Planar spraying developing cavity device

Abstract

The utility model relates to the technical field of chip developing devices, in particular to a planar spraying developing cavity device which comprises a machine table and an upper cover connected to the machine table in a lifting mode, a spraying plate is arranged in the upper cover in a lifting mode, and a plurality of spraying heads are evenly distributed on the circular face of the spraying plate. The area of the spraying plate in the vertical direction is not smaller than the working face of the machine table, and a bottom sealing structure is rotationally arranged on the lower side of the upper cover. Compared with the prior art, the spraying device has the advantages that the nozzles are evenly distributed on the side, facing the wafer, of the spraying plate, can cover the wafer on the vertical projection plane, move to the proper position in a lifting mode and spray developing liquid or rinsing liquid or gas for blowing and wiping, compared with a spraying mode at the present stage, uniform spraying liquid can be formed more quickly, and the spraying efficiency is improved. The production efficiency is improved, and the wafer below can be in a rotating or standing state; and the liquid spraying coverage surface is complete and continuous, so that the occurrence of opening residual glue caused by incomplete liquid spreading due to hydrophobicity of a glue material with relatively poor hydrophilicity is avoided.

Description

Technical Field

[0001] The present application relates to the technical field of chip developing devices, and in particular to a planar spraying developing chamber device. Background Art

[0002] The development process takes place in the developing unit, where a centrifugal motor supports the wafer via a vacuum stage. Several nozzles spray developer, fixer, and surfactant. A robotic arm places the wafer on the vacuum stage, and the developing nozzles spray developer onto the wafer surface. After development is complete, the fixing nozzles spray fixer onto the wafer to remove any residual developer residue and rinse the wafer. Finally, the vacuum stage rotates at high speed to remove any liquid from the wafer surface.

[0003] The spraying method is related to the developer nozzle, which can be divided into the following categories: The first is the scanning type. The developer nozzle has a narrow opening at the bottom. The developer arm moves over the wafer, and developer liquid flows out of the nozzle's outlet, covering the wafer surface under the action of surface tension. The developer arm can scan over the wafer once or multiple times, covering the wafer with developer liquid once or multiple times. The second type is dynamic spraying with multiple nozzles. The developer nozzle has multiple small nozzles at its base. The developer arm moves to the center of the wafer and sprays the developer liquid, or it moves back and forth from the edge to the center while the wafer slowly rotates, covering the entire wafer with developer liquid. The third and simplest type is a single nozzle. A pick-up arm moves the nozzle to the center of the wafer and sprays the developer liquid. The wafer rotates at a constant speed, and centrifugal force causes the developer liquid to flow steadily in a radial direction, covering the entire wafer.

[0004] However, the above-mentioned developer spraying method is still relatively cumbersome and wastes production time. Utility Model Content

[0005] In order to form a more uniform liquid spraying effect on the wafer more quickly and save production time, the present application provides a planar spraying developing chamber device.

[0006] The present application provides a planar spraying developing chamber device, which adopts the following technical solution: a planar spraying developing chamber device, including a machine platform and an upper cover connected to the machine platform for lifting, a spray plate is lifted and arranged inside the upper cover, a plurality of nozzles are evenly distributed on the circular surface of the spray plate, the area of the spray plate in the vertical direction is not smaller than the working surface of the machine platform, and a bottom sealing structure is rotatably arranged on the lower side of the upper cover.

[0007] By adopting the above technical solution, a spray plate of corresponding size is used. The spray plate can be a hollow structure or just a plate-shaped body. The nozzles are evenly distributed on the side of the spray plate facing the wafer. On the vertical projection surface, the wafer can be covered and moved to a suitable position by lifting and lowering. The developer or rinse liquid or gas is sprayed for wiping. Compared with the current spraying method, a more uniform spray can be formed faster, thereby improving production efficiency. At the same time, the wafer below can be in a rotating or stationary state; the spray coverage is complete and continuous, avoiding the incomplete liquid spreading caused by the hydrophobicity of the less hydrophilic adhesive material, which leads to the occurrence of residual adhesive openings.

[0008] Preferably, the upper cover is connected to the machine platform via a first telescopic member.

[0009] Preferably, the upper top wall of the upper cover is provided with a second telescopic member, and the second telescopic member is connected to the spray plate.

[0010] Preferably, the spray plate is connected to a plurality of delivery pipes, and the delivery pipes are passed through the upper cover.

