Current sensor and current sensor integrated structure
Through the design of limiting, positioning and fastening structure, the rapid and accurate installation of the current sensor is achieved, solving the problem of cumbersome and time-consuming installation of traditional current sensors, and improving the stability of the current sensor under vibration conditions and the stability of the printed circuit board on the client.
Patent Information
- Application Number
- CN202521366048.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-07-01
- Publication Date
- 2025-08-12
- Estimated Expiration
- 2035-07-01
AI Technical Summary
The installation of traditional current sensors and clients is cumbersome and time-consuming, and has poor performance under vibration conditions, complex assembly and high cost.
An integrated current sensor structure is designed, including a limit structure, a positioning structure and a fastening structure, to realize the rapid and accurate installation of the current sensor in three mutually perpendicular directions. Through the limit structure, the contact limit with the heat sink plate, the positioning structure is accurately positioned, and the fastening structure is fixedly connected to the printed circuit board.
It improves installation efficiency, enhances the stability and reliability of the current sensor in vibrating conditions, and simultaneously improves the stability of the vibration control of the printed circuit board of the client.
Smart Images

Figure CN223217550U_ABST
Abstract
Description
Technical Field
[0001] The present disclosure relates to the field of sensor technology, and in particular to a current sensor and a current sensor integrated structure. Background Art
[0002] Current sensors are widely used to monitor or control electronic devices and systems, such as new energy vehicle motor control systems, battery management systems, and industrial control systems. With technological advancements, the requirements for current sensors are increasing. However, when used with commercially available power modules, traditional current sensors face challenges such as cumbersome installation, precise alignment requirements, and time-consuming installation. For example, secondary assembly of the current busbars results in high costs, complex and inefficient assembly of current sensors, and complex installation with the client, requiring secondary fastening. Furthermore, single-channel sensors can only be fastened to the client's printed circuit board assembly (PCBA), resulting in poor performance under vibration conditions and inconvenient assembly. Utility Model Content
[0003] The present disclosure provides a current sensor and a current sensor integrated structure to at least solve the above technical problems existing in the prior art.
[0004] According to a first aspect of the present disclosure, there is provided a current sensor, comprising:
[0005] The main body is provided with a through hole for passing the current-carrying bar of the client;
[0006] A limiting structure, provided on the body, for contacting and limiting the heat dissipation plate of the client in a first direction and a second direction;
[0007] a positioning structure, provided on the body, for positioning the client in a third direction; and
[0008] A fastening structure, provided on the body, for fixedly connecting to the first printed circuit board of the client;
[0009] The first direction, the second direction and the third direction are perpendicular to each other.
[0010] In one embodiment, the body includes a housing, a magnetic core assembly, a pin assembly, and a second printed circuit board;
[0011] The housing is provided with a receiving cavity for installing the magnetic core assembly, and the magnetic core assembly is arranged in the receiving cavity;
[0012] One end of the pin assembly is welded to the second printed circuit board, and the other end extends from the housing and is used to connect to the first printed circuit board for signal transmission;
[0013] The housing, the magnetic core assembly and the pin assembly are injection molded, and the accommodating cavity encloses the through hole.
[0014] In one embodiment, a Hall chip is fixedly connected to a side of the second printed circuit board close to the magnetic core assembly;
[0015] The magnetic core component is provided with an air gap opening, and the Hall chip is placed in the air gap opening.
[0016] In one embodiment, the body further includes a shell cover, and the shell cover is connected to the outer shell via a snap-fit structure.
[0017] In one embodiment, the limiting structures are symmetrically distributed at the bottom of the body with respect to the width direction of the body.
[0018] In one embodiment, the positioning structure includes a first positioning portion and a second positioning portion;
[0019] The first positioning portion is configured to contact the upper surface of the heat dissipation plate to achieve positioning in the third direction;
[0020] The number of the second positioning portions is two, and the two second positioning portions are arranged at two ends of the body along the length direction of the body.
[0021] In one embodiment, the fastening structure includes a fastening hole and a guide column.
