Compression resistance detection device for electronic component

Abstract

The utility model provides an electronic component compression resistance detection device, which comprises a base, a vertical rod and a top plate, the top of the base is fixedly connected with the vertical rod, the top end of the vertical rod is fixedly connected with the top plate, the top of the top plate is fixedly connected with an electric cylinder, and the electric cylinder is vertically installed. Compared with the prior art, the device has the advantages that the device is more flexible to use, the tail end of the output end of the electric cylinder is movably connected with the connector and the rotating arm, the angle of the rotating arm can be adjusted and locked, an electronic component is positioned on a special electronic component positioning mold, and the pressure head can be positioned above different positions of the electronic component; the electronic component positioning mold can be used for carrying out compression resistance detection on different point positions of an electronic component, the electronic component positioning mold is covered and buckled above the mold base through the buckles and the buckling positions, when the clamping blocks of the positioning mold are pressed, the electronic component positioning mold can be separated from the buckling positions, and the electronic component positioning mold can be easily replaced and detached and can be matched with positioning of electronic components of different models so as to carry out compression resistance detection on the electronic components. The use is more flexible.

Description

Technical Field

[0001] The utility model relates to the technical field of electronic component detection, in particular to a pressure resistance detection device for electronic components. Background Art

[0002] Electronic component products such as sensors and circuit boards need to undergo compression testing after production. This involves applying a certain amount of pressure to their surface and observing the surface condition to determine the product's quality.

[0003] In the prior art, the pressure detection point of the electronic component pressure resistance testing device for electronic components such as circuit boards is fixed and generally located at the center. The position of the pressure detection point is inconvenient to adjust, and it is inconvenient to judge its overall pressure resistance performance. Therefore, an electronic component pressure resistance testing device is proposed to solve the above problems. Utility Model Content

[0004] The purpose of the present invention is to solve at least one of the above technical deficiencies.

[0005] Therefore, one purpose of the present invention is to provide an electronic component pressure resistance detection device to solve the problems mentioned in the background art and overcome the shortcomings of the prior art.

[0006] In order to achieve the above-mentioned object, an embodiment of one aspect of the present invention provides an electronic component pressure resistance detection device, comprising a base, a vertical rod, and a top plate, wherein the top of the base is fixedly connected to the vertical rod, and the top end of the vertical rod is fixedly connected to the top plate;

[0007] The top of the top plate is fixedly connected to an electric cylinder, which is installed vertically;

[0008] The end of the output end of the electric cylinder is movably connected to a joint, one side of the joint is fixedly connected to a rotating arm, and the end of the bottom surface of the rotating arm is fixedly connected to a pressure head;

[0009] The pressure measuring point of the pressure head is adjustable;

[0010] The end of the output end of the electric cylinder is threadedly connected with a fastening pin, and the end of the fastening pin abuts against the outer surface of the joint;

[0011] The top of the base is fixedly connected to a mold base, the front and back of the mold base are fixedly connected to buckles, and the top of the base is fixedly connected to a buckle;

[0012] An electronic component positioning mold is detachably connected to the top of the mold base, and buckles are fixedly connected to the front, back and both sides of the electronic component positioning mold, and the buckles are buckled inwardly at the buckle positions;

[0013] A pressure sensor is installed at the front end surface of the top plate, and its detection end is located on the pressure head to detect the value of the pressure applied by the pressure head.

[0014] Preferably, according to any of the above solutions, the base is perpendicular to the upright pole, and the base is parallel to the top plate.

[0015] Adopting the above technical solution: This device is specially used for pressure resistance testing of electronic components. The power source is the electric cylinder. When the output end of the electric cylinder is ejected, the joint, rotating arm and pressure head drop as a whole, and the pressure head applies pressure to the electronic components.

[0016] Preferably, from any of the above solutions, the joint is welded to the rotating arm, and the pressing head is located directly above the electronic component positioning mold.

[0017] Adopting the above technical solution: the core structure of this device is: top plate, electric cylinder, joint, rotating arm, pressure head, fastening pin, mold base, buckle position, electronic component positioning mold, and buckle.

[0018] Preferably, any of the above solutions has a hexagonal screw head fixedly connected to the end of the fastening pin, and the mold base is fixedly connected to the top of the base by screws.

[0019] Using the above technical solution, the pressure sensor features a digital display that directly displays the pressure applied by the indenter on the electronic component. The pressure sensor detects the pressure applied by the indenter based on the principle that when the indenter applies pressure to the electronic component, the sensitive element deforms. This deformation is proportional to the magnitude of the applied pressure. The sensitive element, a thin-film resistor, converts the deformation into a corresponding electrical signal. A circuit converts the changed resistance value into a corresponding electrical signal output. By detecting these electrical signals, the pressure sensor outputs data related to the pressure level and displays it on the digital display.

[0020] Preferably, any of the above solutions is that the buckle is made of plastic, and the electronic component positioning mold is connected to the buckle by hot-melt connection.

