Wafer position detection assembly and wafer carrier lifting transmission equipment

Abstract

The utility model discloses a wafer position detection assembly and wafer carrier lifting transmission equipment, and relates to the technical field of semiconductor equipment, the wafer position detection assembly comprises at least one detection unit, the detection unit comprises a transmitting terminal, a receiving terminal and a reflection piece; the detection unit is arranged in the Z-axis direction, and the transmitting end and the receiving end are located on the same side; the reflecting part is arranged opposite to the transmitting end in the Z-axis direction, the reflecting part is provided with a reflecting area, the transmitting end is movably arranged on the top wall of the cavity in the X-axis direction, and the projection of the moving track of the transmitting end in the Z-axis direction is in the reflecting area; the reflecting piece reflects the laser beam emitted by the transmitting end at any position point on the moving track, and the receiving end receives the reflected laser beam; and when the laser beam emitted by the emitting end intersects with the wafer in the wafer box, the signal of the receiving end is weakened. According to the utility model, at least the problem that the reflecting piece is correspondingly moved to a corresponding position while the laser emitting piece needs to be moved can be solved.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor equipment, and in particular to a wafer position detection component and a wafer carrier lifting and transmission device. Background Art

[0002] Wafer position detection sensors optically detect incorrectly placed wafers. Wafers that slip out of the carrier are detected by a laser emitter at the top of the chamber, which shines a beam back onto a reflective mirror at the bottom. If a wafer begins to slip out of the wafer carrier during operation of the wafer carrier's vacuum transfer mechanism, it will intersect with the laser beam, causing the return light intensity to decrease. Once the set threshold is reached, an alarm is triggered to stop the lift axis movement.

[0003] In the prior art, when inspecting wafers of different sizes, it is necessary to move the laser emitter and the reflector simultaneously, which makes the operation process rather complicated.

[0004] Therefore, it is necessary to provide a new wafer position detection component and a wafer carrier lifting and transmission device to solve the above-mentioned problems existing in the prior art. Utility Model Content

[0005] The purpose of the present invention is to provide a wafer position detection component and a wafer carrier lifting and transmission device, which can at least solve the problem in the prior art of needing to move the laser emitting component and the reflecting component to the corresponding position at the same time.

[0006] To achieve the above purpose, the technical solution of the utility model is as follows:

[0007] A wafer position detection component is applied to a wafer carrier lifting and transporting device, wherein the wafer carrier lifting and transporting device includes a cavity with an internal accommodation space for placing a wafer box, wherein a plurality of wafers are placed in the wafer box, and wherein the wafer position detection component includes:

[0008] At least one detection unit, the detection unit comprising a transmitting end, a receiving end and a reflecting element;

[0009] The detection unit is arranged along the Z-axis direction, and the transmitting end and the receiving end are located on the same side;

[0010] The reflector is arranged opposite to the emitting end along the Z-axis direction, and the reflector has a reflection area. The emitting end is movably arranged on the top wall of the cavity along the X-axis, and the projection of the moving trajectory of the emitting end in the Z-axis direction is within the reflection area;

[0011] Among them, the reflector reflects the laser beam emitted by the transmitting end at any position point on the moving track, and the receiving end receives the reflected laser beam; when the laser beam emitted by the transmitting end intersects with the wafer in the wafer box, the signal of the receiving end is weakened.

[0012] By adopting the above technical solution, during the operation, the transmitting end, the receiving end and the reflector cooperate to detect the position of the wafer in the wafer box along the Z-axis direction. During the detection process, the reflector remains stationary, the transmitting end moves, and the laser from the transmitting end is irradiated to the reflector and received by the receiving end; when the wafer slides out of the wafer box, the laser passes through the wafer, and the intensity of the reflected laser is weakened. When it reaches the set threshold, an alarm will be issued to stop the movement of the wafer box.

[0013] Optionally, a bracket is further included, one side of the bracket is fixedly disposed on the cavity, and the other side is fixed to the reflector;

[0014] The bracket is provided with a detection hole corresponding to the position of the reflection area, and the laser beam passes through the detection hole and is emitted to the reflection area.

[0015] By adopting the above technical solution, the reflector is fixed on the bottom wall of the cavity through the bracket, and a detection hole is opened on the bracket to facilitate laser irradiation to the reflective area.

[0016] Optionally, the bracket includes a mounting plate and an abutment block, the abutment block is fixedly arranged at an end portion of the mounting plate, and the abutment block is arranged on an end surface of the mounting plate away from the reflector.

[0017] By adopting the above technical solution, the abutting block is fixed to the bottom wall of the wall, thereby fixing the position of the mounting plate and fixing the position of the reflector.

[0018] Optionally, two abutment blocks are provided, and the detection hole is provided between the two abutment blocks.

[0019] By adopting the above technical solution, the two abutment blocks are provided to enhance the overall stability of the bracket, and the detection hole is provided between the two abutment blocks, which will not interfere with the detection process.