[0022] In one embodiment, the body further includes a fixing pin, which is injection-molded with the housing and welded to the second printed circuit board.
[0023] According to a second aspect of the present disclosure, there is provided a current sensor integrated structure, comprising a power module and a current sensor as described in any one of the above embodiments fixedly connected to the power module;
[0024] The power module includes a main body, a current-carrying bar and a heat sink, wherein the current-carrying bar is inserted into the through hole, and the heat sink is fixedly connected to the positioning structure;
[0025] Wherein, the current-carrying bar and the main body are injection molded.
[0026] In one possible implementation manner, a limiting portion and a mounting hole are provided on the heat dissipation plate, the limiting portion contacts and limits the limiting structure, and the mounting hole is fastened to the positioning structure.
[0027] In the present disclosure, the current sensor is designed with a limit structure, a positioning structure and a fastening structure to achieve rapid installation and precise positioning with the client. The limit structure can ensure that the current sensor is contacted and limited with the heat sink of the client in the first and second directions; the positioning structure accurately positions the sensor in the third direction to ensure the accuracy of the installation position; the fastening structure is used to firmly connect the current sensor to the first printed circuit board of the client to achieve rapid fixation. In summary, this design achieves rapid and precise installation in three mutually perpendicular directions, which not only improves the installation efficiency, effectively solves the problems of cumbersome and time-consuming alignment in the installation process of traditional current sensors, but also significantly enhances the stability and reliability of the current sensor under vibration conditions; because the current sensor is firmly connected to the first printed circuit board of the client through the fastening structure, the stability of the vibration control of the first printed circuit board of the client is simultaneously improved.
[0028] It should be understood that the contents described in this section are not intended to identify the key or important features of the embodiments of the present disclosure, nor are they intended to limit the scope of the present disclosure. Other features of the present disclosure will become readily understood through the following description. BRIEF DESCRIPTION OF THE DRAWINGS
[0029] The above and other objects, features and advantages of the exemplary embodiments of the present disclosure will become readily understood by reading the detailed description below with reference to the accompanying drawings, in which several embodiments of the present disclosure are shown by way of example and not limitation, wherein:
[0030] In the drawings, the same or corresponding reference numerals denote the same or corresponding parts.
[0031] Figure 1 The figure shows the overall structure of a current sensor according to an exemplary embodiment of the present disclosure;
[0032] Figure 2 An exploded view of a current sensor according to an exemplary embodiment of the present disclosure is shown;
[0033] Figure 3 The internal structure of a current sensor according to an exemplary embodiment of the present disclosure is shown. Figure 1 ;
[0034] Figure 4 The internal structure of a current sensor according to an exemplary embodiment of the present disclosure is shown. Figure 2 ;
[0035] Figure 5 A cross-sectional schematic diagram of a current sensor according to an exemplary embodiment of the present disclosure is shown;
[0036] Figure 6The figure shows the overall structure of the current sensor integrated structure of an exemplary embodiment of the present disclosure;
[0037] Figure 7 A schematic structural diagram of a power module of an integrated current sensor structure according to an exemplary embodiment of the present disclosure is shown.
[0038] Explanation of the numbers in the figure: 1. Main body; 2. Limiting structure; 3. Positioning structure; 4. Fastening structure; 5. Power module; 11. Housing; 12. Magnetic core assembly; 13. Pin assembly; 14. Second printed circuit board; 15. Hall chip; 16. Shell cover; 17. Fixing pin; 31. First positioning portion; 32. Second positioning portion; 41. Fastening hole; 42. Guide column; 51. Main body; 52. Current-carrying bar; 53. Heat sink; 111. Through hole; 112. Block; 121. Air gap opening; 161. Elastic buckle; 531. Limiting portion; 532. Mounting hole. DETAILED DESCRIPTION
[0039] To make the purposes, features, and advantages of the present disclosure more apparent and understandable, the technical solutions in the embodiments of the present disclosure will be clearly and completely described below in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present disclosure, not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of the present disclosure without creative work shall fall within the scope of protection of the present disclosure.
