Tool platform based on wafer front and back surface detection

Abstract

The utility model relates to the technical field of wafer detection, and discloses a tool platform based on wafer front and back surface detection, which comprises a bottom plate, an adsorption assembly used for detecting the front and back surfaces of a wafer is arranged on the bottom plate, placing plates used for placing the wafer are symmetrically arranged at the two ends of the adsorption assembly, and first springs are connected between the placing plates and the bottom plate. A pressing assembly used for pressing the wafer is arranged on one side of the placing plate, a second spring is arranged between the placing plate and the pressing assembly, the pressing assembly is connected with a driving assembly arranged on the bottom plate, the driving assembly is used for driving the pressing assembly to press the wafer downwards and promoting the placing plate to make contact with the bottom plate, and the adsorption assembly and the driving assembly are connected with a control system; through the arrangement, the front and back surfaces of the wafer can be detected, the detection is more comprehensive, the time can be saved, and the detection efficiency can be improved; the data of the front and back surfaces of the wafer are completely acquired at one time, so that the waiting and switching time in the detection process can be shortened, and the detection efficiency is improved.

Description

Technical Field

[0001] The present application relates to the technical field of wafer inspection, and in particular to a tooling platform based on inspection of both the front and back sides of wafers. Background Art

[0002] Wafer inspection involves measuring and evaluating wafers during the semiconductor chip manufacturing process to ensure they meet quality requirements. As the fundamental material in chip manufacturing, wafers can have varying materials, structures, and processing on their front and back sides. Their quality directly impacts the performance and reliability of the final chip, necessitating a comprehensive understanding and assessment.

[0003] Most existing wafer inspection tooling platforms use ceramic suction cups to adsorb and fix the wafers, thereby realizing single-sided inspection of the wafers. However, since the ceramic suction cups are set on the other side of the wafer and adsorb the other side, it hinders the inspection equipment from inspecting the other side of the wafer. When inspecting the other side, the wafer needs to be removed and turned over before inspection. In this way, the wafer inspection process cannot be completed in one step, resulting in a cumbersome inspection process and low efficiency.

[0004] Therefore, there is an urgent need to solve technical problems based on tooling platforms for wafer front and back side inspection.

[0005] The above content is only used to assist in understanding the technical solution of this application and does not constitute an admission that the above content is prior art. Utility Model Content

[0006] The main purpose of this application is to provide a tooling platform based on wafer front and back side inspection, aiming to solve the problem that the existing wafer inspection tooling platform is single-sided inspection, resulting in incomplete inspection and low efficiency.

[0007] To achieve the above-mentioned objectives, the present application provides a tooling platform based on wafer front and back surface detection, including a base plate, an adsorption assembly is provided on the base plate, and placement plates for placing wafers are symmetrically provided on both sides of the adsorption assembly, a first spring is connected between the placement plate and the base plate, and a clamping assembly for pressing the wafer is provided on one side of the placement plate, the adsorption assembly includes a support plate, a glass plate, an airway cover plate and an air pipe joint, the glass plate is provided on the support plate, the airway cover plate is connected to the bottom of the support plate, a vacuum airway is opened on the support plate, the vacuum airway cover plate is connected to the air pipe joint, the clamping assembly is connected to a driving assembly provided on the base plate, the driving assembly is used to drive the clamping assembly to press the wafer down and cause the placement plate to contact the base plate, and the driving assembly is connected to a control system.

[0008] As a preferred solution of the present application, a step difference for placing wafers is provided on the placement plate, the step difference is arranged on one side of the placement plate, and the step difference runs through the placement plate.

[0009] As a preferred solution of the present application, the driving assembly includes a cylinder, a first guide rail, a sliding frame and a connecting rod. The cylinder and the first guide rail are arranged on the base plate, the sliding frame is slidably arranged on the first guide rail, the output end of the cylinder is connected to the sliding frame, and the sliding frame is provided with the connecting rod. The connecting rod passes through the clamping assembly and is slidably connected to the clamping assembly.

[0010] As a preferred solution of the present application, the clamping assembly includes a fixed frame, a second guide rail, a slider and a pressure plate. The fixed frame is connected to the base plate. The second guide rail is provided in the fixed frame. The slider is slidably connected to the second guide rail. The pressure plate is connected to the slider, and an inclined groove is provided on the slider. The connecting rod passes through the groove and is slidably connected to the slider.

