Buckle type connecting device for preventing hold from sliding down and separating

Abstract

The utility model relates to the technical field of semiconductor packaging, in particular to a buckle type connecting device for preventing a hold from sliding down and being separated. A connecting rod is fixed to the lower end of the welding head, a containing groove is formed in the connecting rod and communicates with the exterior of the connecting rod, a positioning buckle and a spring are movably arranged on the inner wall of the containing groove, a positioning hole is formed in the outer surface of a sleeve and communicates with the interior of the sleeve, and a hold head is fixed to the lower end of the sleeve. The welding head has the advantages that the connecting mode between the hold head and the welding head connecting rod is changed, under the limiting effect of mutual clamping of the positioning buckle and the positioning hole, under the condition that the suction nozzle sucks a thick chip or the reverse pulling force of chip mounting is large, the chip can be sucked through the suction nozzle, and the chip can be sucked through the suction nozzle. In addition, the connecting device is simple in structure and easy to operate, the cost is not increased too much, and therefore slipping prevention of the hold head in the chip mounting process is achieved.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor packaging, in particular to a snap-on connection device for preventing a hold from sliding down and disengaging. Background Art

[0002] Semiconductors refer to materials whose electrical conductivity at room temperature is between that of conductors and insulators.

[0003] In the existing technology, semiconductors are widely used in integrated circuits, communication systems, photovoltaic power generation and other fields. When manufacturing semiconductor products, semiconductor packaging is a very important part. Usually, semiconductor packaging is performed using wafer-mounted semiconductor equipment. The hold head is fixed to the welding head of the robotic arm by magnetic attraction. Then the robotic arm controls the hold head to transfer the chip from the wafer to the substrate or frame, and fix the chip with glue or adhesive film.

[0004] However, the existing holding head is a magnetic device that is fixed to the welding head by magnetic attraction. When the holding head is used to load a large and thick chip or when the reverse pulling force of the chip is large, the holding head is prone to slipping or even falling, resulting in a height difference between the chip being sucked and the chip being loaded, affecting the quality of the chip loading, such as causing bubbles to form cavities between the chip and the glue or mucous membrane or causing the chip to tilt. Utility Model Content

[0005] The purpose of the present invention is to provide a snap-on connection device that prevents a hold from sliding down and disengaging, so as to solve the problems raised in the above-mentioned background technology.

[0006] To achieve the above-mentioned purpose, the present invention provides the following technical solution: a snap-on connection device for preventing a hold from sliding down and disengaging, the snap-on connection device for preventing a hold from sliding down and disengaging comprising:

[0007] A welding head, wherein a connecting rod is fixed to the lower end of the welding head, a receiving groove is provided inside the connecting rod, the receiving groove is connected to the outside of the connecting rod, and a positioning buckle and a spring are movably provided on the inner wall of the receiving groove;

[0008] A sleeve, wherein a positioning hole is opened on the outer surface of the sleeve, the positioning hole is connected to the interior of the sleeve, a hold head is fixed at the lower end of the sleeve, a suction nozzle is fixed at the lower end of the hold head, and a chip is fixed at the lower end of the suction nozzle.

[0009] Preferably, the sleeve is movably mounted on the outer surface of the connecting rod, and the positioning hole corresponds to and is connected to the receiving groove.

[0010] Preferably, the receiving groove has a limit block fixed on the inner wall near the port, and the limit blocks are provided in two groups, and the two groups of limit blocks are symmetrically distributed.

[0011] Preferably, a limiting groove, an annular groove and a through groove are provided on the outer surface of the positioning buckle, one end of the limiting groove and the through groove in the same direction is connected to the annular groove, and the other end of the through groove penetrates the outer surface of the positioning buckle.

[0012] Preferably, two groups of the limiting grooves and the through grooves are provided, the two groups of the limiting grooves are symmetrically distributed, and the two groups of the through grooves are symmetrically distributed. The limiting blocks correspond to the limiting grooves, the annular grooves and the through grooves and are clamped to form a movably connected connection.

[0013] Preferably, the spring is located on the inner wall surface of the receiving groove behind the positioning buckle, and a protrusion is fixed on the outer end surface of the positioning buckle.

