Liquid cooling node and liquid cooling heat dissipation cabinet

Abstract

The utility model provides a liquid cooling node and a liquid cooling heat dissipation cabinet, the liquid cooling node comprises a sealed cabin, a cooling part, two first joints and two second joints, and the sealed cabin is filled with a first medium; the cooling part is arranged in the sealed cabin body, and the cooling part is filled with a second medium; the first joint is arranged on the side wall of the sealed cabin body and is communicated with the sealed cabin body to form a first cooling passage; and the second joint is arranged on the side wall of the sealed cabin body and is communicated with the cooling component to form a second cooling passage. According to the data center node, heat dissipation of a single high-power main chip can be achieved, and the whole data center node can be kept at a low temperature for a long time.

Description

Technical Field

[0001] The present application relates to the field of heat dissipation technology for communication cabinets, and in particular to a liquid-cooled node and a liquid-cooled heat dissipation cabinet. Background Art

[0002] As the power of IT equipment boards and entire cabinets increases, traditional air cooling becomes increasingly costly, leading the industry to move towards more efficient liquid cooling. Among various liquid cooling technologies, immersion cooling, which involves immersing boards in a non-conductive fluid to dissipate heat, has attracted widespread attention due to its simple structure and ease of implementation. Immersion cooling can use either single-phase or two-phase fluids, as follows:

[0003] Figure 1 This is a typical single-phase node immersion liquid cooling diagram. The single board with the main chip is immersed in a sealed structure. The cooled heat dissipation liquid is input through the liquid pipe connector 100. The pump installed on its periphery drives the circulation of the heated hot fluid to dissipate the heat generated by the node into the external environment.

[0004] Figure 2 and Figure 3 This is a typical two-phase node immersion liquid cooling diagram. Through a non-conductive working medium with a boiling point lower than that of water, a gas-liquid two-phase change occurs at a certain temperature and pressure, thereby removing the heat from the heat source. Since the gas can automatically rise under the action of buoyancy, the system can build a condenser 101 into the node, condensing the working medium gas into liquid and automatically dripping. The condenser removes heat through the inflow and outflow of cooling water ( Figure 2 ); or the gas-liquid two-phase rises automatically, and finally relies on the condenser in the external heat exchange module to condense the gas phase working medium into the liquid phase, and then relies on the pump in the heat exchange module to transport the liquid back to the node for the next heat dissipation cycle ( Figure 3 ).

[0005] However, under this method, the liquid flow rate and liquid replenishment speed at the main chip are not large enough, and the heat dissipation area and vaporization cores are not large enough. When the chip power exceeds a certain value, a heat dissipation bottleneck occurs and the heat dissipation problem cannot be solved. Utility Model Content

[0006] The present application provides a liquid-cooled node and a liquid-cooled heat dissipation cabinet to solve the heat dissipation problem of a single high-power main chip, so that the entire data center node can maintain a low temperature for a long time.

[0007] The first aspect of the present application provides a liquid-cooled node, which includes a sealed cabin, at least one cooling component, two first joints and two second joints, wherein the sealed cabin is filled with a first medium; the at least one cooling component is arranged in the sealed cabin, and the cooling component is filled with a second medium; the first joint is arranged on the side wall of the sealed cabin, for connecting the sealed cabin to form a first cooling path; the second joint is arranged on the side wall of the sealed cabin, for connecting the at least one cooling component to form a second cooling path.

[0008] The liquid cooling node includes a sealed cabin, at least one cooling component, two first joints and two second joints. The sealed chamber is filled with a first medium, and a circuit board with chips is disposed within the sealed chamber. The chips include a main chip and non-main chips. At least a portion of the circuit board is immersed in the first medium so that the first medium circulates to remove heat from the circuit board, thereby cooling the entire circuit board. At least one cooling component is disposed within the sealed chamber and is filled with a second medium. The cooling component contacts the main chip on the circuit board. The high-speed flow of the second medium within the cooling component can rapidly remove heat from the main chip, locally enhancing the cooling of the main chip, thereby meeting the heat dissipation requirements of the main chip. Two first connectors are disposed on the sidewalls of the sealed chamber. The first connector is configured to connect the sealed chamber to form a first cooling path, enabling the first medium to complete heat exchange outside the liquid-cooled node, thereby maintaining a relatively low temperature within the liquid-cooled node for an extended period of time and improving the heat dissipation efficiency of the first medium. Two second connectors are disposed on the sidewalls of the sealed chamber to connect the cooling component to form a second cooling path, thereby enabling the second medium to complete heat exchange outside the liquid-cooled node, thereby maintaining a relatively low temperature within the cooling component for an extended period of time and improving the heat dissipation efficiency of the second medium. Since the liquid-cooled node absorbs the heat emitted by the main chip through a cooling component with a higher heat dissipation effect, and absorbs the heat emitted by other devices other than the main chip through a first medium with a limited heat dissipation effect, the first medium and the second medium in the cooling component complete heat exchange outside the liquid-cooled node. Therefore, it can solve the heat dissipation of a single high-power main chip and keep the entire liquid-cooled node at a low temperature for a long time.

