Loop heat pipe and electronic equipment
Through the closed loop design of the loop heat pipe and the capillary suction effect of the double-layer capillary layer, the problem of insufficient heat dissipation efficiency during the lightweighting of portable electronic devices is solved, and efficient heat transmission and heat dissipation are achieved.
Patent Information
- Application Number
- CN202422334144.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-24
- Publication Date
- 2025-08-12
- Estimated Expiration
- 2034-09-24
AI Technical Summary
In the process of lightweight and thinning, existing portable electronic devices have serious problems in heat dissipation, and the existing heat dissipation solutions are insufficient in efficiency.
The loop heat pipe design is adopted, and the sealing connection between the upper shell assembly and the lower shell assembly is used to form a closed circuit of the evaporator, steam pipe, condenser and liquid pipe. Combined with the capillary suction effect of the double-layer capillary layer, it overcomes gravity and pressure loss and improves the working fluid flow rate.
The gravity resistance of the loop heat pipe is enhanced, the working fluid flow rate is improved, and the heat dissipation efficiency is improved.
Smart Images
Figure CN223216746U_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the field of heat exchange, and in particular to a loop heat pipe and electronic equipment. Background Art
[0002] In the field of electronic device cooling, especially as portable devices like mobile phones, tablets, and laptops become increasingly lightweight and thin, the challenge of effectively dissipating heat within limited dimensions becomes increasingly serious. Existing electronic devices utilize bent heat pipes or vapor chambers in conjunction with fans as the mainstream cooling solution, which has achieved some cooling effectiveness. Summary of the Invention
[0003] The present application provides a loop heat pipe and an electronic device, which can improve the heat dissipation efficiency of the electronic device.
[0004] A loop heat pipe comprising:
[0005] An upper shell assembly comprises an upper shell and a first capillary layer connected to the inner surface of the upper shell, wherein the upper shell is provided with an upper etching structure;
[0006] A lower shell assembly comprises a lower shell and a second capillary layer connected to the inner surface of the lower shell, wherein the lower shell is provided with a lower etching structure;
[0007] In which, the upper shell assembly is sealed and connected to the lower shell assembly, and an evaporator, a steam pipe, a condenser and a liquid pipe are formed inside through the upper etching structure and the lower etching structure. The evaporator, steam pipe, condenser and liquid pipe are connected in sequence to form a closed loop, and the first capillary layer and the second capillary layer are arranged in the liquid pipe.
[0008] Optionally, the second capillary layer is provided in the evaporator, and the inner wall of the evaporator is further provided with a plurality of protruding support columns, which are distributed at intervals and support the second capillary layer, and the intervals between the plurality of support columns form a flow gap for the working medium to pass through.
[0009] Optionally, the first capillary layer and the second capillary layer are further provided in the steam pipe, and a flow gap for the working medium to pass through is further provided in the steam pipe.
[0010] Optionally, the first capillary layer and the second capillary layer are further provided in the condenser, and a flow gap for the working medium to pass through is further provided in the condenser.
[0011] Optionally, the first capillary layer and the second capillary layer are further provided in the liquid pipeline, and the liquid pipeline is further provided with an expansion gap to prevent condensed water from freezing and expanding the pipe.
[0012] Optionally, the loop heat pipe further includes a compensation cavity connecting the liquid pipeline and the evaporator, and the compensation cavity and the evaporator are separated by the first capillary layer and the second capillary layer.
[0013] Optionally, the loop heat pipe is provided with ventilation holes penetrating along the thickness direction.
[0014] Optionally, the first capillary layer and / or the second capillary layer is configured as a composite capillary layer composed of any one or more of a metal mesh capillary layer, an etched groove capillary layer, a metal powder sintered capillary layer, and a foam metal capillary layer, and the mesh number of the pores of the first capillary layer is smaller than the mesh number of the pores of the second capillary layer.
[0015] Optionally, the evaporator is provided with a plurality of working fluid outlets, the loop heat pipe is provided with a plurality of steam pipes, the working fluid outlets are connected to the steam pipes in a one-to-one correspondence, and the plurality of steam pipes are all connected to the condenser.
