Pressure measuring device and test sorting equipment

Abstract

The utility model relates to a pressure measuring device and test sorting equipment. The pressure measuring device comprises a supporting column; the base is arranged on the supporting column; the semiconductor chilling plate is arranged on the base and is provided with a cold surface and a hot surface; the pressure head is mounted at the end part of the supporting column in the lengthwise extension direction, and is spaced from the base; the first heat pipe comprises a first condensation end and a first evaporation end which are connected with each other, the first condensation end is arranged on the base and attached to the cold face, and the first evaporation end is attached to the pressing head; the end face, far away from the base, of the pressing head in the extending direction forms a crimping face used for being pressed on a product. Due to the fact that the first heat pipe conducts heat between the cold face of the semiconductor chilling plate and the pressing head, it is avoided that the semiconductor chilling plate is directly arranged on the pressing head, and more or larger semiconductor chilling plates can be arranged to meet the requirement for large refrigeration power.

Description

Technical Field

[0001] The utility model relates to the technical field of testing and sorting equipment, in particular to a pressure measuring device and testing and sorting equipment. Background Art

[0002] Before shipping, chips undergo performance testing, typically performed on test and sorting equipment. This equipment includes a pressure measuring device. Driven by a driver, the pressure measuring device's indenter moves toward the chip, pressing down on it to perform a pressure test. During the pressure test, a cooling unit is used to control the temperature of the indenter, thereby controlling the temperature of the chip.

[0003] In traditional technology, high-power refrigerant direct cooling refrigeration components are often used as cooling sources. They use an internal compressor to compress high-temperature refrigerant. After the temperature of the refrigerant increases significantly with the pressure, the refrigerant is first dissipated through the condenser, and then the refrigerant pressure is reduced through the throttling mechanism to quickly drop the refrigerant temperature. Finally, the low-temperature refrigerant is transported through the pipeline to the load evaporator to exchange heat with the pressure head, thereby achieving pressure head cooling. However, this type of refrigeration component is large in size, high in cost, has complex pipelines and a high failure rate, resulting in a large, high-cost and complex structure of the pressure measuring device. Some fields (such as medical and life sciences) also use TEC refrigeration chips for cooling, but the cooling power of TEC refrigeration chips is low. When the cooling area is small, the size of the TEC refrigeration chip is small and cannot meet the needs. Utility Model Content

[0004] Based on this, it is necessary to provide a pressure measuring device and a test and sorting device that can improve the above problems.

[0005] A pressure measuring device, comprising:

[0006] Support columns;

[0007] a base, provided on the support column;

[0008] A semiconductor refrigeration plate provided on the base has a cold surface and a hot surface;

[0009] A pressure head is installed at the end of the support column in the longitudinal extension direction and is spaced apart from the base;

[0010] A first heat pipe includes a first condensing end and a first evaporating end connected to each other, wherein the first condensing end is arranged on the base and in contact with the cold surface, and the first evaporating end is in contact with the pressure head;

[0011] The end surface of the pressing head away from the base in the extending direction forms a pressing surface for pressing on the product.

[0012] In one embodiment, in a circumferential direction surrounding the extension direction, the pressure measuring device includes at least one group of cooling fins and at least one group of first heat pipes, and the first heat pipes correspond to the cooling fins in a one-to-one manner;

[0013] Each group of the refrigeration fins includes at least one semiconductor refrigeration fin arranged in the extension direction, and each group of the first heat pipes includes at least one first heat pipe arranged in the surrounding direction. Each first heat pipe is in contact with the cold surfaces of all the semiconductor refrigeration fins of the corresponding refrigeration fin group.

[0014] In one embodiment, the base is sleeved outside the support column, and a heat-insulating gap is provided between the base and the outer surface of the support column; and / or

[0015] The pressure head includes a freezing head and a heater. The freezing head is mounted on the support column. The heater is disposed inside the freezing head. The pressing surface is formed on the freezing head.

[0016] In one embodiment, the pressure measuring device further includes a heat sink, and the heat sink is in contact with the hot surface of the semiconductor refrigeration plate.

[0017] In one embodiment, the pressure measuring device further includes a second heat pipe, the second heat pipe includes a second condensation end and a second evaporation end connected to each other, the second evaporation end is in contact with the hot surface, and the radiator is in contact with the second heat pipe.

