Cathode assembly and electron emission device

Abstract

The embodiment of the utility model provides a cathode assembly and an electron emission device. The cathode assembly comprises a cathode emitter, the first end of the cathode emitter is used for emitting electrons outwards, and the material of the cathode emitter at least comprises boride; the first heating part is used for irradiating the cathode emitter with laser so as to heat the cathode emitter; the second heating part is connected to the second end of the cathode emitter, and the second heating part heats the cathode emitter by generating joule heat; and the second heating component is used for heating the cathode emitter together with the first heating component after the first heating component heats the cathode emitter to a first temperature threshold value.

Description

Technical Field

[0001] The utility model relates to the field of optical communications, in particular to a cathode assembly and an electron emission device. Background Art

[0002] The cathode is the source of electron emission. When the cathode is heated or excited by other forms of energy, the cathode releases electrons. After the cathode releases electrons, these electrons can form an electron flow under the action of the electric field. Electron flow has a wide range of applications in modern electronic devices and scientific research, and is an important part of electronics and physics research. For example, in particle accelerators, electron flow can be accelerated to near the speed of light and used in high-energy physics experiments. Utility Model Content

[0003] In view of this, embodiments of the present disclosure provide a cathode assembly and an electron emission device.

[0004] According to a first aspect of an embodiment of the present disclosure, a cathode assembly is provided, wherein the cathode assembly comprises:

[0005] a cathode emitter, wherein the end surface of the first end of the cathode emitter is used to emit electrons outward, and the material of the cathode emitter at least comprises boride;

[0006] a first heating component, configured to irradiate the cathode emitter with laser light to heat the cathode emitter;

[0007] a second heating component connected to the second end of the cathode emitter, wherein the second heating component heats the cathode emitter by generating Joule heat;

[0008] The second heating component is configured to heat the cathode emitter together with the first heating component after the first heating component heats the cathode emitter to a first temperature threshold.

[0009] In some embodiments, the second heating component comprises:

[0010] a conductor clamping tube, sleeved on the second end of the cathode emitter, wherein the conductor clamping tube generates Joule heat based on a heating current flowing through the conductor clamping tube to heat the cathode emitter;

[0011] at least two clamping rods, respectively connected to the conductor clamping cylinder to clamp the conductor clamping cylinder;

[0012] The heating current flows into the conductor clamping cylinder from at least one first clamping rod among the at least two clamping rods, and flows out of the conductor clamping cylinder from at least one second clamping rod among the at least two clamping rods.

[0013] In some embodiments, the first end of the cathode emitter is a disk-shaped structure; the end surface of the first end of the cathode emitter includes the first end surface of the disk-shaped structure;

[0014] The second end of the cathode emitter is a cylindrical structure;

[0015] The second end surface of the disc-shaped structure is connected to the end surface of the cylindrical structure;

[0016] The conductor clamping cylinder is sleeved on the outer side surface of the cylindrical structure.

[0017] In some embodiments, the cathode assembly further comprises: a first base,

[0018] The at least two clamping rods are arranged on the first base;

[0019] The first heating component and the cathode emitter are respectively arranged on two opposite sides of the first base;

[0020] The first base is provided with a through hole, and the first heating component emits laser light through the through hole and through the cavity of the cylindrical structure toward the second end face of the disk-shaped structure to heat the cathode emitter; wherein the cavity is formed by surrounding the side wall of the cylindrical structure.

[0021] In some embodiments, the laser irradiates the second end surface in a vertical direction.

[0022] In some embodiments, the cathode assembly further comprises: a first base,

[0023] The at least two clamping rods are arranged on the first base;

[0024] The first heating component and the cathode emitter are arranged on the same side of the first base;

[0025] The first heating component emits the laser light toward a first end of the cathode emitter to heat the cathode emitter.

[0026] In some embodiments, the laser irradiates the first end surface.

[0027] In some embodiments, the conductor clamping tube is made of graphite.

[0028] In some embodiments, the cathode assembly further comprises: a cathode hood;

[0029] The cathode cover comprises a first side wall and a second side wall arranged parallel to the electron emission direction;

[0030] The first side wall and the second side wall are arranged around the side of the cathode emitter;

[0031] The distance between the first side wall and the side surface of the cathode emitter is smaller than the distance between the second side wall and the side surface of the cathode emitter;

[0032] The first sidewalls are connected to the second sidewalls with a first annular connecting wall facing the electron emission direction.

[0033] In some embodiments, the first sidewall includes: a first sub-sidewall and a second sub-sidewall spaced apart from each other;

[0034] The first sub-sidewall and the second sub-sidewall are both parallel to the electron emission direction;

[0035] The distance between the first sub-sidewall and the side surface of the cathode emitter is smaller than the distance between the second sub-sidewall and the side surface of the cathode emitter;

[0036] The second sub-side wall is connected to the first annular connecting wall, and the first sub-side wall and the second sub-side wall are connected by a connecting component.

[0037] In some embodiments, the connecting component includes a second annular connecting wall, the inner end surface of the second annular connecting wall is connected to the outer side surface of the first sub-side wall, and the outer end surface of the second annular connecting wall is connected to the inner side surface of the second sub-side wall.

[0038] In some embodiments, at least a portion of the first annular connecting wall faces a surface that is in the same direction as the electron emission direction, forming a cone surface that focuses the electrons emitted by the cathode emitter.

[0039] In some embodiments, the cathode assembly further comprises: a first base and a second base; the first base is fixedly connected to the second base;

[0040] The at least two clamping rods are arranged on the first base;

[0041] The cathode cover is arranged on the second base;

[0042] The first base is made of non-conductive material, and the second base and the cathode cover are made of conductive material.

[0043] According to a second aspect of an embodiment of the present disclosure, a cathode assembly driving method is provided, wherein the cathode assembly is applied to the cathode assembly described in the first aspect, and the method comprises:

[0044] controlling the first heating component to irradiate the cathode emitter with laser light to heat the cathode emitter;

[0045] The first heating component heats the cathode emitter to a first temperature threshold, and controls the second heating component to generate Joule heat to heat the cathode emitter together with the first heating component.

