissipate heat of the interior of the two-dimensional sensor, a laser module can run at a proper temperature, and the laser module can run at a proper temperature. The optimal working state of the two-dimensional sensor is maintained, and the service life of the two-dimensional sensor can be effectively prolonged.
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Description

Technical Field

[0001] The utility model relates to the technical field of two-dimensional sensors, in particular to a two-dimensional sensor with a protective function. Background Art

[0002] The laser 2D sensor is a non-contact precision measurement tool that performs calculations by scanning a laser on a plane at an offset angle from x° to 50°. Based on the principle of diffuse reflection focused imaging, it can measure the surface of almost any material or liquid. It features a sturdy scanner structure and high measurement accuracy, making it suitable for 2D and contour measurement.

[0003] The laser generator of the existing laser displacement sensor generates a large amount of heat during operation. The electronic components inside the laser generator will generate heat loss due to untimely heat dissipation, thereby reducing its working life and working stability. The heat dissipation structure of the existing laser displacement sensor is very simple, and passive heat dissipation with heat dissipation holes is opened. The heat dissipation structure is unreasonable and the heat dissipation effect is poor, which cannot achieve the expected heat dissipation effect. In addition, the existing radiator protective shell is installed with a bolt structure. When it is repaired, it needs to be disassembled with the help of tools and takes a lot of time, resulting in low maintenance efficiency. In view of this, a two-dimensional sensor with protective function is proposed. Utility Model Content

[0004] (1) Technical problems solved

[0005] In response to the shortcomings of the existing technology, the utility model provides a two-dimensional sensor with a protective function, which has the advantages of heat dissipation inside the protective shell and quick disassembly and assembly for maintenance, solving the problem that the heat dissipation structure inside the protective shell is difficult to meet the standards, resulting in the electrical components not being able to operate stably.

[0006] (2) Technical solution

[0007] In order to achieve the above-mentioned purpose of heat dissipation within the protective shell and rapid disassembly for maintenance, the utility model provides the following technical solutions: a two-dimensional sensor with a protective function, comprising a protective shell, a laser module fixedly mounted on the inner wall of the protective shell, a display module fixedly mounted on the inner wall of the protective shell, and a semiconductor cooling plate provided on the top of the inner wall of the protective shell;

[0008] A heat dissipation mechanism is provided in the protective housing and is used to dissipate heat from the protective housing. The heat dissipation mechanism includes a heat dissipation fan, which is fixedly mounted on the upper surface of the semiconductor refrigeration plate.

[0009] The disassembly and assembly mechanism is arranged on the protective shell and is used to disassemble and assemble the two-dimensional sensor and inspect its interior. The disassembly and assembly mechanism includes a back plate, which is arranged on the left surface of the protective shell.

[0010] Preferably, the heat dissipation mechanism further includes a cooling fin and a cooling fan, the cooling fin is fixedly mounted on the lower surface of the semiconductor refrigeration fin, and the cooling fan is fixedly mounted on the lower surface of the cooling fin.

[0011] Preferably, the left surface of the protective shell is provided with five slots, each of the five slots is provided with a card slot, and the card slot is provided on a side of the five slots closer to the outside.

[0012] Preferably, the disassembly and assembly mechanism further includes five fixing blocks, and the five fixing blocks are all fixedly mounted on the right surface of the back plate.

[0013] Preferably, a spring groove is provided on one side of the five fixing blocks close to the outside, and a clamping block is fixedly installed on the inner wall of the spring groove.

[0014] Preferably, the disassembly and assembly mechanism further comprises five clamping blocks, which are respectively fixedly mounted on the outer ends of the five springs, and the right surfaces of the five clamping blocks are all inclined.

[0015] (3) Beneficial effects

[0016] Compared with the existing technology, the present invention provides a two-dimensional sensor with a protective function, which has the following beneficial effects:

[0017] 1. This two-dimensional sensor with protective function can blow the cold air produced by the semiconductor refrigeration plate into the protective shell to effectively dissipate heat inside, so that the laser module can operate at a suitable temperature, maintain its optimal working state, and effectively extend the service life of the two-dimensional sensor.