[0020] Optionally, the reflector is in the shape of an elongated strip, and the length direction of the reflector is the same as the moving direction of the emitting end.

[0021] By adopting the above technical solution, the length direction of the reflector is the same as the moving direction of the transmitter, so that when the transmitter moves, the laser beam can always be irradiated on the reflector, which facilitates the wafer inspection process.

[0022] A wafer position detection component is applied to a wafer carrier lifting and transporting device. The wafer carrier lifting and transporting device has a cavity for placing a wafer box. The wafer box can be raised and lowered along the Z-axis direction. A plurality of wafers are placed in the wafer box. The wafer position detection component includes:

[0023] At least one detection unit, the detection unit comprising a transmitting end and a receiving end;

[0024] The detection unit is arranged along the X-axis direction, and the transmitting end and the receiving end are arranged opposite to each other along the X-axis direction;

[0025] The wafer box moves along the Z-axis direction, and passes through the laser beam between the transmitting end and the receiving end which are relatively arranged along the X-axis direction. The receiving end receives the laser beam from the transmitting end to determine the position and status of the wafer.

[0026] By adopting the above technical solution, the detection unit is set along the X-axis direction, wherein the transmitting end and the receiving end cooperate to detect the status of the wafers on the wafer box and determine whether there are overlapped, tilted, missing wafers, etc. in the wafer box.

[0027] Optionally, the transmitting end and the receiving end are distributed on both sides of the wafer box along the X-axis direction;

[0028] In the working state, the wafer box passes through the laser beam between the transmitting end and the receiving end during the lifting process. The transmitting end continuously emits the laser beam, and the receiving end records the number and time of blocking of the laser beam to determine the position and status of the wafer.

[0029] By adopting the above technical solution, during the lifting process of the wafer box, the laser beam passes between the transmitting end and the receiving end to determine the position and status of the wafer.

[0030] A wafer position detection component is applied to a wafer carrier lifting and transporting device. The wafer carrier lifting and transporting device has a cavity for placing a wafer box. A plurality of wafers are placed in the wafer box. The wafer position detection component includes:

[0031] at least one of a detection unit arranged along the Z-axis direction and a detection unit arranged along the X-axis direction, each of the detection units including a transmitting end and a receiving end;

[0032] in,

[0033] When the detection unit is arranged along the Z-axis direction, it further includes a reflector, the transmitting end and the receiving end are located on the same side, the reflector is arranged opposite to the transmitting end along the Z-axis direction, the reflector has a reflection area, the transmitting end is movably arranged on the top wall of the cavity along the X-axis direction, the projection of the movement trajectory of the transmitting end in the Z-axis direction is within the reflection area, the reflector reflects the laser beam emitted by the transmitting end at any position on the movement trajectory, the receiving end receives and receives the reflected laser beam, and when the laser beam emitted by the transmitting end intersects with the wafer in the wafer box, the signal of the receiving end is weakened;

[0034] When the detection unit is arranged along the X-axis direction, the wafer box can be raised and lowered along the Z-axis direction, and the transmitting end and the receiving end are arranged opposite to each other along the X-axis direction; the wafer box moves along the Z-axis direction, and the laser beam passes between the transmitting end and the receiving end arranged opposite to each other along the X-axis direction. The receiving end receives the laser beam from the transmitting end to determine the position and status of the wafer.

[0035] By adopting the above technical solution, a suitable detection method can be selected according to actual conditions. It is possible to set up a detection unit only for detection along the Z-axis direction, or to set up a detection unit only for detection along the X-axis direction, or to set up detection units along both the X-axis direction and the Z-axis direction.

[0036] A wafer carrier lifting and transporting device, characterized by comprising a cavity, a wafer box, a lifting assembly and a wafer position detection assembly;

[0037] The wafer box is arranged inside the cavity;

[0038] A portion of the lifting assembly is disposed outside the cavity, and another portion extends into the cavity to connect to the wafer box and drive the wafer box to move up and down along the Z-axis direction;

[0039] In the working state, the lifting assembly drives the wafer box to move, and the detection unit performs protrusion detection on the wafers in the wafer box in the Z-axis direction; or, the lifting assembly drives the wafer box to move along the Z-axis direction, and the detection unit performs position and status detection on the wafers in the wafer box in the X-axis direction; or, one of the detection units performs protrusion detection on the wafers in the wafer box in the Z-axis direction, and the other detection unit performs position and status detection on the wafers in the wafer box in the X-axis direction.

[0040] By adopting the above technical solution, the lifting assembly drives the wafer box to move in the cavity. After the movement is completed or during the movement, the detection unit detects the position and status of the wafer to determine whether there is any wafer sliding out of the wafer box or whether there is any overlap or missing wafer.

[0041] Optionally, the lifting assembly includes:

[0042] A support frame, fixedly arranged on the bottom wall of the cavity;

[0043] A screw rod is rotatably arranged on the support frame, and a connecting piece is movably arranged on the screw rod, and the connecting piece moves along the axial direction of the screw rod;

[0044] A carrying unit, one end of which is fixedly arranged on the wafer box, and the other end of which is fixedly arranged on the connecting member;

[0045] In a working state, the lead screw rotates to cause the connecting member to move along the axial direction of the lead screw, thereby driving the carrying unit and the wafer box to move.