[0046] According to a third aspect of an embodiment of the present disclosure, an electron emission device is provided, characterized in that the electron emission device comprises the cathode assembly described in the first aspect.

[0047] According to an embodiment of the present disclosure, a cathode assembly includes: a cathode emitter, a first end of the cathode emitter configured to emit electrons, the cathode emitter being made of at least boride; a first heating element configured to irradiate the cathode emitter with a laser to heat the cathode emitter; and a second heating element connected to the second end of the cathode emitter, configured to heat the cathode emitter by generating Joule heat. The second heating element is configured to heat the cathode emitter together with the first heating element after the first heating element has heated the cathode emitter to a first temperature threshold. In this manner, after the first heating element heats the cathode emitter to the first temperature threshold using the laser, the second heating element is then used to adjust the cathode emitter's temperature using Joule heat. This, while utilizing a high-power laser, can significantly increase the heating speed of the cathode emitter. Furthermore, the combination of the second heating element and Joule heat adjustment allows for precise temperature control, reducing heating current and thermodynamic design complexity compared to using Joule heat alone to heat the cathode emitter. BRIEF DESCRIPTION OF THE DRAWINGS

[0048] Figure 1 is a schematic diagram showing the composition structure of a cathode assembly according to an exemplary embodiment;

[0049] Figure 2 is a schematic diagram showing the composition structure of a cathode assembly according to an exemplary embodiment;

[0050] Figure 3 is a schematic diagram showing the composition structure of a cathode assembly according to an exemplary embodiment;

[0051] Figure 4 is a schematic diagram showing the composition structure of a cathode assembly according to an exemplary embodiment;

[0052] Figure 5 is a schematic diagram showing the composition structure of a cathode assembly according to an exemplary embodiment;

[0053] Figure 6 is a schematic diagram showing the composition structure of a cathode assembly according to an exemplary embodiment;

[0054] Figure 7is a schematic diagram showing the composition structure of a cathode assembly according to an exemplary embodiment;

[0055] Figure 8 is a schematic diagram showing the composition structure of a cathode assembly according to an exemplary embodiment;

[0056] Figure 9 is a flow chart of a control method for a cathode assembly according to an exemplary embodiment;

[0057] Figure 10 The figure is a schematic diagram showing the composition structure of an electron emission device according to an exemplary embodiment. DETAILED DESCRIPTION

[0058] To make the technical solutions and beneficial effects of the present invention more clearly understood, the following detailed description is given by way of specific embodiments. The accompanying drawings are not necessarily drawn to scale, and local features may be enlarged or reduced to more clearly illustrate the details of the local features. Unless otherwise defined, the technical and scientific terms used herein have the same meanings as those in the technical field to which this application belongs.

[0059] The embodiments of the present disclosure are not exhaustive and are merely illustrative of some embodiments, and are not intended to be a specific limitation on the scope of protection of the present disclosure. In the absence of contradiction, each step in a certain embodiment can be implemented as an independent embodiment, and the steps can be arbitrarily combined. For example, a solution after removing some steps in a certain embodiment can also be implemented as an independent embodiment, and the order of the steps in a certain embodiment can be arbitrarily exchanged. In addition, the optional implementation methods in a certain embodiment can be arbitrarily combined; in addition, the embodiments can be arbitrarily combined. For example, some or all steps of different embodiments can be arbitrarily combined, and a certain embodiment can be arbitrarily combined with the optional implementation methods of other embodiments.

[0060] In each embodiment of the present disclosure, unless otherwise specified or provided for by logic, the terms and / or descriptions between the embodiments are consistent and can be referenced by each other. The technical features in different embodiments can be combined to form a new embodiment based on their inherent logical relationships.

[0061] The terms used in the embodiments of the present disclosure are only for the purpose of describing specific embodiments and are not intended to limit the present disclosure.

[0062] In the embodiments of the present disclosure, unless otherwise specified, elements expressed in the singular, such as "a", "an", "the", "above", "said", "the", "the", etc., may mean "one and only one", or "one or more", "at least one", etc. For example, when using articles such as "a", "an", "the" in English in translation, the noun following the article may be understood as a singular expression or a plural expression.

[0063] In the embodiments of the present disclosure, “plurality” refers to two or more.

[0064] In some embodiments, the terms “at least one”, “one or more”, “a plurality of”, “multiple”, etc. can be used interchangeably.

[0065] In some embodiments, descriptions such as "at least one of A and B," "A and / or B," "in one case A, in another case B," or "in one case A, in another case B" may include the following technical solutions depending on the situation: in some embodiments, A (A is executed independently of B); in some embodiments, B (B is executed independently of A); in some embodiments, execution is selected from A and B (A and B are selectively executed); and in some embodiments, A and B (both A and B are executed). The same applies when there are more branches, such as A, B, and C.

[0066] In some embodiments, "A or B" and other expressions may include the following technical solutions, depending on the circumstances: in some embodiments, A (A is executed independently of B); in some embodiments, B (B is executed independently of A); in some embodiments, execution is selected from A and B (A and B are selectively executed). The above is also applicable when there are more branches, such as A, B, and C.

[0067] The prefixes such as "first" and "second" in the embodiments of the present disclosure are only used to distinguish different description objects and do not constitute any restriction on the position, order, priority, value or content of the description objects. For the statement of the description object, please refer to the description in the context of the claims or embodiments, and no unnecessary restriction should be constituted due to the use of prefixes. For example, if the description object is a "field", the ordinal number before the "field" in the "first field" and the "second field" does not limit the position or order between the "fields", and "first" and "second" do not limit whether the "fields" they modify are in the same message, nor do they limit the order of the "first field" and the "second field". For another example, if the description object is a "level", the ordinal number before the "level" in the "first level" and the "second level" does not limit the priority between the "levels". For another example, the value of the description object is not limited by the ordinal number and can be one or more. Taking "first device" as an example, the value of "device" can be one or more. In addition, the objects modified by different prefixes can be the same or different. For example, if the description object is "device", then the "first device" and the "second device" can be the same device or different devices, and their types can be the same or different; for another example, if the description object is "information", then the "first information" and the "second information" can be the same information or different information, and their contents can be the same or different.