[0016] A portable electronic device comprises the loop heat pipe as described in any one of the above items.
[0017] Optionally, the portable electronic device includes a system module and a display module that can be folded or unfolded relative to each other, the system module includes a heat source and the loop heat pipe, and the loop heat pipe is thermally connected to the heat source.
[0018] The present application provides a loop heat pipe and electronic device, in which the first capillary layer and the second capillary layer in the liquid pipe can overcome gravity and pressure loss through the capillary suction of the double capillary layers, provide a driving force for the circulation of the working fluid, enhance the anti-gravity ability of the loop heat pipe, increase the circulation rate of the working fluid, and thereby improve the heat dissipation efficiency of the loop heat pipe. BRIEF DESCRIPTION OF THE DRAWINGS
[0019] Figure 1 is a front view of a loop heat pipe shown in an exemplary embodiment of the present application;
[0020] Figure 2 yes Figure 1 An exploded view of the loop heat pipe is shown in FIG;
[0021] Figure 3 is a schematic diagram of a closed circuit in a loop heat pipe;
[0022] Figure 4 It is a cross-sectional view of a part of the structure of the evaporator;
[0023] Figure 5 It is a schematic diagram of the inner wall of the evaporator provided with support columns;
[0024] Figure 6 yes Figure 5 Magnified view of site A in the middle;
[0025] Figure 7 It is a cross-sectional view of a liquid pipeline;
[0026] Figure 8 is a schematic diagram of a loop heat pipe;
[0027] Figure 9 is a schematic diagram of a portable electronic device shown in an exemplary embodiment of the present application;
[0028] Figure 10 4 is a flow chart of a manufacturing process of a loop heat pipe shown in an exemplary embodiment of the present application. DETAILED DESCRIPTION
[0029] Here, the technical solutions in the embodiments (or "implementations") of the present application will be clearly and completely described in conjunction with the accompanying drawings. When the following description refers to the drawings, unless otherwise indicated, the same numbers in different drawings represent the same or similar elements.
[0030] If there are terms related to directional indications or positional relationships in the embodiments of this application (such as up, down, left, right, front, back, inside, outside, top, bottom, center, vertical, horizontal, longitudinal, transverse, length, width, counterclockwise, clockwise, axial, radial, circumferential, etc.), such terms are only used to explain the relative positional relationship, movement, etc. between the components in a specific posture (as shown in the accompanying drawings); if the specific posture changes, the directional indication or positional relationship will also change accordingly. In addition, the terms "first" and "second" in the embodiments of this application are only used for the purpose of convenience of description and should not be understood as indicating or implying relative importance.
[0031] Please refer to Figure 1 , Figure 1 FIG. 1 is a front view of a loop heat pipe 100 according to an exemplary embodiment of the present application.
[0032] The present application provides a loop heat pipe 100, which is an ultra-thin flat-plate loop heat pipe. In one embodiment, the loop heat pipe 100 has a thickness of 0.1 mm to 5 mm, a width of 10 mm to 200 mm, and a length of 10 mm to 500 mm. The loop heat pipe 100 can be applied to portable electronic devices, including but not limited to laptops, mobile phones, and tablet computers. The loop heat pipe 100 can be used to achieve ultra-long-distance heat transmission, and is used to transport heat generated by a heat source, thereby improving the heat dissipation capacity of electronic devices.
[0033] exist Figure 1In the illustrated embodiment, the loop heat pipe 100 is provided with ventilation holes 101 extending through the thickness thereof. The loop heat pipe 100 can utilize the ventilation holes 101 in conjunction with a fan. For example, the fan can be installed at the ventilation holes 101 to accelerate heat dissipation. Two ventilation holes 101 can be provided, and two fans can be provided accordingly, but this is not a limitation.
[0034] Please refer to Figure 2 , Figure 2 yes Figure 1 An exploded view of the loop heat pipe 100 is shown in FIG.
