Bonding capacitive radio frequency tag

Abstract

The utility model relates to a bonding capacitance type radio frequency tag, which is based on the fact that a basic radio frequency communication function is realized by a radio frequency main tag (1), at least one bonding capacitance module (2) is introduced, and specifically, two metal sheets are carried on two surfaces of a second bearing base material (2-4). The second bearing base material (2-4) bears thickness elastic deformation caused by pressure of the metal sheets on any surface of the second bearing base material (2-4), the effect of a shunt capacitor formed by the two metal sheets is changed, the frequency of the radio frequency tag is further shifted, the communication distance between the radio frequency tag and the reader-writer is shortened until signals are lost, and the radio frequency tag can be used for reading and writing. The displacement and extrusion states of the radio frequency tag are accurately detected, timely detection and timely alarm are realized, and the overall working efficiency of the radio frequency tag is improved.

Description

Technical Field

[0001] The utility model relates to a bonded capacitance type radio frequency tag, belonging to the technical field of radio frequency. Background Art

[0002] Ultra-high frequency (UHF) RFID tags are widely used in clothing, logistics, asset management, and other fields due to their advantages, such as passivity, group readability, low cost, and long-range identification. In certain application scenarios, the object to which the RFID tag is attached or surrounding objects may experience relative displacement or compression. Conventional RFID tags can only provide information transmission but cannot provide feedback on the specific extent of such displacement or compression. This means that they cannot accurately identify the occurrence of such conditions, resulting in inaccurate information feedback in actual applications, affecting the actual working efficiency of the RF chip. Utility Model Content

[0003] The technical problem to be solved by the utility model is to provide a bonded capacitive radio frequency tag, which is based on the radio frequency main tag and adds a bonded capacitor module. While realizing the interactive application of radio frequency signals, it can accurately detect the displacement and extrusion state of the tag and improve the working efficiency of the radio frequency chip.

[0004] In order to solve the above technical problems, the present invention adopts the following technical solutions: the present invention designs a bonded capacitor type radio frequency tag, including a radio frequency main tag and at least one bonded capacitor module. The structures of the bonded capacitor modules are the same. Each bonded capacitor module includes a first metal sheet, a second metal sheet, a conductive connection line, and a second carrier substrate with elastically deformed thickness. In the structure of each bonded capacitor module, the first metal sheet and the second metal sheet are respectively attached to the two sides of the second carrier substrate, and along the projection direction perpendicular to the surface of the second carrier substrate, the projection of the first metal sheet and the projection of the second metal sheet overlap with each other, one end of the conductive connection line is electrically connected to the first metal sheet; the other end of the conductive connection line in each bonded capacitor module is electrically connected to any radio frequency port on the radio frequency chip in the radio frequency main tag; each bonded capacitor module constitutes a parallel capacitor of the radio frequency main tag.

[0005] As a preferred technical solution of the present invention: the radio frequency main tag is based on the radio frequency chip it contains, and the radio frequency main tag also includes two radiating patches, two conductive connecting surfaces, a third metal sheet, and a first carrier substrate of a preset thickness; wherein, the two radiating patches are arranged on one surface of the first carrier substrate without being connected to each other, the radio frequency chip is arranged on the surface where the two radiating patches are arranged on the first carrier substrate, the two radio frequency ports of the radio frequency chip are electrically connected to the two radiating patches respectively, the third metal sheet is arranged on the other surface of the first carrier substrate, the two radiating patches and the two conductive connecting surfaces correspond to each other one by one, one side of each radiating patch extends along the surface where it is arranged to the edge of the first carrier substrate, each conductive connecting surface is arranged on the side of the substrate of the first carrier substrate to which the corresponding radiating patch extends, each radiating patch is electrically connected to the corresponding conductive connecting surface, the edges of the third metal sheet corresponding to the positions of each conductive connecting surface extend along the surface where it is arranged to the corresponding conductive connecting surface for electrical connection, and the third metal sheet constitutes the grounding of the radio frequency main tag.

[0006] As a preferred technical solution of the present invention: two radiation patches are distributed on both sides of the radio frequency chip in an axisymmetric distribution structure.

[0007] As a preferred technical solution of the present invention: at least one of the bonded capacitor modules has the surface on which the first metal sheet is provided on the second carrier substrate in the same direction as the surface on which the RF chip is provided on the first carrier substrate in the RF main tag, and the edge of the second carrier substrate in each bonded capacitor module is connected to the edge of the first carrier substrate.