[0018] In one embodiment, in a circumferential direction surrounding the extension direction, the pressure measuring device includes at least one group of cooling fins, at least one group of second heat pipes, and at least one radiator, and the second heat pipes, the cooling fins, and the radiator are in one-to-one correspondence;

[0019] Each group of the refrigeration fins includes at least one semiconductor refrigeration fin arranged in the extension direction, each group of the second heat pipe groups includes at least one second heat pipe arranged in the surrounding direction, each second heat pipe is in contact with the hot surfaces of all the semiconductor refrigeration fins of the corresponding refrigeration fin group, and each radiator is in contact with all the second heat pipes included in the corresponding second heat pipe group.

[0020] In one embodiment, the cross-sections of the base and the pressure head are both square, the four faces of the base and the pressure head correspond one to one, and each face is provided with a group of the cooling fins.

[0021] In one embodiment, in the extension direction, the radiator extends from the second condensation end to the second evaporation end of the second heat pipe, and the radiator is connected to various locations of the second heat pipe in the extension direction.

[0022] In one embodiment, in a circumferential direction surrounding the extension direction, all of the heat sinks are arranged in a ring shape around the support column and form a receiving space with the support column;

[0023] Part of the pressure head, the base, the semiconductor cooling plate and the first heat pipe are all arranged in the accommodation space, and the remaining part of the pressure head extends out of the accommodation space along the extension direction;

[0024] The pressure measuring device further comprises two end covers, which are respectively arranged at both ends of the radiator in the extension direction to close the accommodating space; and / or

[0025] The radiator is a liquid-cooled radiator, a flow channel is provided in the radiator, and a heat dissipation fin is provided in the flow channel near the hot surface.

[0026] A testing and sorting device comprises the pressure measuring device as described above.

[0027] The pressure measuring device and test and sorting equipment, the semiconductor refrigeration plate and the pressure head, etc. are all integrated on the support column, with a compact structure. On the one hand, it is equivalent to the high-power refrigerant direct cooling type refrigeration source in the prior art, and does not require the installation of components such as a compressor, condenser, throttling mechanism, evaporator, and the complex piping structure connecting the various components. The refrigeration components are small in size, low in cost, and have a low failure rate, which makes the pressure measuring device small in size, low in cost, and simplifies the structure of the pressure measuring device. On the other hand, when the pressure measuring device needs to test the product, the pressure can be directly transmitted to the pressure head through the support column, so that the pressure head can fit tightly with the product, ensuring the cooling effect of the refrigeration product. In addition, because the first heat pipe conducts heat between the cold surface of the semiconductor refrigeration plate and the pressure head, it avoids directly installing the semiconductor refrigeration plate on the pressure head, and more or larger-sized semiconductor refrigeration plates can be installed to meet the demand for higher cooling power. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Figure 1 An axonometric diagram of a pressure measuring device provided in one embodiment of the present application;

[0029] Figure 2 for Figure 1 An axonometric view of another perspective of the load cell shown in FIG.

[0030] Figure 3 for Figure 1 An axonometric view of the load cell shown in FIG.

[0031] Figure 4 for Figure 1 An exploded view of the pressure measuring device shown in ;

[0032] Figure 5 for Figure 1 A structural diagram of a partial structure of the pressure measuring device shown in ;

[0033] Figure 6 for Figure 5 Exploded view of the structure shown in;

[0034] Figure 7 for Figure 5 Another exploded view of the structure shown in;

[0035] Figure 8 for Figure 1 A cross-sectional view of the pressure measuring device shown in ;

[0036] Figure 9 for Figure 1 An exploded view of the heat sink of the pressure measuring device shown in FIG;

[0037] Figure 10 for Figure 9 The structural diagram of the radiator shown in;

[0038] Figure 11 for Figure 8 An enlarged view of point A of the pressure measuring device shown in FIG.

[0039] Description of reference numerals:

[0040] 100. Pressure measuring device; 10. Support column; 20. Base; 30. Semiconductor refrigeration plate; 31. Hot surface; 32. Cold surface; 40. Pressure head; 41. Freezing head; 42. Heater; 50. First heat pipe; 51. First condensing end; 52. First evaporating end; A. Refrigeration plate group; B. First heat pipe group; C. Second heat pipe group; 60. First assembly slot; 70. Radiator; 71. Second assembly slot; 72. Heat dissipation fin; 73. Flow channel; 80. Second heat pipe; 81. Second condensing end; 82. Second evaporating end; 90. Connector; 110. End cover; 120. Thermal insulation gap; 200. Chip. DETAILED DESCRIPTION

[0041] To make the above-mentioned objects, features, and advantages of the present invention more clearly understood, the following detailed description of specific embodiments of the present invention is provided in conjunction with the accompanying drawings. The following description sets forth many specific details to facilitate a full understanding of the present invention. However, the present invention can be implemented in many other ways than those described herein, and those skilled in the art may make similar modifications without departing from the scope of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed below.

