Movable waste collecting mechanism

By designing a movable waste collection mechanism, the use of driving cylinders and air pumps to automatically collect waste during wafer spraying, the problems of photoresist dripping and manual cleaning are solved, and the spraying efficiency and product quality are improved.

CN223209732UActive Publication Date: 2025-08-12ZHEJIANG YUQIAN SEMICON TECH CO LTD
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Patent Information

Application Number
CN202422101396.0
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-08-28
Publication Date
2025-08-12
Estimated Expiration
2034-08-28

AI Technical Summary

Technical Problem

During the existing wafer spraying process, photoresist is prone to dripping, causing product quality problems, and the waste in the spray head needs to be manually cleaned, affecting the spraying efficiency.

Method used

A movable waste collection mechanism is designed, including a carrier assembly and a collection assembly. The drive cylinder is used to drive the collection barrel to move to the bottom of the nozzle to collect waste, and automatic waste cleaning is achieved through the air pipe and the air pump to avoid dripping onto the processed objects.

Benefits of technology

Automatic waste collection is achieved, photoresist dripping affects product quality, and reduces the need for manual cleaning, improving spray efficiency and product quality.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model discloses a movable waste collecting mechanism. The movable waste collecting mechanism comprises a bearing assembly and a collecting assembly. The bearing assembly comprises a mounting plate, a bearing plate and an adjusting plate. The adjusting plate is vertically arranged on the bearing plate, and through holes with different heights are formed in the adjusting plate. The collecting assembly comprises a driving air cylinder, a collecting barrel, an adapter and an air pipe. The middle section of the air pipe passes through the adjusting plate and is movably arranged on the adjusting plate through a constraint piece. The driving air cylinder can drive the collecting barrel to move so that the collecting barrel can be located below the spray head, and therefore dropped leaked materials or redundant waste materials in the spray head can be collected and prevented from dropping to a machined object, and the quality is guaranteed. One end of the air pipe is connected with the adapter, and the other end of the air pipe is connected with an external air pump. Waste materials in the collecting barrel are sucked away in time through the air pump, the waste materials are prevented from being accumulated in the collecting barrel, meanwhile, manual replacement and cleaning are not needed, and more convenience and rapidness are achieved.
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Description

Technical Field

[0001] The utility model relates to the technical field of wafer conveying devices, in particular to a movable waste collection mechanism. Background Art

[0002] A wafer is a silicon wafer used to make silicon semiconductor circuits. The starting material is silicon. High-purity polycrystalline silicon is dissolved, doped with silicon seed crystals, and then slowly pulled out to form a cylindrical single crystal. The silicon ingot is then ground, polished, and sliced to form a silicon wafer.

[0003] When the wafer is being processed, it is necessary to evenly spray a layer of photoresist onto the surface of the wafer. Generally, the photoresist is dropped onto the surface of the wafer by a glue spraying device, and then the wafer is rotated by an external device. Under the action of the centrifugal force generated by the rotation and the surface tension of the photoresist, a photoresist film with uniform thickness is formed on the surface of the wafer. The glue spraying mechanism in the prior art is a wafer glue spraying mechanism based on chip processing disclosed in Patent No. CN202211212591.X. The wafer glue spraying mechanism based on chip processing is provided with a self-leveling glue spraying device, and then when the wafer is sprayed, the photoresist can be automatically leveled. At the same time, the photoresist sprayed on the wafer is defoamed, prompting the photoresist to be evenly filled on the wafer surface, further improving the spraying effect of the photoresist on the wafer. However, at the end of the spraying, sometimes the photoresist will leak and drip onto the wafer due to reasons such as reset speed or part accuracy, resulting in product quality problems. At the same time, the waste remaining in the nozzle needs to be discharged before each spraying to ensure the quality of the spraying. Therefore, a waste collection mechanism is required to collect the dripping and discharged waste in time without affecting the normal operation of the spraying. Utility Model Content

[0004] In view of this, the present invention provides a movable waste collection mechanism to solve the above technical problems.

