Lens and 400G SR4 optical module

Abstract

The utility model relates to a lens. The height difference between a first aspheric lens array and a second aspheric lens array on the chip side of a lens main body is 20 + / -2 microns. According to the 400G SR4 optical module, a PD chip is 10-20 [mu] m lower than a Vcse l chip, a first aspheric lens array is 20 + / -2 [mu] m lower than a second aspheric lens array, the PD chip is coupled with the first aspheric lens array, the Vcse l chip is coupled with the second aspheric lens array, or the PD chip is 10-20 [mu] m higher than the Vcse l chip, the second aspheric lens array is 20 + / -2 [mu] m lower than the first aspheric lens array, and the PD chip is coupled with the second aspheric lens array. The PD chip is coupled with the first aspheric lens array, and the Vcse l chip is coupled with the second aspheric lens array. The method has the beneficial effects that the annular flux of the TX, the responsivity of the RX and a coupling flat region of the TX and the RX are not influenced, and the reliability of a coupling light path is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of optical modules, and in particular to a lens and a 400G SR4 optical module. Background Art

[0002] Traditional 400G SR4 optical modules use PD chips (receiving optical chips) and VCSE L chips (transmitting optical chips) with thicknesses of 150μm or 200μm. Since the thickness tolerance of both PD chips and VCSE L chips is ±10μm, there are three possible height differences between the PD chips and VCSE L chips within the thickness tolerance range:

[0003] ① The height difference between the PD chip and the Vcse l chip is less than or equal to 10μm;

[0004] ② The PD chip is 10μm to 20μm shorter than the Vcse l chip;

[0005] ③. PD chip is 10μm to 20μm higher than Vcse l chip;

[0006] For the above three situations, the lenses coupled in the traditional 400G SR4 optical module are the same lens, that is, the first aspheric lens array and the second aspheric lens array on the lens chip side are at the same height. For the first situation, coupling the first aspheric lens array and the second aspheric lens array with the same height has little effect on the optical performance. However, for the second and third situations, the existing technology still couples the first aspheric lens array and the second aspheric lens array with the same height. In this case, the encircled flux of TX and the responsivity of RX, as well as the coupling flat area of TX and RX, will be affected, resulting in a decrease in optical reliability. Utility Model Content

[0007] The technical problem to be solved by the present invention is to provide a lens and a 400G SR4 optical module to overcome the deficiencies in the above-mentioned prior art.

[0008] The technical solution of the utility model to solve the above technical problems is as follows: a lens, comprising: a lens body, a first aspheric lens array and a second aspheric lens array distributed in rows in a concave cavity on the chip side of the lens body, and a height difference of 20μm±2μm between the first aspheric lens array and the second aspheric lens array.

[0009] The beneficial effects of the utility model are:

[0010] Compared with the existing technology, the first aspheric lens array and the second aspheric lens array have a height difference of 20μm±2μm. When this type of lens is used in a 400G SR4 optical module, the height of the PD chip and the Vcse l chip is first measured, and then the corresponding lens is selected based on the actual height measurement. For example:

[0011] If the PD chip is 10μm to 20μm shorter than the Vcse l chip, then the first aspheric lens array in the lenses selected for coupling is 20μm±2μm lower than the second aspheric lens array, and the PD chip is coupled with the first aspheric lens array, and the Vcse l chip is coupled with the second aspheric lens array. That is, by making the first aspheric lens array 20μm±2μm lower than the second aspheric lens array, the situation that the PD chip is 10μm to 20μm shorter than the Vcse l chip is compensated;

[0012] If the PD chip is 10μm to 20μm higher than the Vcse l chip, then the second aspheric lens array in the lens selected for coupling is 20μm±2μm lower than the first aspheric lens array, and the PD chip is coupled with the first aspheric lens array, and the Vcse l chip is coupled with the second aspheric lens array, that is, by making the second aspheric lens array 20μm±2μm lower than the first aspheric lens array, the situation that the Vcse l chip is 10μm to 20μm shorter than the PD core 3 is compensated;

[0013] Through the above operations, the height difference between the distance between the PD chip and the first aspheric lens array and the distance between the Vcse l chip and the second aspheric lens array is effectively controlled to be less than or equal to 10μm, thereby not affecting the annular flux of TX and the responsiveness of RX, as well as the coupling flat area of TX and RX, greatly improving the coupling yield and improving the reliability of the coupling optical path.

