Wafer film pasting mechanism

Abstract

The utility model provides a wafer film pasting mechanism. The wafer film pasting mechanism comprises a first material placing mechanism used for placing a wafer material piece, a second material placing mechanism used for placing a film frame material piece, a third material placing mechanism used for placing a finished product material piece, a feeding manipulator used for transferring the material piece, and an inflation film pasting mechanism. The inflation film pasting mechanism comprises a bearing table and an inflation assembly, and when the feeding mechanical arm transfers the wafer material piece and the film frame material piece to the bearing table, the inflation assembly carries out output film pasting to form a finished product material piece. A wafer material piece is subjected to film pasting and tight covering in an air blowing mode, and the phenomenon that the wafer is damaged by pressure generated by hard contact is avoided. The air inflation assembly can provide uniform air pressure during air blowing, so that the film can be completely attached to the surface of the wafer.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer film lamination, in particular to a wafer film lamination mechanism. Background Art

[0002] Wafer manufacturing is a crucial step in the semiconductor manufacturing process. During the processing, self-adhesive UV blue film is generally used as a wafer carrier during dicing. When tightly fitted, the UV blue film exhibits excellent self-adhesion and ductility, effectively preventing wafer shifting during dicing. It also maintains the required uniform ductility when expanding the wafer after dicing to separate the silicon wafers, facilitating plastic encapsulation positioning and keeping the wafer clean and dust-free. Therefore, wafer and UV blue film bonding and encapsulation are widely used before wafer photolithography begins.

[0003] In current technology, wafer lamination mostly uses rollers to stick the film on the wafer. However, since this method requires the roller to apply pressure on the film, this pressure will be transmitted to the wafer. Therefore, the wafer will bend and deform under the pressure of the roller, which makes thinner wafers more likely to break when the film is applied.

[0004] In view of this, the applicant has filed this application after studying the existing technology. Utility Model Content

[0005] The utility model provides a wafer film laminating mechanism, aiming to improve at least one of the above technical problems.

[0006] In order to solve the above technical problems, the utility model provides a wafer film laminating mechanism, including a first material placement mechanism for placing wafer materials, a second material placement mechanism for placing film frame materials, a third material placement mechanism for placing finished product materials, a feeding robot for transferring materials, and an inflatable film laminating mechanism; the first material placement mechanism, the second material placement mechanism, the third material placement mechanism and the inflatable film laminating mechanism are arranged around the feeding robot; the inflatable film laminating mechanism includes a receiving table and an inflating component. When the feeding robot transfers the wafer materials and the film frame materials to the receiving table respectively, the inflating component is used to output the film to form the finished product materials.

[0007] As a further optimization, the inflatable film-sticking mechanism also includes a first base, a first slide rail, a first slide and a first drive component. The first slide rail and the first drive component are vertically arranged on the first base, and the first slide is slidably connected to the first slide rail; the output end of the first drive component is fixedly connected to the first slide; and the inflatable component is installed on the first slide.

[0008] As a further optimization, the inflation component includes an air pressure cover and an inflation head, and an inflation cavity is provided inside the air pressure cover; the inflation head is provided at the upper end of the air pressure cover, and the output end of the inflation head passes through the air pressure cover and is connected to the inflation cavity; the lower end of the air pressure cover is provided with an opening connected to the inflation cavity.

[0009] As a further optimization, a groove is provided inwardly at the upper end of the receiving platform, and a boss portion is provided at the lower end of the air pressure cover protruding downwardly, and the outer edge of the boss portion can be adapted to be slidably connected with the inner wall of the groove.

[0010] As a further optimization, a partition plate is provided in the inflation cavity, a plurality of pin seats are provided at the upper end of the partition plate, and a pin column is provided at the top end of the inflation cavity that is slidably connected to the pin hole on the pin seat.

[0011] As a further optimization, an adjustment seat is further provided on the partition plate, and a threaded hole is provided on the upper end of the adjustment seat; an adjustment bolt is provided on the air pressure cover, and the adjustment bolt is rotatably connected to the threaded hole.

[0012] As a further optimization, the inner side wall of the inflation cavity is gradually extended radially inward from top to bottom.

[0013] As a further optimization, the first material loading mechanism includes a second base, a second slide rail, a second slide, a second drive assembly and a material loading table. The second slide rail and the second drive assembly are vertically arranged on the second base, and the second slide is slidably connected to the second slide rail; the output end of the second drive assembly is fixedly connected to the first slide; and the material loading table is installed on the first slide.

