Automatic chip mounter for wafers

Abstract

The utility model relates to an automatic chip mounter for wafers. The automatic chip mounter comprises a feeding frame; the wafer pretreatment device comprises an edge searching and centering unit and a scrubbing unit; the waxing device comprises a wax dripping and throwing unit and a baking unit; the chip mounting device comprises a porcelain disc positioning unit, a wafer overturning unit and a pressing unit; the transfer unit comprises a first manipulator and a second manipulator; the chip mounter further comprises a centering device. According to the utility model, on one hand, the two manipulators of which the transshipment paths are intersected are matched, and the movement stroke of a single manipulator is shortened, so that the wafer transshipment efficiency is improved, and the connection tightness of wafers among all procedures is effectively improved; and on the other hand, the centering device is arranged to carry out centering adjustment on the wafer so as to eliminate offset, so that accurate center positioning of the wafer is ensured, and the surface mounting quality is ensured.

Description

Technical Field

[0001] The utility model belongs to the technical field of semiconductor processing, and in particular relates to an automatic chip placement machine. Background Art

[0002] A chip is a silicon wafer used in the manufacture of semiconductor integrated circuits. Due to its round shape, it is also called a wafer. By creating various circuit structures on the surface of the chip, it can be transformed into an electronic component with specific electrical functions. The production and processing of chips typically involves slicing, grinding, polishing, and cleaning. Currently, during these grinding and polishing processes, a ceramic disc is used as a carrier or base for the chip. The chip is attached to the surface of the ceramic disc during processing. The ceramic disc has a high surface flatness, which serves as a reference surface for grinding and polishing the chip.

[0003] In the existing technology, in order to improve the efficiency of chip placement and reduce labor intensity, an automatic chip placement machine is generally used to complete the chip placement of the product. The main processes include: chip loading → edge finding and centering → chip upper surface cleaning → wax dripping and wax throwing → baking → chip flipping → chip placement, where the movement of the chip between each process is achieved by a single robot.

[0004] However, in the actual production process, the existing automatic placement machines have the following defects:

[0005] 1. After the initial edge-finding and centering of the wafer, when it is transferred over a long distance by a single robot, there is a high probability that the wafer position will shift due to inertia, the robot's own operating vibration, or other external factors. This makes it difficult to accurately position the wafer in each process, thus affecting the final placement quality.

[0006] 2. A single robot is used to move the wafer between the above processes. The robot has a long movement range, takes a long time, and makes it difficult to move the wafer between the processes to achieve a tighter connection, resulting in low patch efficiency. Utility Model Content

[0007] The technical problem to be solved by the utility model is to overcome the deficiencies of the prior art and provide an improved automatic chip mounter.

[0008] In order to solve the above technical problems, the present invention adopts the following technical solutions:

[0009] A wafer automatic placement machine, comprising:

[0010] a feed rack for supplying wafers;

[0011] A wafer pre-processing device comprising an edge-finding and centering unit and a scrubbing unit;

[0012] A wax coating device, comprising a wax dripping and wax throwing unit and a baking unit;

[0013] The chip placement device includes a ceramic plate positioning unit, a chip turning unit, and a pressing unit;

[0014] The transfer unit includes a first manipulator and a second manipulator, the first manipulator is used to transfer chips between the feeding rack, the edge-finding and centering unit, and the brushing unit, and the second manipulator is used to transfer chips between the wax dripping and wax-swinging unit, the baking unit, and the chip flipping unit, wherein the transfer paths formed by the first manipulator and the second manipulator are arranged to intersect; the placement machine also includes a centering device correspondingly arranged at the intersection of the transfer paths, wherein the centering device includes a supporting component with a horizontal supporting surface formed on the top, and a centering component, wherein the first manipulator and / or the second manipulator transfers the chip and places it flat on the supporting surface, and the centering component forms a centering area that extends circumferentially around the chip and can be closed or loosened, and as the centering area closes, the center of the chip gradually coincides with the center of the centering area.

[0015] According to a specific embodiment and preferred aspect of the present invention, there is a centering device at the intersection of the transfer paths, and the feed rack, wafer pre-treatment device, wax coating device, and placement device are distributed circumferentially around the centering device. In this way, the spatial layout is compact and reasonable, which is conducive to reducing the volume of the equipment and saving space.

[0016] Preferably, the first robot is positioned between the feed rack, the wafer pre-processing device, and the centering device; and / or the second robot is positioned between the wax coating device, the wafer placement device, and the centering device. This can further reduce the transfer travel of the first and second robots and improve wafer transfer efficiency.