[0018] 2. The two-dimensional sensor with protective function can quickly disassemble and assemble the protective shell by snapping, so that the internal electrical components can be quickly inspected and repaired, so that it can operate stably. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 This is a schematic diagram of the structure of a two-dimensional sensor with a protective function in the utility model;

[0020] Figure 2 This is a schematic diagram of the internal structure of the protective housing of the utility model;

[0021] Figure 3 This is a schematic diagram of the internal structure of the protective housing of the utility model;

[0022] Figure 4 This is a schematic diagram of the back plate structure of the utility model;

[0023] Figure 5 For this utility model Figure 4 A magnified view of the structure at center A.

[0024] In the figure: 1. Protective shell; 2. Laser module; 3. Display module; 4. Slot; 5. Card slot; 6. Cooling fan; 7. Semiconductor cooling plate; 8. Cooling plate; 9. Cooling fan; 10. Back plate; 11. Fixing block; 12. Spring slot; 13. Spring; 14. Card block. DETAILED DESCRIPTION

[0025] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0026] See also Figure 1-5 The utility model provides a new technical solution: a two-dimensional sensor with a protective function, comprising a protective shell 1, a laser module 2 fixedly mounted on the inner wall of the protective shell 1, a display module 3 fixedly mounted on the inner wall of the protective shell 1, and a semiconductor cooling plate 7 provided on the top of the inner wall of the protective shell 1;

[0027] A heat dissipation mechanism is provided in the protective housing 1 and is used to dissipate heat from the protective housing 1. The heat dissipation mechanism includes a heat dissipation fan 6, which is fixedly mounted on the upper surface of the semiconductor cooling plate 7.

[0028] The disassembly and assembly mechanism is arranged on the protective shell 1 and is used to disassemble and assemble the two-dimensional sensor and inspect and repair the interior of the two-dimensional sensor. The disassembly and assembly mechanism comprises a back plate (10) which is arranged on the left surface of the protective shell (1).

[0029] Furthermore, the heat dissipation mechanism also includes a cooling fin 8 and a cooling fan 9 . The cooling fin 8 is fixedly mounted on the lower surface of the semiconductor refrigeration fin 7 , and the cooling fan 9 is fixedly mounted on the lower surface of the cooling fin 8 .

[0030] Furthermore, five slots 4 are provided on the left surface of the protective shell 1 . Each of the five slots 4 is provided with a card slot 5 , and the card slot 5 is provided on a side of the five slots 4 that is closer to the outside.

[0031] Furthermore, the disassembly and assembly mechanism also includes five fixing blocks 11 , and the five fixing blocks 11 are all fixedly mounted on the right surface of the back plate 10 .

[0032] Furthermore, a spring groove 12 is formed on the outer side of the five fixing members 11 , and a clamping block 14 is fixedly mounted on the inner wall of the spring groove 12 .

[0033] Furthermore, the disassembly and assembly mechanism also includes five card blocks 14, which are respectively fixedly mounted on the outer ends of the five springs 13, and the right surfaces of the five card blocks 14 are all inclined. When the two-dimensional sensor with a protective function is used, after the power is connected, the semiconductor refrigeration plate 7 starts to work for cooling. At this time, the heat emitted from the back of the semiconductor refrigeration plate 7 is discharged by the cooling fan 6, and the cold air cooled by the front of the semiconductor refrigeration plate 7 is transmitted to the surface of the cooling plate 8. At this time, the cooling fan 9 is started to blow the cold air into the protective shell 1 for heat dissipation. When the protective shell needs to be disassembled and inspected, the five fixed blocks 11 fixed on the back plate 10 are removed. When inserted into the slot 4, the inclined surface of the card block 14 set on the fixed block 11 hits the inner wall of the slot 4, and is forced to move downward. At the same time, the card block 14 applies pressure to the spring 13 fixedly installed on the lower surface, causing it to shrink. At this time, the card block 14 shrinks into the spring groove 12. At this time, continue to insert the five fixed blocks 11 into the slot 4. At this time, the five fixed blocks 11 are located below the five card slots 5 opened in the five slots 4. At this time, the five card blocks 14 are no longer under force, and the five springs 13 are no longer under force. At this time, the five springs 13 expand, and the five springs 13 apply an upward thrust to the five card blocks 14 fixedly installed on the upper surface, so that they are carded into the card slot 5 for fixation.

