LED packaging device

Abstract

The utility model discloses a light-emitting diode (LED) packaging device, which relates to the technical field of semiconductor devices, and comprises an LED support which comprises a base and an enclosure part arranged on the outer side of the base, the enclosure part is enclosed on the base to form an accommodating space, and an LED chip is arranged on the base in the accommodating space; the fluorescent packaging layer is formed by mixing fluorescent powder and silica gel, and the containing space is filled with the fluorescent packaging layer to cover the LED chips and the wires; wherein the LED chip comprises a blue light chip and an infrared light chip, the blue light chip and the infrared light chip are both arranged on the base and connected to the positive electrode pin and the negative electrode pin respectively, the blue light chip and the infrared light chip emit white light under dimming of the fluorescent packaging layer when emitting light at the same time, and the infrared light chip emits invisible infrared light. The problem that in the prior art, LED lamp beads only serve as backlight sources of liquid crystal display and only provide white light to excite the liquid crystal panel to be lightened, and signals cannot be effectively transmitted under the low-light condition is solved.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor devices, and in particular to an LED packaging device. Background Art

[0002] Existing technology primarily consists of an LED chip and a white plastic frame, combined with different phosphor combinations to meet varying color gamut requirements. A specific lens covers the top of the LED, allowing it to serve as a backlight for liquid crystal displays. This packaged device lacks infrared light emission, instead opting for a near-infrared spectrum invisible to the human eye. This wavelength of infrared light, due to its excellent penetrating properties, effectively transmits signals, especially in low-light conditions. It also exhibits high sensitivity for certain silicon-based sensors, leading to widespread applications in night vision and remote sensing technologies.

[0003] However, existing lamp beads only serve as backlight sources for liquid crystal displays, providing only white light to stimulate the liquid crystal panel to light up. They are unable to effectively transmit signals under low-light conditions, which is not conducive to the expanded application of lamp beads. Utility Model Content

[0004] In response to the shortcomings of the existing technology, the purpose of this utility model is to provide an LED packaging device, which aims to solve the problem in the existing technology that LED lamp beads are only used as backlight sources for liquid crystal displays, only provide white light to stimulate the liquid crystal panel to light up, and cannot effectively transmit signals under low light conditions.

[0005] In order to achieve the above purpose, the present invention adopts the following technical solutions:

[0006] An LED packaging device, comprising:

[0007] The LED bracket includes a base and a retaining portion provided on the outside of the base, wherein the retaining portion is enclosed on the base to form an accommodating space, and the LED chip is provided on the base in the accommodating space;

[0008] A positive electrode pin, to which the positive electrode of the LED chip is connected via wire bonding;

[0009] A cathode pin, to which the cathode of the LED chip is connected via wire bonding;

[0010] A fluorescent encapsulation layer is formed by mixing fluorescent powder and silica gel, and the fluorescent encapsulation layer is filled in the accommodating space to cover the LED chip and the wire;

[0011] Among them, the LED chip includes a blue light chip and an infrared light chip, the blue light chip and the infrared light chip are both arranged on the base and are respectively connected to the positive pin and the negative pin. When the blue light chip and the infrared light chip emit light at the same time, they emit white light under the dimming of the fluorescent packaging layer, and the infrared light chip emits invisible infrared light.

[0012] According to one aspect of the above technical solution, the blue light chips include two and the infrared light chip is one, and the two blue light chips are respectively arranged on both sides of the infrared light chip.

[0013] According to one aspect of the above technical solution, the positive pin includes a first positive pin, a second positive pin and a third positive pin, and the negative pin includes a first negative pin, a second negative pin and a third negative pin.

[0014] According to one aspect of the above technical solution, the two poles of the first blue light chip are respectively connected to the first positive pin and the first negative pin through wire bonding, the positive pole of the infrared light chip is connected to the base through conductive silver glue, the base is connected to the second positive pin through wire bonding to realize the connection between the positive pole of the infrared light chip and the second positive pin, the negative pole of the infrared light chip is connected to the second negative pin through wire bonding, and the two poles of the second blue light chip are respectively connected to the third positive pin and the third negative pin through wire bonding.

[0015] According to one aspect of the above technical solution, the first blue light chip, the infrared light chip and the second blue light chip are arranged on the base in the accommodating space at equal intervals.

[0016] According to one aspect of the above technical solution, the base is made of silver-plated copper.

[0017] According to one aspect of the above technical solution, the enclosure portion is formed by injection molding of plastic material.

[0018] According to one aspect of the above technical solution, the positive electrode pin and the negative electrode pin are symmetrically arranged on both sides of the LED chip.

