Calibration device for assembling semiconductor equipment

Abstract

The utility model discloses a calibration device for assembling semiconductor equipment, which relates to the technical field of semiconductor equipment and comprises a workbench, electric guide rails are mounted at two ends of the top of the workbench, and a driving motor is mounted on one side of each electric guide rail. First sliding blocks are slidably connected into the electric guide rails, fixing blocks are installed at the tops of the first sliding blocks, first electric push rods are installed at the ends of the opposite faces of the two fixing blocks, position sensors are installed in the middles of the two sides of the top of the workbench, and sliding rails are installed at the top of the workbench. According to the scheme, the problems that in the using process of an existing semiconductor wafer position detection and calibration device, the position of the wafer is not fixed, the wafer is prone to deviating after position adjustment, the center of the wafer does not coincide with the center of a platform of the wafer, the yield of the wafer is decreased, and even the wafer is broken and scrapped are solved.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor equipment, in particular to a calibration device for assembling semiconductor equipment. Background Art

[0002] In semiconductor manufacturing, a robotic arm is typically used to transfer wafers to a process chamber and place them on a wafer platform. To ensure optimal film thickness, uniformity, and stress on the wafer surface after processing, the center of the wafer must be perfectly aligned with the center of the wafer platform.

[0003] For example, announcement number CN212392219U is named as a device for semiconductor wafer position detection and calibration, which includes a machine for supporting and driving the wafer to rotate and a robot arm for placing the wafer on the machine. It also includes a monitor for detecting the position offset of the wafer and a positioning structure for adjusting the position of the wafer relative to the machine. The positioning structure includes a calibration plate and a driving structure for driving the calibration plate to move relative to the machine.

[0004] The above-mentioned device does not fix the position of the wafer during use, which may easily cause the wafer to shift again after the position is adjusted. The center of the wafer and the center of the wafer platform do not coincide with each other, which will lead to a decrease in the yield of the wafer and even cause the wafer to break and be scrapped. Therefore, we propose a calibration device for semiconductor equipment assembly to solve the above-mentioned problems. Utility Model Content

[0005] The purpose of the present utility model is to provide a calibration device for semiconductor equipment assembly, so as to solve the problem that the existing semiconductor wafer position detection calibration device proposed in the above background technology does not fix the position of the wafer during use, which easily causes the wafer to shift again after the position is adjusted, and the center of the wafer does not coincide with the center of the wafer platform, which will lead to a decrease in the yield of the wafer and even cause the wafer to break and be scrapped.

[0006] To achieve the above-mentioned objectives, the present invention provides the following technical solutions: a calibration device for assembling semiconductor equipment, comprising a workbench, wherein electric guide rails are installed at both ends of the top of the workbench, a driving motor is installed on one side of the electric guide rail, a first slider is slidably connected inside the electric guide rail, a fixed block is installed on the top of the first slider, a first electric push rod is installed on one end of the opposite surfaces of the two fixed blocks, a position sensor is installed at the middle position of both sides of the top of the workbench, a slide rail is installed on the top of the workbench, the slide rail is located between the two position sensors and is parallel to the electric guide rail, a second slider is slidably connected inside the slide rail, a tray is installed on the top of the second slider, a circular groove is provided at the middle position of the top of the tray, second electric push rods are installed on both sides of the second slider, the second electric push rods are located inside the slide rail, an abutment plate is installed on the side opposite to each other, and a controller is installed at the front end of the middle part of the workbench.

[0007] Preferably, a rubber pad is installed at one end of the opposite surfaces of the two first electric push rods.

[0008] Preferably, the other end of the rubber pad is provided with an arc-shaped groove.

[0009] Preferably, sensors are installed on one side of the two abutment plates close to the position sensor.

[0010] Preferably, the position sensor is bidirectionally electrically connected to the inductor, the output end of the position sensor is electrically connected to the input end of the controller, and the output end of the controller is electrically connected to the input end of the drive motor.

[0011] Preferably, a cylinder is installed on the inner bottom of the circular groove, and a suction cup is installed on the top of the cylinder.

[0012] Preferably, shock-absorbing pads are installed around the bottom of the workbench.