[0009] Optionally, a heating element is provided in the sealed cabin, the cooling component itself forms a closed structure, the cooling component is attached to the surface of the heating element, and a flow channel is provided inside the cooling component. When the cooling medium flows through the flow channel, it can efficiently take away the heat generated by the heating element.

[0010] Optionally, a heating element is provided in the sealed cabin, and the cooling component is configured as a cavity-like structure with an opening on one side. The open side of the cooling component is connected to the heating element, and the heating element closes the open side of the cooling component to form a closed structure, so that the cooling medium is in direct contact with the heating element, thereby being able to more efficiently take away the heat generated by the heating element.

[0011] Optionally, the first medium and the second medium are the same cooling liquid, which can simplify the layout of heat exchange circuits outside the liquid cooling node.

[0012] Optionally, the first medium and the second medium are different types of cooling liquids to meet complex cooling requirements in the liquid-cooled node.

[0013] Optionally, the first medium is a non-aqueous single-phase working medium. This structure is applicable to both horizontally inserted nodes and vertically inserted nodes.

[0014] Optionally, the liquid cooling node is a vertically inserted node, the first medium is a non-aqueous two-phase working medium, and the two first joints are arranged in a vertical direction.

[0015] Optionally, the second medium is water. Because water has much stronger physical properties than non-aqueous media (such as fluorinated liquids or oils), it can support higher heat dissipation capabilities for the main chip, with heat dissipation capabilities increased by more than 20%. This, based on node immersion, can further support the evolution of higher-power chips, while efficiently achieving heat dissipation for the main chip and its peripheral devices, and conveniently achieving decoupling of single-board and liquid cooling.

[0016] Optionally, the at least one cooling component comprises a plurality of cooling components, each of which is interconnected. Since the cooling components can be configured flexibly, the liquid cooling node can be flexibly adapted to various configurations and circuit boards, decoupling the heat dissipation structure from the circuit board hardware and improving the efficiency of the heat dissipation system.

[0017] Optionally, each of the first connectors is a quick blind-plug connector, which eliminates the need for manual connection operations and allows the quick blind-plug connector to automatically connect once the liquid cooling node is properly installed on the cabinet body, resulting in easy operation and convenience.

[0018] Preferably, each of the second connectors is a quick blind-plug connector, which eliminates the need for manual connection operations. As long as the liquid cooling node is properly installed on the cabinet body, the quick blind-plug connector can automatically connect, making the operation simple and easy to use.

[0019] Optionally, a circuit board is provided in the sealed cabin, and a main chip and a non-main chip are provided on the circuit board;

[0020] The main chip contacts the cooling component, and at least a portion of the non-main chip is immersed in the first medium.

[0021] The second aspect of the present application provides a liquid-cooled heat dissipation cabinet, which includes a cabinet body, any one of the liquid cooling nodes provided in the present application, a first flow distribution unit and a second flow distribution unit; the number of the liquid cooling nodes is multiple, and the liquid cooling nodes can be detachably installed on the cabinet body; the first flow distribution unit is used to distribute a first medium, one of the first connectors of the liquid cooling node is connected to the liquid inlet side of the first flow distribution unit, and the other first connector is connected to the liquid outlet side of the first flow distribution unit; the second flow distribution unit is used to distribute a second medium, one of the second connectors of the liquid cooling node is connected to the liquid inlet side of the second flow distribution unit, and the other second connector is connected to the liquid outlet side of the second flow distribution unit.

[0022] Optionally, the first flow distribution unit and the second flow distribution unit are arranged on the same side of the cabinet body, making the overall structure more compact.

[0023] Optionally, the first flow distribution unit and the second flow distribution unit are arranged on different sides of the cabinet body, so that the layout of the overall structure is more flexible.

[0024] Optionally, the liquid-cooled heat dissipation cabinet includes a heat exchange module, which includes two heat exchange branches that are not connected to each other. The first flow distribution unit is connected to one of the heat exchange branches, and the second flow distribution unit is connected to the other heat exchange branch, so that heat exchange is performed for the first medium and the second medium at the same time through the same heat exchange module.