[0040] The embodiments of the present disclosure will be described in detail below with reference to the accompanying drawings.
[0041] Reference Figure 1 and Figure 2 As shown, a current sensor according to an exemplary embodiment of the present disclosure includes a body 1, a limiting structure 2, a positioning structure 3, and a fastening structure 4. The body 1 is provided with a through-hole 111 for inserting the current-carrying bar of the client. The limiting structure 2 is provided on the body 1 and is used to contact and limit the client's heat sink in the first and second directions. The positioning structure 3 is provided on the body 1 and is used to position the client in the third direction. The fastening structure 4 is provided on the body 1 and is used to securely connect to the first printed circuit board of the client. The first, second, and third directions are perpendicular to each other.
[0042] In this embodiment, it should be noted that the current sensor disclosed herein establishes a direction definition based on a three-dimensional coordinate system, wherein the first direction corresponds to the X direction in the three-dimensional coordinate system, the second direction corresponds to the Y direction in the three-dimensional coordinate system, and the third direction corresponds to the Z direction in the three-dimensional coordinate system. The current sensor is mainly used in clients such as new energy vehicle motor control systems, battery management systems, and industrial control systems. It is used to sense the information of the measured current and transform the information sensed during the detection process into an electrical signal or other required form of information output that meets certain standard requirements according to a certain rule to meet the requirements of information transmission, processing, storage, display, recording, and control. The current sensor includes a main body 1, and a through hole 111 is opened on the main body 1. The size and shape of the through hole 111 are adapted to the current-carrying bar provided on the client, and are used for the current-carrying bar to pass through, thereby realizing the current sensor's detection function of the current in the current-carrying bar. Specifically, the current bus is the current bus of a power module on the client, where the power module may include, but is not limited to, an insulated gate bipolar transistor (IGBT) module, a metal-oxide-semiconductor field-effect transistor (MOSFET) module, or a gallium nitride high electron mobility transistor (GaNHEMT) module. The embodiments described herein are all based on the example of an IGBT module being the power module in the client. A limiting structure 2 is configured on the current sensor body 1. The position and shape of the limiting structure 2 match corresponding limiting portions on the heat sink of the client. Specifically, the limiting structure 2 may be a boss, a groove, or a combination thereof. Its function is to contact and limit the heat sink in a first direction and a second direction, thereby positioning the current sensor and the client within the plane of the first and second directions. It should be noted that the heat sink here specifically refers to the heat sink of the power module in the client, and the "positioning in the plane of the first direction and the second direction" here does not ensure that the current sensor will not be displaced in the first direction and the second direction, but the positioning effect can be achieved by the contact between the limiting structure 2 and the heat sink. The positioning structure 3 of the current sensor cooperates with the corresponding positioning part on the client to determine the relative position of the current sensor and the client in the third direction. The positioning structure 3 can be in the form of a positioning pin, a positioning column, a positioning block or a bushing, etc., which cooperates with the corresponding positioning hole or positioning surface on the client to achieve precise alignment, ensure the accurate installation position of the current sensor in the third direction, and provide an accurate position reference for subsequent fixed installation.Fastening structure 4 is also provided on body 1 and is configured to mate with a connection portion on the client's first printed circuit board (not shown) to secure the current sensor to the first printed circuit board. Fastening structure 4 can employ connection methods including, but not limited to, threaded holes, snaps, or welds. Screwing, snap-fitting, or welding ensures reliable and stable connections.
[0043] During the actual installation process, first align the through hole 111 of the current sensor body 1 with the current-carrying bar of the power module on the client, so that the current-carrying bar passes through the through hole 111; then, the limiting structure 2 of the body 1 is contacted and limited with the heat sink of the power module in the client in the first direction and the second direction; then, the current sensor is precisely positioned in the third direction by the positioning structure 3; finally, the current sensor is fixedly connected to the first printed circuit board of the client by the fastening structure 4. In summary, through the synergistic effect of the above-mentioned components, the current sensor can be quickly positioned and firmly connected to the client in three mutually perpendicular directions, which greatly improves the installation efficiency and accuracy, reduces the installation difficulty and time cost, and at the same time enhances the stability of the current sensor during actual use, ensuring that it can accurately and reliably monitor the current in the client; because the current sensor is firmly connected to the first printed circuit board of the client through the fastening structure, the stability of the vibration control of the first printed circuit board of the client is simultaneously improved.