[0005] A movable waste collection mechanism comprises a bearing assembly and a collection assembly disposed on the bearing assembly. The bearing assembly comprises a mounting plate, a bearing plate disposed on the mounting plate, and an adjustment plate disposed on the mounting plate. The adjustment plate is located on the bottom surface of the bearing plate, the adjustment plate is vertically disposed on the bearing plate, and the adjustment plate is provided with through holes of different heights. The collection assembly comprises a driving cylinder disposed on the bearing plate, a collection bucket disposed on the output end of the driving cylinder, an adapter disposed on the collection bucket, and an air pipe disposed on the adapter, wherein the middle section of the air pipe passes through the adjustment plate and is movably disposed on the adjustment plate by a restraining member.

[0006] Furthermore, the supporting assembly also includes two reinforcement strips arranged on the mounting plate and the supporting plate, and the two reinforcement strips are respectively located on both sides of the mounting plate and the supporting plate, one end of the reinforcement strip is connected to the mounting plate, and the other end is connected to the supporting plate.

[0007] Furthermore, the length of the carrying plate is equal to the length of the mounting plate, and the width of the carrying plate is greater than the width of the mounting plate.

[0008] Furthermore, the collecting bucket is hollow and has a connecting hole at the bottom for communicating with the adapter.

[0009] Furthermore, the restraining member is a plastic buckle.

[0010] Compared with the prior art, the movable waste collection mechanism provided by the present invention is used to drive the collection barrel to move back and forth through the driving cylinder. When the glue spraying is completed, the driving cylinder will drive the collection barrel to move so that the collection barrel is located below the nozzle in the glue spraying station, thereby collecting the leaked materials or excess waste in the nozzle to prevent them from dripping onto the processed objects, so as to ensure quality. One end of the air pipe is connected to the adapter, and the other end is connected to the external air pump. The waste in the collection barrel is sucked away in time by the air pump to avoid accumulation in the collection barrel. At the same time, manual replacement and cleaning are not required, which is more convenient and quick. Through holes of different heights are provided on the adjustment plate. The through holes are used to pass binding parts such as plastic cable ties to limit the middle section of the air pipe. The position of the air pipe can be limited to prevent the air pipe from sagging and affecting the normal processing of other stations. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] Figure 1 This is a structural schematic diagram of a movable waste collection mechanism provided by the utility model. DETAILED DESCRIPTION

[0012] The following is a further detailed description of specific embodiments of the present invention. It should be understood that the description of the embodiments of the present invention herein is not intended to limit the scope of protection of the present invention.

[0013] like Figure 1 , which is a schematic structural diagram of the movable waste collection mechanism provided by the present invention. The movable waste collection mechanism includes a carrier assembly 10 and a collection assembly 20 disposed on the carrier assembly 10. It is conceivable that the movable waste collection mechanism also includes other functional modules, such as a glue spraying device, a connecting assembly, etc., which are well known to those skilled in the art and will not be described in detail here.

[0014] The bearing assembly 10 includes a mounting plate 11 , a bearing plate 12 disposed on the mounting plate 11 , two reinforcing strips 13 disposed on the mounting plate 11 and the bearing plate 12 , and an adjusting plate 14 disposed on the mounting plate 11 .

[0015] The planes of the mounting plate 11 and the supporting plate 12 are perpendicular to each other. The mounting plate 11 is mounted on an external bracket via fasteners. The length of the supporting plate 12 is equal to that of the mounting plate 11, and the width of the supporting plate 12 is greater than that of the mounting plate 11, making the supporting plate 12 larger in area. Various items, such as materials used for gluing, can be placed on the large-area supporting plate 12. Two reinforcing bars 13 are located on either side of the mounting plate 11 and the supporting plate 12, respectively. One end of each reinforcing bar 13 is connected to the mounting plate 11, and the other end is connected to the supporting plate 12, forming a triangular structure with greater stability. The adjustment plate 14 is located on the bottom surface of the supporting plate 12 and is vertically mounted on the supporting plate 12. The adjustment plate 14 is provided with through-holes 15 at different heights. These through-holes 15 are used to insert restraints, such as plastic cable ties, to limit the position of the air pipe of the collection assembly 20, thereby preventing it from sagging and affecting the normal processing of other workstations.

[0016] The collecting assembly 20 includes a driving cylinder 21 disposed on the supporting plate 12 , a collecting barrel 22 disposed on the output end of the driving cylinder 21 , an adapter 23 disposed on the collecting barrel 22 , and an air pipe 24 disposed on the adapter 23 .