[0068] In some embodiments, “including A,” “comprising A,” “used to indicate A,” and “carrying A” can be interpreted as directly carrying A or indirectly indicating A.

[0069] In some embodiments, terms such as "...", "determine...", "in the case of...", "at the time of...", "when...", "if...", "if...", etc. can be used interchangeably.

[0070] In some embodiments, terms such as "greater than", "greater than or equal to", "not less than", "more than", "more than or equal to", "not less than", "higher than", "higher than or equal to", "not less than", and "above" can be replaced with each other, and terms such as "less than", "less than or equal to", "not greater than", "less than", "less than or equal to", "not more than", "lower than", "lower than or equal to", "not higher than", and "below" can be replaced with each other.

[0071] In some embodiments, devices, etc. can be interpreted as physical or virtual, and their names are not limited to the names recorded in the embodiments. Terms such as "device", "equipment", "device", "circuit", "network element", "node", "function", "unit", "section", "system", "network", "chip", "chip system", "entity", and "subject" can be used interchangeably.

[0072] In addition, each element, each row, or each column in the table of the embodiment of the present disclosure can be implemented as an independent embodiment, and the combination of any elements, any rows, and any columns can also be implemented as an independent embodiment.

[0073] In some embodiments, the cathode emitter can be heated by Joule heat to excite the cathode emitter to emit electrons. Here, the cathode emitter can be a boride, such as lanthanum hexaboride.

[0074] To increase the emission intensity, boride cathode emitters with larger emitting surfaces (e.g., diameters > 3mm) are required. Typically, boride cathode emitters are held in place by a clamping mechanism that simultaneously performs both clamping and conductive functions. As the size of the boride cathode emitter increases, the size of the clamping mechanism also increases. Larger clamping mechanisms require higher heat dissipation power, while maintaining current flow requires a certain contact area between the clamping mechanism and the cathode emitter. The coupled Joule heating and thermodynamic design requirements make the development of the clamping structure technically challenging. Furthermore, the high heating current and significant magnetic field degrade the initial emission quality of the electron beam, making it unsuitable for high-performance instruments and large scientific facilities. Therefore, minimizing the impact of the heating current on the electron beam emission quality and reducing the design complexity of the clamping mechanism while increasing the number of cathode emitters remain pressing challenges.

[0075] like Figure 1 As shown, this embodiment provides a cathode assembly 100, and the cathode assembly 100 includes:

[0076] a cathode assembly 110, wherein the end surface of the first end of the cathode assembly 110 is used to emit electrons outward, and the material of the cathode assembly 110 at least includes boride;

[0077] a first heating component 120 for irradiating the cathode assembly 110 with laser light to heat the cathode assembly 110;

[0078] a second heating member 130 connected to the second end of the cathode assembly 110 , and the second heating member 130 heats the cathode assembly 110 by generating Joule heat;

[0079] The second heating component 130 is configured to heat the cathode assembly 110 together with the first heating component 120 after the first heating component 120 heats the cathode assembly 110 to a first temperature threshold.

[0080] Here, the cathode assembly 110 is a component for releasing electrons when excited by heat or other forms of energy.

[0081] In a possible implementation, the material of the cathode assembly 110 may include borides, such as lanthanum hexaboride and other boron lanthanides.

[0082] In one possible implementation, the power of the first heating component 120 is greater than the power of the second heating component 130 .

[0083] The first heating element 120 may include a laser emitter. Lasers can concentrate a large amount of energy in a small area, thereby increasing the speed at which the cathode assembly 110 is heated. Furthermore, laser light can be applied directly to the cathode assembly 110, eliminating the need for physical contact between the first heating element 120 and the cathode assembly 110. This reduces heat conduction due to physical contact, thereby reducing the complexity of the thermodynamic design.

[0084] In one possible implementation, the first temperature threshold may include a lower limit of the operating temperature at which the cathode assembly 110 releases electrons.

[0085] The working temperature of cathode assemblies 110 made of different materials is different. For example, the lower limit T1 of the working temperature for boride to release electrons is 1400°C-1500°C.

[0086] Joule heating can include heat generated by the resistance within a conductor when a heating current passes through the conductor.

[0087] The second heating member 130 may include a conductor portion for generating Joule heat, and may be in close contact with the second end of the cathode assembly 110 to transfer heat to the cathode assembly 110 at least by thermal conduction to heat the cathode assembly 110 .

[0088] Since the laser is not limited to physical contact with the cathode assembly 110 and has the characteristic of transmitting a large amount of energy, the first heating component 120 is used to transmit a large amount of energy to the cathode assembly 110 to increase the temperature of the cathode assembly 110 .

[0089] As the cathode assembly 110 rises from its base temperature of room temperature to the first temperature threshold, the temperature jump is significant, requiring a significant amount of heat to be transferred to the cathode assembly 110. Therefore, using the first heating element 120 for laser heating can meet the high energy transfer requirement, shorten the heating time, and reduce the design complexity associated with physical contact due to heat conduction.

[0090] After the temperature of the cathode assembly 110 exceeds the first temperature threshold, the cathode assembly 110 releases electrons in the operating temperature range. In the operating temperature range, the ability of the cathode assembly 110 to release electrons has a nearly exponential relationship with temperature, and a smaller temperature change generates a larger electron current.

[0091] In a possible implementation, the operating temperature range is smaller than the temperature increase range of the cathode assembly 110 from room temperature to the first temperature threshold.

[0092] For example, the operating temperature T0 at which the boride releases electrons is approximately 1600-1700° C., and the upper limit of the operating temperature is T2 (approximately 1800° C.).

