Automatic point inspection device for ESD grounding monitoring device

By introducing automatic point inspection devices into the ESD grounding monitoring device, including controller, collector, point inspection switch and monitor, the self-test function is realized, the problem of lack of self-test in the prior art is solved, the accuracy and stability of the detection are improved, and the investment in manpower and material resources is reduced.

CN223217666UActive Publication Date: 2025-08-12SHENZHEN UNITED JINGJIE TECH CO LTD
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Patent Information

Application Number
CN202421604739.9
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-07-08
Publication Date
2025-08-12
Estimated Expiration
2034-07-08

AI Technical Summary

Technical Problem

The existing ESD grounding monitoring devices lack self-test functions, resulting in the inability to guarantee data accuracy and effectiveness, resulting in damage to product devices and data loss, and a large amount of manpower and material resources for data inspection.

Method used

An automatic inspection device including a controller, a collector, a point inspection switch and a monitor is designed. The device self-inspection is realized by setting a point inspection circuit and a point inspection switch, and the detection status is calibrated using standard resistors.

Benefits of technology

The self-test function of the ESD grounding monitoring device is realized, which ensures the accuracy and stability of the inspection, reduces the investment of manpower and material resources, and avoids product damage and data loss caused by errors.

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Abstract

The utility model provides an automatic point inspection device for an ESD grounding monitoring device. The automatic point inspection device comprises a controller, a collector, a point inspection change-over switch, a point inspection loop and a monitor. The controller is connected with the collector, and the collector is connected with the monitor and the point inspection loop through the point inspection change-over switch. The point inspection loop is provided with a standard resistor, and the resistance value of the standard resistor corresponds to the monitoring resistance value of the monitor; when the point inspection change-over switch is turned off, the collector is communicated with the monitor through the point inspection change-over switch; when the point inspection change-over switch is turned on, the collector is communicated with the point inspection loop through the point inspection change-over switch. By arranging a point inspection loop and a point inspection change-over switch, a point inspection function is set in the monitoring device, self-inspection of the device is realized, and the stability of operation of the ESD grounding monitoring device is ensured.
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Description

Technical Field

[0001] The present application relates to the technical field of equipment detection, and in particular to an automatic spot inspection device for an ESD grounding monitoring device. Background Art

[0002] In the electronics industry, semiconductor manufacturing, and other technical fields, static electricity is a significant potential hazard in production, causing damage to electronic components, data loss, damage to sensitive electronic components, chip damage, and dust absorption. To prevent these hazards, ESD grounding monitoring devices are gaining increasing attention in related industries and are being adopted by a growing number of companies. However, the accuracy and effectiveness of the monitoring data are currently not effectively managed. Without data spot checks on monitoring equipment, the detected data cannot be guaranteed. When the monitoring device itself encounters errors or its own data errors are large, and there is no standard data comparison, data invalidation and ESD protection failure can occur, leading to product device damage and data loss, thus hindering the healthy development of the industry. Current ESD grounding monitoring devices lack self-test functions, forcing some companies to invest significant manpower and material resources in data spot checks. However, most companies do not directly use the monitoring devices for spot checks due to cost constraints. Utility Model Content

[0003] In view of the above problems, the present application is proposed to provide an automatic spot inspection device for an ESD grounding monitoring device that overcomes the above problems or at least partially solves the above problems, comprising:

[0004] An automatic spot inspection device for an ESD grounding monitoring device, comprising a controller, a collector, a spot inspection switch, a spot inspection circuit, and a monitor;

[0005] The controller is connected to the collector, and the collector is connected to the monitor and the inspection circuit respectively through the inspection switch; the inspection circuit is provided with a standard resistor, and the resistance of the standard resistor corresponds to the monitoring resistance of the monitor;

[0006] When the spot inspection switch is turned off, the collector is connected to the monitor through the spot inspection switch;

[0007] When the spot inspection switch is turned on, the collector is connected to the spot inspection circuit through the spot inspection switch.