[0013] Compared with the prior art, the beneficial effects of the present invention are:

[0014] The utility model clamps the wafer by two rubber pads to avoid the phenomenon of squeezing and friction, thereby ensuring the quality of the wafer. The second electric push rod makes the two abutment plates contact the two sides of the wafer, thereby fixing the wafer and the tray. The cylinder can move the suction cup up until it contacts the bottom of the wafer and generates suction, thereby fixing the wafer. The electric guide rail and the two rubber pads can drive the wafer to move left and right on the slide rail. The position of the wafer on the workbench is judged by the distance from the two sets of position sensors to the sensor, thereby judging whether the wafer is working. The center position of the table, when the distances from the two sets of position sensors to the sensors are equal, the position sensor sends an electrical signal to the controller, which sends an electrical signal to the drive motor through the controller to stop the drive motor, thereby achieving the center of the wafer coinciding with the center of the worktable, solving the problem that the existing semiconductor wafer position detection and calibration device does not fix the position of the wafer during use, which easily causes the wafer to shift again after position adjustment, and the center of the wafer does not coincide with the center of the wafer platform, which will lead to a decrease in the yield of the wafer and even cause the wafer to break and be scrapped. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0016] Figure 2 This is a schematic diagram of the top structure of the utility model;

[0017] Figure 3 It is a right side cross-sectional structural schematic diagram of the present utility model;

[0018] Figure 4 This is a partial enlarged view of point A of the present utility model;

[0019] In the figure: 1. Workbench; 2. Shock-absorbing foot pad; 3. Electric guide rail; 4. Drive motor; 5. First slider; 6. Fixed block; 7. First electric push rod; 8. Rubber pad; 9. Position sensor; 10. Slide rail; 11. Second slider; 12. Tray; 13. Circular groove; 14. Cylinder; 15. Suction cup; 16. Second electric push rod; 17. Abutment plate; 18. Sensor; 19. Controller. DETAILED DESCRIPTION

[0020] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments.

[0021] See also Figure 1-4, the utility model provides an embodiment: a calibration device for assembling semiconductor equipment, comprising a workbench 1, electric guide rails 3 are installed at both ends of the top of the workbench 1, a drive motor 4 is installed on one side of the electric guide rail 3, a first slider 5 is slidably connected inside the electric guide rail 3, a fixed block 6 is installed on the top of the first slider 5, a first electric push rod 7 is installed on one end of the opposite surface of the two fixed blocks 6, a position sensor 9 is installed at the middle position of both sides of the top of the workbench 1, a slide rail 10 is installed on the top of the workbench 1, the slide rail 10 is located between the two position sensors 9 and is parallel to the electric guide rail 3, a second slider 11 is slidably connected inside the slide rail 10, a tray 12 is installed on the top of the second slider 11, a circular groove 13 is provided at the middle position of the top of the tray 12, second electric push rods 16 are installed on both sides of the second slider 11, the second electric push rod 16 is located inside the slide rail 10, and an abutment plate 17 is installed on the side opposite to each other of the two second electric push rods 16, and a controller 19 is installed at the front end of the middle of the workbench 1.

[0022] See also Figure 1 A rubber pad 8 is installed at one end of the opposite surface of the two first electric push rods 7. The wafer is clamped by the two rubber pads 8 to avoid squeezing and friction, thereby ensuring the quality of the wafer.

[0023] See also Figure 1 The other end of the rubber pad 8 is provided with an arc-shaped groove, which facilitates better clamping of the wafer and avoids the occurrence of the wafer tilting phenomenon, thereby affecting the position calibration of the wafer.

[0024] See also Figure 1 and Figure 2 A sensor 18 is installed on one side of the two abutment plates 17 close to the position sensor 9. The position sensor 9 adopts the LE-A series laser displacement sensor. The position of the wafer on the workbench 1 is judged by the distance from the two sets of position sensors 9 to the sensor 18, thereby judging whether the wafer is in the center position of the workbench 1.

[0025] See also Figure 1 and Figure 2 The position sensor 9 is bidirectionally electrically connected to the sensor 18, the output end of the position sensor 9 is electrically connected to the input end of the controller 19, and the output end of the controller 19 is electrically connected to the input end of the drive motor 4. The bidirectional electrical connection between the position sensor 9 and the sensor 18 can detect the distance from the position sensor 9 to the sensor 18. When the distances from the two groups of position sensors 9 to the sensor 18 are equal, the position sensor 9 sends an electrical signal to the controller 19, which sends an electrical signal to the drive motor 4 through the controller 19 to stop the drive motor 4 from running, thereby achieving the coincidence of the center of the wafer and the center position of the workbench 1.