[0008] As a preferred technical solution of the present invention: for the bonding capacitor modules belonging to the second carrier substrates connected to the edge of the first carrier substrate, the second metal sheets in each bonding capacitor module are respectively connected to the third metal sheet in the RF main tag.

[0009] As a preferred technical solution of the present invention: along the projection direction perpendicular to the surface of the second supporting substrate, the projection of the first metal sheet is located within the projection of the second metal sheet.

[0010] As a preferred technical solution of the present invention: the second supporting substrate in each bonded capacitor module is made of PE foam or EVA foam.

[0011] The bonded capacitive radio frequency tag described in the present invention has the following technical effects compared with the prior art by adopting the above technical solution:

[0012] The utility model designs a bonded capacitive RFID tag. While realizing basic RFID communication functions with a main RFID tag, it also introduces at least one bonded capacitor module design. Specifically, two metal sheets are mounted on two sides of a second carrier substrate. The elastic deformation of the thickness caused by the pressure from the metal sheets on any side of the second carrier substrate changes the effect of the parallel capacitance formed by the two metal sheets, thereby causing the RFID tag frequency to shift, shortening the communication distance between the RFID tag and the reader until the signal is lost. In other words, the displacement and extrusion state of the RFID tag can be accurately detected, and timely detection and alarm can be issued, thereby improving the overall working efficiency of the RFID tag. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 This is a 3D schematic diagram of the bonded capacitive radio frequency tag designed by the present invention;

[0014] Figure 2 This is a front view of the bonded capacitive radio frequency tag designed by the present invention;

[0015] Figure 3 This is a schematic diagram of the back of the bonded capacitive radio frequency tag designed in accordance with the present invention;

[0016] Figure 4 This is a schematic diagram of the back of the bonded capacitive radio frequency tag designed in accordance with the second embodiment of the present invention;

[0017] Figure 5 This is a schematic diagram showing the effects of different overlaps and compression levels between the upper and lower metal sheets in the bonded capacitor module on the frequency of the radio frequency tag when the bonded capacitor radio frequency tag designed by the present invention is used.

[0018] Among them: 1. RF main tag, 1-1. RF chip, 1-2. Radiating patch, 1-3. Conductive connection surface, 1-4. Third metal sheet, 1-5. First carrier substrate, 2. Bonded capacitor module, 2-1. First metal sheet, 2-2. Second metal sheet, 2-3. Conductive connection line, 2-4. Second carrier substrate. DETAILED DESCRIPTION

[0019] The specific implementation of the present invention will be further described in detail below with reference to the accompanying drawings.

[0020] The utility model designs a bonded capacitive radio frequency tag, which is used in practical applications, such as Figures 1 to 4As shown, the specific design includes a radio frequency main tag 1 and at least one bonding capacitor module 2. The structures of the bonding capacitor modules 2 are the same. Each bonding capacitor module 2 includes a first metal sheet 2-1, a second metal sheet 2-2, a conductive connection 2-3, and an insulating second carrier substrate 2-4 with elastically deformable thickness. In the structure of each bonding capacitor module 2, the first metal sheet 2-1 and the second metal sheet 2-2 are respectively attached to the two sides of the second carrier substrate 2-4, and along the projection direction perpendicular to the surface of the second carrier substrate 2-4, the projection of the first metal sheet 2-1 and the projection of the second metal sheet 2-2 overlap with each other. One end of the conductive connection 2-3 is electrically connected to the first metal sheet 2-1; the other end of the conductive connection 2-3 in each bonding capacitor module 2 is electrically connected to any one of the radio frequency ports on the radio frequency chip 1-1 in the radio frequency main tag 1; each bonding capacitor module 2 constitutes a parallel capacitor of the radio frequency main tag 1, and in actual application, the second carrier substrate 2-4 in each bonding capacitor module 2 is implemented using PE foam or EVA foam.