[0008] Furthermore, the collector includes a wristband grounding acquisition circuit, a table mat grounding acquisition circuit and a device grounding acquisition circuit; the wristband grounding acquisition circuit, the table mat grounding acquisition circuit and the device grounding acquisition circuit are all connected to the controller;

[0009] The monitor includes a wristband grounding monitoring circuit, a table mat grounding monitoring circuit and an equipment grounding monitoring circuit; the inspection circuit includes a wristband inspection circuit, a table mat inspection circuit and an equipment inspection circuit; the inspection switching switch includes a first inspection switching switch, a second inspection switching switch and a third inspection switching switch; the wristband grounding monitoring circuit is connected to the wristband grounding acquisition circuit and the wristband inspection circuit respectively through the first inspection switching switch, the table mat grounding monitoring circuit is connected to the table mat grounding acquisition circuit and the table mat inspection circuit respectively through the second inspection switching switch, and the equipment grounding monitoring circuit is connected to the equipment grounding acquisition circuit and the equipment inspection circuit respectively through the third inspection switching switch.

[0010] Furthermore, the wristband grounding monitoring circuit includes a first constant current source, a first impedance matching circuit and a first harmonic filtering circuit;

[0011] The first constant current source is connected to the first harmonic filtering circuit, the first harmonic filtering circuit is connected to the first inspection switching switch, and the first impedance matching circuit is connected to the constant current source and the first harmonic filtering circuit; the first impedance matching circuit is used to form impedance matching with the first constant current source.

[0012] Furthermore, the table mat grounding monitoring circuit includes a second constant current source, a second impedance matching circuit and a second harmonic filtering circuit;

[0013] The second constant current source is connected to the second harmonic filter circuit, the second harmonic filter circuit is connected to the second inspection switch, and the second impedance matching circuit is connected to the constant current source and the second harmonic filter circuit; the second impedance matching circuit is used to form impedance matching with the second constant current source.

[0014] Furthermore, the equipment grounding monitoring circuit includes a third constant current source, a third impedance matching circuit and a third harmonic filtering circuit;

[0015] The third constant current source is connected to the third filter circuit, the third filter circuit is connected to the third inspection switch, and the third impedance matching circuit is connected to the constant current source and the third harmonic filter circuit; the third impedance matching circuit is used to form impedance matching with the third constant current source.

[0016] Furthermore, the controller is a single chip microcomputer.

[0017] Furthermore, the standard resistor includes a first standard resistor, a second standard resistor and a third standard resistor;

[0018] The first standard resistor is set in the wristband inspection circuit, and the resistance range of the first standard resistor is 1KΩ-50MΩ;

[0019] The second standard resistor is set in the table pad inspection circuit, and the resistance range of the second standard resistor is 1KΩ-100MΩ;

[0020] The third standard resistor is set in the equipment inspection circuit, and the resistance range of the third standard resistor is 0.1Ω-100Ω.

[0021] Furthermore, the inspection circuit and the monitor are both grounded.

[0022] Furthermore, it also includes a data processor, which is connected to the collector and is used to process and calculate the data collected by the collector.

[0023] Furthermore, it also includes a memory, which is connected to the collector and is used to store the data collected by the collector.

[0024] This application has the following advantages:

[0025] In the embodiments of the present application, compared with the shortcomings of the prior art grounding monitoring device that has no self-test function and requires a lot of manpower and material resources for detection, the present application provides a solution for setting up a spot inspection structure inside the device to perform device self-test, specifically an automatic spot inspection device for an ESD grounding monitoring device, including a controller, a collector, a spot inspection switch, a spot inspection circuit and a monitor; the controller is connected to the collector, and the collector is connected to the monitor and the spot inspection circuit respectively through the spot inspection switch; the spot inspection circuit is provided with a standard resistor, and the resistance of the standard resistor corresponds to the monitoring resistance of the monitor; when the spot inspection switch is closed, the collector is connected to the monitor through the spot inspection switch; when the spot inspection switch is turned on, the collector is connected to the spot inspection circuit through the spot inspection switch. By setting up the spot inspection circuit and the spot inspection switch, the monitoring device is provided with a spot inspection function, the self-test of the device is realized, and the stability of the operation of the ESD grounding monitoring device is ensured. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] In order to more clearly illustrate the technical solution of the present application, the following is a brief introduction to the drawings required for the description of the present application. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0027] Figure 1 This is a circuit diagram of an automatic spot inspection device for an ESD grounding monitoring device provided in one embodiment of the present application;

[0028] Figure 2 This is a circuit diagram of a wristband electrostatic monitoring portion of an automatic inspection device for an ESD grounding monitoring device provided in one embodiment of the present application;