[0011] As a preferred solution of the present application, it also includes a reset component, which includes a limit seat and a third spring. The limit seat is connected to the base plate, one end of the third spring is connected to the limit seat, and the other end of the third spring is connected to the drive component.

[0012] As a preferred solution of the present application, it also includes a guide assembly, which includes a guide rod and a limiting ring. One end of the guide rod is connected to the base plate, and the other end of the guide rod passes through the placement plate and extends to the side away from the placement plate. The other end of the guide rod is provided with the limiting ring.

[0013] As a preferred solution of the present application, it further includes a floating joint, and the floating joint is provided between the cylinder output end and the sliding frame.

[0014] As a preferred solution of the present application, it further includes a guide post and a second spring, wherein the placement plate is provided with the guide post, the second spring is sleeved on the guide post, and the second spring is provided between the placement plate and the pressing assembly.

[0015] The tooling platform based on wafer front and back detection provided by the present application uses a clamping assembly to clamp the two sides of the wafer, which can ensure that the wafer material will not shift during the wafer detection process and maintain the stability and accuracy of the position. At the same time, since only the two sides of the wafer are clamped, the ceramic suction cup structure on the other side of the wafer is omitted, so that an additional detection device can be added to simultaneously detect the other side of the wafer, thereby realizing the simultaneous detection of the front and back sides of the wafer. After the wafer is clamped, the lower surface of the wafer is adsorbed through the vacuum air channel so that it is in full contact and close contact with the glass plate on the tooling detection platform. This can maintain the flatness of the wafer and ensure that there is no air gap or deformation between the wafer and the glass plate during the detection process, thereby providing accurate contact and stable measurement conditions; through the above settings, the front and back sides of the wafer can be detected, the detection is more comprehensive, time can be saved and detection efficiency can be improved; by collecting all the data of the front and back sides of the wafer at one time, the waiting and switching time during the detection process can be reduced, and the detection efficiency can be improved. During the wafer inspection process, the wafer is kept in close contact with the glass plate and has good flatness, effectively maintaining the wafer's position stable and avoiding displacement and deformation, thereby ensuring the accuracy of the inspection results and providing a reliable foundation for subsequent processes. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 This is a schematic diagram of the first structure of a tooling platform based on wafer front and back surface inspection in one embodiment of the present application;

[0017] Figure 2 This is a schematic diagram of a first structure of an adsorption component in a tooling platform based on wafer front and back surface inspection in one embodiment of the present application;

[0018] Figure 3 This is a schematic diagram of a second structure of an adsorption component in a tooling platform based on wafer front and back surface inspection in one embodiment of the present application;

[0019] Figure 4 This is a schematic diagram of a second structure of a tooling platform based on wafer front and back surface inspection in one embodiment of the present application;

[0020] Figure 5 This is a structural diagram of a driving component and a pressing component in a tooling platform based on wafer front and back surface detection in one embodiment of the present application;

[0021] Figure 6 for Figure 5 A top view of

[0022] Figure 7 This is a cross-sectional view of the AA portion of a tooling platform based on wafer front and back surface inspection in one embodiment of the present application;

[0023] Figure 8This is a cross-sectional view of the BB portion of a tooling platform based on wafer front and back surface inspection in one embodiment of the present application.

[0024] Description of reference numerals:

[0025] 1. Bottom plate; 2. Adsorption assembly; 3. Placement plate; 4. First spring; 5. Clamping assembly; 6. Second spring; 7. Drive assembly; 8. Reset assembly; 9. Guide assembly; 10. Floating joint;

[0026] 21. Support plate; 22. Glass plate; 23. Airway cover plate; 24. Air pipe joint; 51. Fixed frame; 52. Second guide rail; 53. Slider; 54. Press plate; 71. Cylinder; 72. First guide rail; 73. Sliding frame; 74. Connecting rod; 81. Limit seat; 82. Third spring. DETAILED DESCRIPTION

[0027] The embodiments of the present application are described in detail below. Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the present application, and should not be understood as limiting the present application. All other embodiments obtained by ordinary technicians in this field based on the embodiments in the present application without making any creative efforts shall fall within the scope of protection of the present application.

[0028] In addition, if the descriptions of "first", "second", etc. are involved in this application, they are only used for descriptive purposes (such as to distinguish the same or similar elements) and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" or "second" may explicitly or implicitly include at least one of such features. In addition, the technical solutions between the various embodiments can be combined with each other, but they must be based on the ability of ordinary technicians in this field to implement them. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such a combination of technical solutions does not exist and is not within the scope of protection required by this application.