[0093] To effectively control the accuracy of the electron current in cathode assembly 110, the temperature of cathode assembly 110 must be precisely controlled. First heating element 120 increases the temperature of cathode assembly 110 using a high power output. Second heating element 130 superimposes Joule heating on the laser heating provided by first heating element 120 to precisely control the temperature of cathode assembly 110 above a first temperature threshold. Specifically, after the temperature of cathode assembly 110 exceeds the first temperature threshold, both first and second heating elements 120 and 130 simultaneously heat cathode assembly 110.

[0094] In one possible implementation, after the temperature of the cathode assembly 110 exceeds a first temperature threshold, the first heating component 120 samples a constant power to heat the cathode assembly 110 , and the second heating component 130 adjusts the temperature of the cathode assembly 110 by adjusting the power (eg, adjusting the heating current).

[0095] The second heating member 130 can adjust the Joule heat by adjusting the heating current, thereby adjusting the temperature of the cathode assembly 110. Since the heating current can be precisely adjusted, the temperature of the cathode assembly 110 can be precisely controlled.

[0096] In one possible implementation, the Joule-heat-generating conductive portion of the second heating element 130 can be in close contact with the second end of the cathode assembly 110 to conduct the Joule heat. Because the second heating element 130 is only used to regulate the temperature within the operating temperature range of the cathode assembly 110, the adjustment range is relatively small. Therefore, compared to solutions that use Joule heat to provide all the heat, the heating current of the second heating element 130 using this embodiment is lower. The less heat the second heating element 130 needs to transfer, the smaller the contact area between the second heating element 130 and the cathode assembly 110, thereby reducing the complexity of the thermodynamic design.

[0097] In one possible implementation, the cathode assembly 100 may further include a controller for controlling the heating timing of the first heating component 120 and the second heating component 130. The controller may also be used to adjust the magnitude of the heating current of the second heating component 130.

[0098] In this manner, after the cathode assembly 110 is heated to a first temperature threshold by the first heating element 120 using a laser, the cathode assembly 110 is then adjusted to a first temperature threshold by the second heating element 130 using Joule heat. On the one hand, the use of a high-power laser can accelerate the heating of the cathode assembly 110. On the other hand, the combination of the second heating element 130 and the Joule heat adjustment of the cathode assembly 110 allows for precise temperature control. This reduces heating current and thermodynamic design complexity compared to using only Joule heat for the cathode assembly 110.

[0099] In some embodiments, as Figure 2 As shown, the second heating component 130 includes:

[0100] a conductor clamping tube 131, sleeved on the second end of the cathode assembly 110, wherein the conductor clamping tube 131 generates Joule heat based on a heating current flowing through the conductor clamping tube 131 to heat the cathode assembly 110;

[0101] At least two clamping rods 132 are respectively connected to the conductor clamping cylinder 131 to clamp the conductor clamping cylinder 131;

[0102] The heating current flows into the conductor clamping cylinder 131 from at least one first clamping rod 132 among the at least two clamping rods 132 , and flows out of the conductor clamping cylinder 131 from at least one second clamping rod 132 among the at least two clamping rods 132 .

[0103] here, Figure 2 FIG. 1 is a cross-sectional view of the cathode assembly 100 .

[0104] The conductor clamping tube 131 is made of a conductive material and is capable of generating Joule heat. Furthermore, the conductor clamping tube 131 is used to clamp and support the cathode assembly 110 to reduce the thermodynamic impact of additional clamping components on the cathode assembly 110 .

[0105] In one possible implementation, the second heating component 130 may include a conductor clamping tube that is sleeved on the second end of the cathode assembly 110. The cross-sectional shape of the conductor clamping tube 131 may be set based on the cross-sectional shape of the second end of the cathode assembly 110. For example, if the cross-sectional shape of the second end of the cathode assembly 110 is circular, the cross-sectional shape of the conductor clamping tube 131 may be a circular ring, that is, the conductor clamping tube 131 is a cylinder with a circular ring cross-section.

[0106] The conductor clamping tube 131 generates Joule heat based on the heating current flowing through it. The inner wall of the conductor clamping tube 131 contacts the outer wall of the second end of the cathode assembly 110 to transfer heat. Because the conductor clamping tube 131 is sleeved over the second end of the cathode assembly 110, it can evenly heat the second end of the cathode assembly 110, improving heating uniformity.

[0107] In one possible implementation, the heating current flows from the first side of the outer wall of the conductor clamping cylinder 131 along the circumference of the conductor clamping cylinder 131 to the second side of the outer wall of the conductor clamping cylinder 131. The first side and the second side are symmetrical about the central axis of the conductor clamping cylinder 131.

[0108] In one possible implementation, a first conductive electrode and a second conductive electrode are axially disposed on the first and second sides of the outer wall of the conductor clamping tube 131, respectively. The lengths of the first and second conductive electrodes can be the same as the axial length of the conductor clamping tube 131. Current can flow into the first conductive electrode and out of the second conductive electrode, or alternatively, current can flow into the second conductive electrode and out of the first conductive electrode. The heating current flows circumferentially between the first and second conductive electrodes within the conductor clamping tube 131, generating Joule heat within the conductor clamping tube 131. This heat is then conducted through the inner wall of the conductor clamping tube 131 to the cathode assembly 110. Because the first and second conductive electrodes extend throughout the axial length of the conductor clamping tube 131, heat is uniformly distributed throughout the entire conductor clamping tube 131, improving heating uniformity.

[0109] There may be two clamping rods 132. The first end of one of the two clamping rods 132 constitutes a first electrode, and the second end can be connected to one end of a power supply (e.g., the positive electrode). The first end of the other of the two clamping rods 132 constitutes a second electrode, and the second end can be connected to the other end of the power supply (e.g., the negative electrode).

[0110] The number of clamping rods 132 may be N, where N is greater than 2. The first ends of the n first clamping rods 132 constitute the first electrode, and the second ends of the n first clamping rods 132 can be connected to a power source. The first ends of the Nn second clamping rods 132 constitute the second electrode, and the second ends of the Nn second clamping rods 132 can be connected to a power source. Here, n is a natural number greater than or equal to 1.

