Radiator with air guide structure

Abstract

An embodiment of the utility model discloses a radiator with an air guide structure, which comprises a central processing unit (CPU) radiator and a plurality of front radiators, the front radiators are positioned at the front end of the CPU radiator, and air guide parts are arranged between the front radiators and the CPU radiator. And the front radiator and the CPU radiator are enclosed by the air guide piece to form an air guide space. Compared with a traditional EVAC radiator air guide structure, the air guide structure is arranged in the space of the radiator, and the air inlet amount of the CPU radiator and the remote end can be adjusted under the condition that the space is not increased.

Description

Technical Field

[0001] The utility model relates to the technical field of server heat dissipation, in particular to a radiator with an air guide structure. Background Art

[0002] Patent publication number (CN217847002U) discloses a server air scoop that proposes adding an air baffle to the scoop. The baffle is located at the front of the EVAC radiator and can adjust the air intake of the EVAC CPU radiator and the remote end. The patent requires sufficient space in front of the remote end of the EVAC radiator to properly place the air baffle. However, with the diversification of end-user needs, servers need to support more and more configurations, which means that the number of cables connected to the motherboard is constantly increasing, and the space for the radiator is constantly being compressed. Adding an air guide structure at the front of the remote end of the radiator will further squeeze the available space of the radiator. Utility Model Content

[0003] The purpose of the utility model is to provide a radiator with an air guide structure, aiming to solve the technical problem that the air guide structure of the existing EVAC radiator squeezes the available space of the radiator.

[0004] In order to solve the above technical problems, the purpose of this utility model is achieved through the following technical solutions:

[0005] The utility model provides a radiator with an air guide structure, comprising a CPU radiator and a plurality of front radiators, wherein the front radiators are located at the front end of the CPU radiator, and air guide members are provided between the front radiators and the CPU radiators, and the front radiators and the CPU radiators are enclosed by the air guide members to form an air guide space.

[0006] Furthermore, a mounting plate is provided at the bottom of the front radiator, and the front radiator is fixedly mounted on the mounting plate. A radiator base is provided at the bottom of the CPU radiator, and the CPU radiator is fixedly mounted on the radiator base.

[0007] Furthermore, the air guide member includes a first air guide plate and a second air guide plate, the first air guide plate is connected to the second air guide plate and is perpendicular to each other, the first air guide plate is fixedly connected to the mounting plate, and the second air guide plate is fixedly connected to the radiator base.

[0008] Furthermore, the first air guide plate is provided with a first bending portion and a second bending portion, the first bending portion is connected to the top of the second bending portion, the first bending portion is attached to and fixed to the mounting plate, and the bottom edge of the second air guide plate is provided with a third bending portion, and the first bending portion, the second bending portion and the third bending portion are all right-angle bends.

[0009] Furthermore, the second bending portion and the third bending portion are both attached with foam.

[0010] Furthermore, the front end of the front radiator is a remote end, and a cooling fan is provided at the remote end.

[0011] Furthermore, the front radiator and the CPU radiator are both composed of a plurality of heat pipes and heat dissipation fins, and the front radiator and the CPU radiator are connected through the heat pipes.

[0012] Furthermore, the heat pipe includes an evaporation end and a condensation end, the evaporation end is located at the mounting plate and the radiator base, and the condensation end is located at the heat dissipation fins.

[0013] Furthermore, a working medium is provided inside the heat pipe.

[0014] Furthermore, the first air guide plate is detachably connected to the mounting plate, and the second air guide plate is detachably connected to the radiator base.

[0015] Compared to existing technologies, this invention offers the following advantages: By placing an air guide between the front radiator and the CPU radiator, the air guide creates an air guide space between the front radiator and the CPU radiator. Airflow is directed from the remote end into the air guide space and then flows out through the CPU radiator. Compared to traditional EVAC radiator air guides, this invention incorporates the air guide within the radiator space, allowing for adjustable airflow to the CPU radiator and the remote end without increasing space. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0017] Figure 1 A schematic structural diagram of a radiator with an air guide structure provided in an embodiment of the present utility model;

[0018] Figure 2 An axonometric diagram of a heat sink with an air guide structure provided by an embodiment of the present invention;

[0019] Figure 3 A schematic diagram of the front structure of a radiator with an air guide structure provided by an embodiment of the present utility model;

[0020] Figure 4A schematic diagram of the back structure of a radiator with an air guide structure provided in an embodiment of the present invention.