[0035] The loop heat pipe 100 includes an upper shell assembly 10 and a lower shell assembly 20. The upper shell assembly 10 includes an upper shell 11 and a first capillary layer 12 connected to the inner surface of the upper shell 11. The upper shell 11 is provided with an upper etching structure (not shown in the figure).
[0036] The upper housing 11 can be made of materials including, but not limited to, copper alloy, stainless steel, aluminum, titanium, composites of these metals, and non-metallic materials. The first capillary layer 12 is a porous material, such as a metal mesh capillary layer, an etched groove capillary layer, a sintered metal powder capillary layer, a foamed metal capillary layer, or a composite capillary layer composed of a combination of these. The first capillary layer 12 can connect to the inner surface of the upper housing 11 through solid-phase diffusion.
[0037] The lower shell assembly 20 includes a lower shell 21 and a second capillary layer 22 connected to the inner surface of the lower shell 21, and the lower shell 21 is provided with a lower etching structure (not shown in the figure). The material of the lower shell 21 includes but is not limited to alloy copper, stainless steel, aluminum, titanium, composite materials of the above-mentioned multiple metal materials and non-metallic materials. The second capillary layer 22 is a porous material, for example, it can be any one of a metal mesh capillary layer, an etched groove capillary layer, a metal powder sintered capillary layer, and a foam metal capillary layer, or a composite capillary layer composed of multiple combinations. The second capillary layer 22 can be connected to the inner surface of the lower shell 21 through solid-phase diffusion.
[0038] Please refer to Figure 3 , Figure 3 Schematic diagram of a closed loop of the loop heat pipe 100 .
[0039] The upper shell assembly 10 is sealedly connected to the lower shell assembly 20. The upper and lower etched structures internally form an evaporator 102, a steam pipe 103, a condenser 104, and a liquid pipe 105. The evaporator 102, steam pipe 103, condenser 104, and liquid pipe 105 are sequentially connected to form a closed circuit. More specifically, the upper shell 11 and the lower shell 21 are sealedly connected, and connection methods include but are not limited to diffusion welding, brazing, resistance welding, ultrasonic welding, friction welding, and laser welding. The first capillary layer 12 and the second capillary layer 22 are disposed within the liquid pipe 105.
[0040] As can be seen from the above description, the loop heat pipe 100 can perform heat transfer. Specifically, the working fluid in the closed loop is heated and vaporized in the evaporator 102 before entering the condenser 104 via the steam pipe 103. As the gaseous working fluid passes through the condenser 104, it releases heat and converts into a liquid state. It can then re-enter the evaporator 102 through the liquid pipe 105 to begin the next working cycle. Furthermore, the first capillary layer 12 and the second capillary layer 22 in the liquid pipe 105 overcome gravity and pressure loss through the capillary suction of the double capillary layers, providing a driving force for the circulation of the working fluid, enhancing the anti-gravity capability of the loop heat pipe 100, and increasing the circulation rate of the working fluid, thereby improving the heat dissipation efficiency of the loop heat pipe 100.
[0041] Please refer to Figure 4 and Figure 5 , Figure 4 It is a cross-sectional view of a part of the structure of the evaporator 102 . Figure 5 Schematic diagram of supporting columns 1020 provided on the inner wall of the evaporator 102 .
[0042] In one embodiment, the second capillary layer 22 is provided in the evaporator 102, and the inner wall of the evaporator 102 is further provided with a plurality of protruding support columns 1020. The plurality of support columns 1020 are distributed at intervals and support the second capillary layer 22. The intervals reserved between the plurality of support columns 1020 form a flow gap for the working medium to flow through. With such an arrangement, the plurality of support columns 1020 can support the second capillary layer 22, ensuring that there is a certain flow gap in the evaporator 102. The capillary suction of the second capillary layer 22 can also provide a circulation driving force for the steam working medium in the evaporator 102. For example, the size of the steam channel in the evaporator 102 in the thickness direction of the loop heat pipe 100 can be set to 0.1 to 0.9 mm, specifically 0.1 mm, 0.3 mm, 0.5 mm, 0.7 mm, 0.9 mm, but is not limited thereto. The thickness of the second capillary layer 22 may be set to 0.03-0.6 mm, specifically 0.03 mm, 0.1 mm, 0.2 mm, 0.3 mm, 0.4 mm, 0.5 mm, or 0.6 mm, but is not limited thereto.