[0026] See also Figure 4A cylinder 14 is installed at the inner bottom of the circular groove 13. The cylinder 14 can move the suction cup 15 upward until it contacts the bottom of the wafer and generates suction, thereby fixing the wafer.

[0027] See also Figure 1 Shock-absorbing pads 2 are installed around the bottom of the workbench 1 to improve the stability of the workbench 1 and facilitate calibration of the position of the wafer on the workbench 1.

[0028] Working principle: When in use, the wafer is placed on the tray 12. At this time, the cylinder 14 and the suction cup 15 are located inside the circular groove 13. The drive motor 4 is started, and the two first electric push rods 7 are moved to the appropriate position under the action of the electric guide rail 3. Under the action of the first electric push rod 7, the wafer is clamped by two rubber pads 8 to avoid squeezing and friction, thereby ensuring the quality of the wafer. Under the action of the second electric push rod 16, the two abutment plates 17 are in contact with both sides of the wafer, thereby fixing the wafer to the tray 12. The suction cup 15 can be moved up by the cylinder 14 until it contacts the bottom of the wafer and generates suction, thereby The wafer is fixed and can be moved left and right on the slide rail 10 under the action of the electric guide rail 3 and the two rubber pads 8. The position sensor 9 is turned on. The position sensor 9 adopts the LE-A series laser displacement sensor. The position of the wafer on the workbench 1 is judged by the distance from the two groups of position sensors 9 to the sensor 18, thereby judging whether the wafer is in the center position of the workbench 1. When the distances from the two groups of position sensors 9 to the sensor 18 are equal, the position sensor 9 sends an electrical signal to the controller 19, and the controller 19 sends an electrical signal to the drive motor 4 to stop the drive motor 4, thereby achieving the coincidence of the center of the wafer and the center position of the workbench 1.

[0029] It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above and that the present invention can be implemented in other specific forms without departing from the spirit or essential characteristics of the present invention. Therefore, the embodiments should be considered in all respects as illustrative and non-restrictive, and the scope of the present invention is defined by the appended claims, not the foregoing description, and all variations within the meaning and range of equivalents of the claims are intended to be encompassed within the present invention. Any reference sign in a claim should not be construed as limiting the claim to which it relates.

Claims

1. A calibration device for semiconductor equipment assembly, comprising a workbench (1), characterized in that: Electric guide rails (3) are installed at both ends of the top of the workbench (1), a driving motor (4) is installed on one side of the electric guide rail (3), a first slider (5) is slidably connected inside the electric guide rail (3), a fixed block (6) is installed on the top of the first slider (5), a first electric push rod (7) is installed on one end of the opposite surface of the two fixed blocks (6), position sensors (9) are installed in the middle position of both sides of the top of the workbench (1), and a slide rail (10) is installed on the top of the workbench (1), and the slide rail (10) is located between the two position sensors (9). , and is parallel to the electric guide rail (3), the interior of the slide rail (10) is slidably connected to a second slider (11), the top of the second slider (11) is installed with a tray (12), the middle position of the top of the tray (12) is provided with a circular groove (13), both sides of the second slider (11) are installed with second electric push rods (16), the second electric push rods (16) are located inside the slide rail (10), and abutment plates (17) are installed on the back side of the two second electric push rods (16), and a controller (19) is installed at the front end of the middle part of the workbench (1).

2. The calibration device for semiconductor device assembly according to claim 1, wherein: A rubber pad (8) is installed at one end of the opposite surface of the two first electric push rods (7).

3. The calibration device for semiconductor device assembly according to claim 2, wherein: The other end of the rubber pad (8) is provided with an arc-shaped groove.

4. The calibration device for semiconductor device assembly according to claim 1, wherein: A sensor (18) is installed on one side of the two abutment plates (17) close to the position sensor (9).

5. The calibration device for semiconductor device assembly according to claim 4, characterized in that: The position sensor (9) is bidirectionally electrically connected to the inductor (18), the output end of the position sensor (9) is electrically connected to the input end of the controller (19), and the output end of the controller (19) is electrically connected to the input end of the drive motor (4).

6. The calibration device for semiconductor device assembly according to claim 1, wherein: A cylinder (14) is installed on the inner bottom of the circular groove (13), and a suction cup (15) is installed on the top of the cylinder (14).

7. The calibration device for semiconductor device assembly according to claim 1, wherein: Shock-absorbing foot pads (2) are installed around the bottom of the workbench (1).

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