[0019] According to one aspect of the above technical solution, the positive electrode pin and the negative electrode pin each include a bonding portion, a connecting portion and a pad portion connected in sequence;

[0020] The bonding portion is used to be bonded to the LED chip on the base within the accommodating space through a wire, the pad portion exposes the outside of the LED bracket for bonding to the circuit board, and the connecting portion is connected between the bonding portion and the pad portion.

[0021] According to one aspect of the above technical solution, the positive electrode pin and the negative electrode pin are both formed by stamping a conductive metal material.

[0022] Compared with the prior art, the packaged LED device shown in the present invention has the following beneficial effects:

[0023] By making the LED bracket include a base and a blocking portion, the blocking portion is enclosed on the base to form an accommodating space, and the LED chip is arranged on the base in the accommodating space. The LED chip includes a blue light chip and an infrared light chip. The blue light chip and the infrared light chip are both arranged on the base in the accommodating space and are respectively connected to the positive pin and the negative pin, and a fluorescent packaging glue which is mixed and solidified by phosphor and silica gel is provided in the accommodating space. Then, after emitting blue light, the blue light chip can emit white light through the dimming energy of the fluorescent packaging layer, and the invisible infrared light emitted by the infrared chip can pass through the fluorescent packaging layer to irradiate. Then, the LED packaging device can emit white light and invisible infrared light at the same time. In actual application, it has high sensitivity when matched with a specific silicon-based sensor, and can be applied to night vision technology and remote sensing technology, thereby solving the problem in the prior art that LED lamp beads are only used as backlight sources for liquid crystal displays, only provide white light to excite the liquid crystal panel to light up, and cannot effectively transmit signals under low light conditions. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] The above and / or additional aspects and advantages of the present invention will become apparent and readily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0025] Figure 1 This is a schematic top view of an LED package device shown in one embodiment of the present invention;

[0026] Figure 2 This is a side view schematic diagram of an LED package device shown in one embodiment of the present invention;

[0027] Description of Figure Numbers:

[0028] Base 11, enclosure 12, accommodating space 13, first positive electrode pin 21, bonding portion 211, connecting portion 212, pad portion 213, second positive electrode pin 22, third positive electrode pin 23, first negative electrode pin 31, second negative electrode pin 32, third negative electrode pin 33, first blue light chip 41, infrared light chip 42, second blue light chip 43, fluorescent packaging layer 50. DETAILED DESCRIPTION

[0029] To make the objectives, features, and advantages of the present invention more readily apparent, the following detailed description of specific embodiments of the present invention is provided in conjunction with the accompanying drawings. The accompanying drawings illustrate several embodiments of the present invention. However, the present invention can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a more thorough and comprehensive understanding of the present invention.

[0030] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the art to which this invention pertains. The terms used herein in the specification of this invention are intended only to describe specific embodiments and are not intended to limit the invention. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0031] Example 1

[0032] See also Figure 1-2 The first embodiment of the present invention provides an LED packaging device. In the LED packaging device shown in this embodiment, its LED bracket includes a base 11 and a blocking portion 12 arranged on the outside of the base 11. The base 11 is supported by silver-plated copper material, and the blocking portion 12 is formed by injection molding of PCT material. The blocking portion 12 made of PCT material has stronger high temperature resistance. By connecting the blocking portion 12 to the base 11, the blocking portion 12 is enclosed on the base 11 to form an accommodating space 13, that is, the bowl-cup structure of the LED packaging device is enclosed. The LED chip for emitting light is arranged on the base 11 in the accommodating space 13, so that light can be concentrated and guided through the specific shape of the blocking portion 12.

[0033] In this embodiment, in order to enable the LED package device to emit white light and infrared light, a blue light chip and an infrared light chip 42 are provided on the base 11 in the accommodating space 13. The positive poles of the blue light chip and the infrared light chip 42 are both connected to the positive pole of the LED package device, and the negative poles of the blue light chip and the infrared light chip 42 are both connected to the negative pole of the LED package device, thereby realizing the electrical connection between the blue light chip, the infrared light chip 42 and the positive pin and the negative pin, so that light can be emitted after power is turned on.

[0034] Among them, there are two blue light chips and one infrared light chip 42, and a polarization pin setting is adopted, that is, there are three positive pins, including a first positive pin 21, a second positive pin 22 and a third positive pin 23 respectively. Similarly, there are three negative pins, including a first negative pin 31, a second negative pin 32 and a third negative pin 33 respectively. The two blue light chips and one infrared light chip 42 are connected between the three positive pins and the three negative pins, and the first blue light chip 41, the infrared light chip 42 and the second blue light chip 43 are arranged at equal intervals on the base 11.