[0025] Optionally, the liquid-cooled heat dissipation cabinet includes two heat exchange modules, the first flow distribution unit is connected to one of the heat exchange modules, and the second flow distribution unit is connected to the other heat exchange module.

[0026] It should be understood that the foregoing general description and the following detailed description are merely illustrative and are not restrictive of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 It is a schematic diagram of a single-phase immersion liquid cooling structure in the prior art;

[0028] Figure 2 This is a schematic diagram of a two-phase node immersion liquid cooling structure in the prior art;

[0029] Figure 3 This is a schematic diagram of another two-phase node immersion liquid cooling structure in the prior art;

[0030] Figure 4It is a structural schematic diagram of an existing immersion liquid cooling system;

[0031] Figure 5 A schematic structural diagram of an immersion liquid cooling system provided in an embodiment of the present application;

[0032] Figure 6 A schematic diagram of a cooling component arrangement structure provided in an embodiment of the present application;

[0033] Figure 7 A schematic diagram of another cooling component arrangement structure provided in an embodiment of the present application;

[0034] Figure 8 A schematic diagram of the structure of a vertical insertion node provided in an embodiment of the present application;

[0035] Figure 9 A schematic diagram of the structure of another vertical plug-in node provided in an embodiment of the present application;

[0036] Figure 10 A schematic diagram of the layout structure of the liquid cooling heat dissipation cabinet provided in an embodiment of the present application;

[0037] Figure 11 A schematic diagram of a first arrangement structure of a heat exchange module provided in an embodiment of the present application;

[0038] Figure 12 A schematic diagram of a second arrangement structure of the heat exchange module provided in an embodiment of the present application;

[0039] Figure 13 A schematic diagram of a third arrangement structure of the heat exchange module provided in an embodiment of the present application;

[0040] Figure 14 A schematic diagram of a connection structure between a heat exchange module and a liquid cooling node provided in an embodiment of the present application;

[0041] Figure 15 A schematic diagram of another connection structure between a heat exchange module and a liquid cooling node provided in an embodiment of the present application;

[0042] Figure 16 A schematic diagram of a connection structure of a flow distribution unit provided in an embodiment of the present application;

[0043] Figure 17 A schematic diagram of another connection structure of the flow distribution unit provided in an embodiment of the present application;

[0044] Figure 18 A schematic diagram of the front structure of a vertically inserted multi-frame node traffic distribution unit connection;

[0045] Figure 19 This is a schematic diagram of the back structure of a vertically inserted multi-frame node traffic distribution unit connection.

[0046] Reference numerals:

[0047] 100-Liquid pipeline connector;

[0048] 101-condenser;

[0049] 102-cooling unit;

[0050] 103-cooling liquid tank;

[0051] 111-Liquid supply line;

[0052] 112-Liquid return line;

[0053] 115-Fluid pump;

[0054] 1-Cabinet body;

[0055] 11-frame;

[0056] 4-Liquid cooling nodes;

[0057] 41-sealed cabin;

[0058] 42- cooling component;

[0059] 43-first connector;

[0060] 44-second connector;

[0061] 45-cooling pipe;

[0062] 46-circuit board;

[0063] 47-main chip;

[0064] 48-condenser;

[0065] 5-first flow distribution unit;

[0066] 6-second flow distribution unit;

[0067] 7-heat exchange module;

[0068] 71-heat exchange branch;

[0069] 72-primary side;

[0070] 73-driving pump;

[0071] 8-Hose.

[0072] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present application and, together with the description, serve to explain the principles of the present application. DETAILED DESCRIPTION

[0073] In order to better understand the technical solution of the present application, the embodiments of the present application are described in detail below with reference to the accompanying drawings.

[0074] The terms used in the embodiments of the present application are for the purpose of describing specific embodiments only and are not intended to limit the present application. The singular forms "a", "an", "the" and "the" used in the embodiments of the present application and the appended claims are also intended to include plural forms unless the context clearly indicates otherwise.

[0075] It should be understood that the term "and / or" as used herein is merely a description of the relationship between associated objects, indicating that three possible relationships exist. For example, "A and / or B" can represent: A exists alone, A and B exist simultaneously, or B exists alone. Furthermore, the character " / " in this document generally indicates that the associated objects are in an "or" relationship.

[0076] It should be noted that the directional words such as "upper", "lower", "left", and "right" described in the embodiments of the present application are described based on the angles shown in the accompanying drawings and should not be understood as limiting the embodiments of the present application. In addition, in the context, it should be understood that when it is mentioned that an element is connected to another element "on" or "under", it can not only be directly connected to the other element "on" or "under", but also be indirectly connected to the other element "on" or "under" through an intermediate element.