[0017] Preferably, the first manipulator and the second manipulator have the same structure; and / or, the first manipulator and the second manipulator each include a rotating base, a first pick-and-place arm and a second pick-and-place arm respectively arranged on the rotating base and capable of linear motion, and a lifting drive member for driving the rotating base to move up and down, wherein the pick-and-place ends of the first pick-and-place arm and the second pick-and-place arm are arranged up and down.

[0018] According to another specific implementation and preferred aspect of the present invention, the support component includes a base and a plurality of support columns extending upward from the top surface of the base, wherein the top ends of the plurality of support columns constitute a horizontal support surface.

[0019] Preferably, there are three support columns arranged in a triangular pattern, which improves the stability of the wafer support and prevents accidental drops. At the same time, this layout can create enough space for the robot to avoid it, making it easier for the robot to pick up and place the wafer.

[0020] According to another specific embodiment and preferred aspect of the present invention, the centering member includes multiple centering ends spaced apart circumferentially around the wafer, forming a centering zone between the multiple centering ends. During centering, the multiple centering ends are relatively close to and simultaneously contact the edge of the wafer. This ensures uniform force on the wafer, preventing deformation or damage.

[0021] Preferably, each centering end is formed with a groove around its periphery that matches the edge of the wafer, so that when centering, the wafer is seated in the groove from its edge, thereby effectively improving the centering accuracy of the wafer.

[0022] Specifically, the centering component includes two drive modules disposed above the support member and capable of moving toward or away from each other, and a plurality of centering rods extending vertically downward from the two drive modules, with the lower end of each centering rod forming a centering end. This provides a simple structure and facilitates assembly and implementation.

[0023] Furthermore, multiple centering rods are symmetrically distributed on the two drive modules; and / or the multiple centering rods are divided into multiple centering rod groups, with the multiple centering rod groups distributed layer by layer from the inside out, and the height of the centering ends decreasing from the inside out. The centering component also includes a power element that drives the two drive modules to rise and fall synchronously. Here, the multiple centering rod groups distributed layer by layer from the inside out can be used to align wafers of different sizes, thereby enabling the bonding of wafers of different sizes.

[0024] Due to the implementation of the above technical solution, the utility model has the following advantages compared with the prior art:

[0025] In the prior art, when transferring chips over long distances, there is a high probability that the chip position will shift due to inertia, the vibration of the robot itself, or other external factors, which makes it difficult to accurately position the chip in each process, thus affecting the final chip placement quality; at the same time, a single robot is used to realize the movement of the chip between the above-mentioned processes. The movement stroke of the robot is long, time-consuming, and it is difficult to make the chip move between the processes to achieve a tighter connection, resulting in low chip placement efficiency. The present application makes an overall design of the structure of the automatic chip placement machine, cleverly solving the deficiencies and defects of the prior art. After adopting the automatic chip placement machine, the first robot takes the material from the feeding rack and transfers the chip to the edge-finding and centering unit and the brushing unit in sequence to perform the edge-finding and centering and surface brushing processes of the chip. Then the first robot transfers the chip that has completed brushing to the horizontal support surface, closes the centering area formed by the counterweight component to drive the center of the chip to coincide with the center of the centering area; then, the centering area opens, and the second robot takes the chip from the support surface and transfers it to the wax dripping and waxing unit, the baking unit and the chip flipping unit in sequence to gradually complete the wax dripping and waxing, baking and flipping of the chip surface. Finally, the flipped chip is attached to the surface of the porcelain plate, and the placement is completed under the pressing of the pressing unit. Therefore, compared with the existing technology, the present invention, on the one hand, adopts the cooperation of two manipulators with intersecting transfer paths to shorten the movement stroke of a single manipulator, thereby improving the chip transfer efficiency and effectively improving the tightness of the chip connection between each process; on the other hand, by setting a centering device to adjust the chip to eliminate offset, ensure the accurate positioning of the chip center, and thus ensure the quality of the patch. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 Schematic diagram of a top view of an automatic wafer placement machine according to the present embodiment (partially omitted);

[0027] Figure 2 for Figure 1 An enlarged schematic diagram of the three-dimensional structure of the centering device;

[0028] Figure 3 for Figure 1 A magnified schematic diagram of the three-dimensional structure of the second manipulator;

[0029] Among them: 1. Feeding rack;

[0030] 2. Wafer pre-treatment device; 20. Edge-finding and centering unit; 21. Brush cleaning unit;