[0043] exist Figure 5 In the illustrated embodiment, a plurality of support columns 1020 are provided on the inner surface of the upper shell 11 where the first capillary layer 12 is not provided. The plurality of support columns 1020 are in contact with the second capillary layer 22 provided on the lower shell 21 to be supported on the second capillary layer 22 . Figure 5 The shaded area in the figure is where a plurality of support columns 1020 are provided.
[0044] Please refer to Figure 6 , Figure 6 for Figure 5 Magnified view of site A in center.
[0045] This application does not specifically limit the structure, number and arrangement of the support columns 1020. Figure 6 In the illustrated embodiment, the support column 1020 is a cylindrical structure, and a plurality of support columns 1020 are regularly arranged horizontally and vertically. The intervals between the plurality of support columns 1020 form flow gaps for the working medium to flow through.
[0046] Please refer to Figure 1 , the steam pipe 103 connects the evaporator 102 and the condenser 104. In one embodiment, the first capillary layer 12 and the second capillary layer 22 are also arranged in the steam pipe 103, and a circulation gap is provided for the working medium steam to flow through. In this way, the smooth circulation of the working medium steam can be guaranteed by setting the circulation gap. In addition, the double-layer capillary suction of the first capillary layer 12 and the second capillary layer 22 can overcome gravity and pressure loss, provide a stronger driving force for the circulation of the working medium steam, and further improve the circulation rate of the working medium steam. The thickness of the steam pipe 103 can be set to 0.1~0.9mm, the width can be set to 5~40mm, and the length is 50~120mm. The thickness of the first capillary layer 12 and the second capillary layer 22 can be set to 0.01~0.3mm.
[0047] In one embodiment, the first capillary layer 12 and the second capillary layer 22 are also arranged in the condenser 104 and are provided with a flow gap for the working medium to pass through. In this way, the smooth flow of the working medium can be ensured by setting the flow gap. In addition, the double-layer capillary suction of the first capillary layer 12 and the second capillary layer 22 can overcome gravity and pressure loss, provide a stronger driving force for the circulation of the working medium, and further improve the circulation rate of the working medium. For example, the width of the condenser 104 can be set to 30 to 60 mm, the length can be set to 10 to 50 mm, and the thickness of the first capillary layer 12 and the second capillary layer 22 can be set to 0.01 to 0.3 mm.
[0048] Please refer to Figure 7 , Figure 7It is a cross-sectional view of the liquid pipeline 105.
[0049] In one embodiment, the first capillary layer 12 and the second capillary layer 22 fill the liquid pipe 105, and the liquid pipe 105 is also provided with an expansion gap to prevent condensed water from freezing and expanding. The liquid pipe 105 circulates a liquid working medium. On the one hand, the double-layer capillary suction of the first capillary layer 12 and the second capillary layer 22 overcomes gravity and pressure loss, providing a stronger driving force for the circulation of the working medium. On the other hand, the reserved expansion gap can also prevent the condensed water from expanding after freezing, thereby improving the safety and reliability of the liquid pipe 105. For example, the liquid pipe has a width of 5 to 30 mm and a length of 50 to 120 mm. The thickness of the first capillary layer 12 and the second capillary layer 22 can be set to 0.05 to 1 mm, and an expansion space of 0.03 to 0.5 mm can be reserved between the first capillary layer 12 and the second capillary layer 22.
[0050] Please refer to Figure 8 , Figure 8 is another schematic diagram of the loop heat pipe 100 .