[0029] Figure 3 This is a circuit diagram of a mat electrostatic monitoring portion of an automatic inspection device for an ESD grounding monitoring device provided in one embodiment of the present application;

[0030] Figure 4 This is a circuit diagram of the equipment electrostatic monitoring portion of an automatic inspection device for an ESD grounding monitoring device provided in one embodiment of the present application. DETAILED DESCRIPTION

[0031] To make the objectives, features, and advantages of this application more readily apparent, the present application is further described below in conjunction with the accompanying drawings and specific embodiments. It is apparent that the embodiments described are only a portion of the embodiments of this application, not all of them. All other embodiments derived by persons of ordinary skill in the art based on the embodiments in this application without inventive effort are also within the scope of protection of this application.

[0032] By analyzing the existing technology, the inventors found that the monitoring equipment in the existing technology does not have a built-in inspection function when in use. Without data inspection, the detected data cannot be guaranteed. When an error occurs in the monitoring device itself or the data error itself is too large, and no standard data comparison is obtained, it will cause data failure and electrostatic protection failure, resulting in damage to product components and data loss, etc., which restricts the healthy development of the industry.

[0033] Reference Figure 1-2 , shows an automatic inspection device for an ESD grounding monitoring device provided by an embodiment of the present application, including a controller, a collector, an inspection switching switch, an inspection circuit and a monitor; the controller is connected to the collector, and the collector is connected to the monitor and the inspection circuit respectively through the inspection switching switch; the inspection circuit is provided with a standard resistor, and the resistance of the standard resistor corresponds to the monitoring resistance of the monitor; when the inspection switching switch is closed, the collector is connected to the monitor through the inspection switching switch; when the inspection switching switch is turned on, the collector is connected to the inspection circuit through the inspection switching switch.

[0034] In the embodiments of the present application, compared with the shortcomings of the prior art grounding monitoring device that has no self-test function and requires a lot of manpower and material resources for detection, the present application provides a solution for setting up a spot inspection structure inside the device to perform device self-test, specifically an automatic spot inspection device for an ESD grounding monitoring device, including a controller, a collector, a spot inspection switch, a spot inspection circuit and a monitor; the controller is connected to the collector, and the collector is connected to the monitor and the spot inspection circuit respectively through the spot inspection switch; the spot inspection circuit is provided with a standard resistor, and the resistance of the standard resistor corresponds to the monitoring resistance of the monitor; when the spot inspection switch is closed, the collector is connected to the monitor through the spot inspection switch; when the spot inspection switch is turned on, the collector is connected to the spot inspection circuit through the spot inspection switch. By setting up the spot inspection circuit and the spot inspection switch, the monitoring device is provided with a spot inspection function, the self-test of the device is realized, and the stability of the operation of the ESD grounding monitoring device is ensured.

[0035] It should be noted that by setting the inspection switch and correspondingly setting the standard resistor, the detection status of the monitoring equipment is determined by the standard resistor, the accuracy of the detection function is ensured, and the detection data is calibrated.

[0036] Next, an automatic spot inspection device for an ESD grounding monitoring device in this exemplary embodiment will be further described.

[0037] In one embodiment of the present application, the collector includes a wristband grounding collection circuit, a table mat grounding collection circuit, and a device grounding collection circuit; the wristband grounding collection circuit, the table mat grounding collection circuit, and the device grounding collection circuit are all connected to the controller;

[0038] The monitor includes a wristband grounding monitoring circuit, a table mat grounding monitoring circuit and an equipment grounding monitoring circuit; the inspection circuit includes a wristband inspection circuit, a table mat inspection circuit and an equipment inspection circuit; the inspection switching switch includes a first inspection switching switch, a second inspection switching switch and a third inspection switching switch; the wristband grounding monitoring circuit is connected to the wristband grounding acquisition circuit and the wristband inspection circuit respectively through the first inspection switching switch, the table mat grounding monitoring circuit is connected to the table mat grounding acquisition circuit and the table mat inspection circuit respectively through the second inspection switching switch, and the equipment grounding monitoring circuit is connected to the equipment grounding acquisition circuit and the equipment inspection circuit respectively through the third inspection switching switch.