[0014] Compared with the prior art, the beneficial effects of the present invention are:

[0015] This device changes the connection method between the hold head and the welding head connecting rod. Under the limit of the mutual locking of the positioning buckle and the positioning hole, when the suction nozzle sucks thicker chips or the reverse pulling force of the chip is large, the hold head will not slip out of the welding head. In addition, this connection device has a simple structure, is easy to operate, and does not increase the cost too much, thereby preventing the hold head from slipping when loading the chip. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a three-dimensional schematic diagram of the overall structure of the utility model;

[0017] Figure 2 This is an exploded three-dimensional schematic diagram of the overall structure of the utility model;

[0018] Figure 3 This is a cutaway exploded perspective diagram of the positioning buckle assembly structure of the utility model;

[0019] Figure 4 It is a three-dimensional schematic diagram of the positioning buckle structure of the utility model.

[0020] In the figure: 1. Welding head; 2. Connecting rod; 3. Positioning buckle; 4. Sleeve; 5. Hold head; 6. Suction nozzle; 7. Chip; 8. Positioning hole; 9. Storage slot; 10. Spring; 11. Limit block; 12. Limit slot; 13. Annular groove; 14. Bump; 15. Through slot. DETAILED DESCRIPTION

[0021] In order to clearly and completely describe the objectives and technical solutions of the present invention and make the advantages more clearly understood, the embodiments of the present invention are further described in detail below with reference to the accompanying drawings. It should be understood that the specific embodiments described herein are part of the embodiments of the present invention, not all of them, and are only used to explain the embodiments of the present invention, not to limit the embodiments of the present invention. All other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0022] Example 1: Please refer to Figures 1 to 4 The utility model provides a technical solution: a snap-on connection device that prevents the hold from sliding down and disengaging. A connecting rod 2 is fixed to the lower end of the welding head 1. A receiving groove 9 is opened inside the connecting rod 2. The receiving groove 9 is connected to the outside of the connecting rod 2. A positioning buckle 3 and a spring 10 are movably provided on the inner wall of the receiving groove 9. The positioning buckle 3 is held by the spring 10 so as to prevent it from moving, so that the positioning buckle 3 is always locked with the positioning hole 8.

[0023] A positioning hole 8 is provided on the outer surface of the sleeve 4, and the positioning hole 8 is connected to the inside of the sleeve 4. A hold head 5 is fixed to the lower end of the sleeve 4, a suction nozzle 6 is fixed to the lower end of the hold head 5, and a chip 7 is fixed to the lower end of the suction nozzle 6. Under the limit setting of the positioning buckle 3 and the positioning hole 8, when the suction nozzle 6 absorbs a thicker chip or the reverse pulling force of the chip is large, the hold head 5 will not slip out of the welding head 1, thereby preventing the hold head 5 from slipping when loading the chip.

[0024] On the basis of Example 1, in order to prevent the hold head 5 from slipping when loading the sheet, the sleeve 4 is movably sleeved on the outer surface of the connecting rod 2, and the positioning hole 8 corresponds to and is connected to the receiving groove 9, so that the movable buckle 3 can be simultaneously clamped in the positioning hole 8 when installed in the receiving groove 9, thereby limiting the sleeve 4.

[0025] A limiting block 11 is fixed to the inner wall of the receiving groove 9 near the end. There are two groups of limiting blocks 11, which are symmetrically distributed. The limiting blocks 11 and the limiting groove 12 are locked together to prevent the positioning buckle 3 from rotating in the receiving groove 9.

[0026] A limiting groove 12, an annular groove 13 and a through groove 15 are provided on the outer surface of the positioning buckle 3. One end of the limiting groove 12 and the through groove 15 in the same direction is connected to the annular groove 13, and the other end of the through groove 15 penetrates the outer surface of the positioning buckle 3. When the limiting block 11 is locked with the through groove 15, and the other end of the through groove 15 penetrates the outer surface of the positioning buckle 3, the positioning buckle 3 can be pulled outward to be removed from the storage slot 9.

[0027] There are two groups of limit grooves 12 and through grooves 15, which are symmetrically distributed. The limit blocks 11 correspond to the limit grooves 12, the annular grooves 13 and the through grooves 15 and are fixed thereto to form a movable connection.