[0021] Reference numerals:

[0022] 1. CPU radiator; 11. Heat pipe; 111. Evaporation end; 112. Condensation end; 12. Heat sink fins; 2. Front radiator; 21. Remote end; 3. Air guide; 31. First air guide plate; 311. First bending portion; 312. Second bending portion; 32. Second air guide plate; 321. Third bending portion; 4. Air guide space; 5. Mounting plate; 6. Radiator base; 7. Foam. DETAILED DESCRIPTION

[0023] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0024] It will be understood that when used in this specification and the appended claims, the terms “comprises” and “comprising” indicate the presence of described features, integers, steps, operations, elements and / or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components and / or groups thereof.

[0025] It should also be understood that the terms used in this utility model specification are only for the purpose of describing specific embodiments and are not intended to limit the utility model. As used in this utility model specification and the appended claims, the singular forms "a", "an" and "the" are intended to include plural forms unless the context clearly indicates otherwise.

[0026] It should be further understood that the term “and / or” used in the present specification and the appended claims refers to any and all possible combinations of one or more of the associated listed items, and includes these combinations.

[0027] See also Figures 1 to 4 The specific embodiment of the present invention discloses a radiator with an air guide structure, including a CPU radiator 1 and several front radiators 2. The front radiator 2 is located at the front end of the CPU radiator 1. An air guide 3 is provided between the front radiator 2 and the CPU radiator 1. The front radiator 2 and the CPU radiator 1 are enclosed by the air guide 3 to form an air guide space 4.

[0028] Specifically, in this embodiment, there are two front radiators 2, and the two front radiators 2 are symmetrically and spaced apart at the front end of the CPU radiator 1. By adding an air guide 3 between the CPU radiator 1 and the front radiator 2, the air intake of the memory on both sides of the radiator is reduced, and the air intake of the CPU radiator 1 will be increased. For the case where the CPU has a heat dissipation bottleneck, this method can effectively reduce the heat dissipation risk of the CPU, and the air guide 3 is located between the CPU radiator 1 and the front radiator 2, rather than at the front end of the front radiator 2. This method can place high components or cables on the motherboard in front of the front radiator 2 to support more configurations.

[0029] like Figure 3-4 As shown, a mounting plate 5 is provided at the bottom of the front radiator 2 , and the front radiator 2 is fixedly mounted on the mounting plate 5 . A radiator base 6 is provided at the bottom of the CPU radiator 1 , and the CPU radiator 1 is fixedly mounted on the radiator base 6 .

[0030] Specifically, the mounting plate 5 and the heat dissipation base are both made of high-strength, corrosion-resistant and thermally conductive metal materials, such as aluminum alloy or stainless steel, to ensure that they can bear the weight of the front radiator 2 and the heat dissipation body and effectively conduct heat. The contact surface between the heat dissipation base and the CPU is flat and seamless to ensure effective heat transfer.

[0031] like Figure 2 and Figure 4 As shown, the air guide member 3 includes a first air guide plate 31 and a second air guide plate 32. The first air guide plate 31 and the second air guide plate 32 are connected and perpendicular to each other. The first air guide plate 31 is fixedly connected to the mounting plate 5, and the second air guide plate 32 is fixedly connected to the radiator base 6.

[0032] Specifically, the air guide space 4 is enclosed by two air guides 3 between the CPU heat sink 1 and the front heat sink 2. Air enters from the front end of the front heat sink 2 and, guided by the air guides 3, is concentrated and transported to the CPU heat sink 1 before being discharged from the air outlet. This design effectively guides the airflow, allowing it to enter the heat sink along a predetermined path, undergo heat exchange through the cooling fins 12 of the CPU heat sink 1, and finally be discharged from the air outlet of the heat sink. This not only ensures that the airflow can pass smoothly through the heat sink, but also, by guiding the direction and speed of the airflow, allows more cold air to contact the cooling fins 12, thereby accelerating the transfer and dissipation of heat.