[0111] Clamping rod 132 is used to clamp and support conductor clamping tube 131. It also serves as an electrode, feeding the heating current. This reduces the design complexity associated with separate clamping and electrode configurations. It also minimizes the thermal impact of separate clamping rod 132 and electrode configurations on cathode assembly 110.

[0112] In some embodiments, the conductor clamping tube 131 is made of graphite.

[0113] Graphite has a high resistivity, so when current passes through graphite, it generates greater Joule heat due to the resistance, which can shorten the heating time and improve work efficiency.

[0114] Graphite also has high thermal conductivity, effectively transferring Joule heat to cathode assembly 110. Graphite also has high temperature resistance, with a very high melting point (approximately 3850 ± 50°C), which can meet the high temperature requirements of cathode assembly 110, thereby improving the operating reliability of cathode assembly 100.

[0115] In some embodiments, as Figure 3 As shown, the first end of the cathode assembly 110 is a disk-shaped structure 111; the end surface of the first end of the cathode assembly 110 includes the first end surface of the disk-shaped structure 111;

[0116] The second end of the cathode assembly 110 is a cylindrical structure 112;

[0117] The second end surface of the disc-shaped structure 111 is connected to the end surface of the cylindrical structure 112;

[0118] The conductor clamping tube 131 is sleeved on the outer side of the cylindrical structure 112 .

[0119] Figure 3 FIG2 is a cross-sectional view of cathode assembly 100. In one possible implementation, disc-shaped structure 111 is a circular disc-shaped structure 111, and cylindrical structure 112 is a cylindrical structure. Correspondingly, conductor clamping tube 131 is a cylindrical clamping tube. Conductor clamping tube 131 is sleeved on cylindrical structure 112.

[0120] In some embodiments, as Figure 4 As shown, the cathode assembly 100 further includes: a first base 140,

[0121] The at least two clamping rods 132 are disposed on the first base 140;

[0122] The first heating component 120 and the cathode assembly 110 are respectively disposed on opposite sides of the first base 140;

[0123] A through hole is provided on the first base 140 , and the first heating component 120 emits laser through the through hole and through the cavity of the cylindrical structure 112 toward the second end face of the disc-shaped structure 111 to heat the cathode assembly 110 ; wherein the cavity is formed by surrounding the side wall of the cylindrical structure 112 .

[0124] Figure 4is a cross-sectional view of the cathode assembly 100. Figure 4 As shown, one end of the clamping rod 132 is connected to the cathode assembly 110, and the other end of the clamping rod 132 is connected to the first base 140. In this way, the conductor clamping cylinder 131 and the cathode assembly 110 are clamped on the first base 140.

[0125] The first base 140 may be provided with a through hole, and the first heating component 120 and the cathode assembly 110 are provided on both sides of the first base 140, and the first heating component 120 emits a laser to the cathode assembly 110 through the through hole. The laser can be irradiated to the second end face of the disk-shaped structure 111 through the cavity formed by the side wall of the cylindrical structure 112. Since the first end face of the disk-shaped structure 111 is used to emit electrons, heat can be quickly conducted to the first end face by irradiating the second end face of the disk-shaped structure 111 with laser light, thereby improving the heating effect. At the same time, since the highest temperature is at the bottom of the deposition tank formed by the second end face and the cylindrical structure 112, most of its heat radiation will be absorbed by the cylindrical structure 112, thereby further reducing heat loss, so that the effective power consumption of the laser can be significantly reduced, further reducing the difficulty of thermal design.

[0126] Since the direction of the electron emission channel of the cathode assembly 110 is opposite to the direction in which the first heating component 120 is arranged, the interference between the electron emission channel of the cathode assembly 110 and the first heating component 120 can be reduced, thereby reducing the complexity of the design.

[0127] In some embodiments, the laser irradiates the second end surface in a vertical direction.

[0128] like Figure 4 As shown, the laser irradiates the second end surface of the disk-shaped structure 111 in a vertical direction.

[0129] When the laser irradiates the material at an oblique angle, the laser energy may be unevenly distributed across the surface of cathode assembly 110, affecting the consistency of the heating effect. This can cause uneven heating of cathode assembly 110. Due to the high laser energy, this uneven heating can easily lead to large temperature differences between different parts of cathode assembly 110. Irradiating the second end surface of disk-shaped structure 111 vertically can improve the uniformity of heating of cathode assembly 110.

[0130] In some embodiments, as Figure 5 As shown, the cathode assembly 100 further includes: a first base 140,

[0131] The at least two clamping rods 132 are disposed on the first base 140;

[0132] The first heating component 120 and the cathode assembly 110 are disposed on the same side of the first base 140;

[0133] The first heating component 120 emits the laser toward a first end of the cathode assembly 110 to heat the cathode assembly 110 .

[0134] Figure 5 is a cross-sectional view of the cathode assembly 100. Figure 5 As shown, the first heating component 120 and the cathode assembly 110 can be disposed on the same side of the first base 140. The laser can irradiate the sides of the cathode assembly 110 to heat the cathode assembly 110.

[0135] In some embodiments, the laser irradiates the first end surface.

[0136] The first end surface of the disk-shaped structure 111 is used to emit electrons outward, and the first heating component 120 and the cathode assembly 110 are arranged on the same side of the first base 140. Figure 5 As shown, the first heating component 120 can irradiate the first end surface of the disk-shaped structure 111, thereby accelerating the release of electrons.

[0137] In a possible implementation, the first heating component 120 may be disposed on the side of the cathode assembly 110 in the axial direction. For example, the first heating component 120 may be disposed outside the channel through which the cathode assembly 110 emits electrons.

[0138] In one possible implementation, Figure 6 As shown, at least two first heating components 120 can be provided. At least one first heating component 120 and the cathode assembly 110 are disposed on the same side of the first base 140 to irradiate the first end surface of the disk-shaped structure 111; at least one first heating component 120 and the cathode assembly 110 are disposed on opposite sides of the first base 140 to irradiate the second end surface of the disk-shaped structure 111. In this way, the first heating components 120 irradiate the cathode assembly 110 from both the first and second end surfaces simultaneously, which can improve the heating effect and enhance the electron emission effect.

