Cleaning equipment for wafer processing

Abstract

The utility model discloses a cleaning device for wafer processing, and relates to the technical field of wafer processing. The cleaning equipment for wafer processing comprises a cleaning pool body, an ultrasonic transducer is arranged on the cleaning pool body, a lifting unit is arranged on the cleaning pool body, a supporting arm is arranged on the lifting unit, a bearing seat is arranged on the supporting arm, a wafer bearing frame is movably connected to the bearing seat in a clamped mode, and the wafer bearing frame is connected with the ultrasonic transducer in a clamped mode. The supporting arm is provided with a locking assembly used for locking the position of the wafer bearing frame, the wafer bearing frame is provided with a clamping block, the supporting arm is provided with a clamping groove, the clamping block is movably clamped in the clamping groove, and the wafer bearing frame is provided with a plurality of groups of limiting grooves. According to the cleaning equipment for wafer processing, it is guaranteed that the wafer bearing frame and the wafers are rapidly replaced when multiple batches of wafers are processed and cleaned, the idle time of the equipment is shortened, and the cleaning efficiency is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer processing, in particular to a device for cleaning wafer processing. Background Art

[0002] Wafer processing cleaning equipment can be divided into various types based on different cleaning solutions and technologies, such as acid cleaning, alkaline cleaning, oxidation cleaning, and ultrasonic cleaning. Among them, ultrasonic cleaning is widely used in single-wafer cleaning equipment due to its advantages such as good cleaning effect, high speed, and easy automation.

[0003] At present, in the ultrasonic cleaning process of wafers, the wafers need to be placed on a liftable bracket in turn. After the wafers are clamped on the bracket, the bracket is lifted and lowered to make the wafers immersed in the cleaning tank and cleaned using ultrasonic equipment. During operation, the bracket is usually fixed. After cleaning is completed, the cleaned wafers need to be gradually disassembled, and then the uncleaned wafers need to be gradually clamped. This operation time is long. Therefore, when performing multiple batches of wafer processing and cleaning, the time for replacing wafers during the multiple batches of cleaning is long, the operation is inconvenient, and the cleaning efficiency is reduced. In view of the shortcomings of the existing technology, the utility model provides a wafer processing cleaning device to solve the above problems. Utility Model Content

[0004] In response to the deficiencies in the prior art, the present invention provides a wafer processing and cleaning device, in which a wafer carrier that is convenient for quick clamping is provided on a support arm and a carrier seat with a lifting function on the cleaning device, and the wafer carrier is utilized to realize quick clamping of multiple groups of wafers. The wafer carrier and the carrier seat are split, and are convenient for quick clamping and positioning by cooperating with a clamping block and a clamping slot. At the same time, the locking component design makes it convenient to lock and disassemble the wafer carrier and the carrier seat, thereby ensuring that the wafer carrier and the wafer can be quickly replaced during the processing and cleaning of multiple batches of wafers, thereby reducing the idle time of the equipment and improving the cleaning efficiency.

[0005] To achieve the above objectives, the present invention is implemented through the following technical solutions: a wafer processing cleaning device, comprising a cleaning pool body, an ultrasonic transducer provided on the cleaning pool body, and a lifting unit provided on the cleaning pool body;

[0006] The lifting unit is provided with a support arm, the support arm is provided with a bearing seat, and the bearing seat is movably connected to a wafer carrier;

[0007] The support arm is provided with a locking assembly for locking the position of the wafer carrier, the wafer carrier is provided with a clamping block, the support arm is provided with a clamping slot, and the clamping block is movably clamped in the clamping slot;

[0008] The wafer carrier is provided with a plurality of limiting grooves.

[0009] Preferably, the lifting unit comprises a support frame fixedly connected to the main body of the cleaning tank, and a lifting platform is movably connected to the support frame, and the lifting platform is used to support the support arm;

[0010] The support frame is fixedly connected with a motor body, and an output end of the motor body is provided with a screw rod threadedly connected with the lifting platform.

[0011] Preferably, the locking assembly includes a movable column movably engaged with the interior of the support arm, a locking rod is fixedly connected to the movable column, a locking hole is provided on the clamping block, and the locking rod is movably engaged with the locking hole.

[0012] Preferably, a spring is fixedly connected between the movable column and the inner wall of the support arm, and a push handle is provided on the movable column.

[0013] Preferably, the wafer carrier is provided with a reinforcement strip, and the reinforcement strip is clamped with the carrier seat.

[0014] Preferably, a reinforcement groove corresponding to the reinforcement strip is provided on the supporting seat.