[0033] like Figure 2 and Figure 4As shown, the first air guide plate 31 is provided with a first bending portion 311 and a second bending portion 312, the first bending portion 311 is connected to the top of the second bending portion 312, the first bending portion 311 is attached to and fixed to the mounting plate 5, and the bottom edge of the second air guide plate 32 is provided with a third bending portion 321, and the first bending portion 311, the second bending portion 312 and the third bending portion 321 are all right-angled bends.

[0034] Specifically, these bent portions not only enhance the strength and stability of the air guide plate, but also optimize the connection mode and sealing effect between the air guide plate, the mounting plate 5 and the radiator base 6, thereby further improving the overall performance and reliability of the radiator.

[0035] like Figure 2 As shown, the second bending portion 312 and the third bending portion 321 are both attached with foam 7 .

[0036] Specifically, due to layout restrictions, there may be high components between the CPU radiator 1 and the front radiator 2. In order to prevent the air guide 3 from damaging the high components on the motherboard during the disassembly and assembly of the radiator, and at the same time taking into account the disassembly and maintenance of the memory, the foam 7 can be affixed while bending the bottom of the air guide 3. The foam 7 can play a certain buffering role. Adding the bent part can not only facilitate the fixation of the foam 7, but also avoid high components, and at the same time does not affect the disassembly and assembly of the memory.

[0037] like Figure 3 As shown, the front end of the front radiator 2 is a remote end 21, and the remote end 21 is provided with a cooling fan (not shown in the figure).

[0038] Specifically, the distal end 21 refers to the end of the front radiator 2 that faces the airflow inlet and is the primary direction from which heat is discharged. In the overall layout of the radiator, the distal end 21 is typically located at the very front or top of the radiator to facilitate directing airflow into the radiator. In the design of the distal end 21, sufficient space must be reserved for installing a cooling fan, and the fan's air inlet must be connected to the radiator's air guide space 4. The cooling fan directs airflow from the distal end 21 into the air guide space 4 and out through the heat dissipation body.

[0039] like Figure 3 As shown, the front radiator 2 and the CPU radiator 1 are both composed of a plurality of heat pipes 11 and heat dissipation fins 12 , and the front radiator 2 and the CPU radiator 1 are connected via the heat pipes 11 .

[0040] Specifically, several heat pipes 11 are embedded within both the front radiator 2 and the CPU radiator 1. These heat pipes 11 act as efficient heat transfer elements, rapidly transferring heat generated by heat sources such as the CPU to the cooling fins 12. The number and diameter of the heat pipes 11 can be designed based on the radiator's heat dissipation requirements to ensure sufficient heat conduction capacity. The front radiator 2 and the CPU radiator 1 are tightly connected via the heat pipes 11, forming a highly efficient heat dissipation system. This design not only improves heat dissipation efficiency but also simplifies radiator installation and maintenance.

[0041] like Figure 2-3 As shown, the heat pipe 11 includes an evaporation end 111 and a condensation end 112 . The evaporation end 111 is located at the mounting plate 5 and the radiator base 6 , and the condensation end 112 is located at the heat dissipation fins 12 .

[0042] Specifically, the evaporation end 111 is usually placed on the side of the radiator close to the heat source so that it can directly absorb heat from the heat source, and the condensation end 112 is located on the side of the radiator away from the heat source, and is usually connected to the heat dissipation fins 12 or other heat dissipation structures to dissipate the absorbed heat into the air.

[0043] In an optional embodiment, a working medium is provided inside the heat pipe 11 .

[0044] Specifically, the working media include water, ethylene glycol, helium, nitrogen, etc., as well as liquid metals such as sodium and potassium that may be used in some special applications. The specific working medium varies depending on product design and application requirements.