[0046] By adopting the above technical solution, the screw rotates, and the connecting part moves along the axial direction of the screw, while pushing the carrying unit to move. Since the carrying unit is connected to the wafer box, the wafer box can be driven to move by rotating the screw, which facilitates the movement process of the wafer box.

[0047] The beneficial effects of the wafer position detection assembly and wafer carrier lifting and transmission equipment provided by the present invention include at least:

[0048] 1. The shape of the reflector has been improved. During the wafer inspection process, or when inspecting wafers of different sizes, only the position of the laser emitter needs to be adjusted, without adjusting the position of the reflector, making the operation process convenient.

[0049] 2. The detection unit can detect the position and status of the wafers on the wafer box, and determine whether there are overlapping, skewed, or missing wafers in the wafer box. BRIEF DESCRIPTION OF THE DRAWINGS

[0050] Figure 1 This is a schematic diagram of the main structure of an embodiment of the utility model;

[0051] Figure 2 This is a schematic diagram of the positions of the laser emitting element and the reflecting element in an embodiment of the utility model;

[0052] Figure 3 This is a schematic diagram of the connection between the reflector and the bracket according to an embodiment of the present utility model;

[0053] Figure 4 This is a schematic diagram of the lifting assembly structure of an embodiment of the present utility model.

[0054] Reference numerals:

[0055] 100, cavity; 200, wafer box; 310, first emitting element; 320, first receiving element; 400, reflecting element; 410, reflecting area; 500, bracket; 510, detection hole; 520, mounting plate; 530, abutment block; 600, lifting assembly; 610, support frame; 611, bottom plate; 612, support plate; 613, fixing member; 620, screw rod; 621, nut; 622, connecting member; 630, bearing unit; 631, sleeve; 632, support plate; 633, bellows; 640, driving assembly; 641, driven wheel; 642, driving wheel; 643, driving motor; 644, transmission belt; 651, second emitting element; 652, second receiving element; 660, track; 661, slider; 670, support seat; 700, lifting door. DETAILED DESCRIPTION

[0056] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments in the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention. Unless otherwise defined, the technical terms or scientific terms used herein should be the common meanings understood by people with ordinary skills in the field to which the present invention belongs. The words "including" and similar words used in this article mean that the elements or objects appearing before the word include the elements or objects listed after the word and their equivalents, without excluding other elements or objects.

[0057] The specific implementation of the present invention will be further described in detail below with reference to the accompanying drawings.

[0058] Reference Figure 1 、 Figure 2 and Figure 3 . An embodiment of the utility model provides a wafer position detection component, which is used to be installed in a wafer carrier lifting and transporting device, wherein the wafer carrier lifting and transporting device includes a cavity 100, and the interior of the cavity 100 has a receiving space, and the receiving space is used to place a wafer box 200, and a plurality of wafers are placed in the wafer box 200. During use, wafers are placed in the wafer box 200, and the wafer box 200 can move in the receiving space of the cavity 100 along the height direction of the cavity 100. At the same time, one of the side walls of the cavity 100 is opened to facilitate the wafer box 200 to enter the receiving space or move away from the receiving space from the opening.

[0059] In order to better describe the present invention, a spatial rectangular coordinate system is established in the following embodiments, including an X-axis, a Y-axis and a Z-axis; the X-axis represents the front and rear positions in the horizontal direction in space, specifically in this embodiment, it is the direction of the opening opened on the side wall of the cavity 100; the Y-axis represents the left and right positions in the horizontal direction in space, specifically in this embodiment, it is the direction perpendicular to the X-axis on the horizontal plane; the Z-axis represents the up and down positions in the vertical direction in space, specifically in this embodiment, it is the movement direction of the wafer box 200 in the accommodation space.

[0060] The wafer position detection assembly detects whether the wafer in the wafer box 200 is protruding; the wafer position detection assembly includes at least one detection unit, which can be arranged along the Z-axis direction in the cavity 100, or, arranged along the X-axis direction or the Y-axis direction in the cavity 100, or two detection units are arranged in the cavity 100, one of which is arranged along the Z-axis direction in the cavity 100, and the other is arranged along the X-axis direction or the Y-axis direction in the cavity 100; here, the case where the detection unit is arranged along the Z-axis direction is first described;