[0042] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like to indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation to the present invention.

[0043] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being referred to. Thus, a feature specified as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of this utility model, "plurality" means at least two, such as two, three, etc., unless otherwise specifically defined.

[0044] In this utility model, unless otherwise specified or limited, the terms "installed," "connected," "connect," "fixed," etc. should be understood in a broad sense. For example, they can refer to fixed connection, detachable connection, or integration; mechanical connection, electrical connection; direct connection, or indirect connection through an intermediate medium; internal communication between two components, or interaction between two components, unless otherwise specified. Those skilled in the art will understand the specific meanings of the above terms in this utility model based on specific circumstances.

[0045] In the present invention, unless otherwise expressly specified or limited, when a first feature is "above" or "below" a second feature, it may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediary. Furthermore, when a first feature is "above," "above," or "above" a second feature, it may mean that the first feature is directly above or diagonally above the second feature, or simply means that the first feature is at a higher level than the second feature. When a first feature is "below," "below," or "below" a second feature, it may mean that the first feature is directly below or diagonally below the second feature, or simply means that the first feature is at a lower level than the second feature.

[0046] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may be an intermediate element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be an intermediate element. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only implementation methods.

[0047] See Figure 1-Figure 3 One embodiment of the present application provides a pressure measuring device 100 for pressure testing a product by crimping the device 100 onto the product. In some specific embodiments, the product tested by the pressure measuring device 100 is a chip 200 (IC). It is understood that in other embodiments, the type of product tested by the pressure measuring device 100 is not limited; for example, the product may be other types of electronic components.

[0048] The pressure measuring device 100 can not only perform pressure testing on the product, but also control the temperature of the product during the pressure testing. For example, in some embodiments, the pressure measuring device 100 can be combined with a heating device to control the chip temperature between -60°C and 175°C.

[0049] See Figure 4-Figure 6 The pressure measuring device 100 includes a support column 10, a base 20 and a semiconductor cooling plate 30. The support column 10 extends longitudinally ( Figure 6 (The X direction is the extension direction of the support column 10). The base 20 is provided on the support column 10. The semiconductor cooling chip 30 is provided on the base 20 and has a hot surface 31 and a cold surface 32. The semiconductor cooling chip 30, also known as a thermoelectric semiconductor cooling component or Peltier, refers to a thermally conductive patch with two sides: one absorbing heat and the other dissipating heat. The cold surface 32 is the heat absorbing surface, and the hot surface 31 is the heat dissipating surface.

[0050] See Figure 5-Figure 7The pressure measuring device 100 also includes a pressure head 40 and a first heat pipe 50. The pressure head 40 is installed at the end of the support column 10 in the extension direction and is spaced apart from the base 20. In this way, the heat of the semiconductor refrigeration plate 30 will not be conducted to the pressure head 40 through the base 20. The first heat pipe 50 includes a first condensation end 51 and a first evaporation end 52 that are connected to each other. The first condensation end 51 is provided on the base 20 and is in contact with the cold surface 32 of the semiconductor refrigeration plate 30, and the first evaporation end 52 is in contact with the pressure head 40. Among them, the heat pipe is a heat transfer element that relies on the phase change of its internal working liquid to achieve heat transfer. One end of the heat pipe is the evaporation end and the other end is the condensation end. When one end of the heat pipe is heated, the liquid in the capillary tube quickly vaporizes. The vapor flows to the other end under the power of heat diffusion and condenses at the condensation end to release heat. The liquid then flows back to the evaporation end along the porous material by capillary action. This cycle continues until the temperatures at both ends of the heat pipe are equal (at this time, the heat diffusion of the vapor stops). The pressure head 40 is made of a material with high thermal conductivity, which facilitates rapid heat conduction to the first heat pipe 50 .

[0051] Furthermore, the end face of the pressure head 40, which is away from the base 20 in the direction of extension of the support column 10, forms a pressing surface, through which the pressure measuring device 100 is pressed against the product to test the product. At the same time, heat is transferred between the pressure head 40 and the product, thereby cooling the product.