[0139] In some possible implementations, the laser irradiates a center position of the first end surface.

[0140] The laser of the first heating component 120 irradiates the first end surface and / or the second end surface, so that the laser power is loaded on the center of the cathode, and the Joule heat power of the second heating component 130 is loaded on the tubular structure 112. By adjusting the ratio of the two, compared with a single heat source cathode, the temperature uniformity on the electron emission surface (first end surface) can be effectively adjusted, thereby improving the life of the cathode.

[0141] In some embodiments, as Figure 7 As shown, the cathode assembly 100 further includes: a cathode cover 150;

[0142] The cathode cover 150 includes a first side wall 151 and a second side wall 152 arranged parallel to the electron emission direction;

[0143] The first side wall 151 and the second side wall 152 are arranged around the side of the cathode assembly 110;

[0144] The distance between the first side wall 151 and the side surface of the cathode assembly 110 is smaller than the distance between the second side wall 152 and the side surface of the cathode assembly 110 ;

[0145] The first sidewalls 151 are connected to the second sidewalls 152 by a first annular connecting wall 153 facing the electron emission direction.

[0146] here, Figure 7 FIG. 1 is a cross-sectional view of the cathode assembly 100 . Figure 7 As shown, the first side wall 151 and the second side wall 152 are parallel to each other. The first side wall 151 forms a cylindrical wall and is arranged on the side of the cathode assembly 110, and the second side wall 152 forms a cylindrical wall and is arranged on the side of the first side wall 151.

[0147] In a possible implementation, the first side wall 151 , the second side wall 152 and the first annular connecting wall 153 may be made of metal such as tantalum.

[0148] In a possible implementation, the first side wall 151 , the second side wall 152 and the first annular connecting wall 153 may be manufactured separately and connected by welding or other methods.

[0149] In a possible implementation, the first side wall 151 , the second side wall 152 and the first annular connecting wall 153 may be integrally formed by pressing metal plates.

[0150] In a possible implementation, the thickness of the first side wall 151 , the second side wall 152 , and the first annular connecting wall 153 may be 1 to 2 mm.

[0151] Because the cathode assembly 110 is made of a boron lanthanum compound, it is more likely to chemically react with other materials. Therefore, the first sidewall 151 and the side surface of the cathode assembly 110 (such as the side surface of the disc-shaped structure 111) can be separated by a first predetermined distance. The first predetermined distance can be less than 0.2 mm.

[0152] The cathode cover 150 can isolate the heat radiated by the cathode assembly 110 through the first side wall 151 and the second side wall 152. On the other hand, the first side wall 151 and the second side wall 152 can also absorb electrons emitted from the side of the cathode assembly 110, thereby improving the quality of current flow.

[0153] In some embodiments, as Figure 8As shown, the first side wall 151 includes: a first sub-side wall 1511 and a second sub-side wall 1512 that are spaced apart;

[0154] The first sub-sidewall 1511 and the second sub-sidewall 1512 are both parallel to the electron emission direction;

[0155] The distance between the first sub-side wall 1511 and the side surface of the cathode assembly 110 is smaller than the distance between the second sub-side wall 1512 and the side surface of the cathode assembly 110 ;

[0156] The second sub-side wall 1512 is connected to the first annular connecting wall 153 , and the first sub-side wall 1511 and the second sub-side wall 1512 are connected by a connecting component.

[0157] here, Figure 8 FIG. 1 is a cross-sectional view of the cathode assembly 100 . Figure 8 As shown, the first sub-side wall 1511 and the second sub-side wall 1512 are parallel to each other. The first sub-side wall 1511 forms a cylindrical wall and is arranged on the side of the cathode assembly 110, and the second sub-side wall 1512 forms a cylindrical wall and is arranged on the side of the first sub-side wall 1511.

[0158] In a possible implementation, the thickness of the first sub-sidewall 1511 and the second sub-sidewall 1512 may be 0.1-0.3 mm.

[0159] In a possible implementation, the first sub-sidewall 1511 and the second sub-sidewall 1512 may be made of the same material, such as tantalum or other metals.

[0160] In a possible implementation, a connecting member may be used to connect the first sub-sidewall 1511 and the second sub-sidewall 1512. The material of the connecting member may be the same as that of the sub-sidewall.

[0161] The connection component may be designed based on reducing heat conduction between the first sub-sidewall 1511 and the second sub-sidewall 1512. For example, the connection component may include one or more connection rods.

[0162] In some embodiments, the connecting component includes a second annular connecting wall 1513, the inner end surface of the second annular connecting wall 1513 is connected to the outer side surface of the first sub-side wall 1511, and the outer end surface of the second annular connecting wall 1513 is connected to the inner side surface of the second sub-side wall 1512.

[0163] In a possible implementation, the surface of the second annular connecting wall 1513 may be a non-planar surface. For example, the surface of the second annular connecting wall 1513 may be a conical surface.

[0164] The thickness of the second annular connecting wall 1513 may be the same as the thickness of the sub-sidewalls (the first sub-sidewall 1511 and / or the second sub-sidewall 1512 ).

[0165] In a possible implementation, the second annular connecting wall 1513 may be 0.1-0.3 mm.

[0166] The second annular connecting wall 1513 is used to connect the first sub-side wall 1511 and the second sub-side wall 1512. Since the second annular connecting wall 1513 is thin, it can reduce heat conduction between the first sub-side wall 1511 and the second sub-side wall 1512, thereby maintaining the temperature of the cathode assembly 110.

[0167] In some embodiments, at least a portion of the first annular connecting wall 153 faces a surface that is in the same direction as the electron emission direction, forming a cone surface that focuses the electrons emitted by the cathode assembly 110 .