[0021] The core advantages of this device are: more flexible use, the end of the electric cylinder output end is movably connected to a joint and a rotating arm, the angle of the rotating arm can be adjusted and locked, the electronic components are positioned on a dedicated electronic component positioning mold, the pressure head can be located above different positions of the electronic components, and different points of the electronic components can be tested for pressure resistance;

[0022] The electronic component positioning mold is snapped in place and fastened to the mold base. The electronic component positioning mold is replaceable and detachable, and can be adapted to the positioning of electronic components of different models to perform pressure resistance testing on them, making it more flexible to use.

[0023] Preferably, in any of the above solutions, the electronic component positioning mold is made of plastic.

[0024] Compared with the prior art, the advantages and beneficial effects of the present invention are as follows:

[0025] The electronic component pressure resistance testing device is more flexible to use through the coordinated arrangement of a top plate, an electric cylinder, a joint, a rotating arm, a pressure head, a fastening pin, a die base, a buckle position, an electronic component positioning die, and a buckle. The output end of the electric cylinder is movably connected to the joint and the rotating arm, and the angle of the rotating arm can be adjusted and locked. The electronic component is positioned on a dedicated electronic component positioning die, and the pressure head can be located above different positions of the electronic component, so that pressure resistance testing can be performed on different points of the electronic component.

[0026] The electronic component positioning mold is buckled and covered on the mold base through buckles. When the clamping block of the positioning mold is pressed, it can be disengaged from the buckle. The electronic component positioning mold can be easily replaced and disassembled, and can be adapted to the positioning of different types of electronic components to perform pressure resistance testing on them, making it more flexible to use.

[0027] Additional aspects and advantages of the present invention will be given in part in the following description and in part will become apparent from the following description or learned through practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] The above and / or additional aspects and advantages of the present invention will become apparent and readily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0029] Figure 1 This is a schematic structural diagram of the utility model from the first perspective;

[0030] Figure 2 This is a schematic structural diagram of the utility model from a second viewing angle;

[0031] Figure 3 This is a side structural diagram of the present utility model;

[0032] Figure 4 For this utility model Figure 2 Schematic diagram of the enlarged structure at point A in the middle.

[0033] In the figure: 1-base, 2-vertical pole, 3-top plate, 4-electric cylinder, 5-connector, 6-rotating arm, 7-pressing head, 8-fastening pin, 11-mold base, 12-buckle, 13-electronic component positioning mold, 14-clip, 15-pressure sensor. DETAILED DESCRIPTION

[0034] The following describes in detail embodiments of the present invention, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to explain the present invention, and should not be construed as limiting the present invention.

[0035] In this utility model, unless otherwise specified or limited, the terms "installed," "connected," "connect," "fixed," etc. should be understood in a broad sense. For example, they can refer to fixed connection, detachable connection, or integral connection; mechanical connection or electrical connection; direct connection or indirect connection through an intermediate medium; and internal communication between two components. Those skilled in the art will understand the specific meanings of the above terms in this utility model based on specific circumstances.

[0036] like Figure 1-4 As shown, the electronic component compression testing device includes a base 1, a vertical pole 2, and a top plate 3. The top of the base 1 is fixedly connected to the vertical pole 2, and the top of the vertical pole 2 is fixedly connected to the top plate 3.

[0037] The top of the top plate 3 is fixedly connected with an electric cylinder 4, which is installed vertically;

[0038] The end of the output end of the electric cylinder 4 is movably connected to a joint 5, one side of the joint 5 is fixedly connected to a rotating arm 6, and the end of the bottom surface of the rotating arm 6 is fixedly connected to a pressure head 7;

[0039] The pressure measuring point of the pressure head 7 is adjustable;

[0040] The end of the output end of the electric cylinder 4 is threadedly connected with a fastening pin 8, and the end of the fastening pin 8 abuts against the outer surface of the connector 5;

[0041] The top of the base 1 is fixedly connected to a mold base 11, and the front and back of the mold base 11 are fixedly connected to buckles 12. The top of the base 1 is fixedly connected to the buckle 12;

[0042] An electronic component positioning mold 13 is detachably connected to the top of the mold base 11. Buckles 14 are fixedly connected to the front, back, and both sides of the electronic component positioning mold 13. The buckles 14 buckle inwardly at the buckle positions 12.

[0043] A pressure sensor 15 is installed at the front end surface of the top plate 3 , and its detection end is located on the pressure head 7 to detect the value of the pressure applied by the pressure head 7 .

[0044] Example 1: Base 1 is perpendicular to upright 2 and parallel to top plate 3. This device is specifically designed for compressive testing of electronic components. The power source is an electric cylinder 4. When the output end of electric cylinder 4 is ejected, connector 5, rotating arm 6, and pressure head 7 descend as a whole, applying pressure to the electronic components. Connector 5 is welded to rotating arm 6, and pressure head 7 is located directly above the electronic component positioning mold 13.