[0029] Please refer to Figure 1 , Figure 2 , Figure 4 , Figure 4 , Figure 6 , Figure 7In one embodiment, a tooling platform based on wafer front and back surface detection includes a base plate 1, a base plate 1 is provided with an adsorption component 2 for detecting the front and back surfaces of the wafer, a placement plate 3 for placing the wafer is symmetrically provided at both ends of the adsorption component 2, a first spring 4 is connected between the placement plate 3 and the base plate 1, a clamping component 5 for clamping the wafer is provided on one side of the placement plate 3, the adsorption component includes a support plate 21, a glass plate 22, an airway cover plate 23 and an air pipe joint 24, a glass plate 22 is provided on the support plate 21, an airway cover plate 23 is connected to the bottom of the support plate 21, a vacuum airway is opened on the support plate 21, the vacuum airway cover plate 23 is connected to the air pipe joint 24, the clamping component 5 is connected to the driving component 7 provided on the base plate 1, the driving component 7 is used to drive the clamping component 5 to press the wafer down and cause the placement plate 3 to contact the base plate 1, the adsorption component 2 and the driving component 7 are connected to the control system.

[0030] It should be noted that, in this embodiment, the wafer includes a wafer body, a wafer protection film, and an iron ring. The wafer protection film has a certain degree of viscosity and can be fixed well, and has good transparency. The wafer body is placed on the wafer protection film, and the upper surface of the wafer protection film is connected to the lower surface of the iron ring. The iron ring is provided to facilitate users or mechanical equipment to grab the wafer body.

[0031] Preferably, a step is provided on the placement plate 3 for placing wafers. The step is located on one side of the placement plate 3 and passes through the placement plate 3. The wafer carrying the iron ring is placed on the step.

[0032] It can be understood that in this embodiment, by placing the wafer with the iron ring on the step difference of the placement plate 3, the driving component 7 is used to drive the pressing component 5 to press the iron ring first, so that the lower surface of the wafer protective film is in contact with the glass plate 22. Since the iron ring outside the wafer body is pressed, the two sides (upper surface and lower surface) of the wafer body located in the middle position can be exposed. The air pipe joint 24 is used to connect the vacuum pump. There is an adsorption hole between the glass plate 22 and the copy plate. The adsorption hole is connected to the vacuum air duct. The vacuum suction of the vacuum pump can be used to level the lower surface of the wafer protective film with the glass plate 22. The glass plate 22 adopts a high-transmittance glass plate 22, and detection equipment is respectively arranged on the upper and lower surfaces of the wafer body, so that the front and back sides of the wafer can be detected; the workbench provided in this application presses the two sides of the wafer, eliminating the need to set a ceramic suction cup structure on the other side of the wafer, so that additional detection equipment can be added to simultaneously detect the other side of the wafer, thereby realizing the simultaneous detection of the front and back sides of the wafer. At the same time, vacuum adsorption is performed by the adsorption component 2 to achieve a flat fit between the wafer surface and the adsorption component 2, effectively maintaining the position of the wafer stable, avoiding displacement and deformation, and thus ensuring the accuracy of the detection results.

[0033] For details, please refer to Figure 1 , Figure 5, Figure 6 , Figure 8 The driving assembly 7 includes a cylinder 71, a first guide rail 72, a sliding frame 73 and a connecting rod 74. The cylinder 71 and the first guide rail 72 are arranged on the base plate 1, and the sliding frame 73 is slidably arranged on the first guide rail 72. The output end of the cylinder 71 is connected to the sliding frame 73, and a connecting rod 74 is provided on the sliding frame 73. The connecting rod 74 passes through the clamping assembly 5 and is slidably connected to the clamping assembly 5. It can be understood that the same pressure can be applied simultaneously by the two cylinders 71 to ensure that the wafer remains smooth and stable during the clamping process, which can improve the clamping accuracy and avoid deflection or misalignment of the wafer during the clamping process.

[0034] For details, please refer to Figure 1 , Figure 5 , Figure 6 , Figure 7 The clamping assembly 5 includes a fixed frame 51, a second guide rail 52, a slider 53 and a pressure plate 54. The fixed frame 51 is connected to the base plate 1. The second guide rail 52 is provided in the fixed frame 51. The slider 53 is slidably connected to the second guide rail 52. The pressure plate 54 is connected to the slider 53, and an inclined slide groove is provided on the slider 53. The connecting rod 74 passes through the slide groove and is slidably connected to the slider 53.