[0015] The utility model discloses a wafer processing cleaning device, which has the following beneficial effects:

[0016] The wafer processing and cleaning equipment is provided with a wafer carrier that is convenient for quick clamping on a support arm and a carrier seat with a lifting function on the cleaning equipment. The wafer carrier is used to realize quick clamping of multiple groups of wafers. The wafer carrier and the carrier seat are split, and the clamping block and the clamping slot cooperate to facilitate quick clamping and positioning. At the same time, the locking component design makes it easy to lock and disassemble the wafer carrier and the carrier seat. Therefore, it is ensured that the wafer carrier and the wafer can be quickly replaced when multiple batches of wafers are processed and cleaned, thereby reducing the idle time of the equipment and improving the cleaning efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0018] Figure 1 This is a schematic diagram of the overall structure of the utility model;

[0019] Figure 2 This is a schematic diagram of position adjustment of the wafer carrier of the present invention;

[0020] Figure 3 This is a schematic structural diagram of the support seat of the utility model;

[0021] Figure 4 This is a schematic structural diagram of the locking assembly of the utility model;

[0022] Figure 5 This is a disassembly diagram of the wafer carrier of the present invention.

[0023] In the figure: 1. Cleaning pool body; 101. Ultrasonic transducer; 2. Lifting unit; 201. Support frame; 202. Lifting platform; 203. Motor body; 204. Screw; 3. Support arm; 301. Card slot; 4. Support seat; 401. Reinforcement slot; 5. Wafer carrier; 501. Limiting slot; 502. Card block; 5021. Locking hole; 503. Reinforcement strip; 6. Locking assembly; 601. Movable column; 602. Locking rod; 603. Spring; 604. Push handle. DETAILED DESCRIPTION

[0024] To make the purpose, technical solutions, and advantages of the embodiments of the present invention more clear, the technical solutions in the embodiments of the present invention are clearly and completely described. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making any creative efforts are within the scope of protection of the present invention.

[0025] The embodiment of the present application provides a wafer processing and cleaning device, which solves the problem that the existing wafer processing and cleaning equipment needs to gradually disassemble the cleaned wafers after wafer cleaning is completed, and then gradually clamp the uncleaned wafers. This operation takes a long time. Therefore, when performing multiple batches of wafer processing and cleaning, the time for replacing wafers during the multiple batches of cleaning is long, the operation is inconvenient, and the cleaning efficiency is reduced.

[0026] In order to better understand the above technical solution, the above technical solution will be described in detail below with reference to the accompanying drawings and specific implementation methods.

[0027] The utility model discloses a device for cleaning wafer processing. Figure 1-5 As shown, it includes a cleaning pool body 1, an ultrasonic transducer 101 is provided on the cleaning pool body 1, a lifting unit 2 is provided on the cleaning pool body 1, a support arm 3 is provided on the lifting unit 2, a bearing seat 4 is provided on the support arm 3, and a wafer carrier 5 is movably connected to the bearing seat 4;

[0028] The device is used for wafer processing and cleaning. When wafer processing and cleaning are performed, the wafer is placed on the wafer carrier 5 for clamping. The wafer carrier 5 is provided with multiple groups of limiting grooves 501, and the limiting grooves 501 are used to provide positioning for the wafer. After the wafer is limited, the wafer carrier 5 is quickly clamped and locked with the supporting seat 4, and then the lifting unit 2 controls the movement of the support arm 3 and the supporting seat 4, so that the supporting seat 4 and the wafer carrier 5 are immersed in the interior of the cleaning tank body 1, so as to clean the multiple groups of wafers on the wafer carrier 5. After the ultrasonic transducer 101 is powered on, ultrasonic cleaning is formed, which has a good cleaning effect on the wafer.

[0029] The lifting unit 2 includes a support frame 201 fixedly connected to the cleaning tank body 1, a lifting platform 202 is movably connected to the support frame 201, and the lifting platform 202 is used to support the support arm 3. A motor body 203 is fixedly connected to the support frame 201, and the output end of the motor body 203 is provided with a screw rod 204 threadedly connected to the lifting platform 202;

[0030] The lifting unit 2 in the device has a simple structural design. The lifting unit 2 uses the motor body 203 to provide power. The motor body 203 drives the screw rod 204 to rotate, and the screw rod 204 drives the lifting platform 202 to move along the support frame 201. The lifting platform 202 then drives the support arm 3 and the supporting seat 4 to move, thereby realizing the lifting and lowering control of the wafer supporting frame 5 and multiple groups of wafers.