[0168] Here, as Figure 7 or Figure 8 As shown, the annular surface of the first annular connecting wall 153 close to the cathode assembly 110 may form a cone, which forms an acute angle with the axis of the cathode assembly 110 to focus the electron beam emitted by the cathode assembly 110, thereby improving the quality of the electron beam.

[0169] In some embodiments, as Figure 7 or Figure 8 As shown, the cathode assembly 100 further includes: a first base 140 and a second base; the first base 140 is fixedly connected to the second base;

[0170] The at least two clamping rods 132 are disposed on the first base 140;

[0171] The cathode cover 150 is disposed on the second base;

[0172] The first base 140 is made of a non-conductive material, and the second base and the cathode cover 150 are made of a conductive material.

[0173] In a possible implementation, the first base 140 may be made of ceramic, and the second base may be made of metal such as stainless steel.

[0174] The first base 140 and the second base are fixedly arranged, the cathode assembly 110 is fixedly arranged on the first base 140 by the clamping rod 132, and the cathode cover 150 is fixedly arranged on the second base. Therefore, the relative positions of the cathode cover 150 and the cathode assembly 110 are fixed, which can reduce the relative displacement of the cathode cover 150 and the cathode assembly 110 and reduce the damage to the cathode assembly 110 caused by the contact between the cathode cover 150 and the cathode assembly 110.

[0175] like Figure 9 The embodiment of the present disclosure provides a method for driving a cathode assembly 100, wherein the cathode assembly 100 is applied to the cathode assembly 100 described in the first aspect. The method includes:

[0176] Step 901: controlling the first heating component 120 to irradiate the cathode assembly 110 with laser light to heat the cathode assembly 110;

[0177] Step 902 : the first heating component 120 heats the cathode assembly 110 to a first temperature threshold, and controls the second heating component 130 to generate Joule heat to heat the cathode assembly 110 together with the first heating component 120 .

[0178] The method of this embodiment can be executed by a controller included in the cathode assembly 100. The controller can be used to control the heating timing of the first heating component 120 and the second heating component 130. The controller can also be used to adjust the magnitude of the heating current of the second heating component 130.

[0179] The cathode assembly 110 is a component for releasing electrons when excited by heat or other forms of energy.

[0180] In a possible implementation, the material of the cathode assembly 110 may include boride, such as lanthanum hexaboride.

[0181] In one possible implementation, the power of the first heating component 120 is greater than the power of the second heating component 130 .

[0182] The first heating element 120 may include a laser emitter. Lasers can concentrate a large amount of energy in a small area, thereby increasing the speed at which the cathode assembly 110 is heated. Furthermore, laser light can be applied directly to the cathode assembly 110, eliminating the need for physical contact between the first heating element 120 and the cathode assembly 110. This reduces heat conduction due to physical contact, thereby reducing the complexity of the thermodynamic design.

[0183] In one possible implementation, the first temperature threshold may include a lower limit of the operating temperature at which the cathode assembly 110 releases electrons.

[0184] The working temperature of cathode assemblies 110 made of different materials is different. For example, the lower limit T1 of the working temperature for boride to release electrons is 1400°C-1500°C.

[0185] Joule heating can include heat generated by the resistance within a conductor when a heating current passes through the conductor.

[0186] The second heating member 130 may include a conductor portion for generating Joule heat, and may be in close contact with the second end of the cathode assembly 110 to transfer heat to the cathode assembly 110 at least by thermal conduction to heat the cathode assembly 110 .

[0187] Since the first heating component 120 has no physical contact with the cathode assembly 110, and the laser has the characteristic of transmitting a large amount of energy, the first heating component 120 can use a larger power to transmit energy to the cathode assembly 110 to increase the temperature of the cathode assembly 110. Moreover, since the first heating component 120 has no contact with the cathode assembly 110, heat conduction is greatly reduced, thereby reducing the complexity of the thermodynamic design.

[0188] As the cathode assembly 110 rises from its base temperature of room temperature to the first temperature threshold, the temperature jump is significant, requiring a significant amount of heat to be transferred to the cathode assembly 110. Therefore, using the first heating element 120 for laser heating can meet the high energy transfer requirement, shorten the heating time, and reduce the design complexity associated with physical contact due to heat conduction.

[0189] After the temperature of the cathode assembly 110 exceeds the first temperature threshold, the cathode assembly 110 releases electrons in the operating temperature range. In the operating temperature range, the ability of the cathode assembly 110 to release electrons has a nearly exponential relationship with temperature, and a smaller temperature change generates a larger electron current.

[0190] In a possible implementation, the operating temperature range is smaller than the temperature increase range of the cathode assembly 110 from room temperature to the first temperature threshold.

[0191] For example, the operating temperature T0 at which the boride releases electrons is approximately 1600-1700° C., and the upper limit of the operating temperature is T2 (approximately 1800° C.).

[0192] To effectively control the accuracy of the electron current in cathode assembly 110, the temperature of cathode assembly 110 must be precisely controlled. First heating element 120 increases the temperature of cathode assembly 110 using a high power output. Second heating element 130 superimposes Joule heating on the laser heating provided by first heating element 120 to precisely control the temperature of cathode assembly 110 above a first temperature threshold. Specifically, after the temperature of cathode assembly 110 exceeds the first temperature threshold, both first and second heating elements 120 and 130 simultaneously heat cathode assembly 110.

[0193] In one possible implementation, after the temperature of the cathode assembly 110 exceeds a first temperature threshold, the first heating component 120 samples a constant power to heat the cathode assembly 110 , and the second heating component 130 adjusts the temperature of the cathode assembly 110 by adjusting the power (eg, adjusting the heating current).

[0194] The second heating member 130 can adjust the Joule heat by adjusting the heating current, thereby adjusting the temperature of the cathode assembly 110. Since the heating current can be precisely adjusted, the temperature of the cathode assembly 110 can be precisely controlled.