[0034] When it needs to be disassembled, the block 14 is manually installed to force it to retract into the spring groove 12, and the back plate 10 is pulled to the right to complete the disassembly. The two-dimensional sensor with a protective function can blow the cold air produced by the semiconductor refrigeration plate into the protective shell 1 to effectively dissipate the heat inside, so that the laser module can operate at a suitable temperature and maintain its optimal working state. It can also effectively extend the service life of the two-dimensional sensor, and the protective shell 1 can be quickly disassembled and assembled by snapping, so that the internal electrical components can be quickly inspected and repaired, so that it can operate stably.

[0035] Working principle: When the two-dimensional sensor with protective function is used and then connected to the power supply, the semiconductor refrigeration plate 7 starts to work for cooling. At this time, the heat emitted from the back of the semiconductor refrigeration plate 7 is discharged by the cooling fan 6, and the cold air cooled by the front of the semiconductor refrigeration plate 7 is transmitted to the surface of the cooling plate 8. At this time, the cooling fan 9 is started to blow the cold air into the protective shell 1 for heat dissipation. When the protective shell needs to be disassembled and repaired, the five fixed blocks 11 fixed on the back plate 10 are inserted into the slot 4. At this time, the inclined surface of the card block 14 set on the fixed block 11 hits the inner wall of the slot 4, and is forced to move downward. At the same time, the card block 14 is fixed to the lower surface. The spring 13 applies pressure to shrink it, and the card block 14 shrinks into the spring groove 12. At this time, continue to insert the five fixing blocks 11 into the slot 4. At this time, the five fixing blocks 11 are located below the five card slots 5 opened in the five slots 4. At this time, the five card blocks 14 are no longer under force, and the five springs 13 are no longer under force. At this time, the five springs 13 expand, and the five springs 13 apply an upward thrust to the five card blocks 14 fixedly installed on the upper surface, so that they are snapped into the card slots 5 for fixation. When it needs to be disassembled, the card block 14 is manually installed to be retracted into the spring groove 12 under force, and the back plate 10 is pulled to the right to complete the disassembly.

[0036] Although the embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and variations may be made to these embodiments without departing from the principles and spirit of the present invention, and the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A two-dimensional sensor with a protective function, comprising a protective housing (1), a laser module (2) fixedly mounted on the inner wall of the protective housing (1), and a display module (3) fixedly mounted on the inner wall of the protective housing (1), characterized in that: A semiconductor cooling plate (7) is provided at the top end of the inner wall of the protective shell (1); A heat dissipation mechanism is provided in the protective housing (1), and is used for dissipating heat from the protective housing (1). The heat dissipation mechanism comprises a heat dissipation fan (6), and the heat dissipation fan (6) is fixedly mounted on the upper surface of the semiconductor refrigeration plate (7); A disassembly mechanism is provided on the protective housing (1), and is used for disassembling and assembling the two-dimensional sensor and inspecting the interior thereof. The disassembly mechanism comprises a back plate (10), and the back plate (10) is provided on the left surface of the protective housing (1).

2. The two-dimensional sensor with a protective function according to claim 1, characterized in that: The heat dissipation mechanism further comprises a cooling fin (8) and a cooling fan (9), wherein the cooling fin (8) is fixedly mounted on the lower surface of the semiconductor refrigeration fin (7), and the cooling fan (9) is fixedly mounted on the lower surface of the cooling fin (8).

3. The two-dimensional sensor with a protective function according to claim 1, characterized in that: The left surface of the protective shell (1) is provided with five slots (4), each of the five slots (4) is provided with a card slot (5), and the card slot (5) is provided on a side of the five slots (4) that is closer to the outside.

4. The two-dimensional sensor with a protective function according to claim 1, characterized in that: The disassembly and assembly mechanism further comprises five fixing blocks (11), and the five fixing blocks (11) are all fixedly mounted on the right surface of the back plate (10).

5. The two-dimensional sensor with a protective function according to claim 4, characterized in that: A spring groove (12) is provided on one side of the five fixing blocks (11) facing outwards, and a clamping block (14) is fixedly mounted on the inner wall of each spring groove (12).

6. The two-dimensional sensor with a protective function according to claim 1, characterized in that: The disassembly and assembly mechanism further comprises five clamping blocks (14), which are respectively fixedly mounted on the outer ends of the five springs (13), and the right surfaces of the five clamping blocks (14) are all arranged in an inclined manner.