[0035] For details, please refer to Figure 1 , Figure 5 , also includes a reset component 8, the reset component 8 includes a limit seat 81 and a third spring 82, the limit seat 81 is connected to the base plate 1, one end of the third spring 82 is connected to the limit seat 81, and the other end of the third spring 82 is connected to the drive component 7.

[0036] It will be appreciated that the primary function of reset assembly 8 is to reset and stabilize slide 73. Furthermore, after the air cylinder 71 completes its work of pushing slider 53, it does not require a continuous supply of air pressure during the retraction phase. Instead, it relies on the elastic force of the reset spring to return slider 53 to its initial position. By utilizing the spring's elastic potential energy to drive the reset of slider 53, energy can be saved and costs can be reduced. Furthermore, in applications requiring frequent reciprocating motion, the use of a reset spring allows air cylinder 71 to return to its initial position more quickly, thereby shortening the reciprocating motion time and improving work efficiency.

[0037] For details, please refer to Figure 1 , Figure 5 , and also includes a guide component 9, the guide component 9 includes a guide rod and a limit ring, one end of the guide rod is connected to the base plate 1, and the other end of the guide rod passes through the placement plate 3 and extends to the side away from the placement plate 3. A limit ring is set at the other end of the guide rod. It can be understood that by setting the guide rod, the vertical lifting and lowering of the placement plate 3 can be ensured, and the placement plate 3 can be prevented from offsetting during the sliding process, which affects the accuracy.

[0038] For details, please refer to Figure 1 , Figure 5 , also includes a floating joint 10, a floating joint 10 is provided between the output end of the cylinder 71 and the sliding frame 73. It can be understood that the floating joint 10 includes a connecting rod, a sliding sleeve and a third spring; the sliding sleeve in the floating joint 10 usually has a certain friction damping capacity, and the direct friction between the cylinder 71 and the sliding frame 73 is reduced by sliding the sliding sleeve, thereby reducing the friction loss and energy consumption of the system; at the same time, the provision of the floating joint 10 can allow the connecting rod to slide, rotate or tilt within a certain range, thereby accommodating these deviations and ensuring the stability of the connection.

[0039] For details, please refer to Figure 1 , Figure 7 , also includes a guide post (not shown in the figure) and a second spring 6. A guide post is provided on the placement plate 3, and the second spring 6 is sleeved on the guide post. A second spring 6 is provided between the placement plate 3 and the clamping assembly 5; it can be understood that by arranging the first spring 4 and the second spring 6, the placement plate 3 can float when it is in the material receiving state, so that there is a height space between the wafer and the glass plate 22, and the conventional material taking and placing device can be freely extended, which has strong applicability. At the same time, the arrangement of the first spring 4 and the second spring 6 can provide a double buffering mechanism, which makes the system more stable when under pressure and reduces the dependence on the single spring 4.

[0040] In summary, when the tooling platform for detecting the front and back sides of the wafer is in use, the control system controls the cylinder 71 to extend, driving the slide 73 to slide along the first guide rail 72. During the movement of the slide 73, the connecting rod 74 drives the slider 53 and the pressure plate 54 through the slide groove to move toward the wafer. At this time, the second spring 6 is compressed, and under the continued push of the cylinder 71, the pressure plate 54 compresses the first spring 4 when moving toward the wafer, so that the bottom of the placement plate 3 contacts the bottom plate 1, thereby achieving the pressing of the iron ring by the pressure plate 54, thereby ensuring that it will not shift during detection. After the wafer is pressed, the vacuum air duct located on the support plate 21 will suck the wafer tightly, thereby ensuring that the sheet is in close contact with the glass on the tooling detection platform, which can ensure good flatness when performing front and back detection;

[0041] During the resetting process, the control system controls the cylinder 71 to retract, and the placement plate 3 and the pressure plate 54 move away from the wafer. The elastic force of the reset spring effectively reduces the situation where the cylinder 71 does not retract into place during the retraction process; by providing the reset component 8, it can be ensured that the cylinder 71 retracts to the initial point, thereby ensuring that the rail and the pressure plate can return to the initial position of the open state;