[0021] Regarding the technical solution design of the above-mentioned radio frequency main tag 1 with each bonding capacitor module 2, in actual application, for the radio frequency main tag 1, such as Figures 1 to 4 As shown, the specific design includes a radio frequency chip 1-1, two radiation patches 1-2, two conductive connection surfaces 1-3, a third metal sheet 1-4, and a first insulating carrier substrate 1-5 of a preset thickness; wherein the two radiation patches 1-2 are arranged on one surface of the first carrier substrate 1-5 without being connected to each other, the radio frequency chip 1-1 is arranged on the surface of the first carrier substrate 1-5 where the two radiation patches 1-2 are arranged, the two radio frequency ports of the radio frequency chip 1-1 are electrically connected to the two radiation patches 1-2 respectively, the third metal sheet 1-4 is arranged on the other surface of the first carrier substrate 1-5, the two radiation patches 1-2 and the two conductive connection surfaces 1-3 correspond to each other one by one, One of the edges of each radiation patch 1-2 extends along the surface on which it is provided to the edge of the first supporting substrate 1-5, and each conductive connection surface 1-3 is arranged on the side of the substrate of the first supporting substrate 1-5 corresponding to the edge to which the radiation patch 1-2 extends. Each radiation patch 1-2 is electrically connected to the corresponding conductive connection surface 1-3, and the edges of the third metal sheet 1-4 corresponding to the position of each conductive connection surface 1-3 extend along the surface on which it is provided to the corresponding conductive connection surface 1-3 for electrical connection. The third metal sheet 1-4 constitutes the grounding of the radio frequency main tag 1; and in actual application, two radiation patches 1-2 are further designed to be distributed on both sides of the radio frequency chip 1-1 in an axially symmetrical distribution structure.

[0022] Based on the above-mentioned specific structural design of the RF main tag 1 and the specific structural design of each bonding capacitor module 2, in actual application, such as Figures 1 to 4As shown, at least one bonding capacitor module 2 in each bonding capacitor module 2 is respectively arranged with the surface of the first metal sheet 2-1 on the second carrier substrate 2-4 thereof in the same direction as the surface of the RF chip 1-1 on the first carrier substrate 1-5 in the RF main tag 1, and the edge of the second carrier substrate 2-4 in each bonding capacitor module 2 is connected to the edge of the first carrier substrate 1-5; and for the bonding capacitor modules 2 to which each second carrier substrate 2-4 connected to the edge of the first carrier substrate 1-5 belongs, the second metal sheet 2-2 in each bonding capacitor module 2 is respectively connected to the third metal sheet 1-4 in the RF main tag 1, as shown Figure 4 As shown,.

[0023] In actual applications, the larger the overlapping area between the projection of the first metal sheet 2-1 and the projection of the second metal sheet 2-2, the larger the parallel capacitance provided by the bonded capacitor module 2. In a further preferred embodiment, the projection of the first metal sheet 2-1 is designed to be located within the projection of the second metal sheet 2-2, that is, to achieve the maximum overlapping area between each other's projections and obtain the maximum parallel capacitance.

[0024] The above-designed bonded capacitive RFID tag is applied in practice, such as Figure 5 As shown, it reflects the influence of different overlapping relationships between the projections of the upper and lower first metal sheets 2-1 and the projections of the second metal sheets 2-2 in the bonding capacitor module 2, and different compression degrees between the projections of the first metal sheet 2-1 and the second metal sheet 2-2 on the frequency of the designed radio frequency tag.

[0025] In actual use, the designed bonded capacitive RFID tag is attached to the target object, and each bonding capacitor module 2 is respectively arranged at a position on the target object that is prone to displacement or extrusion. The RFID main tag 1 has a stable reading distance in the initial state. When the target object is displaced or extruded during application, the bonding capacitor module 2 in the RFID tag attached thereto is subjected to external pressure, and the distance between the first metal sheet 2-1 and the second metal sheet 2-2 in the bonding capacitor module 2 becomes smaller, and the parallel capacitance effect formed between the first metal sheet 2-1 and the second metal sheet 2-2 is intensified, which causes the frequency of the RFID tag to shift, resulting in the communication distance between the RFID tag and the reader being shortened until the signal is lost. The reader can then send an alarm to the background to prompt that the displacement or extrusion of the target object has exceeded the standard, that is, the displacement or extrusion state of the target object is detected.

[0026] The bonded capacitive RFID tag designed by the present invention is based on the use of the RFID main tag 1 to realize the basic RFID communication function, while introducing at least one bonded capacitor module 2 design. Specifically, two metal sheets are carried on two sides of the second carrier substrate 2-4. The second carrier substrate 2-4 is subjected to the elastic deformation of the thickness caused by the pressure from the metal sheets on any side thereof, which changes the effect of the parallel capacitance formed by the two metal sheets, thereby causing the RFID tag frequency to shift, resulting in the communication distance between the RFID tag and the reader being shortened until the signal is lost. That is, the displacement and extrusion state of the RFID tag are accurately detected, and timely detection and timely alarm are issued, thereby improving the overall working efficiency of the RFID tag.