[0052] In the above arrangement, since the first condensing end 51 of the first heat pipe 50 is in contact with the cold surface 32 of the semiconductor cooling sheet 30, and the first evaporating end 52 is in contact with the pressure head 40, the first heat pipe 50 can connect the cold surface 32 of the semiconductor cooling sheet 30 with the pressure head 40 and conduct heat transfer, thereby achieving the effect of dissipating heat and cooling the pressure head 40. When the pressure head 40 is pressed against the product through the holding surface, the heat of the product is transferred to the pressure head 40, and the heat of the pressure head 40 is transferred to the first evaporating end 52 of the first heat pipe 50. When the first evaporating end 52 of the first heat pipe 50 is heated, the liquid in the capillary of the first heat pipe 50 rapidly vaporizes. Under the power of thermal diffusion, the vapor flows toward the first condensing end 51 and condenses at the first condensing end 51, releasing heat to the cold surface 32 of the semiconductor cooling sheet 30. The heat is then dissipated through the hot surface 31 of the semiconductor cooling sheet 30. At the same time, the liquid in the first heat pipe 50 flows back to the first evaporation end 52 along the porous material by capillary action, and the cycle continues until the temperatures at both ends of the first heat pipe 50 are equal, thereby completing the cooling operation of the product.

[0053] The pressure measuring device 100 provided in the embodiment of the present application has the semiconductor cooling plate 30 and the pressure head 40 integrated on the support column 10, resulting in a compact structure. On the one hand, it is equivalent to the high-power refrigerant direct cooling type refrigeration source in the prior art, and does not require the installation of components such as a compressor, condenser, throttling mechanism, evaporator, and the complex piping structure connecting these components. The refrigeration components are small in size, low in cost, and have a low failure rate, making the pressure measuring device 100 small in size, low in cost, and simplifying the structure of the pressure measuring device 100. On the other hand, when the pressure measuring device 100 needs to cool a product, the pressure can be directly transmitted to the pressure head 40 through the support column 10, so that the pressure head 40 can be closely fitted with the product, ensuring the cooling effect of the refrigeration product. In addition, because the first heat pipe 50 conducts heat between the cold surface 32 of the semiconductor cooling plate 30 and the pressure head 40, it avoids the need to directly install the semiconductor cooling plate 30 on the pressure head 40, and more or larger semiconductor cooling plates 30 can be installed to meet the demand for higher cooling power.

[0054] In some embodiments, the cross-sectional shape of the support column 10 is circular, in which case the extension direction is the axial direction of the support column 10, the base 20 is sleeved outside the support column 10, and the pressure head 40 is threadedly connected to one end of the longitudinal extension of the support column 10. This arrangement, on the one hand, facilitates the assembly of the base 20 and the pressure head 40 with the support column 10; on the other hand, it facilitates the replacement of the pressure head 40 when it is damaged. It is conceivable that in some other embodiments, the cross-sectional shape of the support column 10 is not limited, such as it can also be square or triangular. At the same time, there is no limitation on the assembly method of the base 20 and the pressure head 40 with the support column 10. For example, the base 20 is not sleeved outside the support column 10, but is directly installed on the outer surface of the support column 10, and the pressure head 40 is not fixed to the support column 10 by a threaded connection, such as the pressure head 40 is fixed to the support column 10 by a snap fastener.

[0055] Optionally, continue to Figure 6 The pressing head 40 includes a freezing head 41 and a heater 42. The freezing head 41 is mounted on the support column 10, and the heater 42 is disposed inside the freezing head 41. The pressing surface is formed on the freezing head 41. The heater 42 is capable of generating heat. By adjusting the output power of the heater 42, a thermal balance is formed with the heat dissipation of the freezing head 41, thereby achieving temperature control of the pressing head 40.

[0056] In some embodiments, in the circumferential direction ( Figure 6In the R direction, the pressure measuring device 100 includes at least one fin group A and at least one first heat pipe group B, with each first heat pipe group B corresponding to each fin group A. Each fin group A includes at least one semiconductor fin 30 arranged in the direction of extension of the support column 10, and each first heat pipe group B includes at least one first heat pipe 50 arranged in a circumferential direction, with the first heat pipe 50 extending along the direction of extension of the support column 10. Each first heat pipe 50 is in contact with the cold surface 32 of all semiconductor fins 30 in the corresponding fin group A. Specifically, when the cross-sectional shape of the support column 10 is circular, the circumferential direction is the circumference of the support column 10. Because the first heat pipe groups B correspond one-to-one with the fin groups A, and each first heat pipe 50 is in contact with the cold surface 32 of all semiconductor fins 30 in the corresponding fin group A, the first heat pipes 50 and the semiconductor fins 30 are arranged in a regular pattern, facilitating heat transfer between the semiconductor fins 30 and the pressure head 40.