[0031] 3. Waxing device; 30. Waxing dripping and waxing unit; 31. Baking unit;

[0032] 4. Chip placement device; 40. Ceramic plate positioning unit; 41. Wafer flipping unit; 42. Lamination unit;

[0033] 5. Transfer unit; 51. First manipulator; 52. Second manipulator; a0. Rotating seat; a1. First pick-and-place arm; a2. Second pick-and-place arm; a3. Lifting drive member;

[0034] 6. Centering device; 60. Support component; 600. Base; 601. Support column; 61. Centering component; 610. Drive module; 611. Centering rod; c. Centering end; c0. Slot; 612. Power component; q. Centering area;

[0035] P. chip. DETAILED DESCRIPTION

[0036] To make the above-mentioned objects, features, and advantages of the present application more clearly understood, the specific embodiments of the present application are described in detail below with reference to the accompanying drawings. The following description sets forth many specific details to facilitate a full understanding of the present application. However, the present application can be implemented in many other ways than those described herein, and those skilled in the art can make similar improvements without violating the scope of the present application. Therefore, the present application is not limited to the specific embodiments disclosed below.

[0037] In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0038] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being referred to. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of such features. Throughout the description of this application, "plurality" means at least two, for example, two, three, etc., unless otherwise specifically defined.

[0039] In this application, unless otherwise specified or limited, the terms "installed," "connected," "connect," "fixed," etc. should be understood in a broad sense. For example, they can refer to fixed connection, detachable connection, or integration; mechanical connection or electrical connection; direct connection or indirect connection through an intermediate medium; internal communication between two elements or interaction between two elements, unless otherwise specified. Those skilled in the art will understand the specific meanings of the above terms in this application based on specific circumstances.

[0040] In this application, unless otherwise expressly specified or limited, when a first feature is "above" or "below" a second feature, it can mean that the first and second features are in direct contact, or that the first and second features are in indirect contact through an intermediary. Furthermore, when a first feature is "above," "above," or "above" a second feature, it can mean that the first feature is directly above or diagonally above the second feature, or simply means that the first feature is at a higher horizontal height than the second feature. When a first feature is "below," "below," or "below" a second feature, it can mean that the first feature is directly below or diagonally below the second feature, or simply means that the first feature is at a lower horizontal height than the second feature. It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it can be directly on the other element or there can be an intermediate element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or there can be an intermediate element. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only embodiments.

[0041] like Figures 1 to 3 As shown, an automatic wafer placement machine of this embodiment includes a feeding rack 1, a wafer pre-processing device 2, a wax coating device 3, a placement device 4, a transfer unit 5 and a centering device 6.

[0042] Specifically, the feeding rack 1 is used to supply wafers P. In this embodiment, four wafer boxes are provided on the feeding rack 1 for taking wafers.

[0043] In this example, the wafer pre-processing device 2 includes an edge-finding and centering unit 20, and two brushing units 21 located on one side of the edge-finding and centering unit 20, wherein the edge-finding and centering unit 20 is used for edge-finding and centering of the wafer, and the brushing unit 21 is used for brushing the upper surface of the wafer. The wax coating device 3 includes a wax dripping and waxing unit 30 and a baking unit 31, wherein the wax dripping and waxing unit 30 is used to drip wax on the upper surface of the wafer that has been brushed, and then drive the wafer to rotate to evenly shake the wax and spread the wax on the wafer surface; the baking unit 31 is used to bake and heat the wafer that has been dripped and waxed. The patch device 4 includes a ceramic plate positioning unit 40, a wafer flipping unit 41, and a pressing unit 42, wherein the ceramic plate positioning unit 40 is used to position the ceramic plate, and the wafer flipping unit 41 is used to flip the wafer and make the side of the wafer coated with wax face down and adhere to the ceramic plate surface, and complete the patching under the pressing of the pressing unit 42. The wafer pre-treatment device 2, wax coating device 3, and chip placement device 4 of this embodiment are all prior art. For details, reference may be made to another Chinese patent of the applicant with publication number CN221327659U.

[0044] In this example, the transfer unit 5 includes a first manipulator 51 and a second manipulator 52. The first manipulator 51 is used to transfer chips between the feeding rack 1, the edge-finding and centering unit 20, and the brushing unit 21. The second manipulator 52 is used to transfer chips between the wax dripping and wax-stripping unit 30, the baking unit 31, and the chip flipping unit 41. The transfer paths formed by the first manipulator 51 and the second manipulator 52 are arranged to intersect, and the centering device 6 is correspondingly arranged at the intersection of the transfer paths.