[0027] The embodiments of the present invention are described in detail above with reference to the accompanying drawings. However, the present invention is not limited to the above embodiments. Various changes can be made within the scope of knowledge possessed by ordinary technicians in this field without departing from the purpose of the present invention.

Claims

1. A bonded capacitive radio frequency tag, characterized in that: The invention comprises a radio frequency main tag (1) and at least one bonding capacitor module (2), wherein the structures of the bonding capacitor modules (2) are the same, and each bonding capacitor module (2) comprises a first metal sheet (2-1), a second metal sheet (2-2), a conductive connection line (2-3), and a second carrier substrate (2-4) with elastically deformed thickness. In the structure of each bonding capacitor module (2), the first metal sheet (2-1) and the second metal sheet (2-2) are respectively attached to two surfaces of the second carrier substrate (2-4), and along a projection direction perpendicular to the surface of the second carrier substrate (2-4), the projection of the first metal sheet (2-1) and the projection of the second metal sheet (2-2) overlap with each other, and one end of the conductive connection line (2-3) is electrically connected to the first metal sheet (2-1); the other end of the conductive connection line (2-3) in each bonding capacitor module (2) is electrically connected to any radio frequency port on the radio frequency chip (1-1) in the radio frequency main tag (1); and each bonding capacitor module (2) constitutes a parallel capacitor of the radio frequency main tag (1).

2. The bonded capacitive radio frequency tag according to claim 1, characterized in that: The radio frequency main tag (1) is based on the radio frequency chip (1-1) contained therein, and the radio frequency main tag (1) further comprises two radiation patches (1-2), two conductive connection surfaces (1-3), a third metal sheet (1-4), and a first carrier substrate (1-5) of a preset thickness; wherein the two radiation patches (1-2) are arranged on one surface of the first carrier substrate (1-5) without being connected to each other, the radio frequency chip (1-1) is arranged on the surface where the two radiation patches (1-2) are arranged on the first carrier substrate (1-5), the two radio frequency ports of the radio frequency chip (1-1) are electrically connected to the two radiation patches (1-2) respectively, and the third metal sheet (1-4) is arranged on the other surface of the first carrier substrate (1-5). On the surface, two radiation patches (1-2) and two conductive connection surfaces (1-3) correspond to each other one by one, one side of each radiation patch (1-2) extends along the surface on which it is provided to the edge of the first carrier substrate (1-5), each conductive connection surface (1-3) is arranged on the side of the substrate at the edge to which the corresponding radiation patch (1-2) extends on the first carrier substrate (1-5), each radiation patch (1-2) is electrically connected to the corresponding conductive connection surface (1-3), and the sides of the third metal sheet (1-4) corresponding to the positions of the conductive connection surfaces (1-3) extend along the surface on which they are provided to the corresponding conductive connection surface (1-3) for electrical connection, and the third metal sheet (1-4) constitutes the grounding of the radio frequency main tag (1).

3. The bonded capacitive radio frequency tag according to claim 2, characterized in that: The two radiation patches (1-2) are distributed on both sides of the radio frequency chip (1-1) in an axisymmetric distribution structure.

4. A bonded capacitive radio frequency tag according to claim 2 or 3, characterized in that: At least one bonding capacitor module (2) in each bonding capacitor module (2) has a surface on which the first metal sheet (2-1) on its second carrier substrate (2-4) is provided in the same direction as a surface on which the radio frequency chip (1-1) on the first carrier substrate (1-5) in the radio frequency main tag (1) is provided, and the edge of the second carrier substrate (2-4) in each bonding capacitor module (2) is butted against the edge of the first carrier substrate (1-5).

5. The bonded capacitive radio frequency tag according to claim 4, characterized in that: For the bonding capacitor modules (2) belonging to each second carrier substrate (2-4) connected to the edge of the first carrier substrate (1-5), the second metal sheet (2-2) in each bonding capacitor module (2) is respectively connected to the third metal sheet (1-4) in the radio frequency main tag (1).

6. The bonded capacitive radio frequency tag according to claim 1, characterized in that: Along a projection direction perpendicular to the surface of the second supporting substrate (2-4), the projection of the first metal sheet (2-1) is located within the projection of the second metal sheet (2-2).

7. The bonded capacitive radio frequency tag according to claim 1, characterized in that: The second supporting substrate (2-4) in each bonded capacitor module (2) is made of PE foam or EVA foam.

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