[0061] When the detection unit is set along the Z-axis direction, the detection unit includes a transmitting end, a receiving end and a reflecting element 400; for the sake of convenience, the transmitting end when the detection unit is set in the Z-axis direction is named the first transmitting element 310, and the receiving end is named the first receiving element 320; wherein the first transmitting element 310 and the first receiving element 320 are located on the same side, and the reflecting element 400 and the first transmitting element 310 are symmetrically arranged along the Z-axis direction. The first transmitting element 310 emits a laser beam, which is reflected by the reflecting element 400 and then received by the first receiving element 320, wherein the first transmitting element 310 is a laser transmitter, and the laser beam of the laser transmitter is reflected by the reflecting element 400 and then received by the first receiving element 320; in addition, the reflecting element 400 has a reflecting area 410, and the reflecting area 410 is a long strip. The reflector 400 is fixedly arranged on the bottom wall of the wall, and the first emitting element 310 is movably arranged on the top wall of the cavity 100 along the X-axis. At the same time, the projection of the moving trajectory of the first emitting element 310 in the Z-axis direction is within the reflection area 410. During operation, the position of the reflector 400 does not change, the first emitting element 310 moves, and the reflector 400 reflects the laser beam emitted by the first emitting element 310 at any position point on the moving trajectory. The first receiving element 320 receives the reflected laser beam. When the laser beam emitted by the first emitting element 310 intersects with the wafer in the wafer box 200, the signal of the first receiving element 320 is weakened, and it can be determined that the wafer slides to the outside of the wafer box 200 and is in a protruding state in the wafer box 200.

[0062] The reflector 400 is fixed to the bottom wall of the cavity 100, and the fixing method thereof can be bonding, clamping or bolting, etc. In the present embodiment, the reflector 400 is fixed to the bottom wall of the cavity 100 by bolting, that is, the projections of the first emitting element 310 and the reflector 400 in the vertical direction coincide with each other. In the present embodiment, the reflector 400 is a reflective plate, which can reflect the laser. In addition, one or two reflectors 400 can be provided as needed. When one reflector 400 is provided, the length of the reflector 400 is greater than the length of the wafer box 200; when two reflectors 400 are provided, the two reflectors 400 are distributed on both sides of the wafer box 200; and the reflector 400 is in the shape of an elongated strip, which effectively increases the reflection area, and can reflect wafers of different sizes. During the inspection, the first emitting element 310 emits a laser and shines it towards the wafer box 200. At the same time, the first emitting element 310 slides on the top wall of the cavity 100 and changes its position. During this process, the laser is kept irradiated, and the laser returns after irradiating the reflector 400. Since the length of the reflector 400 is greater than the length of the wafer box 200, the reflector 400 does not need to be moved when the position of the first emitting element 310 is moved. When the wafer protrudes from the wafer box 200, it will intersect with the laser beam, causing the returned light intensity to become weaker. When the set threshold is reached, an alarm will be sounded to stop the movement of the lifting axis, thereby completing the inspection of the wafers in the wafer box 200. In addition, when inspecting wafers of different sizes, it is only necessary to adjust the position of the first emitting element 310, and there is no need to adjust the position of the reflector 400.

[0063] In order to facilitate fixing the reflector 400 on the bottom wall of the cavity 100, refer to Figure 1 、 Figure 2 and Figure 3, the bottom wall of the cavity 100 is fixed with a bracket 500, which can be fixed by bonding, welding or bolting. In this embodiment, the bracket 500 is fixed to the bottom wall of the cavity 100 by bolting. The bracket 500 has a mounting plate 520 and two abutment blocks 530. The two abutment blocks 530 are fixed to the end surface of the mounting plate 520 by an integral molding method. During use, the reflector 400 is fixed to the mounting plate 520, and the abutment blocks 530 are fixed to the bottom wall of the cavity 100, thereby fixing the reflector 400 to the bottom wall of the cavity 100; at the same time, the reflector 400 is fixed to the bottom wall of the cavity 100; 00 is in the shape of a long strip, and the length direction of the reflector 400 is the same as the moving direction of the first emitting element 310, which is convenient for receiving the laser beam emitted by the emitting end. The reflective area 410 on the reflector 400 is convenient for reflecting the laser emitted by the first emitting element 310. A detection hole 510 is opened on the mounting plate 520 of the bracket 500. The detection hole 510 penetrates the mounting plate 520 along the thickness direction of the mounting plate 520, and the detection hole 510 is located corresponding to the position of the reflective area 410. The laser of the laser emitter can pass through the detection hole 510 to irradiate the reflective area 410, which is convenient for detecting the wafers in the wafer box 200.