[0044] Reference Figure 2 As shown, in one embodiment, the body 1 includes a housing 11, a magnetic core assembly 12, a pin assembly 13, and a second printed circuit board 14. The housing 11 is provided with a cavity for mounting the magnetic core assembly 12. The magnetic core assembly 12 is disposed within the cavity. One end of the pin assembly 13 is welded to the second printed circuit board 14. The other end of the pin assembly 13 extends from the housing 11 for connection to the first printed circuit board of the client for signal transmission. The housing 11, magnetic core assembly 12, and pin assembly 13 are injection molded, and the cavity encloses a through hole 111.
[0045] In this embodiment, the housing 11 serves as the basic support structure of the current sensor, and a housing cavity for mounting the magnetic core assembly 12 is provided inside the housing 11. The housing cavity is directly enclosed by an injection molding process to form a through hole 111 for passing the current-carrying bar. The magnetic core assembly 12 is formed by winding oriented silicon steel and is used to couple the magnetic field generated by the measured current. The magnetic core assembly 12 is tightly embedded in the housing cavity to ensure the stability and reliability of the magnetic core assembly 12 in the housing 11. The pin assembly 13 includes a plurality of highly conductive metal pins. One end of the pin assembly 13 is welded to the second printed circuit board 14, and the other end extends to the outside of the housing 11 to form a standard interface for connecting to the first printed circuit board of the client for signal transmission. The housing 11, the magnetic core assembly 12 and the pin assembly 13 are integrally formed by an injection molding process, which eliminates the traditional assembly gap, ensures the close fit between the components and the stability of the overall structure, and can significantly improve the structural strength and vibration resistance.
[0046] Reference Figure 3 and Figure 5 As shown, in one embodiment, a Hall chip 15 is fixedly connected to one side of the second printed circuit board 14 close to the magnetic core assembly 12 . The magnetic core assembly 12 is provided with an air gap opening 121 , and the Hall chip 15 is placed in the air gap opening 121 .
[0047] In this embodiment, a Hall chip 15 is fixedly connected to one side of the second printed circuit board 14 near the magnetic core assembly 12, and the Hall chip 15 is arranged at the center of the air gap opening 121 preset in the magnetic core assembly 12 to form a magnetic field coupling structure. This design enables the Hall chip 15 to be in the optimal sensing position of the magnetic field generated by the magnetic core assembly 12, so that it can more accurately sense the changes in the magnetic field, thereby achieving high-precision detection of the current in the current-carrying bus. When current passes through the current-carrying bus, according to the principle of electromagnetic induction, a magnetic field is generated in the magnetic core assembly 12. This magnetic field acts on the Hall chip 15 through the air gap opening 121, and the Hall chip 15 generates a corresponding voltage signal. After the signal is processed by the circuit on the second printed circuit board 14, it is transmitted to the power module through the pin assembly 13 to achieve real-time monitoring and control of the current.
[0048] In one embodiment, the body 1 further includes a shell cover 16 , and the shell cover 16 is connected to the housing 11 via a snap-fit structure.
[0049] In this embodiment, a plurality of elastic clips 161 are evenly distributed on the edge of the shell cover 16, and the same number of blocks 112 are provided on the shell 11, and the position of each block 112 corresponds to the position of the corresponding elastic clip 161. The elastic clip 161 adopts a cantilever beam design, and the elastic clip 161 is provided with a hooking portion that can hook with the block 112, which is used to cooperate with the block 112 to achieve self-locking. This clip structure allows the shell cover 16 to be quickly and conveniently assembled with the shell 11. After the hook structure is aligned, it can be automatically locked by gently pressing it, achieving a tight connection between the shell cover 16 and the shell 11, thereby effectively protecting the internal magnetic core assembly 12, pin assembly 13, second printed circuit board 14 and other components, preventing the intrusion of external impurities such as dust and moisture, and at the same time resisting certain mechanical shocks and vibrations, thereby improving the overall protection performance and reliability of the current sensor.