[0031] The support arm 3 is provided with a locking assembly 6 for locking the position of the wafer carrier 5. The wafer carrier 5 is provided with a clamping block 502. The support arm 3 is provided with a clamping slot 301. The clamping block 502 is movably clamped in the clamping slot 301.

[0032] The design of the clamping block 502 and the clamping slot 301 facilitates the docking operation between the wafer carrier 5 and the carrier seat 4. During docking, the clamping block 502 and the clamping slot 301 are simply engaged. Combined with the design of the locking assembly 6, the wafer carrier 5 and the carrier seat 4 can be quickly locked after being engaged, thereby facilitating the rapid positioning and cleaning of multiple groups of wafers, and allowing them to be quickly removed after cleaning.

[0033] The locking assembly 6 includes a movable column 601 that is movably engaged with the interior of the support arm 3. A locking rod 602 is fixedly connected to the movable column 601. A locking hole 5021 is formed on the clamping block 502. The locking rod 602 is movably engaged in the locking hole 5021. A spring 603 is fixedly connected between the movable column 601 and the inner wall of the support arm 3. A push handle 604 is provided on the movable column 601.

[0034] The locking assembly 6 has a simple overall structure and is easy to operate. When in use, first push the push handle 604 so that the push handle 604 drives the movable column 601 and the locking rod 602 to move and squeeze the spring 603. At this time, the wafer carrier 5 and the carrier seat 4 are clamped, and the clamping block 502 and the clamping slot 301 are clamped. After clamping, release the push handle 604, the spring 603 resets and pushes the movable column 601 and the locking rod 602 to move, so that the locking rod 602 is inserted into the lock hole 5021, completing the rapid clamping and locking of the wafer carrier 5 and the carrier seat 4.

[0035] The wafer carrier 5 is provided with a reinforcement strip 503, which is clamped with the carrier seat 4. The carrier seat 4 is provided with a reinforcement groove 401 corresponding to the reinforcement strip 503. The device makes the wafer carrier 5 and the carrier seat 4 stably docked after being clamped and locked through the setting of the reinforcement strip 503 and the reinforcement groove 401, and is not easy to loosen.

[0036] The above shows and describes the basic principles, main features and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited to the above embodiments. The above embodiments and descriptions are merely illustrative of the principles of the present invention. Various changes and improvements may be made to the present invention without departing from the spirit and scope of the present invention. Such changes and improvements are intended to fall within the scope of the present invention. The scope of protection claimed in this invention is defined by the appended claims and their equivalents.

Claims

1. A wafer processing cleaning device, comprising a cleaning tank body (1), wherein the cleaning tank body (1) is provided with an ultrasonic transducer (101), characterized in that: The cleaning tank body (1) is provided with a lifting unit (2); The lifting unit (2) is provided with a support arm (3), the support arm (3) is provided with a bearing seat (4), and a wafer bearing frame (5) is movably connected to the bearing seat (4); The support arm (3) is provided with a locking assembly (6) for locking the position of the wafer carrier (5); the wafer carrier (5) is provided with a clamping block (502); the support arm (3) is provided with a clamping slot (301); the clamping block (502) is movably clamped in the clamping slot (301); The wafer carrier (5) is provided with a plurality of groups of limiting grooves (501).

2. The wafer processing cleaning equipment according to claim 1, characterized in that: The lifting unit (2) comprises a support frame (201) fixedly connected to the cleaning tank body (1); a lifting platform (202) is movably connected to the support frame (201); and the lifting platform (202) is used to support the support arm (3); A motor body (203) is fixedly connected to the support frame (201), and a screw rod (204) threadedly connected to the lifting platform (202) is provided at the output end of the motor body (203).

3. The wafer processing cleaning equipment according to claim 1, characterized in that: The locking assembly (6) comprises a movable column (601) movably engaged with the interior of the support arm (3); a locking rod (602) is fixedly connected to the movable column (601); a locking hole (5021) is provided on the clamping block (502); and the locking rod (602) is movably engaged with the locking hole (5021).

4. The wafer processing cleaning equipment according to claim 3, characterized in that: A spring (603) is fixedly connected between the movable column (601) and the inner wall of the support arm (3), and a push handle (604) is provided on the movable column (601).

5. The wafer processing cleaning equipment according to claim 1, characterized in that: The wafer carrier (5) is provided with a reinforcement clip (503), and the reinforcement clip (503) is clamped with the carrier seat (4).

6. The wafer processing cleaning equipment according to claim 5, characterized in that: The bearing seat (4) is provided with a reinforcement groove (401) corresponding to the reinforcement clip (503).

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