[0045] Example 2: The core structure of this device is: top plate 3, electric cylinder 4, joint 5, rotating arm 6, pressing head 7, fastening pin 8, mold base 11, buckle 12, electronic component positioning mold 13, and buckle 14. The end of fastening pin 8 is fixedly connected to a hexagonal screw. The mold base 11 is fixed to the top of the base 1 by screws. Buckle 12 is made of plastic. The electronic component positioning mold 13 is connected to buckle 14 by heat-melting. The electronic component positioning mold 13 is made of plastic.

[0046] The working principle of this utility model is as follows:

[0047] The electronic component positioning mold 13 is covered and buckled on the mold base 11 through the buckle 14 and the buckle position 12, and the electronic component is positioned on the dedicated electronic component positioning mold 13;

[0048] After adjusting the positions of the rotary joint 5, the rotating arm 6, and the pressure head 7, tighten the fastening pin 8 to lock the angle of the rotating arm 6;

[0049] When the output end of the electric cylinder 4 is ejected and the pressure head 7 applies pressure to the electronic component, the sensitive element within it deforms. This deformation is proportional to the magnitude of the applied pressure. The sensitive element, a thin-film resistor, converts the deformation into a corresponding electrical signal. A circuit converts the changed resistance value into a corresponding electrical signal for output. By detecting these signals, the pressure sensor 15 outputs data related to the pressure level and displays it on a digital display. The deformation and cracking conditions at the pressure-measuring point on the electronic component are observed, and the corresponding pressure value indicates the compressive performance of that point on the electronic component.

[0050] Compared with the prior art, the present invention has the following beneficial effects:

[0051] The electronic component pressure resistance testing device is more flexible to use through the coordinated arrangement of a top plate 3, an electric cylinder 4, a joint 5, a rotating arm 6, a pressure head 7, a fastening pin 8, a mold base 11, a buckle position 12, an electronic component positioning mold 13, and a buckle 14. The output end of the electric cylinder 4 is movably connected to the joint 5 and the rotating arm 6. The angle of the rotating arm 6 can be adjusted and locked. The electronic component is positioned on the dedicated electronic component positioning mold 13. The pressure head 7 can be located above different positions of the electronic component, and pressure resistance testing can be performed on different points of the electronic component.

[0052] The electronic component positioning mold 13 is covered and buckled on the mold base 11 through the buckle 14 and the buckle position 12. When the clamping block 14 of the positioning mold is pressed, it can be separated from the buckle position 12. The electronic component positioning mold 13 can be easily replaced and disassembled, and can be adapted to the positioning of electronic components of different models to perform pressure resistance testing on them, making it more flexible to use.

Claims

1. A device for detecting the pressure resistance of electronic components, characterized in that: It comprises a base (1), a vertical pole (2), and a top plate (3); the top of the base (1) is fixedly connected to the vertical pole (2), and the top end of the vertical pole (2) is fixedly connected to the top plate (3); The top of the top plate (3) is fixedly connected to an electric cylinder (4), and the electric cylinder (4) is installed vertically; The end of the output end of the electric cylinder (4) is movably connected to a joint (5), one side of the joint (5) is fixedly connected to a rotating arm (6), and the end of the bottom surface of the rotating arm (6) is fixedly connected to a pressure head (7); The pressure measuring point of the pressure head (7) is adjustable; The end of the output end of the electric cylinder (4) is threadedly connected to a fastening pin (8), and the end of the fastening pin (8) abuts against the outer surface of the joint (5); The top of the base (1) is fixedly connected to a mold base (11), the front and back sides of the mold base (11) are fixedly connected to buckles (12), and the top of the base (1) is fixedly connected to the buckle (12); An electronic component positioning mold (13) is detachably connected to the upper portion of the mold base (11); buckles (14) are fixedly connected to the front, back, and both sides of the electronic component positioning mold (13); and the buckles (14) are buckled inwardly at the buckle positions (12); A pressure sensor (15) is installed at the front end surface of the top plate (3), and its detection end is located on the pressure head (7) to detect the value of the pressure applied by the pressure head (7).

2. The electronic component pressure resistance detection device according to claim 1, characterized in that: The base (1) is perpendicular to the upright pole (2), and the base (1) is parallel to the top plate (3).

3. The electronic component pressure resistance detection device according to claim 2, characterized in that: The joint (5) is welded to the rotating arm (6), and the pressing head (7) is located directly above the electronic component positioning mold (13).

4. The electronic component pressure resistance detection device according to claim 3, characterized in that: The end of the fastening pin (8) is fixedly connected with a hexagonal screw head, and the mold base (11) is fixedly connected to the top of the base (1) by screws.

5. The electronic component pressure resistance detection device according to claim 4, characterized in that: The buckle (12) is made of plastic, and the electronic component positioning mold (13) is connected to the buckle (14) by hot melting.

6. The electronic component pressure resistance testing device according to claim 5, characterized in that: The electronic component positioning mold (13) is made of plastic.

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