[0017] The driving cylinder 21 is used to drive the collection barrel 22 to move back and forth. When the glue spraying is completed, the driving cylinder 21 will drive the collection barrel 22 to move so that the collection barrel 22 is located below the nozzle in the glue spraying station, so that it can collect dripping leaked materials or excess waste in the nozzle to prevent dripping onto the processed object to ensure quality. The collection barrel 22 is hollow and has a connection hole at the bottom for connecting with the adapter 23. One end of the adapter 23 is connected to the collection barrel 22, and the other end is connected to the air pipe 24. One end of the air pipe 24 is connected to the adapter 23, and the other end is connected to an external air pump. The waste in the collection barrel 22 is sucked away in time by the air pump to prevent accumulation in the collection barrel 22. At the same time, it does not require manual replacement and cleaning, which is more convenient and quick.

[0018] The middle section of the air pipe 24 passes through the adjustment plate 14 and is flexibly mounted on the adjustment plate 14 by a restraining member, preventing the air pipe 24 from freely drooping and contacting other workstations. It is conceivable that, because the air pipe 24 is made of a flexible material, it will bend to a certain extent when the collection bucket 22 reciprocates under the action of the driving cylinder 21, which may easily cause the air pipe 24 to bend and block the ventilation channel. Therefore, when the restraining member restrains the air pipe 24, it does not need to be completely tied, so that the middle section of the air pipe 24 is flexibly mounted.

[0019] Compared with the prior art, the movable waste collection mechanism provided by the present invention is used to drive the collection barrel 22 to move back and forth through the driving cylinder 21. When the glue spraying is completed, the driving cylinder 21 will drive the collection barrel 22 to move so that the collection barrel 22 is located below the nozzle in the glue spraying station, thereby collecting dripping leaked materials or excess waste in the nozzle to prevent dripping onto the processed object to ensure quality. One end of the air pipe 24 is connected to the adapter 23, and the other end is connected to an external air pump. The air pump promptly sucks away the waste in the collection barrel 22 to prevent accumulation in the collection barrel 22. At the same time, it does not require manual replacement and cleaning, which is more convenient and quick. The adjustment plate 14 is provided with through holes 15 of different heights. The through holes 15 are used to pass binding parts such as plastic tie to limit the middle section of the air pipe 24. The position of the air pipe can be limited to prevent the air pipe from sagging and affecting the normal processing of other stations.

[0020] The above are only preferred embodiments of the present invention and are not intended to limit the scope of protection of the present invention. Any modifications, equivalent replacements or improvements within the spirit of the present invention are included in the scope of the claims of the present invention.

Claims

1. A movable waste collection mechanism, characterized in that: The movable waste collection mechanism includes a bearing assembly and a collecting assembly arranged on the bearing assembly, the bearing assembly includes a mounting plate, a bearing plate arranged on the mounting plate, and an adjusting plate arranged on the mounting plate, the adjusting plate is located on the bottom surface of the bearing plate, the adjusting plate is vertically arranged on the bearing plate, and the adjusting plate is provided with through holes of different heights, the collecting assembly includes a driving cylinder arranged on the bearing plate, a collecting bucket arranged on the output end of the driving cylinder, an adapter arranged on the collecting bucket, and an air pipe arranged on the adapter, the middle section of the air pipe passes through the adjusting plate and is movably arranged on the adjusting plate by a restraining member.

2. The movable waste collection mechanism according to claim 1, wherein: The bearing assembly also includes two reinforcement strips arranged on the mounting plate and the bearing plate, the two reinforcement strips are respectively located on both sides of the mounting plate and the bearing plate, one end of the reinforcement strip is connected to the mounting plate, and the other end is connected to the bearing plate.

3. The movable waste collection mechanism according to claim 1, wherein: The length of the carrying plate is equal to the length of the mounting plate, and the width of the carrying plate is greater than the width of the mounting plate.

4. The movable waste collection mechanism according to claim 1, wherein: The collecting bucket is hollow and has a connecting hole at the bottom for communicating with the adapter.

5. The movable waste collection mechanism according to claim 1, wherein: The restraining piece is a plastic buckle.

Citation Information

Patent Citations

  • Wafer glue spraying mechanism based on chip processing

    CN115445855A