[0064] The wafer position detection component can also detect the wafer in the horizontal direction, refer to Figure 1 、 Figure 2 and Figure 3When the detection unit is set along the X-axis direction, the detection unit includes a transmitting end and a receiving end. For the sake of distinction, the transmitting end when the detection unit is set along the X-axis direction is named the second transmitting element 651, and the receiving end is named the second receiving element 652; the second transmitting element 651 is selected as a laser transmitter. When the detection unit is set along the X-axis direction, the second transmitting element 651 and the second receiving element 652 are set opposite to each other along the X-axis direction, that is, the second transmitting element 651 and the second receiving element 652 are respectively placed on both sides of the wafer box 200; in the actual detection process, the wafer box 200 moves along the Z-axis direction inside the cavity 100. During the movement, the laser beam passes between the second transmitting element 651 and the second receiving element 652 which are set opposite to each other along the X-axis. During this process, the second transmitting element 651 continuously emits the laser beam, and the second receiving element 652 receives the laser beam. beam, and records the number and time of the laser beam being blocked, so as to judge the position and status of the wafer; specifically in this embodiment, the second emitting element 651 and the second receiving element 652 are fixedly arranged on the inner wall of the cavity 100, and the fixing method can be selected from clamping, bonding or bolting, etc. In this embodiment, it is preferred that the second emitting element 651 and the second receiving element 652 are fixedly arranged on the opposite side walls of the cavity 100 along the X-axis by bolting, so that the wafer box 200 can drive the wafer to move between the second emitting element 651 and the second receiving element 652 during the movement; in addition, the detection unit can also be set along the Y-axis direction. When the detection unit is set along the Y-axis direction, its setting method is the same as that along the X-axis. In the actual installation process, the detection unit can be selected to be set along the X-axis or along the Y-axis according to the actual situation.

[0065] When two detection units are provided inside the cavity 100, one detection unit is provided along the Z axis and the other detection unit is provided along the X axis, wherein each detection unit includes a transmitting end and a receiving end; wherein, when the detection unit is provided along the Z axis, the first transmitting element 310 and the first receiving element 320 are located on the same side, and the reflecting element 400 is provided symmetrically with the transmitting element along the Z axis. The first transmitting element 310 transmits a laser beam, which is reflected by the reflecting element 400 and then received by the first receiving element 320, wherein the first transmitting element 310 The laser emitter is a laser emitter. The laser beam of the laser emitter is reflected by the reflector 400 and then received by the first receiving element 320. In addition, the reflector 400 has a reflection area 410. The reflection area 410 is in the shape of a long strip. The reflector 400 is fixedly arranged on the bottom wall of the wall. At the same time, the first emitting element 310 is movably arranged on the top wall of the cavity 100 along the X axis. At the same time, the projection of the moving trajectory of the first emitting element 310 in the Z axis direction is within the reflection area 410. During operation, the position of the reflector 400 does not change. The first emitting element 310 The reflector 400 reflects the laser beam emitted by the first emitting element 310 at any position on the moving track, and the first receiving element 320 receives the reflected laser beam. When the laser beam emitted by the first emitting element 310 intersects with the wafer in the wafer box 200, the signal of the first receiving element 320 is weakened, and it can be determined that the wafer slides to the outside of the wafer box 200 and is in a protruding state in the wafer box 200. When the detection unit is set along the X-axis direction, the second emitting element 651 and the second receiving element 652 are arranged along the X-axis direction. The second emitting element 651 and the second receiving element 652 are arranged relative to each other, that is, they are placed on both sides of the wafer box 200 respectively; in the actual detection process, the wafer box 200 moves along the Z-axis direction inside the cavity 100. During the movement, the laser beam passes between the second emitting element 651 and the second receiving element 652 which are arranged relatively to each other along the X-axis. During this process, the second emitting element 651 continuously emits the laser beam, and the second receiving element 652 receives the laser beam and records the number of times and time when the laser beam is blocked, so as to judge the position and status of the wafer.

[0066] The embodiment of the present invention also provides a wafer carrier lifting and transporting device, referring to Figure 1 、 Figure 2 and Figure 4The wafer carrier lifting and transferring device includes a chamber 100, a wafer box 200, a lifting assembly 600 and a wafer position detection assembly. In this embodiment, the chamber 100 is selected as a vacuum chamber, wherein the wafer box 200 is movably arranged inside the chamber 100 and can move along the Z-axis direction inside the chamber 100. A detection unit can be set in the chamber 100 along the Z-axis direction, or a detection unit can be set along the X-axis direction, or detection units can be set in both the Z-axis direction and the X-axis direction. In this embodiment, detection units are set in both the Z-axis direction and the X-axis direction. In the detection unit, the first emitting element 310 and the first receiving element 320 can be movably set on the top wall of the cavity 100; the reflecting element 400 is fixedly set on the bottom wall of the cavity 100, and the first emitting element 310 cooperates with the reflecting element 400 to detect whether the wafer protrudes from the wafer box 200; in the detection unit arranged along the X-axis, the second emitting element 651 and the second receiving element 652 are both fixedly set on the inner wall of the cavity 100, and the second emitting element 651 and the second receiving element 652 are relatively set along the X-axis direction, placed on both sides of the wafer box 200, and fixed to the inner wall of the cavity 100 by bolts.