[0051] The loop heat pipe 100 also includes a compensation chamber 106 connecting the liquid pipe 105 and the evaporator 102. The compensation chamber 106 is separated from the evaporator 102 by the first capillary layer 12 and the second capillary layer 22. With this arrangement, the portion of the compensation chamber 106 connecting to the evaporator 102 is filled with the first capillary layer 12 and the second capillary layer 22. The first capillary layer 12 and the second capillary layer 22 are stacked. The capillary suction of the first capillary layer 12 and the second capillary layer 22 allows liquid working medium to flow from the compensation chamber 106 to the evaporator 102, but also prevents gas working medium from flowing from the evaporator 102 to the compensation chamber 106, thereby preventing backflow of vapor working medium.
[0052] In one embodiment, the mesh size of the pores of the first capillary layer 12 can be set to be smaller than the mesh size of the pores of the second capillary layer 22. For example, the first capillary layer 12 can be a 250-mesh or 300-mesh capillary layer. The smaller mesh size of the first capillary layer 12 can ensure the unidirectional flow of the liquid working medium.
[0053] In one embodiment, Figure 1 As shown, the evaporator 102 is provided with multiple working medium outlets, and the loop heat pipe 100 is provided with multiple steam pipes 103. The working medium outlets are connected to the steam pipes 103 in a one-to-one correspondence, and the multiple steam pipes 103 are all connected to the condenser. In this way, multiple steam pipes 103 can be connected in parallel, thereby increasing heat dissipation efficiency.
[0054] In a specific embodiment, the total thickness of the loop heat pipe 100 is 0.6 mm, the upper shell 11 and the lower shell 21 can be made of C5191 tin-phosphor bronze, the thickness of the upper shell 11 is 0.4±0.01, the etching depth is 0.34 mm, the thickness of the lower shell 21 is 0.15±0.01, the etching depth is 0.09 mm, the solder paste thickness is 0.03 mm, the first capillary layer 12 is made of a composite copper mesh with a thickness of 0.2 to 0.3 mm, and the second capillary layer 22 is made of a 250-300 mesh copper mesh with a thickness of 0.06 to 0.66 mm.
[0055] Please refer to Figure 9 , Figure 9 FIG. 2 is a schematic diagram of a portable electronic device 200 according to an exemplary embodiment of the present application.
[0056] The present application further provides a portable electronic device 200 , which includes but is not limited to a portable notebook computer, a mobile phone, a tablet computer, etc. The portable electronic device includes a loop heat pipe 100 .
[0057] The portable electronic device 200 includes a system module 201 and a display module 202 that can be folded or unfolded relative to each other. The system module 201 includes a heat source and a loop heat pipe ( Figure 8 (not shown), the loop heat pipe 100 is thermally connected to the heat source. The heat source can be the motherboard of the system module 201. Specifically, the lower shell assembly 20 can be in contact with the heat source, and the lower shell 21 has no support column, which improves the heat transfer effect.
[0058] In a specific embodiment, the total thickness of the loop heat pipe 100 is 0.6 mm, which can occupy a relatively small space inside the electronic device.
[0059] In one embodiment, the portable electronic device may further include a fan, which can accelerate air flow, thereby accelerating heat dissipation. The fan may be disposed corresponding to the ventilation holes 101 of the loop heat pipe 100 .
[0060] Please refer to Figure 10 , Figure 10 FIG. 1 is a flow chart of a manufacturing process of the loop heat pipe 100 .
[0061] This application briefly introduces the manufacturing process of the loop heat pipe 100 by way of example. It should be noted that the manufacturing process is not unique and there are multiple manufacturing processes to choose from.
[0062] 1. Make the copper tube connected to the working fluid injection port: cut the copper tube → clean the copper tube.
[0063] 2. Make the upper cover assembly: etch the upper shell → pre-weld the upper shell and the first capillary layer (copper mesh) → sinter the upper shell and the first capillary layer at high temperature → press out a semicircular groove at the working fluid injection port.
[0064] 3. Make the lower cover assembly: Etch the lower shell → Pre-weld the lower shell and the first capillary layer (copper mesh) → Sinter the lower shell and the second capillary layer at high temperature → Press out a semicircular groove at the working fluid injection port
[0065] 4. Connect the upper cover assembly and the lower cover assembly: apply solder paste between the upper cover assembly and the lower cover assembly → braze in a high-temperature furnace → high-frequency wave welding the upper cover assembly, lower cover assembly and copper tube.