[0077] An embodiment of the present application provides a liquid-cooled heat dissipation cabinet, which includes a cabinet body, in which a switch, a power supply box, and multiple liquid-cooled nodes can be installed to implement data communication functions. The liquid-cooled node can be a pluggable service processing circuit board unit, that is, the liquid-cooled node can be detachably connected to the cabinet body. The liquid-cooled node can be installed in the cabinet body by horizontal insertion or vertical insertion. The liquid-cooled node generally has high heat dissipation requirements and can be dissipated by immersion in liquid cooling.

[0078] refer to Figure 4An immersion cooling liquid tank 103 is provided inside the liquid cooling node, and a cooling unit 102 (such as an indirect evaporative cooling (IDEC) system) is provided outside the liquid cooling node. The cooling liquid tank 103 is connected to the external cooling unit through a liquid supply line 111 and a liquid return line 112 to form a cooling circuit. A fluid pump 115 is provided in the cooling circuit to drive the heat from the cooling circuit to the atmosphere through the external cooling unit. Since the liquid cooling node usually includes a main chip (such as a CPU, GPU, etc., which are characterized by high power and large heat dissipation) and a non-main chip (such as a memory stick, a hard disk, etc., which are characterized by low power and small heat dissipation), and the flow rate of the node immersion liquid cooling is low, the operating efficiency of the cooling system is low, resulting in limited heat dissipation capacity of this method, which can only meet the heat dissipation requirements of non-main chips, but it is difficult to meet the heat dissipation requirements of main chips with higher power consumption. Therefore, a new solution is needed to solve the heat dissipation problem of the main chip.

[0079] like Figure 5 As shown, an embodiment of the present application provides a liquid cooling node 4, which includes a sealed cabin 41, a cooling component 42, two first connectors 43 and two second connectors 44. The sealed cabin 41 is filled with a first medium, and a heat generating component is provided in the sealed cabin 41. For example, a circuit board 46 with chips is provided in the sealed cabin 41, wherein the chips include a main chip 47 (such as a CPU, GPU, etc., which are characterized by high power and large heat dissipation) and a non-main chip 47 (such as a memory stick, a hard disk, etc., which are characterized by low power and small heat dissipation); at least a part of the circuit board 46 is immersed in the first medium to remove the heat on the circuit board 46 through the circulation of the first medium, thereby cooling the circuit board 46 as a whole; the cooling component 42 is arranged in the sealed cabin 41, and the cooling component 42 is filled with a second medium. The cooling component 42 contacts the main chip 47 on the circuit board 46. The high-speed flowing second medium in the cooling component 42 can quickly remove the heat of the main chip 47, and locally enhance the cooling of the main chip 47, thereby meeting the heat dissipation requirements of the main chip 47; two The first joint 43 is arranged on the side wall of the sealed cabin 41, and the first joint 43 is connected to the sealed cabin 41 to form a first cooling passage. That is, the two first joints 43 respectively form the liquid inlet and liquid outlet of the first medium, so that the first medium can complete heat exchange outside the liquid cooling node 4, so that the first medium in the liquid cooling node 4 can maintain a low temperature for a long time, thereby improving the heat dissipation efficiency of the first medium; the two second joints 44 are arranged on the side wall of the sealed cabin 41, and the cooling component 42 is connected to the second joints 44 through the cooling pipe 45 to form a second cooling passage. That is, the two second joints 44 respectively form the liquid inlet and liquid outlet of the second medium, so that the second medium can complete heat exchange outside the liquid cooling node 4, so that the second medium in the cooling component 42 can maintain a low temperature for a long time, thereby improving the heat dissipation efficiency of the second medium.

[0080] The cooling component 42 can be a conventional cold plate structure, that is, the cooling component 42 itself forms a closed structure, the cooling component 42 is attached to the main chip 47, and a flow channel is provided inside the cooling component 42. When the cooling medium flows through the flow channel, the heat generated by the main chip can be efficiently removed. The cooling component 42 can also be a cold plate structure based on internal injection, that is, the cooling component 42 is configured as a cavity-like structure with an opening on one side, the open side of the cooling component 42 is connected to the main chip 47, and the open side of the cooling component 42 is closed by the main chip 47 to form a closed structure. A nozzle is provided in the cooling component 42, and the cooling medium is sprayed onto the main chip 47 through the nozzle, so that the cooling medium is in direct contact with the main chip 47, thereby being able to more efficiently remove the heat generated by the main chip 47. Since the liquid-cooled node 4 absorbs the heat emitted by the main chip 47 through the cooling component 42 with a higher heat dissipation effect, and absorbs the heat emitted by other devices other than the main chip 47 through the first medium with a limited heat dissipation effect, the first medium and the second medium in the cooling component 42 complete heat exchange outside the liquid-cooled node 4, thereby solving the heat dissipation of a single high-power main chip 47 and allowing the entire liquid-cooled node 4 to maintain a low temperature for a long time.