[0067] In order to facilitate the movement of the wafer box 200, refer to Figure 1 、 Figure 2 and Figure 3 The lifting assembly 600 is arranged outside the cavity 100 and connected to the wafer box 200. The lifting assembly 600 is used to drive the wafer box 200 to move. The first emitting element 310 cooperates with the reflecting element 400 and the first receiving element 320 to form a reflective sensor; the second emitting element 651 and the second receiving element 652 cooperate to form a through-beam sensor; it detects whether the position of the wafer is offset after the movement of the wafer box 200; wherein the lifting assembly 600 includes a support frame 610, the support frame 610 is fixed to the bottom wall of the cavity 100, that is, the support frame 610 is stationary relative to the cavity 100, and a screw rod 620 is rotatably provided on the support frame 610, and a connecting member 622 is movably provided on the screw rod 620, In this embodiment, the connecting member 622 is threadedly connected to the screw rod 620. Specifically, a nut 621 is provided on the screw rod 620, and the nut 621 is threadedly connected to the screw rod 620. The connecting member 622 is fixed to the nut 621 by a rigid connection. Therefore, the connecting line is threadedly connected to the screw rod 620, and the connecting member 622 can move along the axial direction of the screw rod 620. At the same time, a carrying unit 630 is provided on the connecting member 622, and the carrying unit 630 is fixed to the wafer box 200. During operation, the screw rod 620 is controlled to rotate, driving the connecting member 622 to move axially along the screw rod 620, thereby driving the carrying unit 630 to move, and the movement of the carrying unit 630 drives the wafer box 200 to move synchronously.

[0068] During the rotation of the screw rod 620, it is necessary to ensure that the connecting member 622 can move along the axial direction of the screw rod 620. Figure 1 、 Figure 2 and Figure 4 The support frame 610 includes a bottom plate 611, a support plate 612 and a fixing member 613. The bottom plate 611 and the fixing member 613 are respectively arranged at both ends of the support plate 612, wherein the bottom plate 611 is fixedly arranged on the end of the support plate 612 away from the cavity 100 by an integral molding method, and the fixing member 613 is fixedly arranged on the end of the support plate 612 close to the cavity 100 by a bolt fixing method. In addition, the fixing member 613 is fixedly arranged on the bottom wall of the cavity 100 by a bolt fixing method, so that the support frame 610 is fixed to the bottom wall of the cavity 100. In this embodiment, the fixing member 613 is selected as a flange, that is, the fixing member 613 has a through hole in the middle, the screw rod 620 is passed through the bottom plate 611, and is rotatably connected to the bottom plate 611. Specifically, a support seat 670 is fixed on the bottom plate 611 by bolts, and the screw rod 620 is rotatably set in the support seat 670, so that the screw rod 620 is rotatably set on the bottom plate 611. The axial direction of the screw rod 620 is parallel to the length direction of the support plate 612. The bearing unit 630 is movably set in the through hole of the fixing member 613, so that the screw rod 620 is rotated. Drive the fixing member 613 to move in the through hole of the fixing member 613; wherein, a track 660 is fixedly provided on the support plate 612 of the support frame 610, and the fixing method thereof can be bonding, welding or bolt fixing, etc. In this embodiment, the track 660 is preferably fixed to the support plate 612 by bolt fixing, and the length direction of the track 660 is parallel to the axial direction of the screw rod 620. The connecting member 622 is connected to the track 660 and can slide on the track 660 along the length direction of the track 660. The track 660 acts on the connecting member 622. Limiting function, specifically, a slider 661 is slidably provided on the track 660, and the connecting block is fixed to the slider 661, so the connecting block is slidably provided on the track 660. In the working state, since the connecting member 622 is threadedly connected to the screw rod 620, and the track 660 and the connecting member 622 act as fibers, the screw rod 620 rotates. Under the restriction of the track 660, the connecting member 622 moves along the axial direction of the screw rod 620, thereby driving the carrying unit 630 to move in the fixing member 613. The movement of the carrying unit 630 drives the wafer box 200 to move at the same time.

[0069] In order to facilitate the fixing of the carrying unit 630 to the connecting member 622 and the wafer box 200 at the same time, Figure 1 、 Figure 2 and Figure 4The carrying unit 630 includes a sleeve 631 and a support plate 632. The support plate 632 is fixed to one end of the sleeve 631 by an integral molding method. The support plate 632 is fixed to the wafer box 200. The fixing method can be bonding, welding or bolting. In this embodiment, it is preferred to fix the support plate 632 and the wafer box 200 by bolting. In addition, the sleeve 631 is sleeved on the outside of the screw rod 620, and the sleeve 631 is connected to the connecting member 622 by a rigid connection. At the same time, the sleeve 631 is inserted into the through hole of the fixing member 613. The screw rod 620 rotates to drive The connecting member 622 moves axially along the screw rod 620, thereby driving the sleeve 631 to move axially along the screw rod 620 in the through hole of the fixing member 613, so as to drive the support plate 632 and the wafer box 200 to move; in addition, the carrying unit 630 also includes a bellows 633, wherein one end of the bellows 633 is fixedly arranged on the end face of the support plate 632 by bonding, and the other end is arranged on the inner wall of the fixing member 613 by bonding, that is, it is arranged on the inner wall of the through hole of the fixing member 613. The bellows 633 is used to prevent the sleeve 631 from being contaminated, and the bellows 633 can adapt to the length change of the sleeve 631.