[0066] 5. Post-processing: Blowing test for leakage → baking → annealing → injecting working fluid → vacuuming → removing impurity gases in the closed circuit → flatness shaping → aging → appearance and size inspection → using helium to detect leakage → heat dissipation performance test → full inspection → packaging.
[0067] The above description is only a preferred embodiment of the present application and is not intended to limit the present application. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present application shall be included in the scope of protection of the present application.
Claims
1. A loop heat pipe, characterized in that: include: An upper shell assembly (10) comprises an upper shell (11) and a first capillary layer (12) connected to the inner surface of the upper shell (11), wherein the upper shell is provided with an upper etching structure; A lower shell assembly (20) comprises a lower shell (21) and a second capillary layer (22) connected to the inner surface of the lower shell (21), wherein the lower shell is provided with a lower etching structure; The upper shell component (10) is sealedly connected to the lower shell component (20); an evaporator (102), a steam pipe (103), a condenser (104) and a liquid pipe (105) are formed inside the upper etching structure and the lower etching structure; the evaporator (102), the steam pipe (103), the condenser (104) and the liquid pipe (105) are connected in sequence to form a closed loop; the first capillary layer (12) and the second capillary layer (22) are arranged in the liquid pipe (105).
2. The loop heat pipe according to claim 1, characterized in that The second capillary layer (22) is arranged in the evaporator (102), and the inner wall of the evaporator (102) is further provided with a plurality of protruding support columns (1020). The plurality of support columns (1020) are distributed at intervals and support the second capillary layer (22), and the intervals between the plurality of support columns (1020) form a flow gap for the working medium to pass through.
3. The loop heat pipe according to claim 1, characterized in that The first capillary layer (12) and the second capillary layer (22) are also arranged in the steam pipe (103), and a flow gap for the working medium to pass through is also provided in the steam pipe (103).
4. The loop heat pipe according to claim 1, wherein: The first capillary layer (12) and the second capillary layer (22) are also provided in the condenser (104), and a flow gap for the working medium to pass through is also provided in the condenser (104).
5. The loop heat pipe according to claim 1, characterized in that The first capillary layer (12) and the second capillary layer (22) are also provided in the liquid pipeline (105), and the liquid pipeline (105) is also provided with an expansion gap to prevent the condensed water from freezing and expanding the pipe.
6. The loop heat pipe according to any one of claims 1 to 5, characterized in that: The loop heat pipe (100) further comprises a compensation cavity (106) connecting the liquid pipe (105) and the evaporator (102), wherein the compensation cavity (106) and the evaporator (102) are separated by the first capillary layer (12) and the second capillary layer (22).
7. The loop heat pipe according to any one of claims 1 to 5, characterized in that: The loop heat pipe (100) is provided with ventilation holes (101) penetrating along the thickness direction.
8. The loop heat pipe according to any one of claims 1 to 5, characterized in that: The first capillary layer (12) and / or the second capillary layer (22) are configured as composite capillary layers formed by combining any one or more of a metal mesh capillary layer, an etched groove capillary layer, a metal powder sintered capillary layer, and a foam metal capillary layer, and the mesh number of the pores of the first capillary layer (12) is smaller than the mesh number of the pores of the second capillary layer (22).
9. The loop heat pipe according to any one of claims 1 to 5, characterized in that: The evaporator (102) is provided with a plurality of working medium outlets, the loop heat pipe (100) is provided with a plurality of steam pipes (103), the working medium outlets are connected to the steam pipes (103) in a one-to-one correspondence, and the plurality of steam pipes (103) are all connected to the condenser (104).
10. An electronic device, characterized in that: The invention comprises a loop heat pipe (100) according to any one of claims 1 to 9.
11. The electronic device according to claim 10, characterized in that The electronic device comprises a system module and a display module that can be relatively folded or unfolded, the system module comprises a heat source and the loop heat pipe (100), and the loop heat pipe (100) is thermally conductive with the heat source.