[0050] In one embodiment, the limiting structures 2 are symmetrically distributed on the bottom of the body 1 with respect to the width direction of the body 1 .
[0051] In this embodiment, the symmetrically distributed limiting structures 2 ensure uniform contact with the heat sink, providing stable support and positioning, effectively positioning the current sensor in both the first and second directions, ensuring accurate relative positioning between the current sensor and the client, and significantly improving stability and reliability after installation. During the manufacturing process, the symmetrically distributed limiting structures 2 also facilitate mold forming, simplifying the production process and reducing production costs. During assembly, the symmetrical design also facilitates automated operations, further improving production efficiency and assembly accuracy.
[0052] Reference Figure 4 As shown, in one embodiment, the positioning structure 3 includes a first positioning portion 31 and a second positioning portion 32, and the first positioning portion 31 is configured to contact the upper surface of the heat dissipation plate to achieve positioning in the third direction; the number of the second positioning portions 32 is two, and the two second positioning portions 32 are arranged at the two ends of the main body 1 along the length direction of the main body 1.
[0053] In this embodiment, the first positioning portion 31 is primarily used for positioning in the third direction. Preferably, there are two of the first positioning portions 31, which are configured to contact the upper surface of the heat sink of the power module in the client. When the current sensor is installed, the first positioning portion 31 fits tightly against the upper surface of the heat sink, thereby determining the position of the current sensor in the third direction and ensuring precise alignment between the current sensor and the client. The specific form of the first positioning portion 31 can be designed as a protrusion or groove structure that matches the upper surface of the heat sink, or it can be a positioning pin, positioning column, positioning block, or positioning bushing. The second positioning portion 32 is used to establish a fixed connection with the client's housing (not shown in the figure). Preferably, there are two of the second positioning portions 32, and the two second positioning portions 32 are arranged at both ends of the body 1 along the length direction of the body 1. This symmetrically distributed layout at both ends enables the current sensor to obtain balanced positioning constraints during installation, further improving the accuracy and stability of positioning. The second positioning portion 32 can be implemented by a positioning pin or a positioning column, which can be tightly matched with the corresponding hole on the client casing; a positioning bushing can also be provided, which can be locked and fixed to the client casing by screws to ensure that the current sensor is installed stably and prevent the current sensor from shifting or shaking.
[0054] In one embodiment, the fastening structure 4 includes a fastening hole 41 and a guide post 42 .
[0055] In this embodiment, fastening holes 41 are formed at designated locations on the upper end of the main body 1. Their shape, size, and position match corresponding structures on the client's first printed circuit board. For example, they can be threaded holes designed to accept screws to securely fasten the current sensor to the client's first printed circuit board, ensuring a stable and reliable electrical connection between the two while also protecting against vibrations and other factors that may affect the connection during operation. The number and position of guide posts 42 are designed to match the positioning holes on the client's first printed circuit board. Their primary function is to guide the current sensor during installation, enabling quick and accurate alignment with the client's first printed circuit board. The guide posts 42 have a smooth surface and an appropriate length. When the current sensor approaches the client, they are first inserted into the corresponding positioning holes, guiding the alignment of the remaining components of the main body 1. This allows for rapid positioning and pre-fixation, facilitating subsequent fastening operations and improving installation efficiency and accuracy.
[0056] Reference Figure 2 and Figure 4 As shown, in one embodiment, the body 1 further includes a fixing pin 17 , which is injection-molded with the housing 11 and welded to the second printed circuit board 14 .
[0057] In this embodiment, the fixing pin 17 is integrally formed with the housing 11 during the injection molding process. One end of the fixing pin 17 is securely fixed within the housing 11, while the other end is soldered to the second printed circuit board 14. This design not only strengthens the fixing strength of the second printed circuit board 14 within the housing 11, preventing displacement or loosening of the second printed circuit board 14 due to vibration or impact, but also provides a reliable electrical connection path through the soldered connection, ensuring stable and accurate signal transmission.