[0011] Preferably, the upper cover has a plurality of connection holes corresponding to the delivery pipes, the connection holes have convex points along the extension direction, and the delivery pipe body is fixedly provided with a connection sleeve for contacting the convex points.

[0012] Preferably, the bottom sealing structure includes two semicircular bottom plates, and the two bottom plates are folded together to form a cone.

[0013] Preferably, the edge of the bottom plate has a drainage hole.

[0014] Preferably, the edge of the bottom plate has a clamping edge that is sleeved on the outer side of the upper cover.

[0015] Preferably, the highest point of the clamping edge and the highest point of the bottom plate are located in the same plane.

[0016] Preferably, one side of the two base plates is rotatably connected.

[0017] In summary, this application includes at least one of the following beneficial technical effects:

[0018] 1. The nozzles are evenly distributed on the side of the spray plate facing the wafer. On the vertical projection plane, the wafer can be covered and moved to the appropriate position by lifting and lowering to spray the developer or rinse liquid or blow gas for wiping. Compared with the current spraying method, it can form a more uniform spray faster and improve production efficiency. At the same time, the wafer below can be in a rotating or stationary state.

[0019] 2. The spray coverage is complete and continuous, avoiding the occurrence of open residual glue caused by incomplete liquid spreading due to hydrophobic adhesive materials with poor hydrophilicity. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 This is a schematic structural diagram of Example 1 of the present application;

[0021] Figure 2 This is a schematic diagram of the internal structure of the upper cover in Example 1 of the present application;

[0022] Figure 3 This is a schematic structural diagram of the bottom seal structure in Example 1 of the present application when it is opened;

[0023] Figure 4 This is a schematic diagram of the internal structure of the upper cover when the bottom sealing structure is closed in Example 1 of the present application;

[0024] Figure 5 This is a schematic diagram of the connection relationship between the delivery pipe and the connecting hole in Example 2 of the present application;

[0025] Figure 6 yes Figure 5 Enlarged schematic diagram of part A.

[0026] Explanation of the accompanying reference numerals: 100, machine platform; 111, upper cover; 112, first telescopic member; 113, second telescopic member; 114, spray plate; 115, lower cover; 116, nozzle; 117, delivery pipe; 118, connecting hole; 120, bottom plate; 121, drainage hole; 122, clamping edge; 123, rotating shaft; 124, rotating seat; 130, protrusion; 131, connecting sleeve; 132, groove. DETAILED DESCRIPTION

[0027] The present application is further described in detail below with reference to the accompanying drawings.

[0028] Example 1: Reference Figure 1 The embodiment of the present application discloses a planar spraying developing chamber device, including a machine platform 100 and an upper cover 111 connected to the machine platform 100 for lifting. A first telescopic member 112 is installed on the upper side of the upper cover 111, which can be a cylinder or a screw lift. A lower cover 115 is sleeved on the outer side of the machine platform 100. The first telescopic member 112 enables the upper cover 111 to cover or open the lower cover 115.

[0029] Reference Figure 2A spray plate 114 is installed in the upper cover 111, which is movable. Specifically, a second telescopic member 113 is installed on the top wall of the upper cover 111, and the second telescopic member 113 is connected to the spray plate 114. In this embodiment, the spray plate 114 is circular and is used to cover the upper side of the machine 100. A number of nozzles 116 are evenly distributed on the circular surface of the spray plate 114. The vertical area of the spray plate 114 is not less than the working surface of the machine 100. The relationship between the spray plate 114 and the nozzles 116 can be that the nozzles 116 are separately installed on the side wall of the spray plate 114, or the spray plate 114 can be designed as a hollow structure to directly deliver the working medium to the interior.

[0030] The spray plate 114 is connected to a number of delivery pipes 117, including but not limited to delivery paths for developer, rinse liquid, and ammonia. A connection hole 118 for the delivery pipe 117 to pass through is provided on the upper cover 111. The delivery pipe 117 will slide in the connection hole 118 as the spray plate 114 moves up and down.

[0031] Reference Figure 1 、 Figure 3 、 Figure 4 The lower side of the upper cover 111 is rotatably provided with a bottom seal structure. The bottom seal structure is used to seal the lower side of the upper cover 111 after the operation is completed to prevent contamination by dripping liquid. Specifically, the bottom seal structure includes two semicircular bottom plates 120. The two bottom plates 120 are combined to form a cone, with the tip facing the side close to the spray plate 114. The liquid will flow outward along the inclined surface. At the same time, drainage holes 121 are provided on the edge of the bottom plate 120 for drainage. The edge of the bottom plate 120 is provided with a clamping edge 122. The clamping edge 122 will be installed on the outer side of the upper cover 111. At the same time, the highest point of the clamping edge 122 is located in the same plane as the highest point of the bottom plate 120.