[0057] Preferably, continue to refer to Figure 6 and Figure 7 The pressure measuring device 100 includes multiple cooling fin groups A and multiple first heat pipe groups B. Each cooling fin group A includes multiple semiconductor cooling fins 30 arranged along the extension direction of the support column 10, and each first heat pipe group B includes multiple first heat pipes 50 arranged in a circumferential direction. In this way, the first heat pipes 50 in the multiple first heat pipe groups B can direct the cooling energy of their corresponding multiple semiconductor cooling fins 30 to the pressure head 40, ensuring that the pressure head 40 has sufficient cooling energy to cool the product.

[0058] In some specific embodiments, the pressure measuring device 100 includes four cooling fin groups A and four first heat pipe groups B. Each cooling fin group A includes three semiconductor cooling fins 30, and each first heat pipe group B includes two first heat pipes 50. Thus, the entire pressure measuring device 100 includes 12 semiconductor cooling fins 30 and 8 first heat pipes 50. The eight first heat pipes 50 direct the cooling energy of the 12 semiconductor cooling fins 30 to the pressure head 40, ensuring sufficient cooling of the pressure head 40.

[0059] Preferably, the base 20 and the pressure head 40 are both square in cross-section. The four surfaces of the base 20 and pressure head 40 correspond one to one, with each surface correspondingly provided with a corresponding cooling fin assembly A. Thus, the four cooling fin assemblies A and the four first heat pipe assemblies B are respectively provided on the four surfaces of the base 20, and the four first heat pipe assemblies B are respectively attached to the four surfaces of the pressure head 40. This facilitates the installation and fixation of the first heat pipes 50 and the semiconductor cooling fins 30, while ensuring the compactness of the pressure measuring device 100.

[0060] It is worth noting that in some other specific embodiments, the pressure measuring device 100 may further include other numbers of refrigeration fin groups A and other numbers of first heat pipe groups B, such as the pressure measuring device 100 including three refrigeration fin groups A and three first heat pipe groups 50, or including five refrigeration fin groups A and five first heat pipe groups B. Furthermore, each refrigeration fin group A may include other numbers of semiconductor refrigeration fins 30, and each first heat pipe group B may include other numbers of first heat pipes 50, such as each refrigeration fin group A including four or five semiconductor refrigeration fins 30, and each first heat pipe group B including three or four first heat pipes 50.

[0061] It should be noted here that the shapes of the base 20 and the pressure head 40 can be changed accordingly according to the number of refrigeration fin groups A and the first heat pipe group B. For example, when there are 3 groups of refrigeration fin groups A and the first heat pipe group B, the cross-sectional shapes of the base 20 and the pressure head 40 are both triangular. When there are 5 groups of refrigeration fin groups A and the first heat pipe group B, the cross-sectional shapes of the base 20 and the pressure head 40 are both pentagonal.

[0062] Continue reading Figure 6 To further facilitate the installation and fixation of the first heat pipe 50 and the semiconductor cooling sheet 30, first mounting grooves 60 are recessed into the surfaces of the base 20 and the pressure head 40. The ends of the first heat pipe 50 are respectively positioned in the first mounting grooves 60 of the base 20 and the pressure head 40. The semiconductor cooling sheet 30 is attached to the portion of the base 20 not provided with the first mounting grooves 60. Furthermore, when the semiconductor cooling sheet 30 is attached to the surface of the base 20, it also aligns with the first condensing end 51 of the first heat pipe 50.

[0063] Continue reading Figure 3 and Figure 4 The pressure measuring device 100 further includes a heat sink 70, which is in contact with the hot surface 31 of the semiconductor cooling plate 30. During cooling, the heat sink 70 can cool the hot surface 31 of the semiconductor cooling plate 30 to reduce the temperature difference between the hot surface 31 and the cold surface 32, thereby preventing the temperature difference between the hot and cold surfaces 31 from being too large, causing heat to flow back from the hot surface 31 to the cold surface 32, thereby significantly reducing the cooling efficiency.

[0064] Optionally, see Figure 8 and Figure 9The radiator 70 is a liquid-cooled radiator 70, and a flow channel 73 is provided in the radiator 70. Heat dissipation fins 72 are provided in the flow channel 73 near the hot surface 31. The cooling medium can flow through the heat dissipation fins 72 when circulating in the flow channel 73. The provision of the heat dissipation fins 72 can increase the contact area between the cooling medium and the radiator 70, thereby ensuring the heat dissipation effect of the radiator 70 on the hot surface 31 of the semiconductor refrigeration plate 30. The pressure measuring device 100 includes a joint 90, which is connected to the radiator 70, and the internal channel in the joint 90 is connected to the flow channel 73. The external cooling medium can flow into the flow channel 73 through the internal channel of the joint 90, and then flow to the outside through the internal channel of the joint 90, so that the cooling medium circulates in the flow channel 73 to dissipate heat from the hot surface 31 of the semiconductor refrigeration plate 30.