[0014] On the basis of the above technical solution, the present invention can also be improved as follows.

[0015] Furthermore, there is a 20 μm height difference between the first aspheric lens array and the second aspheric lens array.

[0016] Furthermore, the first aspheric lens array has four aspheric lenses distributed at a preset interval, and the second aspheric lens array has four aspheric lenses distributed at a preset interval.

[0017] Based on the above technical solution, the utility model also provides a 400G SR4 optical module, including: a PCB board, a PD chip, a Vcse l chip and a lens. The chip side of the lens is bonded to the PCB board, and the PD chip and the Vcse l chip patched on the PCB board are arranged in the cavity on the chip side of the lens. The PD chip is 10μm to 20μm shorter than the Vcse l chip, and the first aspheric lens array is 20μm±2μm lower than the second aspheric lens array. The PD chip is coupled with the first aspheric lens array, and the Vcse l chip is coupled with the second aspheric lens array.

[0018] The further beneficial effect of adopting the above method is: effectively controlling the height difference between the distance between the PD chip and the first aspheric lens array and the distance between the Vcse l chip and the second aspheric lens array to be less than or equal to 10μm, thereby not affecting the annular flux of TX and the responsiveness of RX, as well as the coupling flat area of TX and RX, greatly improving the coupling yield and improving the reliability of the coupling optical path.

[0019] Furthermore, there is a gap of 70 μm±30 μm between the chip side of the lens and the PCB for dispensing glue.

[0020] Based on the above technical solution, the utility model also provides a 400G SR4 optical module, including: a PCB board, a PD chip, a Vcse l chip and a lens. The chip side of the lens is bonded to the PCB board, and the PD chip and the Vcse l chip patched on the PCB board are arranged in the concave cavity on the chip side of the lens. The PD chip is 10μm to 20μm higher than the Vcse l chip, and the second aspheric lens array is 20μm±2μm lower than the first aspheric lens array. The PD chip is coupled with the first aspheric lens array, and the Vcse l chip is coupled with the second aspheric lens array.

[0021] The further beneficial effect of adopting the above method is: effectively controlling the height difference between the distance between the PD chip and the first aspheric lens array and the distance between the Vcse l chip and the second aspheric lens array to be less than or equal to 10μm, thereby not affecting the annular flux of TX and the responsiveness of RX, as well as the coupling flat area of TX and RX, greatly improving the coupling yield and improving the reliability of the coupling optical path.

[0022] Furthermore, there is a gap of 70 μm±30 μm between the chip side of the lens and the PCB for dispensing glue. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 The first aspheric lens array in the present invention is a lens that is 20±2 μm lower than the second aspheric lens array;

[0024] Figure 2The second aspheric lens array in the present invention is a lens that is 20±2 μm lower than the first aspheric lens array;

[0025] Figure 3 This is a structural diagram of a 400G SR4 optical module in which the PD chip is 10μm to 20μm shorter than the Vcse l chip in this utility model;

[0026] Figure 4 This is a structural diagram of a 400G SR4 optical module in which the Vcse l chip is 10μm to 20μm shorter than the PD chip in this utility model.

[0027] In the accompanying drawings, the components represented by the reference numerals are as follows:

[0028] 1. Lens, 110. Lens body, 120. First aspheric lens array, 130. Second aspheric lens array, 2. PCB board, 3. PD chip, 4. Vcse l chip. DETAILED DESCRIPTION

[0029] The principles and features of the present invention are described below in conjunction with the accompanying drawings. The examples given are only used to explain the present invention and are not used to limit the scope of the present invention.

[0030] Example 1

[0031] A lens includes: a lens body 110, wherein a first aspheric lens array 120 and a second aspheric lens array 130 are arranged in a row in a cavity on the chip side of the lens body 110, wherein the first aspheric lens array 120 and the second aspheric lens array 130 have a height difference of 20 μm±2 μm, that is, the height of the first aspheric lens array 120 is different from the height of the second aspheric lens array 130, for example, the height difference can be:

[0032] The first aspheric lens array 120 is 20 μm ± 2 μm lower than the second aspheric lens array 130. Figure 1 As shown;

[0033] Or, the second aspheric lens array 130 is lower than the first aspheric lens array 120 by 20 μm±2 μm, as shown in FIG. Figure 2 As shown;