[0195] In one possible implementation, the Joule-heat-generating conductive portion of the second heating element 130 can be in close contact with the second end of the cathode assembly 110 to conduct the Joule heat. Because the second heating element 130 is only used to regulate the temperature within the operating temperature range of the cathode assembly 110, the adjustment range is relatively small. Therefore, compared to solutions that use Joule heat to provide all the heat, the heating current of the second heating element 130 using this embodiment of the heating method is lower. The less heat the second heating element 130 needs to transfer, the smaller the contact area between the second heating element 130 and the cathode assembly 110, thereby reducing the complexity of the thermodynamic design.

[0196] In this manner, after the cathode assembly 110 is heated to a first temperature threshold by the first heating element 120 using a laser, the cathode assembly 110 is then adjusted to a first temperature threshold by the second heating element 130 using Joule heat. On the one hand, the use of a high-power laser can accelerate the heating of the cathode assembly 110. On the other hand, the combination of the second heating element 130 and the Joule heat adjustment of the cathode assembly 110 allows for precise temperature control. This reduces heating current and thermodynamic design complexity compared to using only Joule heat for the cathode assembly 110.

[0197] like Figure 10 As described above, an embodiment of the present disclosure provides an electron emission device, which includes the cathode assembly 100 disclosed in any of the above embodiments.

[0198] In one possible implementation, the electron emission device further includes a power supply for supplying power to the first heating component 120 and the second heating component 130 .

[0199] Those skilled in the art will readily recognize other embodiments of the present invention after considering the specification and practicing the invention disclosed herein. This disclosure is intended to cover any variations, uses, or adaptations of the present invention that follow the general principles of the invention and include common knowledge or customary techniques in the art not disclosed herein. The description and examples are to be considered as exemplary only, with the true scope and spirit of the invention being indicated by the following claims.

[0200] It should be understood that the present invention is not limited to the precise structure described above and shown in the accompanying drawings, and various modifications and changes can be made without departing from the scope thereof. The scope of the present invention is limited only by the appended claims.

Claims

1. A cathode assembly, characterized in that: The cathode assembly comprises: a cathode emitter, wherein the end surface of the first end of the cathode emitter is used to emit electrons outward, and the material of the cathode emitter at least comprises boride; a first heating component, configured to irradiate the cathode emitter with laser light to heat the cathode emitter; a second heating component connected to the second end of the cathode emitter, wherein the second heating component heats the cathode emitter by generating Joule heat; The second heating component is configured to heat the cathode emitter together with the first heating component after the first heating component heats the cathode emitter to a first temperature threshold.

2. The cathode assembly according to claim 1, wherein The second heating component comprises: a conductor clamping tube, sleeved on the second end of the cathode emitter, wherein the conductor clamping tube generates Joule heat based on a heating current flowing through the conductor clamping tube to heat the cathode emitter; at least two clamping rods, respectively connected to the conductor clamping cylinder to clamp the conductor clamping cylinder; The heating current flows into the conductor clamping cylinder from at least one first clamping rod among the at least two clamping rods, and flows out of the conductor clamping cylinder from at least one second clamping rod among the at least two clamping rods.

3. The cathode assembly according to claim 2, wherein: The first end of the cathode emitter is a disk-shaped structure; the end surface of the first end of the cathode emitter includes the first end surface of the disk-shaped structure; The second end of the cathode emitter is a cylindrical structure; The second end surface of the disc-shaped structure is connected to the end surface of the cylindrical structure; The conductor clamping cylinder is sleeved on the outer side surface of the cylindrical structure.

4. The cathode assembly according to claim 3, wherein: The cathode assembly further includes: a first base, The at least two clamping rods are arranged on the first base; The first heating component and the cathode emitter are respectively arranged on two opposite sides of the first base; The first base is provided with a through hole, and the first heating component emits laser light through the through hole and through the cavity of the cylindrical structure toward the second end face of the disk-shaped structure to heat the cathode emitter; wherein the cavity is formed by surrounding the side wall of the cylindrical structure.

5. The cathode assembly according to claim 4, wherein: The laser irradiates the second end surface in a vertical direction.

6. The cathode assembly according to claim 3, wherein: The cathode assembly further includes: a first base, The at least two clamping rods are arranged on the first base; The first heating component and the cathode emitter are arranged on the same side of the first base; The first heating component emits the laser toward the first end of the cathode emitter to heat the cathode emitter; The laser irradiates the first end surface.

7. The cathode assembly according to any one of claims 2 to 6, characterized in that The cathode assembly further includes: a cathode cover; The cathode cover comprises a first side wall and a second side wall arranged parallel to the electron emission direction; The first side wall and the second side wall are arranged around the side of the cathode emitter; The distance between the first side wall and the side surface of the cathode emitter is smaller than the distance between the second side wall and the side surface of the cathode emitter; The first sidewalls are connected to the second sidewalls with a first annular connecting wall facing the electron emission direction.

8. The cathode assembly according to claim 7, wherein The first side wall includes: a first sub-side wall and a second sub-side wall spaced apart from each other; The first sub-sidewall and the second sub-sidewall are both parallel to the electron emission direction; The distance between the first sub-sidewall and the side surface of the cathode emitter is smaller than the distance between the second sub-sidewall and the side surface of the cathode emitter; The second sub-side wall is connected to the first annular connecting wall, and the first sub-side wall and the second sub-side wall are connected by a connecting component; The connecting component includes a second annular connecting wall, the inner end surface of the second annular connecting wall is connected to the outer side surface of the first sub-side wall, and the outer end surface of the second annular connecting wall is connected to the inner side surface of the second sub-side wall.

9. The cathode assembly according to claim 7, wherein: At least a portion of the first annular connecting wall faces a surface that is in the same direction as the electron emission direction, forming a cone surface for focusing the electrons emitted by the cathode emitter.

10. The cathode assembly according to claim 7, wherein The cathode assembly further includes: a first base and a second base; the first base is fixedly connected to the second base; The at least two clamping rods are arranged on the first base; The cathode cover is arranged on the second base; The first base is made of non-conductive material, and the second base and the cathode cover are made of conductive material.

11. An electron emission device, characterized in that: The electron emission device comprises the cathode assembly according to any one of claims 1 to 10.

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