[0042] Through the above settings, both the front and back sides of the wafer can be inspected, which makes the inspection more comprehensive, saves time and improves inspection efficiency. By collecting complete data on the front and back sides of the wafer at one time, the waiting and switching time during the inspection process can be reduced, and the inspection efficiency can be improved. At the same time, by inspecting both the front and back sides of the wafer, the consistency and reliability of the inspection process can be guaranteed. Since both sides are affected by the same environmental conditions and instruments at the same time, the errors or deviations introduced by process or system differences can be reduced, and the comparability and consistency of the data can be improved. Furthermore, the wafer can be closely attached to the glass plate during the wafer inspection process, and good flatness can be provided, effectively maintaining the stable position of the wafer and avoiding displacement and deformation, thereby ensuring the accuracy of the inspection results and providing a reliable foundation for subsequent processes.

[0043] It should be noted that, in this document, the terms "comprises," "includes," or any other variations thereof are intended to encompass non-exclusive inclusion, such that a process, apparatus, article, or method comprising a series of elements includes not only those elements but also other elements not explicitly listed, or elements inherent to such process, apparatus, article, or method. In the absence of further limitations, an element defined by the phrase "comprising a ..." does not exclude the presence of other identical elements in the process, apparatus, article, or method comprising the element.

[0044] The above description is only a preferred embodiment of the present application and does not limit the patent scope of the present application. Any equivalent structure or equivalent process transformation made using the contents of the present application specification and drawings, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present application.

Claims

1. The tooling platform based on wafer front and back side detection is characterized by: It includes a base plate, on which an adsorption assembly is provided, and placement plates for placing wafers are symmetrically provided on both sides of the adsorption assembly, a first spring is connected between the placement plate and the base plate, and a clamping assembly for pressing the wafer is provided on one side of the placement plate, the adsorption assembly includes a support plate, a glass plate, an airway cover plate and an air pipe joint, the glass plate is provided on the support plate, the airway cover plate is connected to the bottom of the support plate, a vacuum airway is opened on the support plate, the vacuum airway cover plate is connected to the air pipe joint, the clamping assembly is connected to a driving assembly provided on the base plate, the driving assembly is used to drive the clamping assembly to press the wafer down and cause the placement plate to contact the base plate, and the driving assembly is connected to a control system.

2. The tooling platform based on wafer front and back surface detection according to claim 1 is characterized in that: The placement plate is provided with a step for placing wafers, the step is located at one side of the placement plate, and the step runs through the placement plate.

3. The tooling platform based on wafer front and back surface detection according to claim 1 is characterized in that: The driving assembly includes a cylinder, a first guide rail, a sliding frame and a connecting rod. The cylinder and the first guide rail are arranged on the base plate. The sliding frame is slidably arranged on the first guide rail. The output end of the cylinder is connected to the sliding frame. The sliding frame is provided with the connecting rod. The connecting rod passes through the clamping assembly and is slidably connected to the clamping assembly.

4. The tooling platform based on wafer front and back surface detection according to claim 3 is characterized in that: The clamping assembly includes a fixed frame, a second guide rail, a slider and a pressure plate. The fixed frame is connected to the base plate. The second guide rail is provided in the fixed frame. The slider is slidably connected to the second guide rail. The pressure plate is connected to the slider, and an inclined sliding groove is provided on the slider. The connecting rod passes through the sliding groove and is slidably connected to the slider.

5. The tooling platform based on wafer front and back surface detection according to claim 1, characterized in that: It also includes a reset component, which includes a limit seat and a third spring. The limit seat is connected to the base plate, one end of the third spring is connected to the limit seat, and the other end of the third spring is connected to the drive component.

6. The tooling platform based on wafer front and back surface detection according to claim 1, characterized in that: It also includes a guide assembly, which includes a guide rod and a limiting ring. One end of the guide rod is connected to the base plate, and the other end of the guide rod passes through the placement plate and extends to a side away from the placement plate. The other end of the guide rod is provided with the limiting ring.

7. The tooling platform based on wafer front and back surface detection according to claim 3 is characterized in that: It also includes a floating joint, which is provided between the cylinder output end and the sliding frame.

8. The tooling platform based on wafer front and back surface detection according to claim 1, characterized in that: It also includes a guide column and a second spring. The guide column is provided on the placement plate, the second spring is sleeved on the guide column, and the second spring is provided between the placement plate and the clamping assembly.

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