[0081] like Figure 6 and Figure 7 As shown, the number of cooling components 42 can be reasonably set according to the heat dissipation requirements. For example, the number of cooling components 42 can be one, two, three, four, five, etc., wherein, Figure 8 The number of cooling components 42 is five. Figure 9 There are two cooling components 42, which are directly attached to the surface of the main chip 47 to provide reliable contact cooling for the main chip 47. When there are two or more cooling components 42, each cooling component 42 can be connected in series or parallel via a cooling pipe 45, and then connected to the second connector 44 via the cooling pipe 45. Due to the flexible configuration of the cooling components 42, the liquid cooling node 4 can be flexibly adapted to various configurations and types of circuit boards 46, achieving hardware decoupling of the heat dissipation structure and the circuit boards 46, thereby improving the efficiency of the heat dissipation system.

[0082] The first medium and the second medium can be the same cooling liquid to simplify the layout of the heat exchange circuit outside the liquid-cooled node 4. The first medium and the second medium can be different cooling liquids to meet the complex cooling requirements within the liquid-cooled node 4. For example, the cooling capacity of the second medium can be greater than that of the first medium. The cooling liquid with higher cooling capacity can be used to cool the main chip with high heat dissipation to achieve a reliable heat dissipation effect. The cooling liquid with lower cooling capacity can be used to cool other heat dissipation devices other than the main chip to avoid waste caused by cooling capacity exceeding the heat dissipation requirement.

[0083] In one embodiment, the first medium and the second medium are the same cooling liquid. Different pressures can be used to achieve different cooling effects. For example, the first medium is a low-pressure non-aqueous medium to prevent excessive pressure from forming within the liquid-cooled node 4, which could affect its service life. The second medium is a high-pressure non-aqueous medium to increase its flow rate, thereby improving the heat dissipation of the main chip 47.

[0084] In one embodiment, the first medium is a non-conductive non-aqueous working fluid, and the second medium can be a non-conductive non-aqueous working fluid or a water working fluid. The non-aqueous working fluid can be a single-phase liquid working fluid (i.e., it always maintains a single-phase liquid state within the operating temperature), for example, FC43, mineral oil or vegetable oil, etc. At this time, the first medium needs to flow into the heat exchange module 7 through the first joint 43 to complete the heat exchange in the heat exchange module 7. This structure is applicable to both horizontal and vertical insertion nodes. The non-aqueous working fluid can use a phase change working fluid (i.e., at the design temperature, it can realize the mutual conversion between liquid and gas), for example, FC72 or Novec7000, etc., whose boiling point is lower than that of water, and the boiling point at normal pressure is usually between 30 and 60°C.

[0085] Further, refer to Figure 8 When the first medium is a phase-change medium, it can flow out of the liquid-cooled node 4 through the first connector 43, complete heat exchange outside the liquid-cooled node 4, and then cool to form liquid droplets that flow back into the liquid-cooled node 4. This structure is mainly used in vertically inserted nodes, and the two first connectors 43 are arranged in a vertical direction, with the lower first connector 43 being the medium inlet and the upper first connector 43 being the medium outlet.

[0086] Further, refer to Figure 9 When the first medium is a phase-change medium, a condenser 48 can be built into the liquid-cooled node 4. The gaseous phase-change medium within the liquid-cooled node 4, which has absorbed heat, exchanges heat with the built-in condenser 48, condensing the vaporized phase-change medium into a liquid that drips back into the liquid phase-change medium. The liquid in the built-in condenser 48 flows out of the liquid-cooled node 4 through the first connector 43, completing the heat exchange outside the liquid-cooled node 4. This structure is applicable to both horizontally inserted nodes and vertically inserted nodes.

[0087] In another embodiment, the first medium is a non-conductive non-aqueous medium, and the second medium is an aqueous medium. Because water has much stronger physical properties than non-aqueous media (such as fluorinated liquids or oils), the heat dissipation capacity of the main chip 47 can be improved by more than 20%. This allows for further support of higher-power chip evolution based on node immersion, while efficiently dissipating heat from the main chip 47 and its peripheral components, facilitating decoupling of single-board and liquid cooling.