[0032] In order not to affect the operation of the liquid spraying, one side of the two base plates 120 is rotatably connected. Specifically, a rotating shaft 123 is provided on the lower side of the base plate 120. The two rotating shafts 123 are rotatably connected to a rotating seat 124. The specific driving method can be a motor connection drive. At the same time, the rotating seat 124 is connected through a three-axis motion robotic arm to place or remove the bottom sealing structure from the lower side of the upper cover 111.

[0033] The implementation principle of Example 1 of the present application is as follows: the upper cover 111 is closed to the upper side of the lower cover 115, so that the machine 100 and the spray plate 114 are enclosed, and the spray plate 114 is adjusted up and down to move to a suitable position, and liquid is sprayed in a full coverage manner. After the operation is completed, the upper cover 111 is first opened, so that the two bottom plates 120 are brought together and wrap the upper cover 111. At this time, the bottom plate 120 and the clamping edge 122 seal the lower side of the upper cover 111, and the dripping liquid will be discharged from the drainage hole 121.

[0034] Example 2: The difference from Example 1 is that, referring to Figure 5 、 Figure 6 , there are protrusions 130 in the connecting hole 118 along its extension direction. In this embodiment, there are two groups of protrusions 130, which are mainly used to reduce the contact friction between the delivery tube 117 and the connecting hole 118 during actual movement. A connecting sleeve 131 is sleeved and fixed on the tube body of the delivery tube 117. The connecting sleeve 131 is used to contact the protrusions 130. In order to facilitate the limiting, a groove 132 for the protrusions 130 to be embedded in the connecting sleeve 131 is also provided to realize the movement of the two.

[0035] The embodiments of this specific implementation method are all preferred embodiments of the present application and are not intended to limit the scope of protection of the present application. Therefore, any equivalent changes made based on the structure, shape, and principle of the present application should be included in the scope of protection of the present application.

Claims

1. A planar spray developing chamber device, comprising a machine platform (100) and an upper cover (111) connected to the machine platform (100) in a lifting manner, characterized in that: A spray plate (114) is provided in the upper cover (111) for lifting, and a plurality of spray heads (116) are evenly distributed on the circular surface of the spray plate (114). The area of the spray plate (114) in the vertical direction is not less than the working surface of the machine (100). A bottom sealing structure is provided on the lower side of the upper cover (111) for rotation.

2. The planar spraying developing chamber device according to claim 1, characterized in that: The upper cover (111) is connected to the machine (100) via a first telescopic member (112).

3. The planar spraying developing chamber device according to claim 2, characterized in that: A second telescopic member (113) is provided on the upper top wall of the upper cover (111), and the second telescopic member (113) is connected to the spray plate (114).

4. The planar spraying developing chamber device according to claim 3, characterized in that: The spray plate (114) is connected to a plurality of delivery pipes (117), and the delivery pipes (117) are passed through the upper cover (111).

5. The planar spraying developing chamber device according to claim 4, characterized in that: The upper cover (111) has a plurality of connection holes (118) corresponding to the delivery pipe (117), the connection holes (118) have convex points (130) along the extension direction, and the delivery pipe (117) is fixedly sleeved with a connection sleeve (131) for contacting the convex points (130).

6. A planar spraying developing chamber device according to claim 1 or 4, characterized in that: The bottom sealing structure comprises two semicircular bottom plates (120), and the two bottom plates (120) are folded together to form a cone.

7. The planar spraying developing chamber device according to claim 6, characterized in that: The edge of the bottom plate (120) is provided with a drainage hole (121).

8. The planar spraying developing chamber device according to claim 7, characterized in that: The edge of the bottom plate (120) has a clamping edge (122) sleeved on the outside of the upper cover (111).

9. The planar spraying developing chamber device according to claim 8, characterized in that: The highest point of the clamping edge (122) and the highest point of the bottom plate (120) are located in the same plane.

10. The planar spraying developing chamber device according to claim 9, characterized in that: One side of the two bottom plates (120) is rotatably connected.

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