[0034] Compared with the prior art, the first aspheric lens array 120 and the second aspheric lens array 130 have a height difference of 20μm±2μm. When this type of lens 1 is used in a 400G SR4 optical module, the height of the PD chip 3 and the Vcse l chip 4 is first measured, and then the lens 1 is selected accordingly based on the actual height measurement. For example:

[0035] For the case where the PD chip 3 is 10μm to 20μm shorter than the Vcse l chip 4, the first aspheric lens array 120 in the lens 1 selected during coupling is lowered by 20μm±2μm than the second aspheric lens array 130, and the PD chip 3 is coupled with the first aspheric lens array 120, and the Vcse l chip 4 is coupled with the second aspheric lens array 130. That is, by lowering the first aspheric lens array 120 by 20μm±2μm than the second aspheric lens array 130, the situation that the PD chip 3 is 10μm to 20μm shorter than the Vcse l chip 4 is compensated;

[0036] For the case where the PD chip 3 is 10μm to 20μm higher than the Vcse l chip 4, the second aspheric lens array 130 in the lens 1 selected during coupling is 20μm±2μm lower than the first aspheric lens array 120, and the PD chip 3 is coupled with the first aspheric lens array 120, and the Vcse l chip 4 is coupled with the second aspheric lens array 130, that is, the second aspheric lens array 130 is lowered by 20μm±2μm than the first aspheric lens array 120 to compensate for the fact that the Vcse l chip 4 is 10μm to 20μm shorter than the PD chip 3;

[0037] Through the above operations, the height difference between the distance between the PD chip 3 and the first aspheric lens array 120 and the distance between the Vcse l chip 4 and the second aspheric lens array 130 is effectively controlled to be less than or equal to 10μm, thereby not affecting the annular flux of TX and the responsiveness of RX, as well as the coupling flat area of TX and RX, greatly improving the coupling yield and improving the reliability of the coupling optical path.

[0038] Example 2

[0039] like Figure 1 、 Figure 2 As shown, this embodiment is a further improvement on the basis of embodiment 1, specifically as follows:

[0040] There is preferably a 20 μm height difference between the first aspheric lens array 120 and the second aspheric lens array 130 .

[0041] Furthermore, the first aspheric lens array 120 has four aspheric lenses distributed at a preset interval, and the second aspheric lens array 130 has four aspheric lenses distributed at a preset interval.

[0042] Example 3

[0043] like Figure 3As shown, a 400G SR4 optical module includes: a PCB board 2, a PD chip 3, a Vcse l chip 4 and a lens 1. The chip side of the lens 1 is bonded to the PCB board 2. The PD chip 3 and the Vcse l chip 4 are arranged in the cavity on the chip side of the lens 1. After the PD chip 3 and the Vcse l chip 4 are patched and wired, the height of the PD chip 3 and the Vcse l chip 4 are first tested. If the PD chip 3 is 10μm to 20μm shorter than the Vcse l chip 4 (this range does not include 10μm, but includes 20μm), then the first aspheric lens array 120 in the lens 1 selected for coupling is lowered by 20μm±2μm than the second aspheric lens array 130, and the PD chip 3 is coupled with the first aspheric lens array 120, and the Vcse l chip 4 is connected to the PCB board 2. The first chip 4 is coupled to the second aspheric lens array 130, that is, the first aspheric lens array 120 is lower than the second aspheric lens array 130 by 20μm±2μm to compensate for the fact that the PD chip 3 is 10μm to 20μm shorter than the Vcse l chip 4.

[0044] Through the above operations, the height difference between the distance between the PD chip 3 and the first aspheric lens array 120 and the distance between the Vcse l chip 4 and the second aspheric lens array 130 is effectively controlled to be less than or equal to 10μm, thereby not affecting the annular flux of TX and the responsiveness of RX, as well as the coupling flat area of TX and RX, greatly improving the coupling yield and improving the reliability of the coupling optical path.

[0045] In addition, a gap is reserved between the chip side of the lens 1 and the PCB board 2 for dispensing glue, and the gap is 70 μm±30 μm.

