Covering type cavity developing device

Abstract

The utility model relates to the technical field of developing devices, in particular to a covering type cavity developing device which comprises a machine table, a cover body is arranged on the machine table in a lifting mode, the cover body is provided with a plurality of conveying channels, the bottom of the cover body is provided with a blocking ring abutting against a wafer, the cover body is provided with a plurality of liquid outlets corresponding to the conveying channels, and the conveying channels are communicated with the liquid outlets. And the extension direction of the liquid outlet is parallel to the upper surface of the wafer. The device has the following effects that the cover body moves downwards and enables the blocking ring to abut against the upper side of the wafer, the surface of the wafer and the blocking ring form a structure similar to a liquid pool, then liquid is input into the liquid outlet through the conveying channel, the liquid can flow into the liquid pool along the plane of the wafer, much liquid is not needed, and the production efficiency is improved. And meanwhile, relatively high developing efficiency can be ensured.

Description

Technical Field

[0001] The present application relates to the technical field of developing devices, and in particular to a covering cavity developing device. Background Art

[0002] The development process is carried out in the developing unit, where a centrifugal motor carries the wafer through a vacuum wafer stage, and an annular nozzle sprays the developer, fixer and surfactant separately.

[0003] The robot places the wafer on a vacuum stage. A cylindrical cover moves down to press against the wafer, completely isolating it from the outside world. A developing nozzle in the cover sprays developer onto the wafer surface, covering it completely. After development is complete, the cover is lifted and rotated at high speed to remove the liquid from the wafer surface. A fixing nozzle in the cover sprays developer onto the wafer surface, covering it completely. After fixing is complete, the cover is lifted and rotated at high speed to remove the liquid from the wafer surface. Finally, the vacuum stage rotates at high speed to remove the liquid from the wafer surface.

[0004] There are two common methods for removing liquid. The first is immersion development, which involves placing the entire wafer in an immersion tank and shaking it. However, this development method has an unstable rate and is not suitable for operations requiring high precision. The second is spray development, which evenly sprays the developer onto the wafer surface in the form of an atomized mist. While this method offers a more stable development rate, it consumes more developer and wastes more. Therefore, a development method that balances development efficiency with minimal developer waste is urgently needed. Utility Model Content

[0005] In order to achieve the effect of taking into account the development efficiency while not wasting the developer, the present application provides a covering cavity development device.

[0006] The present application provides a covered cavity developing device, which adopts the following technical solution: a covered cavity developing device, including a machine platform, a cover body is arranged on the machine platform for lifting and lowering, the cover body has a plurality of conveying paths, the bottom of the cover body has a blocking ring abutting against the wafer, the cover body has a plurality of liquid outlets corresponding to the conveying paths, and the extension direction of the liquid outlet is parallel to the upper surface of the wafer.

[0007] By adopting the above technical solution, the cover moves downward and causes the blocking ring to contact the upper side of the wafer. The wafer surface and the blocking ring form a structure similar to a liquid pool. The liquid is then input to the liquid outlet through the conveying channel and can flow along the plane of the wafer into this liquid pool. It does not require a large amount of liquid and can ensure better development efficiency.

[0008] Preferably, the connection point of the delivery channel is located on the upper side of the cover body, and the liquid outlet is connected to the lower side of the cover body.

[0009] Preferably, the blocking ring is fixedly connected to the bottom of the cover body.

[0010] Preferably, the inner side of the blocking ring has an accommodating ring groove for embedding the edge of the wafer.

[0011] Preferably, the liquid outlets are arranged at an angle, and each liquid outlet forms a vortex shape along a circumferential array.

[0012] Preferably, a group of the conveying channels are circumferentially arranged in the cover body, each group of the conveying channels is connected to a distribution ring located at the top of the cover body, and each of the conveying channels is connected to a separate distribution ring.

[0013] Preferably, there is a gap between the bottom of the cover body and the inner side of the blocking ring.

[0014] Preferably, a bottom plate for sleeved on the lower side of the cover body is movably provided on the machine platform, and the bottom plate has a liquid drainage channel.

[0015] Preferably, the bottom cover plate is a cone with a raised center.

[0016] Preferably, the bottom cover plate comprises two semicircular assemblies, and one side of the two assemblies are rotatably connected.

[0017] To sum up, the present application includes at least one of the following beneficial technical effects: the cover moves downward and causes the blocking ring to contact the upper side of the wafer, and the wafer surface and the blocking ring form a structure similar to a liquid pool. The liquid is then input toward the liquid outlet through the conveying channel, and can flow along the plane of the wafer into this liquid pool. It does not require a large amount of liquid and can ensure better development efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a schematic diagram of the structure of this application;

[0019] Figure 2 Schematic diagram of the internal structure of the cover;

[0020] Figure 3 This is a schematic diagram of the structure of the top-level distribution ring;

[0021] Figure 4 It is a structural diagram when the bottom cover is closed.

[0022] Explanation of the accompanying reference numerals: 100, machine; 111, cover body; 112, conveying channel; 113, liquid outlet; 114, distribution ring; 115, input pipe; 116, output pipe; 120, blocking ring; 121, accommodating ring groove; 130, bottom plate; 131, assembly; 132, rotating shaft; 133, rotating seat; 134, drainage channel. DETAILED DESCRIPTION

[0023] The present application is further described in detail below with reference to the accompanying drawings.

[0024] A covering cavity developing device, referring to Figure 1 , including a machine platform 100, a cover body 111 is set on the machine platform 100 for lifting. In this embodiment, the cover body 111 is connected to a telescopic rod, and a screw device can be used to lift or lower the cover body 111.