[0070] During the rotation of the screw rod 620, the driving assembly 640 is required to drive the screw rod 620. Figure 1 、 Figure 2 and Figure 4The driving assembly 640 includes a driving motor 643, a driving wheel 642 and a driven wheel 641, wherein the driven wheel 641 is fixedly arranged on the screw rod 620, and its fixing method can be clamping, bolting or rigid connection. In this embodiment, the two are preferably rigidly connected, and the driven wheel 641 and the screw rod 620 are coaxially arranged so that the driven wheel 641 can drive the screw rod 620 to rotate synchronously; the driving wheel 642 is fixedly connected to the rotating shaft of the driving motor 643, and its fixing method can be clamping, bolting or rigid connection. In this embodiment, it is preferred to use a rigid connection between the two, and the rotating shafts of the driving wheel 642 and the driving motor 643 are coaxially arranged. The rotation of the driving motor 643 can drive the driving wheel 642 to rotate synchronously. The driving wheel 642 and the driven wheel 641 are connected by transmission. In this embodiment, the driving wheel 642 and the driven wheel 641 are connected by a transmission belt 644, that is, the transmission method is pulley rotation. During operation, the driving motor 643 is started to drive the driving wheel 642 to rotate, and the rotating wheel drives the driven wheel 641 to rotate. The screw rod 620 is driven to rotate, which is convenient for controlling the rotation process of the screw rod 620; the side wall of the cavity 100 is also provided with a lifting door 700, which is used to close the opening of the side wall of the cavity 100; in this embodiment, the second transmitting element 651 and the second receiving element 652 are fixedly arranged inside the cavity 100 by bolts, and are distributed on both sides of the wafer box 200, so as to facilitate the detection of whether there are overlapped, tilted or missing wafers, etc., wherein the second transmitting element is fixedly arranged on the inner wall of the lifting door 700, and the second receiving element 652 is fixedly arranged on the inner wall of the lifting door 700, and the second receiving element 652 is fixedly arranged on the inner wall of the lifting door 700. The receiving element 652 is fixedly arranged on the side wall of the cavity 100 opposite to the lifting door 700. During operation, the lifting assembly 600 drives the wafer box 200 to move, and makes the wafer box 200 pass through the second emitting element 651 and the second receiving element 652 to detect the wafers in the wafer box 200 to determine whether there are overlapped, tilted or missing wafers; at the same time, the first emitting element 310 moves on the top wall of the cavity 100, and cooperates with the reflecting element 400 and the first receiving element 320 to determine whether there are protruding wafers or other conditions.

[0071] The implementation principle of a wafer position detection component and a wafer carrier lifting and transmission device in an embodiment of the present application is that the driving motor 643 drives the lead screw 620 to rotate through the active wheel 642 and the driven wheel 641. While the lead screw 620 rotates, it drives the sleeve 631 to move axially along the lead screw 620 to drive the wafer box 200 in the cavity 100 to move. During the movement of the wafer box 200, the detection unit arranged along the X-axis direction detects the position and status of the wafers on the wafer box 200 to determine whether there are overlapped, tilted, missing wafers, etc. in the wafer box 200. At the same time, the detection unit arranged along the Z-axis determines whether the wafers in the wafer box 200 have slipped out. During the detection process, the reflector 400 does not need to move, which simplifies the operation process and improves the detection efficiency.

[0072] While the embodiments of the present invention have been described in detail above, it will be apparent to those skilled in the art that various modifications and variations may be made to these embodiments. However, it should be understood that such modifications and variations are within the scope and spirit of the present invention as set forth in the claims. Furthermore, the present invention described herein may have other embodiments and may be implemented or carried out in a variety of ways.

Claims

1. A wafer position detection component is applied to a wafer carrier lifting and transmission device, wherein the wafer carrier lifting and transmission device comprises a cavity (100) and has an accommodating space inside for placing a wafer box (200), wherein a plurality of wafers are placed in the wafer box (200), characterized in that: The wafer position detection component includes: At least one detection unit, the detection unit comprising a transmitting end, a receiving end and a reflecting element (400); The detection unit is arranged along the Z-axis direction, and the transmitting end and the receiving end are located on the same side; The reflector (400) is arranged opposite to the emitting end along the Z-axis direction, the reflector (400) has a reflection area (410), the emitting end is movably arranged on the top wall of the cavity (100) along the X-axis, and the projection of the moving trajectory of the emitting end in the Z-axis direction is within the reflection area (410); The reflector (400) reflects the laser beam emitted by the transmitting end at any position on the moving track, and the receiving end receives the reflected laser beam; when the laser beam emitted by the transmitting end intersects with the wafer in the wafer box (200), the signal of the receiving end is weakened.

2. The wafer position detection assembly according to claim 1, characterized in that: It also includes a bracket (500), one side of the bracket (500) is fixedly disposed on the cavity, and the other side is fixed to the reflector (400); The bracket (500) is provided with a detection hole (510) corresponding to the position of the reflection area (410), and the laser beam passes through the detection hole (510) and is emitted to the reflection area (410).