[0014] As a further optimization, three limit pin rods are arranged in a triangular shape on the second base; and a through groove suitable for the limit pin rods to pass through is provided on the placing table.

[0015] By adopting the above technical solution, the utility model can achieve the following technical effects:

[0016] The present application provides a wafer film laminating mechanism, comprising a first placing mechanism for placing wafer materials, a second placing mechanism for placing film frame materials, a third placing mechanism for placing finished product materials, a feeding robot for transferring materials, and an inflatable film laminating mechanism; the inflatable film laminating mechanism comprises a receiving platform and an inflatable component, and when the feeding robot transfers the wafer materials and the film frame materials to the receiving platform respectively, the inflatable component is used to output the film to form the finished product materials. The wafer materials are tightly covered with film by blowing air to avoid damage to the wafer caused by pressure generated by hard contact. The inflatable component of the present application can provide a relatively uniform air pressure when blowing air, so as to completely adhere the film to the surface of the wafer. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following is a brief introduction to the drawings required for use in the embodiments. It should be understood that the following drawings only show certain embodiments of the present invention and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can be obtained based on these drawings without creative work.

[0018] Figure 1 This is a schematic structural diagram of a wafer laminating mechanism of the utility model;

[0019] Figure 2 This is a structural diagram of the inflatable film-sticking mechanism of the utility model;

[0020] Figure 3 This is a structural diagram of the first feeding mechanism of the utility model;

[0021] Figure 4 This is a schematic cross-sectional view of the inflatable film-sticking mechanism of the utility model;

[0022] Figure 5 This utility model Figure 4 A in the middle is an enlarged structural diagram;

[0023] Markings in the figure: 1. First loading mechanism; 2. Second loading mechanism; 3. Third loading mechanism; 4. Wafer material; 5. Film frame material; 6. Finished material; 7. Feeding robot; 8. Inflating film-sticking mechanism; 9. Receiving platform; 10. Inflating assembly; 11. Air pressure cover; 12. Inflating head; 13. Inflating cavity; 14. First base; 15. First slide rail; 16. First slide; 17. First drive assembly; 18. Groove; 19. Boss; 20. Partition plate; 21. Pin seat; 22. Pin column; 23. Adjusting seat; 24. Threaded hole; 25. Adjusting bolt; 26. Second base; 27. Second slide rail; 28. Second slide; 29. Second drive assembly; 30. Loading platform; 31. Limiting pin rod. DETAILED DESCRIPTION

[0024] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments in the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention. Therefore, the following detailed description of the embodiments of the present invention provided in the drawings is not intended to limit the scope of the utility model for which protection is sought, but merely represents the selected embodiments of the present invention. Based on the embodiments in the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention.

[0025] Depend on Figures 1 to 5 As shown, an embodiment of the present invention provides a wafer laminating mechanism, comprising a first loading mechanism 1 for placing wafer materials 4, a second loading mechanism 2 for placing film frame materials 5, a third loading mechanism 3 for placing finished materials 6, a feeding robot 7 for transferring materials, and an inflatable laminating mechanism 8; the first loading mechanism 1, the second loading mechanism 2, the third loading mechanism 3, and the inflatable laminating mechanism 8 are arranged around the feeding robot 7. Thus, the feeding robot 7 can sequentially transfer the wafer materials 4 from the first loading mechanism 1 to the inflatable laminating mechanism 8, and then transfer the film frame materials 5 from the second loading mechanism 2 to the inflatable laminating mechanism 8. After the inflatable laminating mechanism 8 is inflated and output to complete the laminating, the feeding robot 7 transfers the finished laminating material 6 to the third loading mechanism 3. Among them, in order to avoid damage during grasping, the feeding robot 7 of the present application adopts a vacuum adsorption method to grasp each material. This is a prior art and will not be elaborated here.