[0025] Reference, Figure 1 、 Figure 2 The cover 111 has a plurality of conveying channels 112, and the conveying channels 112 have a group, which is generally applicable to various needs. In this embodiment, a is 3, that is, three groups, which are used to introduce developer, rinse liquid, and nitrogen respectively. The cover 111 has a plurality of liquid outlets 113 corresponding to the conveying channels 112, and the extension direction of the liquid outlet 113 is parallel to the upper surface of the wafer.

[0026] Reference Figure 2 、 Figure 3 In this embodiment, a distribution ring 114 corresponding to each group of conveying channels 112 is provided on the top of the cover body 111, and each distribution ring 114 is provided with a single input pipe 115. At the same time, the conveying channels 112 are evenly distributed along the circumferential direction on the inner side of the cover body 111. In this embodiment, there are four conveying channels 112 in each group, and the three groups of conveying channels 112 are arranged at intervals, so that the four conveying channels 112 in each group are also evenly distributed on the circumferential side of the cover body 111. On the upper side of the cover body 111, there is an inlet corresponding to each conveying channel 112, and the lower side of each distribution ring 114 has three output pipes 116, which will be directly inserted into the inlet of the conveying channel 112. Since the distribution rings 114 are stacked in this embodiment, the output pipe 116 on the upper distribution ring 114 will pass through the lower distribution ring 114 and then be inserted into the inlet, but the output pipe 116 passing through other distribution rings 114 will not affect the flow inside the corresponding distribution ring 114, and the two are independent and do not affect each other. At the same time, different working media will be independent of each other and will not affect each other. After coming out of each group of conveying channels 112, they can evenly affect the wafer surface.

[0027] The bottom of the cover body 111 has a blocking ring 120 that abuts against the wafer. There is a gap between the inner side of the blocking ring 120 and the bottom of the cover body 111, which can form a space similar to a liquid pool on the surface of the wafer. At the same time, in order to position the wafer, in this embodiment, there is also a accommodating ring groove 121 on the inner side of the blocking ring 120 for positioning the wafer.

[0028] The medium coming from the conveying channel 112 will reach the upper side of the wafer through the liquid outlet 113 located on the lower side of the cover 111. In order to soak the wafer more evenly, the liquid outlet 113 is set at an angle, and each liquid outlet 113 forms a vortex shape along the circumferential array.

[0029] During the development process, the developer moves downward along the delivery channel 112 and flows through the liquid outlet 113 to form a vortex shape and reach the surface of the wafer.

[0030] Reference Figure 1 、 Figure 4 After the operation is completed, a bottom plate 130 is movably provided on the machine 100. The bottom plate 130 is used to seal the lower side of the cover body 111 after the operation is completed to prevent contamination by dripping liquid. Specifically, the bottom plate 130 includes two semicircular assemblies 131. One side of the two assemblies 131 is rotatably connected. When the two are closed, they form a cone with a raised middle part, which is used to guide the dripping liquid to the side. There is a drainage channel 134 on the side of the bottom plate 130 for discharging waste liquid. The lower side of the assembly 131 has a rotating shaft 132. The two rotating shafts 132 are both rotatably connected to a rotating seat 133. The specific driving method can be motor connection drive. At the same time, the rotating seat 133 is connected through a three-axis motion robot arm to place or remove the bottom plate 130 from the lower side of the cover body 111.

[0031] The embodiments of this specific implementation method are all preferred embodiments of the present application and are not intended to limit the scope of protection of the present application. Therefore, any equivalent changes made based on the structure, shape, and principle of the present application should be included in the scope of protection of the present application.

Claims

1. A covering cavity developing device, comprising a machine platform (100), characterized in that: A cover body (111) is provided on the machine (100) for lifting, and the cover body (111) has a plurality of conveying paths (112). The bottom of the cover body (111) has a blocking ring (120) that abuts against the wafer. The cover body (111) has a plurality of liquid outlets (113) corresponding to the conveying paths (112), and the extension direction of the liquid outlets (113) is parallel to the upper surface of the wafer.

2. The covering cavity developing device according to claim 1, characterized in that: The connection point of the delivery channel (112) is located on the upper side of the cover body (111), and the liquid outlet (113) is connected to the lower side of the cover body (111).

3. The covering cavity developing device according to claim 2, characterized in that: The blocking ring (120) is fixedly connected to the bottom of the cover body (111).

4. The covering cavity developing device according to claim 3, characterized in that: The inner side of the blocking ring (120) is provided with an accommodating ring groove (121) for embedding the edge of the wafer.

5. The covering cavity developing device according to claim 1, characterized in that: The liquid outlets (113) are arranged at an angle, and each liquid outlet (113) forms a vortex shape along a circumferential array.

6. The covering cavity developing device according to claim 5, characterized in that: A group of the conveying channels (112) is circumferentially arranged inside the cover body (111), each group of the conveying channels (112) is connected to a distribution ring (114) located at the top of the cover body (111), and each conveying channel (112) is connected to a separate distribution ring (114).

7. The covering cavity developing device according to claim 3, characterized in that: There is a gap between the bottom of the cover body (111) and the inner side of the blocking ring (120).

8. The covering cavity developing device according to claim 1, characterized in that: A bottom cover plate (130) for sleeved on the lower side of the cover body (111) is movably provided on the machine platform (100), and the bottom cover plate (130) has a liquid drainage channel (134).

9. The covering cavity developing device according to claim 8, characterized in that: The bottom cover plate (130) is a cone with a raised center.

10. The covering cavity developing device according to claim 9, characterized in that: The bottom cover plate (130) comprises two semicircular assemblies (131), one side of the two assemblies (131) being rotatably connected.

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