[0065] Continue reading Figure 4 、 Figure 5 and Figure 7 The pressure measuring device 100 further includes a second heat pipe 80, which includes a second condensing end 81 and a second evaporating end 82 connected to each other. The second evaporating end 82 is in contact with the hot surface 31, and the heat sink 70 is in contact with the second heat pipe 80. That is, at least a portion of the heat sink 70 is in contact with the hot surface 31 of the semiconductor cooling chip 30 through the second heat pipe 80. The provision of the second heat pipe 80 facilitates the conduction of heat from the hot surface 31 of the semiconductor cooling chip 30 to the heat sink 70, where it is dissipated through the heat sink 70, thereby improving heat dissipation efficiency.

[0066] In some specific embodiments, the semiconductor cooling sheet 30 is sandwiched between the first heat pipe 50 and the second heat pipe 80. Figure 10 The heat sink 70 is provided with a second assembly groove 71, and the second heat pipe 80 is provided in the second assembly groove 71. The portion of the heat sink 70 provided with the second assembly groove 71 is in contact with the hot surface 31 of the semiconductor cooling plate 30 through the second heat pipe 80, and the portion without the second assembly groove 71 is directly in contact with the hot surface 31 of the semiconductor cooling plate 30, so that the heat of the hot surface 31 of the semiconductor cooling plate 30 is fully dissipated through the heat sink 70. In other specific embodiments, the portion of the heat sink 70 provided with the second assembly groove 71 can also be in contact with the hot surface 31 of the semiconductor cooling plate 30 through the second heat pipe 80, and the portion without the second assembly groove 71 is spaced apart from the hot surface 31 of the semiconductor cooling plate 30, which is not limited here.

[0067] Furthermore, the heat sink 70 extends from the second condensing end 81 of the second heat pipe 80 to the second evaporating end 82 in the extension direction of the support column 10, and the heat sink 70 is connected to various parts of the second heat pipe 80 in the extension direction. In this way, the second heat pipe 80 can transfer heat from the hot surface 31 to the area of the heat sink 70 that is not directly opposite the hot surface 31 of the semiconductor cooling plate 30, preventing heat from accumulating in the area where the heat sink 70 faces the hot surface 31, reducing the heat flux density on the hot surface 31, and improving the heat dissipation efficiency of the heat sink 70.

[0068] In the circumferential direction, the pressure measuring device 100 includes at least one second heat pipe group C, which corresponds one-to-one with the first heat pipe group B and the cooling fin group A. That is, the number of second heat pipe groups C is equal to and corresponds one-to-one with the number of first heat pipe groups B and the cooling fin group A. Furthermore, the number of radiators 70 is equal to and corresponds one-to-one with the number of second heat pipe groups C. Each second heat pipe group C includes at least one second heat pipe 80 arranged in the circumferential direction, extending along the extension direction of the support column 10. Each second heat pipe 80 is in contact with the hot surfaces 31 of all semiconductor cooling fins 30 of the corresponding cooling fin group A, and each radiator 70 is in contact with all second heat pipes 80 included in the corresponding second heat pipe group C. In this way, each second heat pipe group C directs heat from the hot surface 31 of the corresponding cooling fin group A to the corresponding radiator 70, ensuring effective heat dissipation.

[0069] It is conceivable that in some other embodiments, the refrigeration fin group A, the first heat pipe group B, the second heat pipe group C and the radiator 70 are not arranged in a one-to-one correspondence. For example, the refrigeration fin group A, the first heat pipe group B and the second heat pipe group C can be arranged in a one-to-one correspondence, while there is only one radiator 70, which is surrounded by the support column 10 in a ring shape.

[0070] In some specific embodiments, there are four cooling fin groups A, four first heat pipe groups B, and four second heat pipe groups C, and four heat sinks 70. The base 20 and the pressure head 40 have a square cross-sectional shape, specifically a square. The four cooling fin groups A, four first heat pipe groups B, four second heat pipe groups C, and four heat sinks 70 are arranged corresponding to the four sides of the square. Each cooling fin group A includes three semiconductor fins 30, each first heat pipe group B includes two first heat pipes 50, and each second heat pipe group C includes two second heat pipes 80. This ensures sufficient cooling capacity is transferred to the pressure head 40 while increasing the structural compactness of the pressure measuring device 100.