[0046] Example 4

[0047] like Figure 4As shown, a 400G SR4 optical module includes: a PCB board 2, a PD chip 3, a Vcse l chip 4 and a lens 1. The chip side of the lens 1 is bonded to the PCB board 2. The PD chip 3 and the Vcse l chip 4 patched on the PCB board 2 are arranged in the cavity on the chip side of the lens 1. After the PD chip 3 and the Vcse l chip 4 are patched and wired, the height of the PD chip 3 and the Vcse l chip 4 are first tested. If the PD chip 3 is 10μm to 20μm higher than the Vcse l chip 4 (this range does not include 10μm, but includes 20μm), then the second aspheric lens array 130 in the lens 1 selected for coupling is lowered by 20μm±2μm than the first aspheric lens array 120, and the PD chip 3 is coupled with the first aspheric lens array 120, and the Vcse l The Vcse chip 4 is coupled to the second aspheric lens array 130, that is, the second aspheric lens array 130 is lowered by 20μm±2μm than the first aspheric lens array 120 to compensate for the fact that the Vcse chip 4 is 10μm to 20μm shorter than the PD chip 3.

[0048] Through the above operations, the height difference between the distance between the PD chip 3 and the first aspheric lens array 120 and the distance between the Vcse l chip 4 and the second aspheric lens array 130 is effectively controlled to be less than or equal to 10μm, thereby not affecting the annular flux of TX and the responsiveness of RX, as well as the coupling flat area of TX and RX, greatly improving the coupling yield and improving the reliability of the coupling optical path.

[0049] In addition, a gap is reserved between the chip side of the lens 1 and the PCB board 2 for dispensing glue, and the gap is 70 μm±30 μm.

[0050] When the height difference between the PD chip 3 and the Vcse l chip 4 is less than or equal to 10 μm, the lens in the prior art can still be used. The present utility model only processes the second and third cases in the background technology.

[0051] Although the embodiments of the present invention have been shown and described above, it can be understood that the above embodiments are illustrative and cannot be understood as limitations on the present invention. Ordinary technicians in this field can change, modify, replace and modify the above embodiments within the scope of the present invention.

Claims

1. A lens comprising: A lens body (110) is provided, wherein a first aspheric lens array (120) and a second aspheric lens array (130) are arranged in a row in a concave cavity on the chip side of the lens body (110), and the first aspheric lens array (120) and the second aspheric lens array (130) have a height difference of 20 μm±2 μm.

2. The lens according to claim 1, wherein: There is a height difference of 20 μm between the first aspheric lens array (120) and the second aspheric lens array (130).

3. The lens according to claim 1, wherein: The first aspheric lens array (120) has four aspheric lenses distributed at a preset interval, and the second aspheric lens array (130) has four aspheric lenses distributed at a preset interval.

4. A 400G SR4 optical module, characterized in that: include: A PCB board (2), a PD chip (3), a VCSEL chip (4), and a lens (1) as claimed in any one of claims 1 to 3, wherein the chip side of the lens (1) is bonded to the PCB board (2), the PD chip (3) and the VCSEL chip (4) patched on the PCB board (2) are arranged in a cavity on the chip side of the lens (1), the PD chip (3) is 10 μm to 20 μm shorter than the VCSEL chip (4), the first aspheric lens array (120) is 20 μm ± 2 μm lower than the second aspheric lens array (130), the PD chip (3) is coupled to the first aspheric lens array (120), and the VCSEL chip (4) is coupled to the second aspheric lens array (130).

5. The 400G SR4 optical module according to claim 4, wherein: There is a gap of 70 μm±30 μm between the chip side of the lens (1) and the PCB board (2) for dispensing glue.

6. A 400G SR4 optical module, characterized in that: include: A PCB board (2), a PD chip (3), a VCSEL chip (4), and a lens (1) as claimed in any one of claims 1 to 3, wherein the chip side of the lens (1) is bonded to the PCB board (2), the PD chip (3) and the VCSEL chip (4) patched on the PCB board (2) are arranged in a concave cavity on the chip side of the lens (1), the PD chip (3) is 10 μm to 20 μm higher than the VCSEL chip (4), the second aspheric lens array (130) is 20 μm ± 2 μm lower than the first aspheric lens array (120), the PD chip (3) is coupled to the first aspheric lens array (120), and the VCSEL chip (4) is coupled to the second aspheric lens array (130).

7. The 400G SR4 optical module according to claim 6, wherein: There is a gap of 70 μm±30 μm between the chip side of the lens (1) and the PCB board (2) for dispensing glue.

Images