[0045] In some specific embodiments, there is one transfer path intersection, and the feed rack 1 , the wafer pre-processing device 2 , the wax coating device 3 and the chip placement device 4 are distributed circumferentially around the centering device 6 .

[0046] At the same time, the first manipulator 51 is correspondingly arranged between the feeding rack 1, the chip pretreatment device 2 and the centering device 6; the second manipulator 52 is correspondingly arranged between the wax coating device 3, the patch device 4, and the centering device 6; the first manipulator 51 and the second manipulator 52 have the same structure; the first manipulator 51 and the second manipulator 52 each include a rotating base a0, a first pick-and-place arm a1 and a second pick-and-place arm a2 respectively arranged on the rotating base a0 and capable of linear motion, and a lifting drive a3 for driving the rotating base a0 to move up and down, wherein the pick-and-place ends of the first pick-and-place arm a1 and the second pick-and-place arm a2 are arranged up and down, and each pick-and-place end is crescent-shaped.

[0047] In this example, the centering device 6 includes a support component 60 with a horizontal support surface formed on the top, and a centering component 61, wherein the first robot 51 and / or the second robot 52 transfers the chip and places it flat on the support surface, and the centering component 61 forms a centering area q that extends circumferentially around the chip and can be closed or loosened, and as the centering area q closes, the center of the chip gradually coincides with the center of the centering area q.

[0048] In some specific embodiments, the support component 60 includes a base 600 and a plurality of support columns 601 extending upward from the top surface of the base 600, wherein the top ends of the plurality of support columns 601 constitute a horizontal support surface; there are three support columns 601, and they are distributed in a triangular shape, so that the crescent-shaped picking and placing ends of the first manipulator 51 and the second manipulator 52 can be cleverly avoided in two directions.

[0049] In this example, the centering component 61 includes two driving modules 610 arranged above the supporting component 60 and capable of moving relatively close to or away from each other, a plurality of centering rods 611 extending vertically downward from the two driving modules 610, and a power member 612 driving the two driving modules 610 to rise and fall synchronously, wherein the lower end of each centering rod 611 forms a centering end c, and the plurality of centering ends c are evenly spaced around the circumference of the chip, and a centering area q is formed between the plurality of centering ends c. During centering, the plurality of centering ends c are relatively close to and synchronously contact the edge of the chip.

[0050] In some specific embodiments, a slot c0 is formed on the circumference of each centering end c that matches the edge of the chip. During centering, the chip is pressed against the edge of the slot c0; multiple centering rods 611 are symmetrically distributed on the two driving modules 610; multiple centering rods 611 are divided into multiple centering rod groups, and the multiple centering rod groups are distributed layer by layer from the inside to the outside, and the height of the centering end c decreases layer by layer from the inside to the outside; the two driving modules 610 are driven by a rodless cylinder to move closer or farther away from each other, and the power part 612 is driven by a conventional lifting slide rail. Here, by distributing multiple centering rod groups layer by layer from the inside to the outside, it is possible to adapt to the centering of chips of different sizes to realize the patching of chips of different sizes. That is to say, when the chip size is changed, for example, from a 4-inch chip to a 6-inch chip, the driving module 610 is driven to rise to drive the centering end c of the multiple centering rods 611 located in the corresponding layer to be on the same horizontal plane as the 6-inch chip, and then the driving module 610 drives the multiple centering end c to close to implement centering adjustment on the chip.

[0051] In addition, this embodiment also includes a conventional casing, an air handling device, and electrical equipment, which are clearly implementable without further description here.

[0052] In summary, after adopting the automatic placement machine, the first robot takes the material from the feed rack and transfers the chip to the edge-finding and centering unit and the brushing unit in sequence to perform the edge-finding and centering and surface brushing processes of the chip. Then the first robot transfers the chip that has completed brushing to the horizontal support surface, and closes the centering area formed by the counterweight component to drive the center of the chip to coincide with the center of the centering area; then, the centering area is opened, and the second robot takes the chip from the support surface and transfers it to the wax dripping and wax throwing unit, the baking unit and the chip flipping unit in sequence to gradually complete the wax dripping and wax throwing, baking and flipping of the chip surface. Finally, the flipped chip is attached to the surface of the porcelain plate, and the placement is completed under the pressing of the pressing unit. Therefore, compared with the prior art, the present invention adopts the cooperation of two manipulators whose transfer paths intersect, shortening the movement stroke of a single manipulator, thereby improving the chip transfer efficiency and effectively improving the tightness of the chip connection between each process; on the other hand, by setting a centering device, the chip is centered and adjusted to eliminate the offset, ensuring the accurate positioning of the chip center, thereby ensuring the quality of the patch; thirdly, three support columns distributed in a triangular pattern are adopted to improve the stability of the chip support and prevent accidental falling; at the same time, under this layout, enough space can be formed to avoid the manipulator, making it easier for the manipulator to pick up and place the chip; fourthly, through multiple centering rod groups distributed layer by layer from the inside to the outside, it can be used to align chips of different sizes to achieve the patch of chips of different sizes; fifthly, the spatial layout is compact and reasonable, which is conducive to reducing the equipment volume and saving space.