[0039] It should be noted that the collector includes a wristband grounding collection circuit, a table mat grounding collection circuit and an equipment grounding collection circuit. The electrostatic monitoring equipment can perform electrostatic detection on operators, equipment and table mats, and also perform spot checks on each circuit separately, using corresponding standard resistors for spot checks to ensure the stability of equipment monitoring.

[0040] In one embodiment of the present application, the wristband grounding monitoring circuit includes a first constant current source, a first impedance matching circuit, and a first harmonic filtering circuit;

[0041] The first constant current source is connected to the first harmonic filtering circuit, the first harmonic filtering circuit is connected to the first inspection switching switch, and the first impedance matching circuit is connected to the constant current source and the first harmonic filtering circuit; the first impedance matching circuit is used to form impedance matching with the first constant current source.

[0042] In a specific implementation, referring to Figure 2 , R1, D1, and C1 constitute a constant current source, C3 and R3 constitute a harmonic filtering circuit, U1A, R4, R2, and C2 constitute an impedance matching circuit, and K1 constitutes a W automatic point inspection I / O controller.

[0043] When the wristband ESD monitoring device does not receive a spot check instruction, the W automatic spot check I / O control device is in standby mode, W1 and W2 are turned on, and the constant current source outputs an excitation current IW that passes through WI-W2 and then through the connecting wire to the human body model contact resistance SWR, and then through the loop wire to the ESD release ground, forming a loop and completing the normal ground resistance monitoring. The ADC collects the voltage according to Ohm's law:

[0044] V=IW*SWR

[0045] The ADC sends the detected value to the MCU computing center for processing.

[0046] When the wristband static monitoring part of the static monitoring device receives the inspection instruction, the W automatic inspection I / O control device is in working state, W1 and W3 are turned on, and the constant current source outputs the excitation current IW through WI-W3 to the wristband standard resistor device WR, forming an inspection circuit.

[0047] The ADC acquisition voltage is known from Ohm's law:

[0048] V=IW*WR

[0049] The ADC sends the detected value to the MCU computing center for processing

[0050] Since WR is a standard value, the AD voltage value obtained should be a standard value. For example, if the instruction sent by the MCU collects the standard resistance of the wristband 35MΩ and the returned data is 35MΩ, it means that the collection device is normal, otherwise it is considered abnormal.

[0051] In one embodiment of the present application, the table mat grounding monitoring circuit includes a second constant current source, a second impedance matching circuit, and a second harmonic filtering circuit;

[0052] The second constant current source is connected to the second harmonic filter circuit, the second harmonic filter circuit is connected to the second inspection switch, and the second impedance matching circuit is connected to the constant current source and the second harmonic filter circuit; the second impedance matching circuit is used to form impedance matching with the second constant current source.

[0053] In a specific implementation, referring to Figure 3 , R5, D2, and C4 constitute a constant current source, C6 and R7 constitute a harmonic filtering circuit, U3A, R8, R6, and C5 constitute impedance matching, and K2 constitutes an M automatic point inspection I / O controller.

[0054] When the static monitoring part of the static monitoring device does not receive the inspection instruction, the M automatic inspection I / O control device is in standby state, M1 and M2 are turned on, and the constant current source outputs the excitation current IM, which passes through MI-M2 and then through the connecting wire to the pad model contact resistance SMR, and then through the loop wire to the static discharge ground, forming a loop to complete the normal ground resistance monitoring. The ADC collects the voltage according to Ohm's law:

[0055] V=IM*SMR

[0056] The ADC sends the detected value to the MCU computing center for processing.

[0057] When the static monitoring part of the static monitoring device receives the inspection instruction, the M automatic inspection I / O control device is in working state, M1 and M3 are turned on, and the constant current source outputs the excitation current IM, which passes through MI-M3 and reaches the standard resistance device MR of the mat, forming an inspection circuit. The voltage collected by ADC is obtained by Ohm's law:

[0058] V=IM*MR

[0059] The ADC sends the detected value to the MCU computing center for processing.

[0060] Since MR is a standard value, the AD voltage value obtained should be a standard value. For example, if the instruction sent by the MCU collects the standard resistance value of the pad as 10MΩ, and the returned data is 10MΩ, it means that the acquisition device is normal, otherwise it is considered abnormal.