[0071] Of course, as described above, there are no restrictions on the number of fin groups A and first heat pipe groups B, the number of semiconductor fins 30 included in the fin group A, or the number of first heat pipes 50 included in the first heat pipe group B. Consequently, there are no restrictions on the number of second heat pipe groups C or the number of radiators 70. Furthermore, there is no restriction on the number of second heat pipes 80 included in the second heat pipe group C.

[0072] Specifically, see Figure 3 In the circumferential direction, all heat sinks 70 are arranged in a ring shape outside the support column 10, and form a storage space with the support column 10. Part of the pressure head 40, the base 20, the semiconductor cooling plate 30, the first heat pipe 50 and the second heat pipe 80 are all arranged in the storage space, and the remaining part of the pressure head 40 extends out of the storage space along the extension direction. The holding surface is formed on the part of the pressure head 40 that extends out of the storage space. Figure 2 and Figure 3 The pressure measuring device 100 also includes two end caps 110, which are positioned at either end of the heat sink 70 in the direction of extension to enclose the storage space. This arrangement isolates the semiconductor cooling fins 30, the first heat pipe 50, the second heat pipe 80, and the areas involved in heat exchange within the storage space from the external environment, preventing the impact of external airflow disturbances on the internal space and improving heat dissipation efficiency. Optionally, the internal heat pipes and areas involved in heat exchange can be silver-plated to reduce heat radiation from high-temperature areas to low-temperature areas, thereby improving cooling efficiency.

[0073] In some embodiments, see Figure 6 、 Figure 7 、 Figure 8 and Figure 11 The base 20 is sleeved outside the support column 10, and a thermal insulation gap 120 is defined between the base 20 and the outer surface of the support column 10 to reduce heat conduction between the base 20 and the support column 10, so that more cooling energy is transferred to the pressure head 40 through the first heat pipe 50. Optionally, the base 20 is made of a high thermal conductivity metal material. In this way, the base 20 can receive the cooling energy conducted by the cold surface 32 of the semiconductor cooling plate 30 and transfer it to the first condensing end 51 of the first heat pipe 50, thereby ensuring a high proportion of cooling energy transferred from the cold surface 32 to the pressure head 40.

[0074] It should be noted that, since there is a thermal insulation gap 120 between the base 20 and the outer surface of the support column 10, the base 20 is fixedly connected to the radiator 70, and the end cover 110 is connected to the radiator 70, and is sleeved and fixed on the support column 10. That is, the base 20 is indirectly connected to the support column 10 through the radiator 70 and the end cover 110. It should also be noted that the end of the support column 10 away from the pressure head 40 forms an operating end that passes through the end cover 110, so that the pressure measuring device 100 can be operated through the operating end to press the pressure head 40 onto the product, so that the pressure is transmitted to the pressure head 40 through the support column 10, thereby preventing the heat pipe and the radiator 70 from being damaged by force.

[0075] Another embodiment of the present application also provides a test and sorting device, including a feeding device, a receiving device, a conveying device and the above-mentioned pressure measuring device 100. The conveying device is used to convey the product provided by the feeding device to the pressure measuring position. The pressure measuring device 100 performs a pressure test on the product by pressing the pressure head down on the product located at the pressure measuring position. The conveying device can also convey the product tested by the pressure measuring device 100 to the receiving device for collection. Optionally, the test and sorting device is a three-temperature test and sorting device, which can control the product at low temperature, normal temperature and high temperature. Since the above-mentioned pressure measuring device 100 has beneficial effects, correspondingly, the test and sorting device including the above-mentioned pressure measuring device 100 has the same beneficial effects, which will not be described in detail here.

[0076] The technical features of the above-mentioned embodiments can be combined arbitrarily. In order to make the description concise, not all possible combinations of the technical features in the above-mentioned embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0077] The above-described embodiments merely represent several implementations of the present invention. While the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the utility model patent. It should be noted that a person skilled in the art would be able to make various modifications and improvements without departing from the concept of the present invention, and these modifications and improvements fall within the scope of protection of the present invention. Therefore, the scope of protection of the present utility model patent shall be determined by the appended claims.