[0088] In another embodiment, the first medium is a non-conductive non-aqueous working fluid, and the second medium can be a liquid with a latent heat of vaporization greater than 500KJ / kg, such as Freon or alcohol, or a heat dissipation medium such as liquid metal under ultra-high pressure or liquid carbon dioxide. As the power of the main chip 47 continues to increase, the heat it dissipates continues to increase, and the heat dissipation demand will also continue to increase. This second medium can further improve the heat dissipation effect of the cooling component 42.

[0089] Furthermore, the first connector 43 and the second connector 44 can be arranged at the rear of the sealed cabin 41 along the plug-in and pull-out direction to avoid the first connector 43 and the second connector 44 occupying the internal space of the cabinet body 1. At least one of the first connector 43 and the second connector 44 can be a quick blind plug connector. The quick blind plug connector is provided with a floating device, and no manual connection operation is required. As long as the liquid cooling node 4 is installed in place on the cabinet body 1, the quick blind plug connector can automatically connect. The operation is simple and easy to use. Of course, the first connector 43 and the second connector 44 can also be a quick connector connected by a hose or a hand-inserted quick connector. In this case, it is necessary to connect each connector manually after the liquid cooling node 4 is installed in place. Among them, the leakage control of the first connector 43 and the second connector 44 can be achieved by relying on the characteristics of the quick connector. Specifically, the quick connector is a fluid connector that can be automatically closed when disconnected and can achieve liquid conduction when connected.

[0090] like Figure 10 As shown, the liquid-cooled heat dissipation cabinet provided in the embodiment of the present application also includes two flow distribution units and at least one heat exchange module 7. The liquid cooling node 4 is connected to the flow distribution unit and the heat exchange module 7 to form a cooling circuit to reduce the temperature of the data center. The heat exchange module 7 is also called a coolant distribution unit (CDU), which mainly includes components such as a pump and a heat exchanger, and serves to transport fluid and control the temperature of the liquid flowing into the liquid cooling node 4. The two flow distribution units are respectively a first flow distribution unit 5 and a second flow distribution unit 6. The first flow distribution unit 5 is connected to the first joint 43, and the second flow distribution unit 6 is connected to the second joint 44.

[0091] Specifically, the heat exchange module 7 includes a primary side 72 and a secondary side that are not interconnected and can exchange heat with each other. The primary side 72 of the heat exchange module 7 is connected to the external liquid, allowing low-temperature external liquid to flow into the heat exchange module 7 and cool the secondary side of the heat exchange module 7. The liquid cooling node 4 is connected to the secondary side of the heat exchange module 7 through a flow distribution unit, allowing the liquid in the liquid cooling node 4 to flow into the secondary side of the heat exchange module 7 for cooling.

[0092] like Figure 11-13 As shown, the heat exchange module 7 can be located at the back of the cabinet body 1 (i.e., behind the cabinet body 1), on the side of the cabinet body 1, or a combination of the back and sides of the cabinet body 1. The heat exchange module 7 can also occupy the height space of the cabinet body 1, for example, the heat exchange module 7 can be located at the bottom, middle, or top of the cabinet body 1. The heat exchange module 7 can be a separate box installed outside the cabinet body 1, or it can be directly installed inside the cabinet body 1. The liquid cooling cabinet can include one heat dissipation module or multiple heat dissipation modules.

[0093] like Figure 14 As shown, in one embodiment, the liquid cooling heat dissipation cabinet includes a heat exchange module 7, and the heat exchange module 7 includes two heat exchange branches 71 that are not connected to each other. That is, the secondary side of the heat exchange module 7 is provided with two heat exchange branches 71, and each heat exchange branch 71 is provided with a separate drive pump 73. The heat exchange branch 71 can also be provided with a purification device as needed. The first flow distribution unit 5 is connected to one of the heat exchange branches 71, and the second flow distribution unit 6 is connected to the other heat exchange branch 71. At this time, the main chip 47 removes heat through the first medium and the water cooling component 42, and the devices other than the main chip 47 remove heat through the circulation of the second medium. Both of them exchange heat with the third cooling medium (the primary side 72 of the heat exchange module 7) outside the liquid cooling node 4, so that the same heat exchange module 7 can simultaneously exchange heat for the first medium and the second medium, and can also provide circulation power for the first medium and the second medium at the same time. The two heat exchange branches 71 may be spaced apart from each other. For example, the two heat exchange branches 71 are arranged in sequence along the up-down direction, or the two heat exchange branches 71 are spaced apart from each other along the left-right direction.