[0026] Among them, the inflatable film-laminating mechanism 8 includes a receiving platform 9 and an inflatable component 10. Specifically, the inflatable component 10 includes an air pressure cover 11 and an inflating head 12. An inflatable cavity 13 is provided inside the air pressure cover 11; the inflating head 12 is provided at the upper end of the air pressure cover 11, and the output end of the inflatable head 12 passes through the air pressure cover 11 and is connected to the inflatable cavity 13, and the upper input end is connected to a gas pumping device (not shown in the figure); the lower end of the air pressure cover 11 is provided with an opening connected to the inflatable cavity 13. When the feeding robot 7 transfers the wafer material 4 and the film frame material 5 respectively to the receiving platform 9, gas is first injected into the inflatable cavity 13 through the inflating head 12, and then the gas impacts the film of the film frame material 5 downward from the opening, and the film is pressed tightly against the wafer material 4 by air pressure, completing the film lamination and forming a finished material 6.

[0027] Furthermore, the inflatable film-applying mechanism 8 also includes a first base 14, a first slide rail 15, a first slide 16, and a first drive assembly 17. The first slide rail 15 and the first drive assembly 17 are vertically arranged on the first base 14, and the first slide 16 is slidably connected to the first slide rail 15; the output end of the first drive assembly 17 is fixedly connected to the first slide 16; the inflatable component 10 is mounted on the first slide 16; and the receiving platform 9 is arranged on the first base 14 below the output end of the inflatable component 10. The first drive assembly 17 drives the first slide 16 to perform vertical movement on the first slide rail 15, thereby controlling the output end of the inflatable component 10 on the first slide 16 to approach or move away from the material placed on the receiving platform 9 for air blowing and film applicator application. Among them, the first drive assembly 17 is a combination of a motor screw moving module, which will not be described in detail here.

[0028] Preferably, the upper end of the receiving platform 9 is concavely provided with a groove 18, and the lower end of the air pressure cover 11 is provided with a downwardly protruding boss portion 19. The outer edge of the boss portion 19 can be adapted to slide with the inner sidewall of the groove 18. The arrangement of the groove 18 and the boss portion 19 allows the air pressure cover 11 to move downward and contact the receiving platform 9, thereby generating a certain sealing effect, thereby maintaining pressure in the inflation chamber 13, and better allowing the film to adhere tightly to the wafer material 4.

[0029] Preferably, a partition plate 20 is provided in the inflation chamber 13, and a plurality of pin seats 21 are provided at the upper end of the partition plate 20. A pin column 22 is provided at the top of the inflation chamber 13 and is slidably connected to the pin holes on the pin seats 21. It should be noted that a gap is provided between the outer edge of the partition plate 20 and the inner side wall of the inflation chamber 13. By providing the partition plate 20, the inflation chamber 13 can be separated into an upper chamber and a lower chamber. The lower chamber corresponds to the opening, so that when the inflation head 12 inflates the inflation chamber 13, the gas can first fill the upper chamber, then enter the lower chamber from the gap at the edge to fill it, and finally concentrate the gas downward from the center of the opening. This allows the gas to be output from the opening more evenly, expands the blowing area, and thus can cover the wafer surface with air. The blowing force decreases from the center to the outside, reducing the probability of bubbles, and avoiding the inflation head 12 from the output end rushing to a smaller range, reducing the problem of possible damage to the membrane.

[0030] Furthermore, the partition plate 20 is provided with an adjustment seat 23, the upper end of which is provided with a threaded hole 24; the air pressure cover 11 is provided with an adjustment bolt 25, which is rotatably connected to the threaded hole 24. The adjustment end of the adjustment bolt 25 is set above the air pressure cover 11 and is axially limited. Since the partition plate 20 is restricted by multiple pins 22, it rotates and moves within the radial limit. Preferably, it is set at the four corners, so that when the adjustment bolt 25 is rotated, the partition plate 20 can be driven to move up and down in the inflation chamber 13 to adjust the size between the upper chamber and the lower chamber. When the output of the inflation head 12 is large, the gap between the partition plate 20 and the inner wall of the inflation chamber 13 can reduce the cross-sectional area of the gas, thereby generating a Venturi effect at the outlet, accelerating the flow rate, and then adjusting the gas flow rate near the opening in the lower chamber.

[0031] Furthermore, as an embodiment, the inner sidewall of the plenum chamber 13 is configured to gradually extend radially inward from top to bottom. This allows the cross-sectional area of the gap to be reduced as the height of the partition plate 20 changes, further adjusting the gas flow rate. This allows for better blowing of the film on the film frame, allowing the film to adhere to the wafer 4.