[0053] The above detailed description of the utility model is intended to enable people familiar with the technology in this field to understand the content of the utility model and implement it. It is not intended to limit the scope of protection of the utility model. Any equivalent changes or modifications made according to the spirit of the utility model should be included in the scope of protection of the utility model.

Claims

1. A wafer automatic placement machine, comprising: a feed rack for supplying wafers; A wafer pre-processing device comprising an edge-finding and centering unit and a scrubbing unit; A wax coating device, comprising a wax dripping and wax throwing unit and a baking unit; The chip placement device includes a ceramic plate positioning unit, a chip turning unit, and a pressing unit; Reprint unit, It is characterized in that The transfer unit includes a first manipulator and a second manipulator, the first manipulator is used to transfer chips between the feeding rack, the edge-finding and centering unit, and the brushing unit, and the second manipulator is used to transfer chips between the wax dripping and wax-swinging unit, the baking unit, and the chip flipping unit, wherein the transfer paths formed by the first manipulator and the second manipulator are arranged to intersect; the placement machine also includes a centering device correspondingly arranged at the intersection of the transfer paths, wherein the centering device includes a supporting component with a horizontal supporting surface formed on the top, and a centering component, wherein the first manipulator and / or the second manipulator transfers the chip and places it flat on the supporting surface, and the centering component forms a centering area that extends circumferentially around the chip and can be closed or loosened, and as the centering area closes, the center of the chip gradually coincides with the center of the centering area.

2. The automatic wafer mounter according to claim 1, characterized in that: There is one transfer path intersection, and the feed rack, wafer pre-processing device, wax coating device and patch device are distributed circumferentially around the centering device.

3. The automatic wafer mounter according to claim 2, characterized in that: The first robot is correspondingly arranged between the feeding rack, the wafer pre-processing device and the centering device; and / or the second robot is correspondingly arranged between the wax coating device, the patch device and the centering device.

4. The automatic wafer mounter according to claim 1, 2 or 3, characterized in that: The structures of the first manipulator and the second manipulator are the same; and / or, the first manipulator and the second manipulator each include a rotating base, a first pick-and-place arm and a second pick-and-place arm respectively arranged on the rotating base and capable of linear motion, and a lifting drive member for driving the rotating base to move up and down, wherein the pick-and-place ends of the first pick-and-place arm and the second pick-and-place arm are arranged up and down.

5. The automatic wafer mounter according to claim 1, characterized in that: The supporting component includes a base and a plurality of supporting columns extending upward from the top surface of the base, wherein the top ends of the plurality of supporting columns constitute the horizontal supporting surface.

6. The automatic wafer mounter according to claim 5, characterized in that: There are three support columns, which are distributed in a triangular shape.

7. The automatic wafer mounter according to claim 1, characterized in that: The centering component has a plurality of centering ends distributed at intervals around the circumference of the wafer, and the centering area is formed between the plurality of centering ends. During centering, the plurality of centering ends are relatively close to and synchronously abut against the edge of the wafer.

8. The automatic wafer mounter according to claim 7, characterized in that: A slot matching the edge of the wafer is formed on the circumference of each centering end portion. When centering, the wafer abuts against the slot from its edge.

9. The automatic wafer mounter according to claim 7 or 8, characterized in that: The centering component includes two driving modules arranged above the supporting component and capable of moving relatively close to or away from each other, and a plurality of centering rods extending vertically downward from the two driving modules respectively, wherein the lower end of each centering rod forms the centering end portion.

10. The automatic wafer mounter according to claim 9, characterized in that: The multiple centering rods are symmetrically distributed on the two driving modules; and / or, the multiple centering rods are divided into multiple centering rod groups, and the multiple centering rod groups are distributed layer by layer from the inside to the outside, and the height of the centering end portion decreases layer by layer from the inside to the outside, and the centering component also includes a power part that drives the two driving modules to rise and fall synchronously.

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