[0035] Specifically, two blue light chips and one infrared light chip 42 are arranged along a linear array. More specifically, the blue light chip includes a first blue light chip 41 and a second blue light chip 43. The first blue light chip 41 and the second blue light chip 43 are respectively arranged on both sides of the infrared light chip 42. The two ends of the first blue light chip 41 at the first end of the base 11 are respectively connected to the first positive electrode pin 21 and the first negative electrode pin 31 through wire bonding, wherein the wire is such as a gold wire or a silver wire. The infrared light chip 42 located between the first blue light chip 41 and the second blue light chip on the base 11 is a vertical structure. The negative electrode of the infrared light chip 42 is connected to the second negative electrode pin 32 through a wire. The positive electrode of the infrared light chip 42 is arranged on the opposite side of the negative electrode. The base 11 is fixed to the base 11 by conductive silver glue. The base 11 is made of silver-plated copper and has good conductivity. The positive electrode of the infrared light chip 42 is electrically connected to the base 11 through the conductive silver glue. The wire is bonded between the base 11 and the second negative electrode pin 32, thereby achieving an electrical connection between the positive electrode of the infrared light chip 42 and the second positive electrode pin 22. The two ends of the second blue light chip 43 provided on the second end of the base 11 are respectively connected to the third positive electrode pin 23 and the third negative electrode pin 33 by wire bonding. The first blue light chip 41, the infrared light chip 42, and the second blue light chip 43 are all directly or indirectly connected to the corresponding metal pins by wire bonding, so as to transmit current when powered on to drive the chips to operate.

[0036] Among them, since the first blue light chip 41, the infrared light chip 42 and the second blue light chip 43 are set with polarization pins, the first blue light chip 41, the infrared light chip 42 and the second blue light chip 43 can be controlled individually or in conjunction with each other. When the first blue light chip 41 and / or the second blue light chip 43 are driven individually, the LED package device can emit white light. When the infrared light chip 42 is driven individually, the LED package device can emit infrared light. When the first blue light chip 41 and / or the second blue light chip 43 and the infrared light chip 42 are driven at the same time, the LED package device is used to emit white light and infrared light.

[0037] In order to enable the LED packaged device to emit white light, a fluorescent packaging layer 50 is further provided in this embodiment. The fluorescent packaging layer 50 is formed by mixing fluorescent powder and silica gel, and is filled into the accommodating space 13 to cover the first blue light chip 41, the infrared light chip 42, the second blue light chip 43 and the wires bonded to them. After curing, the fluorescent packaging layer 50 is obtained. After the first blue light chip 41 and / or the second blue light chip 43 emits blue light, its blue light will emit white light after passing through the fluorescent packaging layer 50, so that the LED packaged device can emit white light of a specific color point, and the infrared light chip 42 emits invisible infrared light that can pass through the fluorescent packaging layer 50 and irradiate. Then, the LED packaged device can emit white light and invisible infrared light at the same time during use. In the back-end application, it can be applied to night vision technology and remote sensing technology by matching with specific silicon-based sensors.

[0038] It should also be noted that the positive pin and the negative pin are both stamped out of a conductive metal material, for example, a copper sheet is used to stamp the chip, and the positive pin and the negative pin are symmetrically arranged on both sides of the LED chip, that is, the first positive pin 21, the second positive pin 22, the third positive pin 23 and the first negative pin 31, the second negative pin 32 and the third negative pin 33 are symmetrical on both sides of the center line of the base 11 where the first blue light chip 41, the infrared light chip 42 and the second blue light chip 43 are located.

[0039] Since the structures of the first positive pin 21, the second positive pin 22, the third positive pin 23 and the first negative pin 31, the second negative pin 32 and the third negative pin 33 are consistent, the only difference is that there is a difference in the position on the base 11. Therefore, in this embodiment, the structure of all metal pins is explained using the first positive pin 21 as an example.

[0040] Specifically, the first positive pin 21 includes a bonding portion 211, a connecting portion 212 and a pad portion 213, wherein the bonding portion 211 is used to be bonded and connected to the positive electrode of the first blue light chip 41 on the base 11 in the accommodating space 13 through a wire, and the pad portion 213 exposes the outside of the LED bracket for bonding and connection with the circuit board, and the connecting portion 212 is connected between the bonding portion 211 and the pad portion 213, so that the positive electrode of the first blue light chip 41 can be connected to the circuit board through the first positive pin 21.