[0061] In one embodiment of the present invention, the equipment grounding monitoring circuit includes a third constant current source, a third impedance matching circuit and a third harmonic filtering circuit;

[0062] The third constant current source is connected to the third filter circuit, the third filter circuit is connected to the third inspection switch, and the third impedance matching circuit is connected to the constant current source and the third harmonic filter circuit; the third impedance matching circuit is used to form impedance matching with the third constant current source.

[0063] In a specific implementation, referring to Figure 4 , R11, D3, C7, R12, and CE11 constitute a constant current source, C8 and R14 constitute a harmonic filtering circuit, U4, R9, R10, R13, and R15 constitute an AD conversion circuit, and K3 constitutes an E automatic inspection I / O controller.

[0064] When the static monitoring part of the static monitoring device does not receive the inspection instruction, the E automatic inspection I / O control device is in standby state, E1 and E2 are turned on, and the constant current source outputs the excitation current IE, which passes through EI-E2 and then through the connecting wire to the equipment model contact resistance SER, and then through the loop wire to the static discharge ground, forming a loop and completing the normal ground resistance monitoring. The ADC collects the voltage according to Ohm's law:

[0065] V=IE*SER

[0066] The ADC sends the detected value to the MCU computing center for processing

[0067] When the static monitoring part of the static monitoring device receives the inspection instruction, the E automatic inspection I / O control device is in working state, E1 and E3 are turned on, and the constant current source outputs the excitation current IE and then passes through EI-E3 to the equipment standard resistor device ER, forming an inspection circuit. The ADC collects the voltage according to Ohm's law:

[0068] V=IE*ER

[0069] The ADC sends the detected value to the MCU operation center for processing. Since ER is a standard value, the obtained AD voltage value should be a standard value. For example, if the instruction issued by the MCU is that the standard resistance value of the acquisition device is 2Ω, and the returned data is 2Ω, it means that the acquisition device is normal, otherwise it is considered abnormal.

[0070] In one embodiment of the present invention, the controller is a single chip microcomputer.

[0071] In a specific implementation, referring to Figure 1 , the controller is U2.

[0072] In one embodiment of the present invention, the standard resistor includes a first standard resistor, a second standard resistor and a third standard resistor;

[0073] The first standard resistor is set in the wristband inspection circuit, and the resistance range of the first standard resistor is 1KΩ-50MΩ;

[0074] The second standard resistor is set in the table pad inspection circuit, and the resistance range of the second standard resistor is 1KΩ-100MΩ;

[0075] The third standard resistor is set in the equipment inspection circuit, and the resistance range of the third standard resistor is 0.1Ω-100Ω.

[0076] It should be noted that the first standard resistor is used for anti-static wrist strap grounding monitoring, the second standard resistor is used for anti-static table mat grounding monitoring, and the third standard resistor is used for anti-static equipment grounding monitoring. Different standard resistors are selected according to different equipment and production to facilitate calibration of the monitoring equipment.

[0077] In one embodiment of the present invention, the spot inspection circuit and the monitor are both grounded.

[0078] In one embodiment of the present invention, a data processor is further included. The data processor is connected to the collector and is used to process and calculate the data collected by the collector.

[0079] It should be noted that the data processor is used to collect and process data, transmit the detected information to the controller through digital or analog signals, and provide feedback on abnormal data and push it to related equipment.

[0080] In one embodiment of the present invention, a memory is further included, which is connected to the collector and is used to store the data collected by the collector.

[0081] It should be noted that the storage device is used to centrally manage and analyze data, and store the detected data according to a certain data storage model, thereby realizing functions such as big data management, intelligent anomaly summary, intelligent report analysis and intelligent data tracking.

[0082] Although preferred embodiments of the present invention have been described, those skilled in the art may make additional changes and modifications to these embodiments once they become aware of the basic inventive concepts. Therefore, the appended claims are intended to be interpreted as including the preferred embodiments and all changes and modifications that fall within the scope of the embodiments of the present invention.

[0083] Finally, it should be noted that, in this document, relational terms such as first and second, etc., are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the terms "comprises," "comprising," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or terminal device that includes a series of elements includes not only those elements, but also other elements not explicitly listed, or elements inherent to such process, method, article, or terminal device. In the absence of further limitations, an element defined by the phrase "comprising a ..." does not exclude the presence of additional identical elements in the process, method, article, or terminal device that includes the element.