[0058] Reference Figure 6 and Figure 7 As shown, the present disclosure also provides a current sensor integrated structure, including a power module 5 and a current sensor according to any of the above-described embodiments, fixedly connected to the power module 5. The power module 5 includes a main body 51, a current bar 52, and a heat sink 53. The current bar 52 is disposed in the through hole 111, and the heat sink 53 is fixedly connected to the positioning structure 3. The current bar 52 and the main body 51 are injection molded.
[0059] In this embodiment, the current-carrying bar 52 is pre-molded integrally with the main body 51 through an injection molding process, which ensures the stability and reliability of the connection between the current-carrying bar 52 and the main body 51, simplifies the production process, improves production efficiency, and avoids secondary installation. The heat sink 53 is tightly connected to the main body 51 and is used to dissipate the heat generated by the power module 5 during operation to ensure the normal operating temperature range of the power module 5. The overall structure of the current sensor integrated structure disclosed in the present invention is compact and suitable for application scenarios with limited space on the client side, saving space for other layouts of the client side. The design of the limiting structure 2, the positioning structure 3 and the fastening structure 4 makes the installation process of the current sensor and the power module 5 fast and accurate, without the need for complicated alignment and adjustment, saving installation time and improving production efficiency. The injection molding design of the current-carrying bar 52 and the main body 51 enables the entire integrated structure to remain stable under vibration and impact conditions, reduces the risk of loose connections, and improves the reliability of the system.
[0060] Specifically, refer to Figure 7 As shown, in one embodiment, a limiting portion 531 and a mounting hole 532 are provided on the heat dissipation plate 53 , the limiting portion 531 contacts and limits the limiting structure 2 , and the mounting hole 532 is fastened to the positioning structure 3 .
[0061] In this embodiment, the limiting portion 531 contacts and limits the limiting structure 2 of the current sensor, ensuring the accurate position of the current sensor in the first direction and the second direction, and preventing it from shaking or shifting. The mounting hole 532 is fastened to the positioning structure 3 of the current sensor, and the current sensor is fixed to the heat sink 53 by fasteners such as screws to ensure the stability and reliability of the current sensor in the third direction. This design makes the connection between the current sensor and the power module 5 tighter and more stable. The cooperation between the limiting portion 531 and the mounting hole 532 not only improves the accuracy and efficiency of the installation, but also enhances the stability of the entire integrated structure under vibration and impact conditions, effectively prevents the connection from loosening due to external forces, and extends the service life of the integrated structure.
[0062] In the description of the present disclosure, it should be understood that the orientation or positional relationship indicated by the directional words is usually based on the orientation or positional relationship shown in the accompanying drawings, and is only for the convenience of describing the present disclosure and simplifying the description. Unless otherwise specified, these directional words do not indicate or imply that the device or element referred to must have a specific orientation or be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the scope of protection of the present disclosure; the directional words "inside" and "outside" refer to the inside and outside relative to the outline of each component itself.
[0063] For ease of description, spatially relative terms such as "above", "above", "on the upper surface of", "above", etc. may be used herein to describe the spatial positional relationship between one or more components or features shown in the figures and other components or features. It should be understood that spatially relative terms include not only the orientation of the components as described in the figures, but also different orientations during use or operation. For example, if the components in the drawings are inverted as a whole, the components "above other components or features" or "above other components or features" will include the situation where the components are "below other components or structures" or "below other components or structures". Therefore, the exemplary term "above" can include both the orientations of "above" and "below". In addition, these components or features can also be positioned at other different angles (for example, rotated 90 degrees or other angles), and this document is intended to include all of these situations.
[0064] It should be noted that the terms used herein are only for describing specific embodiments and are not intended to limit the exemplary embodiments according to the present disclosure. As used herein, unless the context clearly indicates otherwise, the singular form is also intended to include the plural form. In addition, it should be understood that when the terms "comprise" and / or "include" are used in this specification, they indicate the presence of features, steps, operations, parts, components and / or combinations thereof.