Claims

1. A pressure measuring device, characterized in that: include: Support column (10); A base (20) is provided on the support column (10); A semiconductor refrigeration plate (30) provided on the base (20) has a cold surface (32) and a hot surface (31); A pressure head (40) is mounted on the end of the support column (10) in the longitudinal extension direction and is spaced apart from the base (20); A first heat pipe (50) comprises a first condensation end (51) and a first evaporation end (52) connected to each other, wherein the first condensation end (51) is arranged on the base (20) and abuts against the cold surface (32), and the first evaporation end (52) is abutted against the pressure head (40); The end surface of the pressing head (40) away from the base (20) in the extending direction forms a pressing surface for pressing on the product.

2. The pressure measuring device according to claim 1, characterized in that In a circumferential direction surrounding the extension direction, the pressure measuring device includes at least one group of refrigeration fin groups (A) and at least one group of first heat pipe groups (B), and the first heat pipe groups (B) correspond one to one to the refrigeration fin groups (A); Each group of the refrigeration fins (A) includes at least one semiconductor refrigeration fin (30) arranged in the extension direction, and each group of the first heat pipes (B) includes at least one first heat pipe (50) arranged in the circumferential direction, and each first heat pipe (50) is in contact with the cold surfaces (32) of all the semiconductor refrigeration fins (30) of the corresponding refrigeration fin group (A).

3. The pressure measuring device according to claim 1, characterized in that The base (20) is sleeved outside the support column (10), and a heat-insulating gap is provided between the base (20) and the outer surface of the support column (10); and / or The pressure head (40) includes a freezing head (41) and a heater (42), wherein the freezing head (41) is mounted on the support column (10), the heater (42) is arranged inside the freezing head (41), and the pressing surface is formed on the freezing head (41).

4. The pressure measuring device according to any one of claims 1 to 3, characterized in that: The pressure measuring device further comprises a radiator (70), and the radiator (70) is in contact with the hot surface (31) of the semiconductor cooling plate (30).

5. The pressure measuring device according to claim 4, characterized in that The pressure measuring device further comprises a second heat pipe (80), the second heat pipe (80) comprising a second condensation end (81) and a second evaporation end (82) connected to each other, the second evaporation end (82) being in contact with the hot surface (31), and the radiator (70) being in contact with the second heat pipe (80).

6. The pressure measuring device according to claim 5, characterized in that In a circumferential direction surrounding the extending direction, the pressure measuring device comprises at least one refrigeration fin group (A), at least one second heat pipe group (C), and at least one radiator (70), wherein the second heat pipe group (C), the refrigeration fin group (A), and the radiator (70) correspond to each other one by one; Each group of the refrigeration fins (A) includes at least one semiconductor refrigeration fin (30) arranged in the extension direction, and each group of the second heat pipe groups (C) includes at least one second heat pipe (80) arranged in the circumferential direction. Each second heat pipe (80) is in contact with the hot surfaces (31) of all the semiconductor refrigeration fins (30) of the corresponding refrigeration fin group (A), and each radiator (70) is in contact with all the second heat pipes (80) included in the corresponding second heat pipe group (C).

7. The pressure measuring device according to claim 6, characterized in that The cross-sectional shapes of the base (20) and the pressure head (40) are both square, the four faces of the base (20) and the pressure head (40) correspond to each other, and each face is provided with a group of the refrigeration fin group (A).

8. The pressure measuring device according to claim 5, characterized in that In the extension direction, the radiator (70) extends from the second condensation end (81) of the second heat pipe (80) to the second evaporation end (82), and the radiator (70) is connected to various locations of the second heat pipe (80) in the extension direction.

9. The pressure measuring device according to claim 4, characterized in that In a circumferential direction surrounding the extending direction, all of the heat sinks (70) are arranged in a ring shape around the outside of the support column (10) and form a receiving space with the support column (10); Part of the pressure head (40), the base (20), the semiconductor cooling plate (30) and the first heat pipe (50) are all arranged in the accommodation space, and the remaining part of the pressure head (40) extends out of the accommodation space along the extension direction; The pressure measuring device further comprises two end covers (110), which are respectively arranged at two ends of the radiator (70) in the extension direction to seal the accommodation space; and / or The radiator (70) is a liquid-cooled radiator (70), a flow channel (73) is provided in the radiator (70), and a heat dissipation fin (72) is provided in the flow channel (73) at a position close to the hot surface (31).

10. A test and sorting device, characterized in that: It includes a loading device, a receiving device, a conveying device and a pressure measuring device as described in any one of claims 1 to 9, the conveying device is used to convey the product provided by the loading device to the pressure measuring position, the pressure measuring device presses down the product located at the pressure measuring position through the pressure head, and the conveying device can also convey the product tested by the pressure measuring device to the receiving device for collection.

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