[0084] The above is a detailed introduction to an automatic inspection device for an ESD grounding monitoring device provided by the present application. Specific examples are used in this article to illustrate the principles and implementation methods of the present application. The description of the above embodiments is only used to help understand the method of the present application and its core idea; at the same time, for general technical personnel in this field, based on the ideas of the present application, there will be changes in the specific implementation methods and application scope. In summary, the content of this specification should not be understood as a limitation on the present application.

Claims

1. An automatic spot inspection device for an ESD grounding monitoring device, characterized in that: Including controller, collector, inspection switch, inspection loop and monitor; The controller is connected to the collector, and the collector is connected to the monitor and the inspection circuit respectively through the inspection switch; the inspection circuit is provided with a standard resistor, and the resistance of the standard resistor corresponds to the monitoring resistance of the monitor; When the spot inspection switch is turned off, the collector is connected to the monitor through the spot inspection switch; When the spot inspection switch is turned on, the collector is connected to the spot inspection circuit through the spot inspection switch.

2. The automatic inspection device according to claim 1, characterized in that: The collector includes a wristband grounding collection circuit, a table mat grounding collection circuit and a device grounding collection circuit; the wristband grounding collection circuit, the table mat grounding collection circuit and the device grounding collection circuit are all connected to the controller; The monitor includes a wristband grounding monitoring circuit, a table mat grounding monitoring circuit and an equipment grounding monitoring circuit; the inspection circuit includes a wristband inspection circuit, a table mat inspection circuit and an equipment inspection circuit; the inspection switching switch includes a first inspection switching switch, a second inspection switching switch and a third inspection switching switch; the wristband grounding monitoring circuit is connected to the wristband grounding acquisition circuit and the wristband inspection circuit respectively through the first inspection switching switch, the table mat grounding monitoring circuit is connected to the table mat grounding acquisition circuit and the table mat inspection circuit respectively through the second inspection switching switch, and the equipment grounding monitoring circuit is connected to the equipment grounding acquisition circuit and the equipment inspection circuit respectively through the third inspection switching switch.

3. The automatic spot inspection device according to claim 2, characterized in that: The wristband grounding monitoring circuit includes a first constant current source, a first impedance matching circuit and a first harmonic filtering circuit; The first constant current source is connected to the first harmonic filtering circuit, the first harmonic filtering circuit is connected to the first inspection switching switch, and the first impedance matching circuit is connected to the constant current source and the first harmonic filtering circuit; the first impedance matching circuit is used to form impedance matching with the first constant current source.

4. The automatic spot inspection device according to claim 2, characterized in that: The table mat grounding monitoring circuit includes a second constant current source, a second impedance matching circuit and a second harmonic filtering circuit; The second constant current source is connected to the second harmonic filter circuit, the second harmonic filter circuit is connected to the second inspection switch, and the second impedance matching circuit is connected to the constant current source and the second harmonic filter circuit; the second impedance matching circuit is used to form impedance matching with the second constant current source.

5. The automatic inspection device according to claim 2, characterized in that: The equipment grounding monitoring circuit includes a third constant current source, a third impedance matching circuit and a third harmonic filtering circuit; The third constant current source is connected to the third harmonic filter circuit, the third harmonic filter circuit is connected to the third inspection switch, and the third impedance matching circuit is connected to the constant current source and the third harmonic filter circuit; the third impedance matching circuit is used to form impedance matching with the third constant current source.

6. The automatic inspection device according to claim 1, characterized in that: The controller is a single chip microcomputer.

7. The automatic spot inspection device according to claim 2, characterized in that: The standard resistors include a first standard resistor, a second standard resistor and a third standard resistor; The first standard resistor is set in the wristband inspection circuit, and the resistance range of the first standard resistor is 1KΩ-50MΩ; The second standard resistor is set in the table pad inspection circuit, and the resistance range of the second standard resistor is 1KΩ-100MΩ; The third standard resistor is set in the equipment inspection circuit, and the resistance range of the third standard resistor is 0.1Ω-100Ω.

8. The automatic spot inspection device according to claim 1, characterized in that: The spot inspection circuit and the monitor are both grounded.

9. The automatic inspection device according to claim 1, characterized in that: It also includes a data processor, which is connected to the collector and is used to process and calculate the data collected by the collector.

10. The automatic spot inspection device according to claim 1, characterized in that: It also includes a memory, which is connected to the collector and is used to store the data collected by the collector.