[0094] like Figure 15 As shown, in another embodiment, the liquid-cooled heat dissipation cabinet includes at least two heat exchange modules 7, each heat exchange module 7 is provided with a separate drive pump 73, and a purification device can also be provided in the heat exchange module 7 as needed. The first flow distribution unit 5 is connected to one of the heat exchange modules 7, and the second flow distribution unit 6 is connected to the other heat exchange module 7, so that the first medium exchanges heat with the third cooling medium (the primary side 72 of the heat exchange module 7) in one of the heat exchange modules 7, and the second medium exchanges heat with the third cooling medium (the primary side 72 of the heat exchange module 7) in the other heat exchange module 7.

[0095] like Figure 16 and Figure 17 As shown, the flow distribution unit includes a liquid collector and a liquid distributor, which is used to split or merge gas or fluid and is commonly used to regulate fluid flow in a hydraulic system, such as flow distribution and pressure transmission of the cooling medium between a pump and a liquid cooling component 42.

[0096] Specifically, the flow distribution unit has two independent liquid flow channels, one of which provides a flow channel for the cold fluid and is called a liquid distributor; the other provides a flow channel for the hot fluid and is called a liquid collector. Each liquid flow channel is equipped with multiple liquid quick connectors, which are connected to the first connector 43 or the second connector 44 of the liquid cooling node 4 through the liquid quick connectors, so that the coolant enters each liquid cooling node 4 to absorb heat. In the liquid distributor, the liquid in the liquid flow channel is distributed and enters each liquid cooling node 4, thereby allowing the coolant to enter each liquid cooling node 4 to absorb heat. In the liquid collector, the liquid in the liquid cooling node 4 is collected in the liquid flow channel for reflux, so that the coolant in each liquid cooling node 4 enters the heat exchange module 7 for heat exchange.

[0097] Furthermore, the first flow distribution unit 5 is provided with a quick connector that cooperates with the first connector 43. The first flow distribution unit 5 is connected to the first connector 43 for distributing and converging the first medium. One of the first connectors 43 of the liquid cooling node 4 is connected to the liquid inlet side of the first flow distribution unit 5, and the other first connector 43 is connected to the liquid outlet side of the first flow distribution unit 5, thereby forming a closed cooling circuit between the first flow distribution unit 5 and the sealed cabin 41; the second flow distribution unit 6 is provided with a quick connector that cooperates with the second connector 44. The second flow distribution unit 6 is connected to the second connector 44 for distributing and converging the second medium. One of the second connectors 44 of the liquid cooling node 4 is connected to the liquid inlet side of the second flow distribution unit 6, and the other second connector 44 is connected to the liquid outlet side of the second flow distribution unit 6, thereby forming a closed cooling circuit between the second flow distribution unit 6 and the cooling pipe 45 and the cooling component 42 inside the sealed cabin 41.

[0098] Among them, when the node adopts vertical plug-in and multiple frames 11 are provided in the cabinet body 1 (3 frames in the figure), the flow distribution unit can also be multiple sets accordingly (a first flow distribution unit 5 and a second flow distribution unit 6 are called a set), and each frame corresponds to a set, that is, each frame 11 is provided with a first flow distribution unit 5 and a second flow distribution unit 6, such as Figure 18 and Figure 19 shown.

[0099] Continue to refer Figure 16 and Figure 17 The first flow distribution unit 5 and the second flow distribution unit 6 can be installed on any side of the cabinet body 1, such as the front, rear, left, right, top or bottom. The first flow distribution unit 5 and the second flow distribution unit 6 can be installed on the same side of the cabinet body 1 to make the overall structure more compact; the first flow distribution unit 5 and the second flow distribution unit 6 can also be installed on different sides of the cabinet body 1 to make the layout of the overall structure more flexible.

[0100] like Figure 16 As shown, in one embodiment, the first flow distribution unit 5 and the second flow distribution unit 6 are installed on the rear side of the cabinet body 1. The first flow distribution unit 5 and the second flow distribution unit 6 can be fixed to the main structure at the rear of the cabinet body 1. This structure enables the two pairs of quick connectors (two first connectors 43 and two second connectors 44) in the liquid cooling node 4 to be installed in alignment with the two flow distribution units respectively. Specifically, the first flow distribution unit 5 can be directly opposite the first connector 43, thereby facilitating the first flow distribution unit 5 and the first connector 43 to be matched in a quick blind connection manner; similarly, the second flow distribution unit 6 can be directly opposite the second connector 44, thereby facilitating the second flow distribution unit 6 and the second connector 44 to be matched in a quick blind connection manner.