3. The wafer position detection assembly according to claim 2, characterized in that: The bracket (500) comprises a mounting plate (520) and an abutment block (530), wherein the abutment block (530) is fixedly arranged at the end of the mounting plate (520), and the abutment block (530) is arranged on the end surface of the mounting plate (520) away from the reflector (400).

4. The wafer position detection assembly according to claim 3, characterized in that: The abutment blocks (530) are provided in two pieces, and the detection hole (510) is provided between the two abutment blocks (530).

5. The wafer position detection assembly according to claim 1, wherein: The reflective element (400) is in the shape of an elongated strip, and the length direction of the reflective element (400) is the same as the moving direction of the emitting end.

6. A wafer position detection component is applied to a wafer carrier lifting and transmission device, wherein the wafer carrier lifting and transmission device has a cavity (100) for placing a wafer box (200), the wafer box (200) can be lifted and lowered along the Z axis, and a plurality of wafers are placed in the wafer box (200), characterized in that: The wafer position detection component includes: At least one detection unit, the detection unit comprising a transmitting end and a receiving end; The detection unit is arranged along the X-axis direction, and the transmitting end and the receiving end are arranged opposite to each other along the X-axis direction; The wafer box (200) moves along the Z-axis direction, and passes through the laser beam between the transmitting end and the receiving end which are arranged relatively along the X-axis direction. The receiving end receives the laser beam from the transmitting end to determine the position and state of the wafer.

7. The wafer position detection assembly according to claim 6, characterized in that: The transmitting end and the receiving end are distributed on both sides of the wafer box (200) along the X-axis direction; In a working state, the wafer box (200) passes through the laser beam between the transmitting end and the receiving end during the lifting process, the transmitting end continuously emits the laser beam, and the receiving end records the number and time of the laser beam being blocked to determine the position and state of the wafer.

8. A wafer position detection component is applied to a wafer carrier lifting and transmission device, wherein the wafer carrier lifting and transmission device has a cavity (100) for placing a wafer box (200), wherein a plurality of wafers are placed in the wafer box (200), characterized in that: The wafer position detection component includes: at least one of a detection unit arranged along the Z-axis direction and a detection unit arranged along the X-axis direction, each of the detection units including a transmitting end and a receiving end; in, When the detection unit is arranged along the Z-axis direction, it further includes a reflector (400), the transmitting end and the receiving end are located on the same side, the reflector (400) is arranged opposite to the transmitting end along the Z-axis direction, the reflector (400) has a reflection area (410), the transmitting end is movably arranged on the top wall of the cavity (100) along the X-axis direction, the projection of the moving trajectory of the transmitting end in the Z-axis direction is within the reflection area (410), the reflector (400) reflects the laser beam emitted by the transmitting end at any position on the moving trajectory, the receiving end receives and receives the reflected laser beam, and when the laser beam emitted by the transmitting end intersects with the wafer in the wafer box (200), the signal of the receiving end is weakened; When the detection unit is arranged along the X-axis direction, the wafer box (200) can be raised and lowered along the Z-axis direction, and the transmitting end and the receiving end are arranged relatively along the X-axis direction; the wafer box (200) moves along the Z-axis direction, and the laser beam passes between the transmitting end and the receiving end that are arranged relatively along the X-axis direction, and the receiving end receives the laser beam from the transmitting end to determine the position and status of the wafer.

9. A wafer carrier lifting and transporting device, characterized in that: It comprises a cavity (100), a wafer box (200), a lifting assembly (600), and a wafer position detection assembly according to any one of claims 1 to 8; The wafer box (200) is arranged inside the cavity (100); A portion of the lifting assembly (600) is disposed outside the cavity (100), and another portion extends into the cavity (100) to be connected to the wafer box (200), and drives the wafer box (200) to rise and fall along the Z-axis direction; In the working state, the lifting assembly (600) drives the wafer box (200) to move, and the detection unit performs a protrusion detection on the wafers in the wafer box (200) in the Z-axis direction; or, the lifting assembly (600) drives the wafer box (200) to move along the Z-axis direction, and the detection unit performs a position and status detection on the wafers in the wafer box (200) in the X-axis direction; or, one of the detection units performs a protrusion detection on the wafers in the wafer box (200) in the Z-axis direction, and the other detection unit performs a position and status detection on the wafers in the wafer box (200) in the X-axis direction.

10. The wafer carrier lifting and transporting device according to claim 9, characterized in that: The lifting assembly (600) comprises: a support frame (610) fixedly disposed on the bottom wall of the cavity (100); A screw rod (620) is rotatably arranged on the support frame (610), and a connecting piece (622) is movably arranged on the screw rod (620), and the connecting piece (622) moves axially along the screw rod (620); A carrying unit (630), one end of which is fixedly disposed on the wafer box (200) and the other end of which is fixedly disposed on the connecting member (622); In a working state, the screw rod (620) rotates, causing the connecting member (622) to move axially along the screw rod (620), thereby driving the carrying unit (630) and the wafer box (200) to move.

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