[0045] In an EVAC radiator, the evaporation end 111 and the condensation end 112 are connected by a steam channel inside the heat pipe 11, forming a closed-loop heat transfer system. When the evaporation end 111 absorbs heat and causes the working medium to evaporate, the steam flows along the channel to the condensation end 112. At the condensation end 112, the steam releases heat and condenses into a liquid. Then, through capillary action or gravity, it returns to the evaporation end 111, completing a complete heat transfer cycle. During this process, the working medium absorbs heat from the evaporation end 111 and transfers it to the condensation end 112. The cooling fan dissipates the heat absorbed from the condensation end 112 by the heat sink fins 12 into the air, thereby improving the overall heat dissipation efficiency of the radiator.

[0046] In an optional embodiment, the first air guide plate 31 is detachably connected to the mounting plate 5, and the second air guide member 32 is detachably connected to the radiator base 6. The detachable connection includes a threaded connection, a snap connection, a hinge connection, a pin connection, etc., and an appropriate connection method can be selected according to the specific situation.

[0047] Specifically, the air guide 3 is a detachable component, and its design and installation process take into account possible future adjustments and maintenance needs. Through simple removal and replacement, the size and shape of the air guide space 4 can be easily adjusted to suit different heat dissipation requirements and working environments. This also facilitates cleaning and maintenance of the air guide space 4, keeping it unobstructed and ensuring continuous and stable heat dissipation.

[0048] The above description is merely a specific embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any person skilled in the art can easily conceive of various equivalent modifications or substitutions within the technical scope disclosed in the present invention, and such modifications or substitutions are intended to be within the scope of protection of the present invention. Therefore, the scope of protection of the present invention shall be subject to the scope of protection of the claims.

Claims

1. A radiator with an air guide structure, characterized in that: It includes a CPU radiator and several front radiators, the front radiator is located at the front end of the CPU radiator, and an air guide is provided between the front radiator and the CPU radiator. The front radiator and the CPU radiator are enclosed by the air guide to form an air guide space.

2. The heat sink with an air guide structure according to claim 1, characterized in that: A mounting plate is provided at the bottom of the front radiator, and the front radiator is fixedly mounted on the mounting plate. A radiator base is provided at the bottom of the CPU radiator, and the CPU radiator is fixedly mounted on the radiator base.

3. The heat sink with an air guide structure according to claim 2, characterized in that: The air guide member includes a first air guide plate and a second air guide plate, the first air guide plate and the second air guide plate are connected and perpendicular to each other, the first air guide plate is fixedly connected to the mounting plate, and the second air guide plate is fixedly connected to the radiator base.

4. The heat sink with an air guide structure according to claim 3, characterized in that: The first air guide plate is provided with a first bending portion and a second bending portion, the first bending portion is connected to the top of the second bending portion, the first bending portion is attached to and fixed to the mounting plate, and the bottom edge of the second air guide plate is provided with a third bending portion, and the first bending portion, the second bending portion and the third bending portion are all right-angled bends.

5. The heat sink with an air guide structure according to claim 4, characterized in that: The second bending portion and the third bending portion are both attached with foam.

6. The heat sink with an air guide structure according to claim 1, characterized in that: The front end of the front radiator is a remote end, and a cooling fan is provided at the remote end.

7. The heat sink with an air guide structure according to claim 2, characterized in that: The front radiator and the CPU radiator are both composed of a plurality of heat pipes and heat dissipation fins, and the front radiator and the CPU radiator are connected through the heat pipes.

8. The heat sink with an air guide structure according to claim 7, characterized in that: The heat pipe includes an evaporation end and a condensation end. The evaporation end is located at the mounting plate and the radiator base, and the condensation end is located at the heat dissipation fins.

9. The heat sink with an air guide structure according to claim 8, characterized in that: A working medium is provided inside the heat pipe.

10. The heat sink with an air guide structure according to claim 3, characterized in that: The first air guide plate is detachably connected to the mounting plate, and the second air guide plate is detachably connected to the radiator base.

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