[0101] like Figure 17 As shown, in another embodiment, the first flow distribution unit 5 and the second flow distribution unit 6 are installed on any side of the cabinet body 1, such as the front, rear, left, right, top or bottom, and the two pairs of quick connectors in the liquid cooling node 4 are respectively connected to the two flow distribution units through a hose 8, so that the installation position of the flow distribution unit is not restricted, thereby improving the flexibility of the overall structure of the device.

[0102] In another embodiment, one of the first flow distribution unit 5 and the second flow distribution unit 6 is connected by a quick blind connection, while the other is connected by a hose. For example, the first connector 43 and the first flow distribution unit 5 are connected by a floating blind plug connection, and the second connector 44 and the second flow distribution unit 6 are connected by a hose; or the first connector 43 and the first flow distribution unit 5 are connected by a hose, and the second connector 44 and the second flow distribution unit 6 are connected by a floating blind plug connection.

[0103] The above description is merely a preferred embodiment of the present application and is not intended to limit the present application. Various modifications and variations are possible for those skilled in the art. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of the present application shall be included within the scope of protection of the present application.

Claims

1. A liquid cooling node, characterized in that: include: A sealed cabin body is filled with a first medium, wherein the first medium is a non-aqueous single-phase working medium; At least one cooling component is disposed in the sealed cabin, the cooling component is filled with a second medium, the at least one cooling component is a cold plate, and the second medium is water or a two-phase working medium; Two first connectors are provided on the side walls of the sealed cabin, and are used to connect the sealed cabin to form a first cooling passage. The two first connectors are quick blind plug connectors. Two second connectors are provided on the side wall of the sealed cabin and are used to connect the at least one cooling component to form a second cooling passage. The two second connectors are quick blind plug connectors.

2. The liquid cooling node according to claim 1, characterized in that: The sealed cabin has a heating element, the cooling component itself forms a closed structure, the cooling component is attached to the surface of the heating element, and a flow channel is provided inside the cooling component.

3. The liquid cooling node according to claim 1, characterized in that: The sealed cabin has a heating element, the cooling component is configured as a cavity-shaped structure with an opening on one side, the opening side of the cooling component is connected to the heating element, and the heating element closes the opening side of the cooling component to form a closed structure.

4. The liquid cooling node according to any one of claims 1 to 3, characterized in that: The liquid cooling node is a vertical plug-in node, and the two first connectors are arranged in a vertical direction.

5. The liquid cooling node according to any one of claims 1 to 4, characterized in that: The at least one cooling component comprises a plurality of cooling components, and the cooling components are interconnected.

6. The liquid cooling node according to any one of claims 1 to 5, characterized in that: A circuit board is provided in the sealed cabin, and a main chip and non-main chips are provided on the circuit board; The main chip contacts the cooling component, and at least a portion of the non-main chip is immersed in the first medium.

7. A liquid cooling cabinet, characterized in that: include: Cabinet body; The liquid cooling node according to any one of claims 1 to 6, wherein the number of the liquid cooling nodes is multiple and the liquid cooling nodes are detachably mounted on the cabinet body; a first flow distribution unit, configured to distribute a first medium to the plurality of liquid-cooling nodes, wherein one of the first connectors of the liquid-cooling node is connected to a liquid inlet side of the first flow distribution unit, and another of the first connectors is connected to a liquid outlet side of the first flow distribution unit; The second flow distribution unit is used to distribute the second medium to the multiple liquid cooling nodes, one of the second connectors of the liquid cooling node is connected to the liquid inlet side of the second flow distribution unit, and the other second connector is connected to the liquid outlet side of the second flow distribution unit.

8. The liquid cooling cabinet according to claim 7, characterized in that: The first flow distribution unit and the second flow distribution unit are arranged on the same side of the cabinet body.

9. The liquid cooling cabinet according to claim 7, characterized in that: The first flow distribution unit and the second flow distribution unit are arranged on different sides of the cabinet body.

10. The liquid cooling cabinet according to claim 9, characterized in that: The liquid-cooled heat dissipation cabinet includes a heat exchange module, which includes two heat exchange branches that are not connected to each other. The first flow distribution unit is connected to one of the heat exchange branches, and the second flow distribution unit is connected to the other heat exchange branch.

11. The liquid cooling cabinet according to claim 9, characterized in that: The liquid-cooling heat dissipation cabinet includes two heat exchange modules, the first flow distribution unit is connected to one of the heat exchange modules, and the second flow distribution unit is connected to the other heat exchange module.

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