[0065] It should be noted that the terms "first," "second," and the like in the specification and claims of the present disclosure and the accompanying drawings are used to distinguish similar objects and are not necessarily used to describe a specific order or precedence. It should be understood that the terms used in this manner are interchangeable where appropriate, such that the embodiments of the present disclosure described herein can be implemented in an order other than that illustrated or described herein.
[0066] The present disclosure has been described through the above-described embodiments, but it should be understood that the above-described embodiments are for illustrative and illustrative purposes only and are not intended to limit the present disclosure to the described embodiments. In addition, it will be understood by those skilled in the art that the present disclosure is not limited to the above-described embodiments, and that various variations and modifications may be made based on the teachings of the present disclosure, all of which fall within the scope of protection claimed by the present disclosure. The scope of protection of the present disclosure is defined by the appended claims and their equivalents.
Claims
1. A current sensor, characterized in that: include: The main body (1) is provided with a through hole (111) for passing the current-carrying bar of the client; A limiting structure (2), provided on the body (1), and used for contacting and limiting the heat dissipation plate of the client in a first direction and a second direction; A positioning structure (3) is provided on the body (1) and is used for positioning the client in a third direction; as well as A fastening structure (4), provided on the body (1), and used for fixed connection with the first printed circuit board of the client; The first direction, the second direction and the third direction are perpendicular to each other.
2. The current sensor according to claim 1, wherein The body (1) comprises a housing (11), a magnetic core assembly (12), a pin assembly (13) and a second printed circuit board (14); The housing (11) is provided with a receiving cavity for installing the magnetic core component (12), and the magnetic core component (12) is arranged in the receiving cavity; One end of the pin assembly (13) is welded to the second printed circuit board (14), and the other end extends from the housing (11) and is used to connect to the first printed circuit board for signal transmission; The housing (11), the magnetic core assembly (12), and the pin assembly (13) are injection molded, and the accommodating cavity encloses the through hole (111).
3. The current sensor according to claim 2, characterized in that A Hall chip (15) is fixedly connected to a side of the second printed circuit board (14) close to the magnetic core assembly (12); The magnetic core component (12) is provided with an air gap opening (121), and the Hall chip (15) is placed in the air gap opening (121).
4. The current sensor according to claim 2, characterized in that The body (1) further comprises a shell cover (16), and the shell cover (16) is connected to the outer shell (11) via a snap-fit structure.
5. The current sensor according to claim 1, wherein: The limiting structure (2) is symmetrically distributed at the bottom of the body (1) relative to the width direction of the body (1).
6. The current sensor according to claim 1, wherein: The positioning structure (3) comprises a first positioning portion (31) and a second positioning portion (32); The first positioning portion (31) is configured to contact the upper surface of the heat dissipation plate to achieve positioning in the third direction; The number of the second positioning portions (32) is two, and the two second positioning portions (32) are arranged at two ends of the body (1) along the length direction of the body (1).
7. The current sensor according to claim 1, wherein: The fastening structure (4) comprises a fastening hole (41) and a guide column (42).
8. The current sensor according to claim 2, wherein: The body (1) further comprises a fixing pin (17), wherein the fixing pin (17) is injection-molded with the housing (11) and welded to the second printed circuit board (14).
9. A current sensor integrated structure, characterized in that: A current sensor comprising a power module (5) and a current sensor according to any one of claims 1 to 8, fixedly connected to the power module (5); The power module (5) comprises a main body (51), a current-carrying bar (52) and a heat dissipation plate (53), wherein the current-carrying bar (52) is arranged in the through hole (111), and the heat dissipation plate (53) is fixedly connected to the positioning structure (3); The current-carrying bar (52) and the main body (51) are injection-molded.
10. The current sensor integrated structure according to claim 9, characterized in that: A limiting portion (531) and a mounting hole (532) are provided on the heat dissipation plate (53); the limiting portion (531) contacts and limits the limiting structure (2); and the mounting hole (532) is fastened to the positioning structure (3).