[0028] The spring 10 is located on the inner wall surface of the receiving groove 9 behind the positioning buckle 3. A protrusion 14 is fixed to the outer end surface of the positioning buckle 3. The protrusion 14 makes it convenient for the operator to move and rotate the positioning buckle 3 in the receiving groove 9.

[0029] The specific solution is as follows: when the suction nozzle 6 sucks the chip, a certain pulling force will be generated between the chip and the blue film on the wafer. The magnitude of this pulling force is proportional to the size of the chip. The larger and thicker the chip, the greater the pulling force. Before using the hold head 5 to load the chip, it needs to be installed on the connecting rod 2 of the welding head 1. First, press the positioning buckle 3 to move it toward the inside of the storage groove 9. When the positioning buckle 3 moves, the limit block 11 will also slide on the limit groove 12. When the limit block 11 slides into the annular groove 13, the positioning buckle 3 is rotated in the storage groove 9 through the protrusion 14. When the through groove 15 corresponds to the limit block 11, stop rotating the positioning buckle 3. At this time, pull the positioning buckle 3 outward to remove it from the storage groove 9. After the welding head 1 is welded, the welding nozzle 6 will be tightened, and the welding head 1 will not fall out of the welding head 1. The welding head 1 will not fall out of the welding head 1, and the welding head 2 will not fall out of the welding head 1. The welding head 1 will not fall out of the welding head 1, and the welding head 2 will not fall out of the welding head 1. The welding head 1 will not fall out of the welding head 1, and the welding head 2 will not fall out of the welding head 1. The welding head 1 will not fall out of the welding head 1, and the welding head 2 will not fall out of the welding head 1, and the welding head 1 will not fall out of the welding head 1. The welding head 1 will not fall out of the welding head 1, and the ...

[0030] Although the embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and variations may be made to these embodiments without departing from the principles and spirit of the present invention, and the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A snap-on connection device for preventing a hold from sliding off, characterized in that: The snap-on connection device for preventing the hold from sliding down and disengaging comprises: A welding head (1), wherein a connecting rod (2) is fixed at the lower end of the welding head (1), a receiving groove (9) is provided inside the connecting rod (2), the receiving groove (9) is connected to the outside of the connecting rod (2), and a positioning buckle (3) and a spring (10) are movably provided on the inner wall of the receiving groove (9); A sleeve (4) is provided with a positioning hole (8) on the outer surface of the sleeve (4), the positioning hole (8) is connected to the interior of the sleeve (4), a holding head (5) is fixed at the lower end of the sleeve (4), a suction nozzle (6) is fixed at the lower end of the holding head (5), and a chip (7) is fixed at the lower end of the suction nozzle (6).

2. A snap-on connection device for preventing a hold from sliding down and disengaging according to claim 1, characterized in that: The sleeve (4) is movably sleeved on the outer surface of the connecting rod (2), and the positioning hole (8) corresponds to and is connected to the receiving groove (9).

3. The snap-on connection device for preventing the hold from sliding down and disengaging according to claim 2, characterized in that: The receiving groove (9) is fixed with a limiting block (11) on the inner wall near the end, and the limiting blocks (11) are provided in two groups, and the two groups of limiting blocks (11) are symmetrically distributed.

4. The snap-on connection device for preventing the hold from sliding down and disengaging according to claim 3, characterized in that: The outer surface of the positioning buckle (3) is provided with a limiting groove (12), an annular groove (13) and a through groove (15); one end of the limiting groove (12) and the through groove (15) in the same direction is connected to the annular groove (13), and the other end of the through groove (15) penetrates the outer surface of the positioning buckle (3).

5. The snap-on connection device for preventing the hold from sliding down and disengaging according to claim 4, characterized in that: The limiting grooves (12) and the through grooves (15) are both provided with two groups, the two groups of limiting grooves (12) are symmetrically distributed, and the two groups of through grooves (15) are symmetrically distributed. The limiting blocks (11) correspond to the limiting grooves (12), the annular grooves (13), and the through grooves (15) and are clamped and movably connected.

6. The snap-on connection device for preventing the hold from sliding down and disengaging according to claim 5, characterized in that: The spring (10) is located on the inner wall surface of the receiving groove (9) behind the positioning buckle (3), and a protrusion (14) is fixed on the outer end surface of the positioning buckle (3).

Images