[0032] Preferably, the first loading mechanism 1 includes a second base 26, a second slide rail 27, a second slide 28, a second drive assembly 29, and a loading platform 30. The second slide rail 27 and the second drive assembly 29 are vertically mounted on the second base 26, and the second slide 28 is slidably connected to the second slide rail 27. The output end of the second drive assembly 29 is fixedly connected to the first slide 16. The loading platform 30 is mounted on the first slide 16. In this embodiment, the second drive assembly 29 is a combination of a motor and a screw-driven movement module, thereby adjusting the height of the loading platform 30.

[0033] Furthermore, three limit pin rods 31 are arranged in a triangle on the second base 26; and a through slot suitable for the limit pin rod 31 to pass through is provided on the material placement table 30. The bottom end of the limit pin rod 31 is set on the slide groove on the second base 26, so that it can be close to or away from the center of the triangle, and then it can be pressed against the material from the side to limit and stabilize the material pile. When the material is used, the material placement table 30 moves upward to send the top material to above the end of the limit pin rod 31, so that the feeding robot 7 can grab and transfer it. When the material is used up, it can also be replenished by adjusting the position of the limit pin rod 31. Among them, in this embodiment, the second material placement mechanism 2 and the third material placement mechanism 3 are also the same structure as the first material placement mechanism 1, but the materials placed are different, so they will not be described in detail.

[0034] The above description is merely a preferred embodiment of the present invention and is not intended to limit the present invention. Those skilled in the art will readily appreciate that the present invention is susceptible to various modifications and variations. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of the present invention shall be included within the scope of protection of the present invention.

Claims

1. A wafer laminating mechanism, characterized in that: It includes a first material placement mechanism for placing wafer materials, a second material placement mechanism for placing film frame materials, a third material placement mechanism for placing finished product materials, a feeding robot for transferring materials, and an inflation film-laminating mechanism; the first material placement mechanism, the second material placement mechanism, the third material placement mechanism and the inflation film-laminating mechanism are arranged around the feeding robot; the inflation film-laminating mechanism includes a receiving table and an inflation component. When the feeding robot transfers the wafer materials and the film frame materials to the receiving table respectively, the inflation component is used to output the film to form the finished product materials.

2. A wafer laminating mechanism according to claim 1, characterized in that The inflatable film-sticking mechanism also includes a first base, a first slide rail, a first slide and a first drive component. The first slide rail and the first drive component are vertically arranged on the first base, and the first slide is slidably connected to the first slide rail; the output end of the first drive component is fixedly connected to the first slide; the inflatable component is installed on the first slide.

3. A wafer laminating mechanism according to claim 2, characterized in that The inflation component includes an air pressure cover and an inflation head, and an inflation cavity is provided inside the air pressure cover; the inflation head is provided at the upper end of the air pressure cover, and the output end of the inflation head passes through the air pressure cover and is connected to the inflation cavity; the lower end of the air pressure cover is provided with an opening connected to the inflation cavity.

4. A wafer laminating mechanism according to claim 3, characterized in that The upper end of the receiving platform is concavely provided with a groove, and the lower end of the air pressure cover is protruding downwardly with a boss portion, and the outer edge of the boss portion can be adapted and slidably connected with the inner wall of the groove.

5. A wafer laminating mechanism according to claim 3, characterized in that A partition plate is provided in the inflation cavity, a plurality of pin seats are provided at the upper end of the partition plate, and a pin column is provided at the top end of the inflation cavity, which is slidably connected to the pin hole on the pin seat.

6. A wafer laminating mechanism according to claim 5, characterized in that The partition plate is also provided with an adjustment seat, and a threaded hole is provided at the upper end of the adjustment seat; the air pressure cover is provided with an adjustment bolt, and the adjustment bolt is rotatably connected to the threaded hole.

7. A wafer laminating mechanism according to claim 6, characterized in that The inner wall of the inflation cavity is gradually extended radially inward from top to bottom.

8. A wafer laminating mechanism according to claim 2, characterized in that The first material loading mechanism includes a second base, a second slide rail, a second slide, a second drive assembly and a material loading table. The second slide rail and the second drive assembly are vertically arranged on the second base, and the second slide is slidably connected to the second slide rail; the output end of the second drive assembly is fixedly connected to the first slide; the material loading table is installed on the first slide.

9. A wafer laminating mechanism according to claim 8, characterized in that Three limit pin rods are arranged in a triangle on the second base; a through groove suitable for the limit pin rod to pass through is set on the material placement table.

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