[0041] In summary, compared with the prior art, the LED packaging device shown in this embodiment has the following beneficial effects:

[0042] The LED bracket includes a base 11 and a blocking portion 12, and the blocking portion 12 is enclosed on the base 11 to form a accommodating space 13. The LED chip is arranged on the base 11 in the accommodating space 13. The LED chip includes a blue light chip and an infrared light chip 42. The blue light chip and the infrared light chip 42 are both arranged on the base 11 in the accommodating space 13 and are respectively connected to the positive pin and the negative pin. In addition, a fluorescent packaging glue which is mixed and solidified by phosphor and silica gel is provided in the accommodating space 13. Then, after emitting blue light, the blue light chip can emit white light through the dimming energy of the fluorescent packaging layer 50, and the invisible infrared light emitted by the infrared chip 42 can pass through the fluorescent packaging layer 50 and irradiate. Then, the LED package device can emit white light and invisible infrared light at the same time. In actual application, it has high sensitivity when matched with a specific silicon-based sensor, and can be applied to night vision technology and remote sensing technology, thereby solving the problem in the prior art that LED lamp beads are only used as a backlight source for liquid crystal display, only provide white light to excite the liquid crystal panel to light up, and cannot effectively transmit signals under low light conditions.

[0043] Throughout this specification, reference to terms such as "one embodiment," "some embodiments," "examples," "specific examples," or "some examples" means that the specific features, structures, materials, or characteristics described in conjunction with that embodiment or example are included in at least one embodiment or example of the present invention. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

[0044] The above-described embodiments merely represent several implementation methods of the present invention. While the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the present invention. It should be noted that a person skilled in the art would be able to make various modifications and improvements without departing from the concept of the present invention, and these modifications and improvements fall within the scope of protection of the present invention. Therefore, the scope of protection of the present invention shall be determined by the appended claims.

Claims

1. An LED package device, characterized in that: The device comprises: The LED bracket includes a base and a retaining portion provided on the outside of the base, wherein the retaining portion is enclosed on the base to form an accommodating space, and the LED chip is provided on the base in the accommodating space; A positive electrode pin, to which the positive electrode of the LED chip is connected via wire bonding; A cathode pin, to which the cathode of the LED chip is connected via wire bonding; A fluorescent encapsulation layer is formed by mixing fluorescent powder and silica gel, and the fluorescent encapsulation layer is filled in the accommodating space to cover the LED chip and the wire; Among them, the LED chip includes a blue light chip and an infrared light chip, the blue light chip and the infrared light chip are both arranged on the base and are respectively connected to the positive pin and the negative pin. When the blue light chip and the infrared light chip emit light at the same time, they emit white light under the dimming of the fluorescent packaging layer, and the infrared light chip emits invisible infrared light.

2. The LED package device according to claim 1, characterized in that: There are two blue light chips and one infrared light chip, and the two blue light chips are respectively arranged on both sides of the infrared light chip.

3. The LED package device according to claim 2, characterized in that: The positive pins include a first positive pin, a second positive pin and a third positive pin, and the negative pins include a first negative pin, a second negative pin and a third negative pin.

4. The LED package device according to claim 3, characterized in that: The two poles of the first blue light chip are respectively connected to the first positive pin and the first negative pin through wire bonding, the positive pole of the infrared light chip is connected to the base through conductive silver glue, the base is connected to the second positive pin through wire bonding to realize the connection between the positive pole of the infrared light chip and the second positive pin, the negative pole of the infrared light chip is connected to the second negative pin through wire bonding, and the two poles of the second blue light chip are respectively connected to the third positive pin and the third negative pin through wire bonding.

5. The LED package device according to claim 4, characterized in that: The first blue light chip, the infrared light chip and the second blue light chip are arranged on the base in the accommodating space at equal intervals.

6. The LED package device according to claim 1, wherein: The base is made of silver-plated copper.

7. The LED package device according to claim 6, characterized in that: The enclosure portion is formed by injection molding of plastic material.

8. The LED package device according to any one of claims 1 to 7, characterized in that: The positive electrode pin and the negative electrode pin are symmetrically arranged on both sides of the LED chip.

9. The LED package device according to claim 8, characterized in that: The positive electrode pin and the negative electrode pin each include a bonding portion, a connecting portion and a pad portion connected in sequence; The bonding portion is used to be bonded to the LED chip on the base within the accommodating space through a wire, the pad portion exposes the outside of the LED bracket for bonding to the circuit board, and the connecting portion is connected between the bonding portion and the pad portion.

10. The LED package device according to claim 9, characterized in that: The positive electrode pin and the negative electrode pin are both formed by stamping a conductive metal material.

Images